Abstract: A connectorized silicon bench and ferrule that aids in the passive alignment of optical fibers to optical components on the bench. The apparatus includes a bench having an optical component, a groove formed in the bench, the groove configured to accommodate an optical fiber; and a ferrule, including a recess region to accommodate the optic fiber when the ferrule is mounted onto the bench. The groove and the ferrule cooperate to passively align the optical fiber and the optical component on the bench. A connector sleeve, which accommodates the silicon bench and ferrule, includes a receptacle that is configured to receive a plug-in connector which optically couples the optical fiber to an optical network or link.

Abstract: A multi-layer laterally-confined dispersion-engineered optical waveguide may include one multi-layer reflector stack for guiding an optical mode along a surface thereof, or may include two multi-layer reflector stacks with a core therebetween for guiding an optical mode along the core. Dispersive properties of such multi-layer waveguides enable modal-index-matching between low-index optical fibers and/or waveguides and high-index integrated optical components and efficient transfer of optical signal power therebetween. Integrated optical devices incorporating such multi-layer waveguides may therefore exhibit low (<3 dB) insertion losses. Incorporation of an active layer (electro-optic, electro-absorptive, non-linear-optical) into such waveguides enables active control of optical loss and/or modal index with relatively low-voltage/low-intensity control signals. Integrated optical devices incorporating such waveguides may therefore exhibit relatively low drive signal requirements.

Abstract: An optical chip module has an optical chip on an element forming face with a light emitting or a light receiving element and terminals for electrical connection with the element and an optical fiber optically bonded to the element with its end face abutting the element. The outer circumference of the optical fiber has interconnect patterns extending from the end face, and in the axial direction, of the optical fiber and electrically connected with the terminals. Terminals of the optical chip are connected with the interconnect patterns at the end face of the optical fiber, intersecting circumferential lines of the end face of the optical fiber abutting against the element forming face and bonded thereto.

Abstract: In a planar-waveguide-type optical circuit 1, a reflection filter 4 is placed inside an oblique groove 3 formed to traverse optical waveguides 2n. Reflected light from the reflection filter 4 is detected by photodetectors 61n of a photodetector array 6, and thereby light intensity of signal light is monitored. A glass substrate made of glass material having a refractive index substantially identical to that of a core 20 of the optical waveguide 2n and filter fixing resin 5 fixing the reflection filter 4 is used for a substrate 10 of the optical circuit 1 constituting part of the groove 3. This inhibits reflection of light in various regions of the groove 3, thereby reducing generation of extra scattered light inside the groove 3 and its confinement. An optical waveguide module capable of enhancing monitoring characteristics of the signal light is thus realized.

Abstract: In optical module 1a, substrate 3 has first and second regions 3a, 3b and first and second optical waveguides 3c, 3d. First and second regions 3a, 3b are arranged along a predetermined plane. First and second optical waveguides 3d, are provided in the first region 3a and extend in a direction of a predetermined axis. Semiconductor light emitting device 7 includes a semiconductor light emitting element 7a optically coupled to first optical waveguide 3c and provided in second region 3e. Semiconductor driving element 9 is electrically connected to semiconductor light emitting element 7a. Semiconductor driving element 9 is mounted on mount member 13. Optical element 15a reflects a part of incident light and transmits a part of the incident light, and semiconductor light receiving device 17 includes a light receiving element 17a provided in first region 3a so as to be optically coupled to optical element 15a.

Abstract: An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a registration feature. The registration feature is configured to couple to a fixed reference mount.

Abstract: A bi-directional transceiver, integrated module based on a silicon optical bench is provided, which comprises at least a laser diode, at least a signal detector, at least a thin film filter, at least an optical lens, an optical fiber and an SiOB. As the optical signal of specific wavelength can be reflected or inserted by thin film filter, the module has functions of a wavelength division multiplexer and a bi-direction transceiver. Furthermore, the optical lens improves the coupling efficiency between the laser diode and the optical fiber. On the other hand, a plurality of optical elements are integrated on the same SiOB. Hence, only a single optical fiber is used and optical signals of multiple wavelengths can be handled simultaneously.

Abstract: An integrated type optical coupling device capable of easily accurately performing an optical arrangement between a narrow-pitch multi-channel optical waveguide and an optical fiber array and a master used in fabricating the same are provided. By forming a fixing projection between the optical fibers, the dynamic stability of the optical fiber array is increased and the optical arrangement between the optical waveguide and the optical fiber is easily accurately performed by hand. Accordingly, the cost required for the alignment is reduced and the alignment error due to the rolling of the optical fiber is not generated. In addition, the multi-step metal master is fabricated by using a photoresist film for X-ray exposure, and the narrow-pitch multi-channel optical coupling device is fabricated in a hot embossing method using the same, thereby the high-integrated device can be fabricated at a low price.

Abstract: VCSEL array configurations for use with parallel WDM transmitters are disclosed. Transmitters that use several wavelengths of VCSELs are built up out of multiple die to avoid the difficulty of manufacturing monolithic arrays of VCSELs with different optical wavelengths. VCSEL configurations are laid out to insure that VCSELs of different wavelengths that destined for the same waveguide are close together.

Abstract: A planar wafer-level packaging method is provided for a laser and a microlens. Light from the laser is directed and shaped by the microlens to couple into an external light guide. A plurality of such assemblies, each comprising a laser and a microlens may be assembled on a single planar substrate. A tapered surface is formed on the microlens. The microlens may be formed from a silicon substrate. The angle of the tapered surface causes an accurate cone or pyramid shape. The tapered surface is formed such that the axis of the cone or pyramid is aligned with the optical axis of the lens. The lens may then be aligned with the optical axis of the laser. A light guide receptacle is formed with a tapered surface that matches the tapered surface of the microlens. The tapered surface of the receptacle is formed such that the axis of the cone or pyramid is aligned with the optical axis of the receptacle. The receptacle may then be passively aligned with the microlens by mating the tapered surfaces.

Abstract: Disclosed is a printed circuit board with opto-via holes for transmitting an optical signal to an optical waveguide in the PCB, and a process of forming the opto-via holes. The process comprises forming a plurality of via holes on a plurality of copper clad laminates using a drill, plating an inner wall of each via hole, exposing and etching the plated portions of an upper and lower side of each copper clad laminate to form a circuit pattern on the upper and lower side of the copper clad laminate, layering the patterned copper clad laminates on each other using an insulating resin adhesive, and removing the insulating resin adhesive in the predetermined via holes to form opto-via holes.

Abstract: An optical component comprising an optical waveguide and adjacent to it at least one grating array adapted to reflect stray light away from said optical waveguide. The use of a grating array with a plurality of structures like polygons or stripes gives the possibility to define a multiple of reflection directions. This is obtained by using polygons layed out in different orientations up to a random one or a Bragg grating preferably defined with a non-uniform period (chirped). Such grating arrays are usually structured within the same layer as the optical waveguide core layer.

Abstract: The present invention provides a connector-integrated type polymer optical waveguide, comprising: an optical waveguide including a film substrate for clad, an optical waveguide core provided on the film substrate, and a clad layer formed on side faces and a top face of the core; a pair of connector sleeves formed at positions at which the connector sleeves sandwich the optical waveguide core at least in one end portion of the polymer optical waveguide; and a rigid member for connector formation, wherein the film substrate for clad and the connector sleeves are fixed to the rigid member for connector formation in such a state that the center of the optical waveguide core and the center for connector sleeves are substantially on the same plane. The present invention also provides a method for producing the above-mentioned connector-integrated type polymer optical waveguide and a mold to be used for the method.

Abstract: An optical apparatus comprises an optical device fabricated on a substrate, an external-transfer optical waveguide fabricated on the substrate and/or on the optical device, and a transmission optical waveguide. The optical device and/or the external-transfer waveguide are adapted for and positioned for transfer of optical power therebetween (end-transfer or transverse-transfer). The external-transfer waveguide and/or the transmission waveguide are adapted for transverse-transfer of optical power therebetween (mode-interference-coupled or adiabatic). The transmission waveguide is initially provided as a component mechanically separate from the substrate, device, and external-transfer waveguide. Assembly of the transmission waveguide with the substrate, device, and/or external-transfer waveguide results in relative positioning of the external-transfer waveguide and the transmission waveguide for enabling transverse-transfer of optical power therebetween.

Abstract: This invention provides an optical fiber wiring board having excellent optical property, high reliability and high mounting property. This invention relates to an optical fiber component for connection having a substrate on which a plurality of optical fibers being wired, wherein a foam polymer layer is provided on a surface of the substrate wiring the optical fibers, or both on a surface of the substrate wiring the optical fibers and on a surface opposite to the surface of the substrate wiring the optical fibers, or so that whole of substrate is covered. The optical fiber component of the present invention may be further provided with a protective layer and may be filled with a filler. This invention provides also a manufacturing method of the optical fiber component for connection.

Abstract: To provide an optical interconnection circuit among wavelength multiplexing chips, capable of increasing signal transmission speed and of being easily made minute thereby being simply and easily fabricated, an electro-optical device, and an electronic apparatus, an optical interconnection circuit among wavelength multiplexing chips, which is disposed on a substrate, includes micro-tile shaped elements having a light emitting function or a light receiving function with wavelength selectivity.

Abstract: A waveguide type variable optical attenuator has: a substrate; two optical circuits that are in parallel formed on the substrate, each of the optical circuits including two couplers that conduct the branching and coupling of light and are connected to the input port and output port of light and two waveguides through which the two couplers are connected; a polarization maintaining fiber one end of which is connected to the output port of one of the two optical circuits and the other end of which is connected to the input port of the other of the two optical circuits while being twisted 90°; and a heater that is provided around neighboring waveguides of the two optical circuits such that the neighboring waveguides share heat to be generated by the heater.

Abstract: The present invention relates a fiber optical module. A first filter 5 transmits a light with a first predetermined wavelength (?A ), and reflects lights with a second predetermined wavelength (?B) and a third predetermined wavelength (?C). A second filter 6 transmits the light with wavelength ?B and reflects the light with wavelength ?C. A first light-receiving device 2 receives the light with wavelength ?A, and a second light-receiving device 3 receives the light with wavelength ?B, A light-emitting device 4 emits the light with wavelength ?C. A first optical fiber 1a leads the lights with wavelengths ?A and ?B to the first filter 5. A second optical fiber 1b leads the light with wavelength ?B reflected by the first filter 1a. A third optical fiber 1c leads the light with wavelength ?C emitted by the light-emitting device 4 to the second filter 6.

Abstract: An optical device is provided which includes a plurality of optical modules. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to a substrate. A plurality of optical modules mount on the substrate to form the optical device.

Abstract: Transmission signal light emitted from a light emitting element is coupled to an optical waveguide and guided into a transmission line. A light monitor a portion of leakage light, which is used for control of optical output of the light emitting element. The optical semiconductor module is covered with transparent resin that is closely matched to the refractive index of a clad layer covering the optical waveguide. The light leaked to the inside of the clad layer is not reflected at a top surface of the clad layer and is received at a light receiving surface of the light monitor.

Abstract: An optical mount substrate and a manufacturing method of the optical mount substrate. An optical fiber guide section for arranging and fixing an optical transfer section, having an optical waveguide or an optical fiber, is formed. An electrical conductivity member is embedded in the optical mount substrate so that it penetrates a first principal plane of an arrangement section for arranging an optical device optically connected with the optical waveguide or the optical fiber on the first principal plane, and a second principal plane of the arrangement section parallel to the first principal plane. The optical fiber guide section and the arrangement section are formed by pressing a mold member to a heated and softened substrate to transfer inversion geometry of the mold member onto the substrate. The electrical conductivity member, having a predetermined shape, is directly pressed onto the heated and softened substrate to embed it into the substrate.

Abstract: The invention relates to an optical, integrated alignment device for accurately aligning and efficiently coupling energy between in-plane optical devices. A semiconductor substrate is etched to include a groove for an optical fiber and a lens for passing an optical signal from a cut fiber to a photodetector. The etched semiconductor substrate may be used to pass an optical signal from a surface light emitting device to a cut fiber. The end of the optical fiber is cut at a slant that redirects an optical signal from the fiber through the lens or vice-versa. The lens focuses the optical signal onto a target.

Abstract: A method for making a transmitter optical subassembly (TOSA) is provided. In the method, an alignment in the Z-direction between a fiber stub array (FSA) and a VCSEL array is performed first. Then, an alignment in the X-Y direction is performed. A rough prealignment in the X-Y direction may also be performed prior to the alignment in Z-direction. A vertical cavity surface emitting laser (VCSEL) array may be hermetically sealed using a lens assembly or by using a separate lid assembly. The hermetic sealing and attaching of different components may be achieved by laser welding and/or soldering or any other suitable method.

Abstract: A multi-layer laterally-confined dispersion-engineered optical waveguide may include one multi-layer reflector stack for guiding an optical mode along a surface thereof, or may include two multi-layer reflector stacks with a core therebetween for guiding an optical mode along the core. Dispersive properties of such multi-layer waveguides enable modal-index-matching between low-index optical fibers and/or waveguides and high-index integrated optical components and efficient transfer of optical signal power therebetween. Integrated optical devices incorporating such multi-layer waveguides may therefore exhibit low (<3 dB) insertion losses. Incorporation of an active layer (electro-optic, electro-absorptive, non-linear-optical) into such waveguides enables active control of optical loss and/or modal index with relatively low-voltage/low-intensity control signals. Integrated optical devices incorporating such waveguides may therefore exhibit relatively low drive signal requirements.

Abstract: An optoelectronic assembly for an electronic system includes a support electronic chip set configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions. A first substrate having a first surface and an opposite second surface is in communication with the support electronic chip set via the first surface while a second substrate is in communication with the second surface of the first substrate. The second substrate is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set and an optical fiber array is aligned at a first end with the optoelectronic transducer and with an optical signaling medium at a second end.

Abstract: Two techniques are disclosed for writing waveguides between laser diodes and an optical fiber such that the laser diodes are aligned with their respective waveguide facets. The first technique utilizes a light sensitive polymer, such as a ultra-violet (UV) cross-linkable polymer. A precision writing system locates the light emitting centers of the laser diodes and writes the waveguide circuit by exposing the waveguiding regions with the appropriate light. The unexposed areas of the core layer are developed with a solvent and removed. The entire device is then encapsulated with a low-index cladding polymer. The second technique utilizes an active polymer approach in which waveguide regions are formed when the writing beam aligns the dipole molecules in the polymer to cause a change in the refractive index of the polymer.

Abstract: An optoelectronic device is provided having an active alignment. The lens and the optoelectronic device are mounted on their respective carrying members, and the carrying members are placed proximate to each other in a loose alignment controlled by alignment pins loosely engaging oversized alignment opening. An alignment range is created by a difference in the diameter of the alignment pins and the alignment opening, allowing the lens and optoelectronic device to be moved with respect to each other and actively aligned. The member carrying the lens may also include a connector stop cooperatively arranged with the alignment pins to provide an aligned coupling between an optical fiber connector and the optoelectronic component.

Abstract: Optical waveguide composite materials and integrated optical subsystems with low loss connection to optical fibers, are disclosed. The waveguide material has a varying thickness and/or refractive index from one portion (816) to another (820) and can be varied in all three directions. Methods of producing the composite materials and waveguides are also disclosed.

Abstract: A coupling configuration for connecting an optical conductor to an opto-receiver has a parabolic mirror or a spherical mirror that reflects light emerging from the optical conductor onto a launching mirror through which the light is launched into the opto-receiver. Such a configuration is largely adjustment-free and therefore particularly suitable for the connection of single-mode fibers (SMF).

Abstract: A butt joined electronic assembly has first and second matching coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on respective first and second electrical elements that are secured on respective independently positioned and mechanically joined first and second open end face carriers. The first and second matching coplanar transmission structures are electrically coupled together via substantially flat electrical conductors.

Abstract: An optoelectronic subassembly for optoelectronic modules includes a supporting substrate with an optoelectronic device mounted on a mounting surface. A supporting structure includes a trench for mounting the subassembly and a lens assembly. Four offset arms are provided each including a substrate-mounting portion, a supporting-structure-mounting portion, and a linking portion. The substrate-mounting portion and the supporting-structure-mounting portion have parallel surfaces with the linking portion extending at an angle therebetween. The arms include deformable material for allowing small changes in the angle. One of the parallel surfaces of each of the offset arms is mounted on either the mounting surface or an opposed surface of the supporting substrate and the other of the parallel surfaces is mounted on the support structure with the substrate suspended in the trench. The linking portion of the arms is then deformed to align the optoelectronic device with the lens assembly.

Abstract: In a bi-directional optical transceiver module, a first waveguide transmits a optical signal received from a light source to a high reflection layer formed on a waveguide substrate. A second waveguide extends from the optical fiber to the high reflection layer. With a first mode coupling region formed by ends of the first and second waveguides near the high reflection layer, the second waveguide transmits the transmission optical signal mode-coupled from the first waveguide to the optical fiber and receives the reception optical signal from the optical fiber. A third waveguide extends from the optical detector to near an end of the optical fiber. With a second mode coupling region formed by an end of the third waveguide and the other end of the second waveguide, the third waveguide transmits the reception optical signal mode-coupled from the second waveguide to the optical detector.

Abstract: An optical package substrate and a molding method therefor which provide for easy production, easy mounting of optical elements such as photodiodes and lasers, good functionality, productivity and economy, and an optical device incorporating the package substrate. On the surface of an optical package substrate, a guide groove used for the positioning of an optical fiber and a tapered face adjoining the guide groove are provided, the tapered face being formed to have a predetermined angle. A mirror for reflecting light is formed on the tapered face. An optical fiber is affixed in the guide groove. A surface reception type photodiode, which is placed in a position for receiving light deflected by the mirror, is mounted above the tapered face. By providing a positioning marker for a light receiving element on the optical package substrate, it becomes particularly easy to mount the surface reception type photodiode through passive alignment.

Abstract: An optical component of the present invention is compensated its optical dispersion, including third order dispersion, at low loss using optical dispersion compensating element comprising multi-layer film. In the optical component, an optical dispersion compensating element and a functional element are connected in series along an optical path.

Abstract: It is an object of the invention to supply an optical communication device and an optical communication module that are provided with a substrate, a vertical waveguide that is formed in the substrate and that is for transmitting light in a thickness direction of the substrate, a horizontal waveguide that is formed in the substrate and that is for transmitting light in a planar direction of the substrate, and a light bending portion for optically coupling the vertical waveguide and the horizontal waveguide. The substrate is a laminated body including a first substrate in whose surface a groove is formed and in which a reflective mirror is disposed on at least one end of the groove, and a second substrate layered to the surface of the first substrate in which the groove is formed and in which a through hole located in opposition to the portion of the groove in which the reflective mirror is disposed is formed.

Abstract: A tunable optical filter (30) includes a thin film waveguide (10) and a ring (308) surrounding the thin film waveguide. The ring can be mechanically pressed inwardly toward or pulled outwardly away from the thin film waveguide by external radial forces (306). A central wavelength of the tunable optical filter can be tuned according to the external radial forces. The thin film waveguide includes a substrate (102) and a multi-layered thin film (104) deposited on the substrate. The multi-layered thin film includes high refractive index layers (106) and low refractive index layers (108) alternately superposed on one another to form the multi-layered structure.

Abstract: Provided are an optical module used in a high-frequency optical communication system, and an optical receiver module, an optical transmitter module, and an optical repeater module for receiving, transmitting, and repeating an optical signal in a high frequency band. The optical module includes a silicon substrate, the optical fiber, devices, a signal transmission line, and an oxidized porous silicon layer. In the silicon substrate, a V-shaped guide groove for arranging an optical fiber is formed. The optical fiber is installed in the V-shaped guide groove and used as a path through which an optical signal is input or output. The devices are mounted on the silicon substrate to receive, transmit, or repeat the optical signal. The signal transmission line electrically connects the devices. The oxidized porous silicon layer is formed at least between the silicon substrate and the devices to prevent signal loss.

Abstract: The present invention is an optoelectronic device including a circuit board with a plurality of signal traces, a first ground plane, and a second ground plane. The impedance of a signal trace is determined by which of the first ground plane and the second ground plane is closest to the signal trace. The area of the first ground plane coincident with a first signal trace is left intact in order to set the impedance of the first signal trace, by reference to the first ground plane. The area of the first ground plane coincident with a second signal trace is removed in order to set the impedance of the second signal trace, by reference to the second ground plane.

Abstract: An optical element-mounting substrate that makes it easy to optically couple the optical semiconductor element to the optical fiber or to the lens and that can be highly integrated while suppressing deterioration in the high-frequency signals. The optical element-mounting substrate for optically coupling the optical semiconductor element to the optical fiber through the lens, comprises an insulating film formed on the surface of the optical element-mounting substrate, grooves formed on the substrate for installing the optical fiber and the lens, a thin-film electrode formed on the insulating film, a thin-film capacitor and a thin-film temperature sensor arranged maintaining a distance from the thin-film electrode, and a solder film formed on the insulating film in a region where the optical semiconductor element is mounted so as to be electrically connected to the thin-film electrode.

Abstract: In accordance with the invention, an optical fiber is coupled to a planar waveguide through 1) a series of planar waveguide segments of enlarged cross section and 2) a segment of vertically tapered cross section. The combination of spaced segments and tapered segments provide efficient coupling over a much shorter length than required for conventional adiabatic coupling.

Abstract: A novel electro-opto-mechanical assembly is provided. The electro-opto-mechanical assembly comprising: a first wafer, the wafer having a top and bottom surface; at least one optical element disposed on one surface of the first wafer; at least one discrete opto-electronic transducer element disposed on the bottom surface of the first wafer and in optical communication with the optical element; and an optical waveguide; wherein the first wafer and the optical element form an optical relay which relays light between the discrete opto-electronic transducer and the optical waveguide and thereby forms an efficient optical coupling between the discrete opto-electronic transducer and the optical waveguide.

Abstract: An optical waveguide structure has lines (2), crossings (3), and branchings (4). In the area of the branchings (4), the waveguide structure consists of planar waveguides made of a waveguide material that is put into troughs (7) formed into a substrate (8). The waveguide material has a higher refractive index than the material delimiting the troughs (7). In the area of said crossing (3) the waveguide structure consists of fibers (5) which cross in the area of the crossings.

Abstract: An optical coupling structure useful in optical switching devices is described. The optical coupling structure includes a core layer for guiding a light beam exiting a core layer of an optical fiber into a slab waveguide layer. The core layer of the optical coupling structure avoids a power loss of a light beam and establishes an adiabatic coupling. The core layer of the optical coupling structure may have a tapered surface.

Abstract: A method of producing a modulated light source including the steps of providing a modulator, fiberlessly coupling a laser diode light source to the modulator and enclosing the modulator and the laser diode light source within a housing together with output optics operative to direct modulated light from the modulator into an optical fiber extending outwardly from the housing.

Abstract: The present invention aims at providing a connecting method capable of suppressing an influence of stray light for a plurality of optical function devices formed on the same substrate, and an optical apparatus applied with the control method. To this end, in the connecting method of optical function devices according to the present invention, the plurality of optical function devices formed on the same substrate are cascade connected so that both ends of an optical path passing through the plurality of optical function devices are positioned on the same end face of the substrate. According to such a connecting method, it becomes possible to effectively suppress a leakage of stray light from an optical input side to an optical output side.

Abstract: Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.

Abstract: An attachment structure, and an associated method and system for forming the attachment structure. An end of an optical fiber is melted while the end is above, but not touching, an exposed surface of a substrate such that said end becomes molten. The optical fiber is substantially optically transparent to laser radiation of a given wavelength. The molten end is moved toward the exposed surface of the substrate until the end makes physical contact with the exposed surface of the substrate. The moving is performed sufficiently fast so that the end is still molten when the end initially makes the physical contact with the exposed surface of the substrate. The physical contact is maintained for a sufficient length of time to enable the end to bond to the exposed surface of the substrate with no intervening matter between the end and the exposed surface of the substrate.

Abstract: A semiconductor photodetection device includes a light incident facet for receiving light from an optical waveguide. Light received at the light incident facet is refracted through a photo-absorption layer to register photonic events. A material may be introduced between the optical waveguide and the light incident facet to improve responsiveness of the device. The light incident facet may be at an angle to the direction of the light emitted from the optical waveguide to cause the incident light to be refracted through several layers of the semiconductor photodetection device.

Abstract: In the present invention, a frame for mounting a fiber optic taper and a CCD chip in optical contact comprises a resilient support for supporting the fiber optic taper adjacent the CCD chip, means for lowering the fiber optic taper towards the CCD chip and means for applying pressure to urge the fiber optic taper onto the CCD chip. The weight of the fiber optic taper is supported by the resilient support as it is lowered into contact with the chip. Once in engagement with the CCD chip, the fiber optic taper can be pressed against the CCD chip to provide a positive pressure in excess of that due to its weight. As the support is resilient, it provides resistance to the positive pressure, thereby preventing the pressure on the CCD chip from becoming great enough to cause damage to the fragile CCD chip.

Abstract: The invention features a programmable optical chip. The optical chip has a plurality of optical functions, each of which is connected to a waveguide having a core and a cladding. A photosensitive layer is disposed between at least three of the waveguides, and the photosensitive layer has a refractive index similar to that of the cladding prior to exposure to irradiation. The photosensitive layer changes refractive index upon exposure to irradiation to selectively form an optical connection between at least two of the waveguides.