Abstract: An optical component formed from a fiber directly coupled to a photodiode without any intervening optical components such as mirrors or lenses is disclosed. The optical component includes a stripped optical fiber having a core with a flat distal end that extends through a ferrule. The distal flat end of the core is printed with an annular coating of metal leaving a central portion of the core uncovered. The coated flat end of the core is initially aligned with an aperture or active area of a rear side of a back-illuminated photodiode which also includes a coating of metal. With the two parts in abutting engagement, a reflow or a partial melting process is carried out to directly couple the fiber core to the photodiode.

Abstract: An optical fiber having an a core with a D-shape or an oval shape at an endface. The optical fiber tapers from a round, cylindrical section to the endface so that adiabatic mode transformation is provided. Preferably, the D-shape or oval shape is selected so that the optical fiber has a mode shape at its endface that matches the mode shape of a diffused waveguide.

Abstract: A semiconductor device for optically coupling a semiconductor light-emitting device to an optical fiber, includes (a) a lens which focuses lights emitted from the semiconductor light-emitting device, onto the optical fiber, (b) a shell which supports the lens therewith, the shell being comprised of a cylindrical first portion, a second portion integral with the first portion at an upper end of the first portion and being formed centrally with an opening into which the lens is to be fit, and a cylindrical third portion extending from the first portion upwardly beyond the second portion, (c) glass arranged around the lens for keeping the lens and the opening hermetically sealed, and (d) a reinforcement formed on at least one of upper and lower surfaces of the second portion for preventing the shell from being deformed due to a stress acting on the shell.

Abstract: An optical connector adapter advantageously interfaces waveguide devices using passive alignment. The connector adapter includes a substrate for transporting optical signals and having opposing ends and a top reference surface and single side reference surface. A carrier bracket is received over the top reference surface at either end and includes substrate alignment fiducials for aligning the top and side reference surfaces. A substrate carrier receives the substrate and carrier bracket as a subassembly and has carrier alignment fiducials for aligning to the side reference surface and top reference surface and interfacing a waveguide device.

Abstract: An optical switch/modulating device includes a pump waveguide that provides a pump light to the switch/modulating device. A waveguide element is positioned parallel to the pump waveguide and receives the pump light that causes the waveguide element to switch or modulate a signal light running through the pumped waveguide.

Abstract: An optical module has a high-frequency circuit substrate; at least one optical semiconductor device mounted on the high-frequency circuit substrate; and an optical waveguide substrate arranged on the high-frequency circuit substrate.

Abstract: An optical communication module having a roughened bottom of a silicon bench for suppressing optical crosstalk. The roughened bottom prevents stray laser beams from reflecting toward a photodiode. The roughened bottom is further covered with a photoabsorbent resin, pigment or adhesive for absorbing the stray laser beams at a bottom. A cladding of a lightwaveguide are narrowed and are painted with a photoabsorbent resin, pigment or adhesive for absorbing horizontally stray beams propagating in the cladding.

Abstract: An automatic apparatus and method for attaching a ferrule to a fiber, such as an optical fiber. The apparatus may include a ferrule supply, a ferrule support, an adhesive dispenser and a fiber support. Components may be computer controlled and the method may provide for automatic attachment of a ferrule to an optical fiber.

Abstract: An apparatus and method for monitoring the optical output of vertical cavity surface emitting lasers (VCSELS) utilizes a portion of light emitted by the VCSEL and scatters and/or reflects this portion of emitted light so that it is directed towards a detecting surface of a photodetector. In one embodiment, scattering elements may be incorporated within the epoxy or other coupling medium used to couple the VCSEL to the optical fiber. In another embodiment, the VCSEL may be coupled to an optical fiber secured within a ferrule which has an end surface capable of reflecting or scattering light and directing the light towards the photodetector. In another embodiment, a reflective integrating member may be alternatively or additionally used to reflect a portion of the emitted light to the photodetector. The photodetector, in conjunction with electrical circuitry to which it is coupled, develops an electrical signal which may be provided to laser control means to control and adjust the optical output of the VCSELs.

Abstract: A prismatic tap assembly positioned over a vertical cavity surface emitting laser (VCSEL) redirects a small portion of a beam back to a light detector positioned adjacent to the VCSEL. The larger portion of the beam passes through the tap assembly and into, for example, an optical fiber. The light received by the light detector may be used to monitor the power output of the VCSEL and may be used for control purposes.

Abstract: An optical thick film formed on a photodetector improves the optical coupling efficiency between the optical fiber and photodetector which are optically coupled. The optical thick film has a refractive index that is between the refractive index of air and the refractive index of photodetector upon which the optical matching coating is disposed. Silicone may advantageously be formed as the optical thick film coating on the photodetector.

Abstract: In a star coupler, a Free Propagation Region (FPR) is bounded by a first interface and a second opposing interface, and guides an input signal launched from the first interface in a predetermined first plane while allowing the input signal to travel unguided in a predetermined second plane in the FPR which is orthogonal to the first plane. A plurality of output waveguides are formed in an array and terminate at the second interface of the FPR. The axis of each output waveguide at the second interface is separated from an axis of an adjacent output waveguide by a predetermined distance “t”. An input waveguide is split into a plurality of subsections which each terminate at the first interface of the FPR. The subsections of the input waveguide are arranged for simultaneously launching parts of the input signal into the FPR which diffracts and produces mode patterns at the second interface having a maximum intensity at inputs of each of the output waveguides, and a low intensity elsewhere.

Abstract: In a method of making a replication tool, replication parts for both two dimensional optical elements, such as are fabricated using micro-forming techniques, and three dimensional optical elements, that are typically formed using cutting techniques are present on the replication tool. A method of manufacturing a replication tool for a planar optical sheet includes mounting at least one optical element part on a base to form a master part and forming a conductive metal layer over the master part. The method also comprises electrochemically depositing over the conductive metal layer to form an electrochemically deposited layer, separating the electrochemically deposited layer from the master part. The invention also relates to the replication tool itself and optical circuits formed using the replication tool.

Abstract: Positioned on a block is a filter for reflecting light ?1 and transmitting another light ?2. First and second light guides are positioned on the block in an aligned relation to each other so that their angled ends oppose to each other. An adhesive is applied to the angled ends of the light guides for holding a filter. Light ?2 is introduced in the light guides for adjusting the position of the light guides so that a predetermined amount of light is discharged from the light guide. A light receiver is positioned on the block through the adhesive and then light is introduced in the light guide for adjusting the position of the light receiver relative so that a predetermined amount of light is received by the light receiver. In particular, the adhesive has the same refractive index as the light guides.

Abstract: A photonic device suitable for being optically coupled to at least one optical fiber having a first spot-size, the device including: at least one photonic component; and, a graded index lens optically coupled between the at least one photonic component and the at least one optical fiber; wherein, the graded index lens is adapted to convert optical transmissions from the at least one photonic component to the first spot size.

Abstract: A coupling system for photonic integrated circuits and integrated optical waveguides is provided. A recess is formed in a substrate on which one or more integrated optical waveguides are disposed, the recess being located at the desired mounting location of the photonic integrated circuit. At least one end wall of the recess is inclined with respect to a normal to the substrate surface. At least one end face of a photonic integrated circuit is inclined to match the inclined end wall of the recess. The length, width, and depth of the recess are controlled so that inserting the photonic integrated circuit into the recess passively provides both lateral and vertical alignment of the photonic integrated circuit with the integrated optical waveguide(s).

Abstract: An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

Abstract: There is provided a packaging unit for an optical fiber array using a planar lightwave circuit (PLC). An optical fiber array is fixed within a housing. The housing has first and second slots formed to face each other on the side periphery, and each of the first and second slots has opened ends to make the inner and outer walls of the housing communicate with each other. An optical fiber of the optical fiber array is inserted through first and second boots and then the first and second boots are inserted in the first and second slots of the housing.

Abstract: An apparatus for facilitating the alignment of an optical fiber to an integrated waveguide component comprising a substrate having an integral waveguide comprises a mask arranged to be disposed between the optical fiber and the integrated waveguide component, wherein the mask includes an aperture extending therethrough. In use, the aperture is substantially exactly aligned with the waveguide thereby to permit light from the optical fiber to be transmitted to the waveguide but to substantially prevent light from the optical fiber from passing around the waveguide and/or through the substrate.

Abstract: The invention concerns a photonic device comprising a first section including a material adapted to interact with photons, a second section including a material adapted to interact with photons, with an area of said first section and an area of said second section abutting each other wherein at least a part of said first area and a part of said second area defines a low temperature bonding area to provide adaptability for a plurality of applications based on a combination of materials having specific characteristic benefits, however without introducing unwanted effects having a negative influence on the quality of optical signals.

Abstract: An optical communications module in which electrical crosstalk is reduced. The term “optical communications module” represents a surface-mounting-type optical tranceiver, transmitter, or receiver module. The optical communications module has a following structure. (a) An Si substrate carries at least one signal-transmitting section comprising an LD, at least one signal-receiving section comprising a PD, or both together with other components. (b) An insulating substrate is bonded to the back face of the Si substrate. (c) A separating groove separates the Si substrate along the or each boundary line between the sections in order to prevent an AC current flowing through the Si substrate. To attain this object, the separating groove is provided from the top surface of the Si substrate to some midpoint of the insulating substrate.

Abstract: A planar lightwave circuit comprises a first portion of a waveguide, a second portion of a waveguide, and a segment of crystal core fiber coupling the first portion to the second portion of the waveguide. The crystal core fiber helps to reduce the polarization sensitivity of the waveguide. In one embodiment, multiple crystal core fibers are used in a planar lightwave circuit having multiple waveguides, such as an array waveguide grating.

Abstract: In a connection between an optical fiber or optical fiber array and an integrated optical waveguide or integrated optical waveguide array mounted or fabricated on a grooved substrate, an end face of an optical fiber array has a first facet and a second facet. The first facet has an inclination angle substantially equal to the inclination angle of an end wall of the substrate groove; the second facet has an inclination angle substantially equal to the inclination angle of the end face of the integrated optical waveguide. When the optical fiber array is mounted on the grooved substrate, each of the fibers rests in one of the substrate grooves. The first facet of each optical fiber end face is aligned with the end wall of the groove in which it rests, and the second facet is aligned with the end face of the integrated optical waveguide.

Abstract: Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

Abstract: A method and apparatus for bonding optical fibers are disclosed. A fiber bonding device feeds an optical fiber through a supportive sheath having a ceramic tip at its end. The optical fiber extends slightly beyond the ceramic tip and is aligned with the focal point of a laser, which causes the end of the optical fiber to melt, forming a molten region. The ceramic tip then extends partially into a substrate surface, causing the molten region of the optical fiber to become bonded to the substrate. The process is controlled by computer logic, such that it is an automated, precision process for bonding optical fibers.

Abstract: An optical module (1) which contains at least one optical component (2) whose one optical input/output is directed towards an optical fibre (4) to which it is to be coupled. At least one additional optical waveguide (6) is arranged between this optical component (2) and the optical fibre (4). The optical component (2) is provided with an optical waveguide (3) whose end (5), facing towards the optical fibre (4), is tapered or widened for a modal field adaptation. Additionally the end of each interposed optical waveguide (6) facing towards the optical fibre (4) is also tapered or widened for a modal field adaptation.

Abstract: A device for transmitting optical waves has a structure having at least an optical guide element wherein the structure comprises hollow parts or notches (9, 10) adapted to receive the end parts (13, 14) of an optical fiber (12) such that the fiber spans the surface (11a) of the structure separating the hollow parts and the ends of the optical fiber are respectively optically coupled to optical guide elements (7, 8) of the structure. The invention also concerns a method for making such a device which consists in etching the notch by cutting off the end of the optical micro-guide. The device is useful for producing optical switches.

Abstract: A wavelength-multiplexing connector and a transmitting/receiving part can be easily connected to and disconnected from each other. The wavelength-multiplexing connector comprises a single optical fiber, through which a plurality of optical signals having different wavelengths are transmitted, and a wavelength-multiplexer optically coupled to the optical fiber and capable of optically separating an optical signal having a particular wavelength out of the plurality of optical signals. The wavelength-multiplexer comprises a wavelength division multiplexing filter disposed at a midway of a first light waveguide, and a multilayered film mirror for reflecting, at a midway of a second light waveguide, a signal separated by the wavelength division multiplexing filter.

Abstract: An optical-optoelectronic coupling structure comprising a flip-chip optoelectronic/ultrathin silicon-on-sapphire device mounted on a V-groove, optical-fiber-bearing carrier substrate, including light-reflective structures for launching light into the optical fiber core or transmitting light emitted by the optical fiber core to the optoelectronic device. The optical fiber may be immobilized in the V-groove using a curable resin adhesive characterized by a refractive index substantially similar to the refractive index of the optical fiber.

Abstract: An optical element 1 comprises an optical substrate having a lens 2, projections 4a and 4b, and a handle 6. The lens 2 is provided to the roughly rectangular handle 6 at a predetermined position thereon, while the projections 4a and 4b are provided to the handle 6 at the respective positions separate from the lens 2 by a predetermined distance and each have a semi-cylindrical shape that extends from a bottom of the handle 6. An overall size of an arc shape of each of the projections 4a and 4b is equal to an overall size of an optical fiber with which the optical element 1 is to be coupled optically. When mounting the optical element 1 on a support substrate having a mounting groove therein, the projections 4a and 4b butt against the mounting groove, thereby positioning the optical element 1 in a direction perpendicular to an optical axis.

Abstract: A parallel multichannel LD/PD module comprising a bench, a set of M (M; channel number) curving lightpaths (lightwaveguides or optical fibers) having a narrow width region, a width enlarging region and a wide width region which are formed upon the bench, a wavelength selective filter provided at the wide width region for reflecting receiving beams upward, a set of photodiodes installed in front of the wavelength selective filter at the wide width region above the bench and light emitting devices mounted behind the ends of the lightpaths with a wide pitch for yielding transmitting beams. Propagating in outer M-channel element fibers of a ribbonfiber, receiving signal beams go into the lightpaths via the narrow width region, expand horizontally in the width enlarging region, arrive at the wide width region, and are reflected by the wavelength selective filter upward. The receiving beams go into the photodiodes which yield photocurrents in proportion to the powers of the receiving beams.

Abstract: In present invention, a photonic integrated circuit includes a number of optical coupling ports that extend from the surface of the device through at least a dedicated fibre guiding layer or a planar structure for coupling the end of an optical fibre mounted within the optical coupling port to an underlying planar optical wave guide or other light emitting device so that, in use, light is coupled between the underlying optical wave guide or light emitting device and the optical fibre. The other and of the optical fibre may be coupled to an optical fibre holder or to another optical coupling port. An important advantage of the present invention is the flexibility it gives to a designer since it eliminates the need to for waveguides to be routed to the edge of the chip. It also solves the problem of aligning a large number of fibres onto a chip since the optical coupling ports allow fibres to be passively aligned.

Abstract: A tap monitor including provisions to accommodate misalignment is disclosed. The tap monitor includes an optical coupler tuned to a desired optical splitting ratio. The light output of one of the output fibers or legs is directed to a sensor. The sensor resides in a hole in the substrate and is configured to absorb substantially all of the optical energy regardless of the precise alignment between the sensor and the fiber. Also disclosed are multiple tap monitors disposed in an array.

Abstract: A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.

Abstract: An athermal package for fiber photonic devices includes a ferrule to attach the optical fiber to the package. The ferrule has an opening to receive the optical fiber. The ferule is collapsed to attach the optical fiber to the athermal package. Alternatively, the athermal package uses adhesive bonds disposed in pockets of the package. The pockets have a narrow end and a wide end, with the narrow ends facing each other. The adhesive bonds are disposed in the pockets in contact the narrow ends of the pockets but not with the wide ends. The narrow ends physically confine the adhesive bonds so that if the bonds expand or contract due to environmental conditions (or the curing process), the adhesive either expands or contracts near the wide ends of the pockets. This allows the strain on the optical fiber segment between the bonds to remain substantially constant.

Abstract: This invention provides an optical fiber block that includes an optical-fiber-alignment portion and a stress-reduction-depth portion. In the optical-fiber-alignment portion, a V groove array is arranged to accommodate the non-coated fiber portion of a ribbon fiber. The V groove array is formed by primary and secondary wet-etching processes on a silicon wafer, and further includes first V grooves at both sides and second V grooves different from the first V grooves disposed between the first V grooves. Meanwhile, the stress-reduction-depth portion is formed by another wet etching, extending to a predetermined depth from the optical-fiber-alignment portion, for reducing stress caused by a variation in the coating thickness of the optical fibers.

Abstract: Wide range linear tuning of optical gratings is possible by selecting a thin film heater such that the temperature variation in heater's resistivity ? matches the temperature variation in the heat transfer coefficient of air h. A tunable optical device, such as a fiber grating with such a grating heater, exhibits near linear tuning characteristics over a wide range of temperatures and tuning currents. The heater is useable in other heat tunable optical devices such as interferometers.

Abstract: The optical module optically aligns two adjacently located optical components. The optical module comprises a substrate and at least one pre-alignment groove formed therein for coarsely aligning the two optical components. The optical components are seated in the at least one groove with a gap between them. The optical module further comprises a waveguide core located in the gap between the two optical components. The waveguide core extends from a light-guiding portion of one optical component to a light-guiding portion of the other optical component and guides light from one optical component to the other.

Abstract: The invention is directed to an immersion agent that can be used to couple optical waveguides to optical components. The invention is also directed to the use of an immersion agent, a coupling arrangement and a method for coupling optical waveguides to other optical components; for example, an optical chip.

Abstract: An optical device 1 has a substrate 2, whereas bare fibers 5 exposed from a coated optical fiber tape 3 by removing a coating 4 from its middle part are secured to the upper face part of the substrate 2. In the substrate 2, a transverse groove 8 is formed obliquely with respect to an axis of the bare fibers 5 so as to traverse core parts 5a of the bare fibers. An optical member 9 for reflecting a part of signal light transmitted through the bare fibers 5 is inserted in the transverse groove 8. A support member 10 is provided on the upper side of the bare fibers 5, whereas a support surface 10a of the support member 10 is provided with photodetectors 11 for detecting light reflected by the optical member 9. The support surface 10a of the support member 10 is inclined with respect to the upper face of the substrate 2, whereby the light entrance surface 13 of each photodetector 11 is inclined by a predetermined angle with respect to the upper face of the substrate 2.

Abstract: In an optical transmitter in which the amount of light of an LD is monitored by a monitor PD, and the power of the LD is kept constant by feedback, the present invention aims to provide an optical transmitter that is suitable for size and cost reductions while being able to input a greater amount of the LD light of to the monitor PD, and that is capable of performing higher-bit-rate transmission. The present invention is characterized in that a concave groove is formed in a substrate, and the monitor photodiode is mounted on a slanted face of the concave groove, and the light of the LD that is oppositely and horizontally disposed is received directly by the monitor the LD photodiode.

Abstract: An optical module package may include a body that, in one embodiment, may be made of metal. Ceramic inserts may be inserted into the metal body. The ceramic inserts may have a pair of shelves to facilitate electrical connection. In one embodiment, each shelf may include an upwardly directed contact surface and a downwardly directed contact surface. As a result, a more compact design may be formed in some embodiments which has desirable strength characteristics.

Abstract: An object beam divided by a light dividing means 12 is caused to enter a photo-refractive polymer layer 6 through an optical fiber 23. On the other hand, a reference beam divided by the light dividing means 12 is irradiated on the photo-refractive polymer layer 6 through a lens 13 from the opposite side. In this manner, the object beam is superimposed on the reference beam in the photo-refractive polymer layer 6 to provide an interference fringe or pattern. Since a photo-refractive polymer has a specific characteristic whereby the refractive index changes according to the intensity of irradiation light and the change is fixed after the irradiation light is stopped, a diffraction grating 5 corresponding to the interference fringe is recorded on the photo-refractive polymer layer 6. This diffraction grating 5 exhibits a specific characteristic whereby the object beam emitted from the optical fiber 23 is emitted in the direction of the reference beam.

Abstract: A method for producing a semiconductor device with a built-in light receiving element is provided. The device comprises a light receiving element region for receiving and converting an optical signal to an electric signal, the light receiving element region being provided on a substrate. The method comprises the steps forming an anti-reflection film in the light receiving element region on the substrate, and forming a protection film, the protection film serving as an etch stop film in a subsequent etching step.

Abstract: A three-storied structure optical communications module having a top case, a middle case and a bottom case which are piled and coupled in a vertical direction. The middle case has a silicon bench with M (channel number) lightwaveguides, a first WDM1, a second WDM2, M (channel number) laser diodes for generating transmitting signals ?1. The top case has a set of ?2 receiving photodiodes PD1s of the channel number M. The bottom case has another set of ?3 receiving photodiodes PD2s. ?2 signal beams and ?3 signal beams propagating in optical fibers go into the lightwaveguides on the middle case. The ?2 signal beams are reflected midway on the lightwaveguides by the WDM1 upward to the photodiodes PD1s on the top case and are converted into photocurrents by the photodiodes PDs. The ?3 signal beams are reflected halfway on the lightwaveguides by the WDM2 downward to the photodiodes PD2s and are converted into photocurrents by the photodiodes PD2s.

Abstract: A multi-layer laterally-confined dispersion-engineered optical waveguide may include one multi-layer reflector stack for guiding an optical mode along a surface thereof, or may include two multi-layer reflector stacks with a core therebetween for guiding an optical mode along the core. Dispersive properties of such multi-layer waveguides enable modal-index-matching between low-index optical fibers and/or waveguides and high-index integrated optical components and efficient transfer of optical signal power therebetween. Integrated optical devices incorporating such multi-layer waveguides may therefore exhibit low (<3 dB) insertion losses. Incorporation of an active layer (electro-optic, electro-absorptive, non-linear-optical) into such waveguides enables active control of optical loss and/or modal index with relatively low-voltage/low-intensity control signals. Integrated optical devices incorporating such waveguides may therefore exhibit relatively low drive signal requirements.

Abstract: A packaging device for alignment between a planar lightguide circuit and an optical-fiber block is disclosed. The device includes a planar lightguide circuit and a single optical-fiber block. The planar lightguide circuit includes an input port of an input waveguide, a plurality of output ports of output waveguides, arranged on the same surface as the input port of the input waveguide, and at least one dummy waveguide arranged abutting the outermost end of the output waveguides. An output port of the dummy waveguide is arranged on the same surface. The single optical-fiber block includes a plurality of ports corresponding to the input/output ports. The input/output ports are coupled in alignment with the input port of the input waveguide and the output ports of the output waveguides. The invention enables making a single processed alignment of the input/output ports of the planar lightguide circuit and the single input/output ports.

Abstract: An optical assembly which allows for passive alignment of the various elements is described. A substrate with a cut out portion and an upper surface is utilized as a mount for an optical array and an imaging assembly. The optical array, which preferably includes a plurality of optical fibers is positioned on V-grooves located on the upper surface. The imaging assembly, which preferably includes a plurality of lenses, such as GRIN lenses, is lowered at least partially into the cut-out portion. The optical fibers are optically coupled with said lenses. A waveguide, having a plurality of waveguide cores within a cladding, may further be optically coupled with the lenses, or alternatively, directly to the optical fibers. An integrated optic chip may also be affixed to the substrate or mounted on the substrate.

Abstract: To provide an optical interconnection circuit among wavelength multiplexing chips, capable of increasing signal transmission speed and of being easily made minute thereby being simply and easily fabricated, an electro-optical device, and an electronic apparatus, an optical interconnection circuit among wavelength multiplexing chips, which is disposed on a substrate, includes micro-tile shaped elements having a light emitting function or a light receiving function with wavelength selectivity.

Abstract: An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.