Abstract: A reflector chip of the present invention integrates a planar lightwave circuit (PLC) waveguide wafer and an active component, such as a photo-detector or laser, e.g. vertical cavity surface emitting laser. Typically, the PLC waveguide wafer includes a waveguide core region bound by upper and lower cladding layers. An end of the waveguide core region is mounted within a channel, trench, notch or recess within the bottom surface of the body of the reflector chip. A V-notch is also formed in the bottom surface of the body of the reflector, including a reflective surface, which redirects the light between the active component and the waveguide core region.

Abstract: Provided are high power PLC optical Tx module and PLC optical Tx/Rx module. The PLC optical Tx/Rx module is located in an OLT of a PON system. The high power PLC optical Tx/Rx module includes a photodiode, a laser diode, an SOA, an optical coupler, and a PLC platform. The photodiode converts an input optical signal into an electrical signal, and the laser diode generates an optical signal of a predetermined wavelength. The SOA amplifies the optical signal generated by the laser diode, and the optical coupler couples optical signals, outputs the coupled signal to a splitter, divides an optical signal from the slitter, and outputs the divided signals to the photodiode. The PLC platform incorporates the photodiode, the laser diode, the SOA, and the optical coupler into one package to allow an optical signal to be output with high power.

Abstract: An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 ?m or more.

Abstract: An arrangement for providing optical coupling into and out of a relatively thin silicon waveguide formed in the SOI layer of an SOI structure includes a lensing element and a defined reference surface within the SOI structure for providing optical coupling in an efficient manner. The input to the waveguide may come from an optical fiber or an optical transmitting device (laser). A similar coupling arrangement may be used between a thin silicon waveguide and an output fiber (either single mode fiber or multimode fiber).

Abstract: An optoelectronic device includes a submount and a lid. The submount includes a substrate and a lens and a laser above the substrate. The lid defines a cavity having a surface coated with a reflective material to form a 45 degree mirror. The mirror reflects a light from the laser to the lens and the light exits the optoelectronic device through the submount.

Abstract: A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.

Abstract: An optical waveguide module includes a wiring board, and a light-receiving element and optical waveguide substrate that are positioned on both sides of this wiring board. The wiring board includes a base member having transparency to light of the wavelength that can be received by the light-receiving element; surface electrical wiring on the surface of the base member, and filter film on the rear surface of the base member for passing only light of the wavelength that can be received by the light-receiving element and for reflecting light of other wavelengths. An aperture larger than the core of the optical waveguide is formed in the surface electrical wiring. The light-receiving element (9) is flip-chip mounted on surface electrical wiring (4) using bumps (11), and the light-receiving region (10) of the light-receiving element (9) is arranged to face the wiring board (7).

Abstract: Embodiments provide single fiber bidirectional HDCP modules. A signal fiber module includes at least one laser and at least one detector and a waveguide combiner/splitter. An optical fiber is used as a cylindrical lens in order to partially collimate in the vertical axis the optical signals entering and leaving branches of a waveguide. The branches of the waveguide have lens-shape interfaces in order to at least partially collimate in the horizontal axis the beams entering and leaving the waveguide. Each branch of the waveguide tapers toward a join-section of the waveguide. At the join section, the cross-section of a laser branch is smaller than the cross-section of a detector branch. If more than one detector is present in a module, the cross-sections of the detector branches differ from each other. If more than one laser is present in a module, the cross-sections of the laser branches differ from each other.

Abstract: Printed circuit boards that include optical interconnects include a flexible optical waveguide embedded or locally attached to the board having at least one end mechanically decoupled from the board during fabrication that can be fitted with a mechanical connector. Also disclosed are processes for fabricating the circuit board.

Abstract: Provided are a photonic-crystal plate that forms an optical waveguide and an optical device assembly using the same, and more particularly, a vertical-type photonic-crystal plate and an optical device assembly configured to be easily integrated with surface-emitting light source devices and surface-receiving light detector devices. The photonic-crystal plate includes a plurality of cylindrical through holes formed in a thickness direction and arranged in a periodic crystal lattice structure. The plate further includes: a main crystal lattice defect that forms a main optical waveguide for passing lights in a direction perpendicular to the photonic-crystal plate; and a sub-crystal lattice defect that forms a sub-optical waveguide for causing light in a specific wavelength band among the lights passing through the main optical waveguide to be optically coupled and passing the coupled light in the direction perpendicular to the photonic-crystal plate.

Abstract: One or more single mode waveguide devices are fiber coupled such that signals to an optical element affect the coupling of the waveguide device to an optical fiber. A number of systems and methods are disclosed to adjust the coupling of the waveguide device to the optical fiber. These include dithering the tunable optical element at different frequencies along differing axes and using a lock-in technique to derive an error signal for each degree of motion, using a beamsplitter to form a secondary image of the focused beam on a position-sensitive detector, the use of a chiseled fiber to generate reflections from the angled facets, using an additional laser for a secondary image, or obtaining a secondary image from an angled fiber or a parasitic reflection.

Abstract: A low-cost alignment system suitable for aligning a wafer to a test fixture includes a bundle of optical fibers wherein at least one fiber serves to deliver illumination to the alignment target from an end thereof, and a plurality of receiver fibers, each having ends with a known spatial relationship to the end of the illuminator fiber. The ends of the fiber bundle have a known spatial relationship to the fixture. In some embodiments, the fiber bundle is disposed within the fixture such that there is an unobscured optical path between the wafer and the receiving and illuminating ends of the fibers. In some embodiments, the fiber bundle is coupled to a light source and a light sensor mounted on the fixture. In some embodiments the alignment target is one or more bonding pads disposed on a wafer.

Abstract: An optical element and an optical transmission member are fixedly secured onto a substrate so as to be coupled to each other. In this substrate, a through hole is formed between an optical element secured portion and an optical transmission member secured portion. In an attempt to assemble these optical transmission member and optical element so as to make the coupling at an optimal position, first, the position of the optical transmission member is adjusted to an optimal position, and after measuring the position by a laser micrometer, the optical transmission member is fixedly secured thereto by using a soldering material. Thus, measurements are again carried out by the laser micrometer to detect an amount of deviation from the measured value before the securing process, and the secured portion is again fused so that the optical transmission member is shifted based on the amount of deviation, and again fixedly secured thereon.

Abstract: An optical display system includes an image generator providing discrete anamorphic picture elements to form an image, with each picture element spatially compressed along only a short dimension. A fiber optic array magnifier extends from the image generator and includes optical fibers dimensioned for optically coupling to each discrete anamorphic picture element. An output face of the array magnifier is bias-cut for magnifying the image along the short dimension. A light redirecting structure includes layered arcuate waveguide slabs optically coupled to the array magnifier with each of the arcuate waveguide slabs optically coupled to the array magnifier. A screen is integrally formed with the light redirecting structure and includes tapered slab waveguide portions positioned between light absorbing material having a saw tooth styled edge for providing multiple scattering and thus multiple absorption of ambient light incident upon the screen.

Abstract: An arrangement for providing passive alignment between an optical fiber and the “tip” of a nanotaper coupling waveguide (the nanotaper formed within the SOI layer of an SOI-based optoelectronic arrangement). The arrangement includes a separate fiber carrier support element, including a longitudinal V-groove for supporting the fiber and an alignment feature formed parallel thereto. The SOI structure is formed to include an associated alignment slot, so that as the fiber carrier is positioned over and attached to the SOI structure, the alignment feature and alignment slot will mate together and provide passive alignment of the optical fiber to the nanotaper waveguide tip.

Abstract: An optical link module of the present invention for connecting light beams by deflection and including light-emitting devices arranged in a planar manner; an optical fiber bundle that is an optical waveguide for receiving the light beams from the light-emitting devices, and an optical turn which includes a plurality of aspherical lenses which are disposed between the light-emitting devices and the optical fiber bundle and are formed while corresponding to the number of the light-emitting devices and the number of optical fibers.

Abstract: A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide structure is positioned proximate to the substrate and aligned with the optical via to communicate optical signals with the optoelectronic die through the optical via.

Abstract: An image detection system includes a multimode fiber amplifier. The multimode fiber amplifier includes a core configured to receive an input image that includes a plurality of input beams spanning a range of incidence angles and to propagate at least some of the input beams as different ones of a plurality of transverse modes along the core. The multimode fiber amplifier provides an amplified image at an output facet thereof corresponding to the input image. A focal plane detector includes an array of detectors arranged to receive different portions of the amplified image.

Abstract: A first optical device has an optical fiber mount with an optical fiber disposed thereon, and an optical demultiplexer for demultiplexing a portion of an optical signal beam transmitted through the optical fiber, as a demultiplexed optical signal beam, and guiding the demultiplexed optical signal beam out of the optical fiber. The optical fiber has a first tapered surface for emitting the demultiplexed optical signal beam therethrough. The first tapered surface is inclined at an angle ?1 of at least 1° to an optical axis of the optical fiber. The distance (h) between the optical axis of the optical fiber and the first tapered surface is progressively greater along the direction in which the optical signal beam travels through the optical fiber.

Abstract: The invention relates to a light redirecting polymeric film comprising a plurality of polymeric individual optical elements wherein the elements comprise curved wedge shaped features in the plane of the film, having a length in the range of 800 to 4000 micrometers.

Abstract: When a resin 59 to form a molded body 20 is poured and a lead frame 30 is attached to a front end face 21 of the molded body 20 by insert molding, protective leads 32 provided on both outsides of a lead pattern 31 of the lead frame 30 moderate the flow of the resin 59 and the force acting on the lead pattern 31 is decreased, so that misregistration of the lead pattern 31 can be prevented. Accordingly, the inserted and molded lead frame 30 can be wired on the front end face 21 of the molded body 20 for easily accomplishing three-dimensional electric wiring.

Abstract: An optical waveguide chip including a core portion as an optical waveguide, a clad portion composed of a lower clad layer and an upper clad layer, and an optical fiber guide portion which is formed integrally with the clad portion for positioning a single-mode optical fiber which is to be connected with the core portion. Each portion of the optical waveguide chip is formed by creating a layer of a radiation-sensitive polysiloxane composition by photolithography. At least two kinds of radiation-sensitive polysiloxane compositions are used so that the core portion has a higher refractive index than the clad portion.

Abstract: An optical data link includes a circuit board and an optical module component. The circuit board includes first and second mounting sections on a principal plane thereof. A step is formed between the first mounting section and the second mounting section. The first mounting section has the optical module component, and the second mounting section has an electron device. The optical module component includes a mounting component, a semiconductor optical device, and an optical transmission medium. The semiconductor optical device of the optical module component is electrically connected to the electron device, and is mounted on a first region of the mounting component. The optical transmission medium is supported by a second region of the mounting component, and is optically coupled with the semiconductor optical device.

Abstract: An optical connecting device includes a substrate including an optical waveguide, and a connecting portion provided on the substrate and optically connecting to the optical waveguide. The connecting portion includes a base provided with a groove that fixes an optical fiber and a 90 degrees optical path conversion mirror disposed to face an end of the optical fiber.

Abstract: An optical waveguide monitor equipped with an output light monitor having a decreased restriction in the dimensions and form thereof, a high reliability and a low production cost includes an optical waveguide element (having a plurality of surface waveguide portions, a connecting portion for converging and connecting the surface waveguide portions and an output light-outputting waveguide portion connected to the connecting portion each formed on a dielectric substrate plate; an output light optical fiber connected to an output end of the output light-outputting waveguide portion, a reinforcing capillary for reinforcing a connection between the optical waveguide element and the output light optical fiber and a monitoring light receiving means, wherein the reinforcing capillary has a hole or groove for containing and supporting the output light optical fiber therein, a connecting face thereof bonded to an output end face of the substrate, and a terminal surface opposite to the connecting face, to thereby enable

Abstract: Decrease in optical near-field intensity is prevented when an light propagating medium made of a high refractive index material, such as a waveguide or a lens, is combined with a scatterer for producing optical near-field. Near the optical near-field generating element, a second light propagating medium is disposed in contact with a first light propagating medium of a high refractive index material, such as a waveguide or a lens. The refractive index of the second light propagating medium is made smaller than the refractive index of the first light propagating medium.

Abstract: Provided is a double waveguide electroabsorption modulator, in which two spot size converters are integrated between first and second optical waveguides, thereby reducing an insertion loss between an optical fiber and an optical modulator while favorably operating even in high input optical power. Therefore, the electroabsorption modulator can stably operate in higher input optical power while reducing an optical coupling loss and an optical confinement factor (OCF).

Abstract: A semiconductor device integrated with optoelectronic components includes a carrier board with at least two openings; a first and a second optoelectronic component disposed in the openings respectively, each of them having an active surface and an opposite non-active surface, wherein the active surface has a plurality of electrode pads and an optical active area; a dielectric layer formed on a surface of the carrier board and the active surfaces, and having a plurality of vias and openings to expose the electrode pads and the optical active areas respectively; and a circuit layer formed on a surface of the dielectric layer and electrically connected to the electrode pads directly.

Abstract: A reconfigurable intelligent subsystem may include a bidirectional photonic integrated circuit. The bidirectional photonic integrated circuit may include a distributed reflector (DR) laser or a distributed feedback laser (DFB) that emits light of a first wavelength, and a longitudinal waveguide portion that transmits light of a second wavelength, while attenuating light of the first wavelength. The bidirectional photonic integrated circuit may be coupled to a single mode optical fiber to provide two-way optical communication between a service provider (“headend”) and a subscriber.

Abstract: The present invention provides a micro-optical device which may be used as an optical pigtailing assembly for waveguides. In an exemplary configuration the assembly includes a first chip which includes an optoelectronic component and an optical fiber. The optical fiber and optoelectronic component are coupled with an optical component, such as one or more waveguides on an integrated optic chip.

Abstract: A waveguide type optical device includes a substrate where a waveguide is formed; a supplemental plate connected on the substrate by using an adhesive; and a groove forming part formed by cutting through the supplemental plate so as to reach the substrate and cut the waveguide, the groove forming part being where a functional thin film is inserted. The supplemental plate and the waveguide adhere to each other or come close to each other in a range not influencing a mode of light.

Abstract: The invention relates to an optical connector assembly for optically connecting to a waveguide structure in a x-y plane of a layer stack, wherein the connector assembly comprises a coupling device providing a first optical path, and the waveguide structure provides a second optical path, deflecting from said first optical path. The coupling device comprises first reference means adapted to co-operate with second reference means in the layer stack, wherein the second reference means are adapted for aligning the coupling device to the waveguide structure in both the x- and y-direction of the x-y plane as to optically couple the first and second optical path. As a result an optical connector assembly is provided that improves the optical coupling between the optical path in a waveguide structure and in a coupling device and/or a mating optical device. The coupling device may comprise third reference means to couple an optical connector to the waveguide structure.

Abstract: A coupler is passively aligned over a substrate, wherein the coupler is laterally aligned to an optoelectronic (OE) device coupled to the substrate. The coupler is placed on the substrate, wherein the coupler is vertically aligned to the OE device. The coupler is fixed to the substrate.

Abstract: Disclosed herein is a light modulator package having an inclined light transmissive lid which is manufactured or positioned such that a surface of the light transmissive lid is inclined relative to a reflective surface of a light modulating array.

Abstract: Chromatic dispersion of thin-film based mux/demux and add/drop modules can be reduced. Thin-film devices can be arranged in a specific order in the module. Multiple kinds of filters are used to remove “even” and “odd” channels, or other divisions of channels. At least one filter type can be designed for a higher dispersion in transmission but lower dispersion in reflection. At least another filter type can be designed in conjunction with the first filter type such that the sum of the dispersion from the reflection and that from transmission is as low as possible. This ensures that the overall dispersion of the odd and even channels is lower than what one can achieve with one uniform filter.

Abstract: A photoelectric composite interconnection assembly having: a flexible substrate having an electric interconnection; and an electrical interface provided at both ends of the electric interconnection. A part of the electric interconnection is replaced by an optical transmission line.

Abstract: An optical module mounting method for mounting an optical module including a plurality of light emitting points onto a substrate including an optical waveguide is provided. The method includes mounting the optical module on the substrate such that a surface of the optical module including the plurality of light emitting points faces one end of the optical waveguide; measuring optical coupling efficiency between each of the light emitting points and the optical waveguide; and selecting a light emitting point to be used based on the optical coupling efficiency measurements.

Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.

Abstract: The present invention provides an optical fiber device that takes advantage of the fiber structure to construct mechanically stable devices with components inserted in the optical path. An optical component is inserted in a cavity transversally machined across an optical fiber. The component is secured in the cavity and functionally interrelates with light propagated in the optical fiber. The invention also provides a method for manufacturing an optical fiber device with a component insertion into an optical fiber by machining a cavity in an optical fiber, providing a solid component to be inserted in the optical fiber, positioning the component inside the cavity, and securing the component in the cavity. The component is preferably provided as a glass ribbon and the component is preferably secured in the cavity using laser fusion.

Abstract: A circuit board includes a substrate having a thickness in a first direction, extending in a plane perpendicular to the first direction, and having at least one of a through hole and a recess, and an optical transmission channel having an end thereof at a perimeter of the one of a through hole and a recess and having a portion thereof extending a predetermined distance from the end in a direction substantially perpendicular to the first direction, the portion being provided in the substrate or on a surface of the substrate.

Abstract: An apparatus for forming a pattern for a light guiding plate and a method of manufacturing a light guiding plate. The method of manufacturing a light guiding plate includes preparing a plurality of light guiding plates, each of the light guiding plates being a mother substrate on which optical patterns are formed, disposing molding frames including molding patterns on at least one surface of the light guiding plates, forming optical patterns corresponding to the molding patterns on the light guiding plates and removing the molding frames from the respective light guiding plates. The forming optical patterns includes hydrostatic pressing of the light guiding plates and the molding frames.

Abstract: The invention relates to an asymmetric optical fiber that includes a core and a functional cladding that surrounds substantially half of the core along at least a portion of the fiber. The asymmetric optical fiber may include substantially parallel electrodes disposed on a face of the optical fiber.

Abstract: An apparatus is provided that includes a substrate having a top surface, at least one optical data transport medium coupled to the substrate, one or more lens devices coupled to the substrate, and one or more reflective devices coupled to the substrate. The one or more lens devices and the one or more reflective devices are at least partially passively aligned with the at least one optical transport medium by use of one or more pins.

Abstract: When a surface of a filter member on a multilayer film is defined as a first surface, a surface of the filter member on an quartz substrate as a second surface, an inner wall surface of a slit which faces the first surface of the filter member as a first inner wall surface, and an inner wall surface of the slit which faces the second surface of the filter member as a second inner wall surface, one or more of the first inner wall surface and the second inner wall surface of the slit, and the second surface of the filter member do not lie parallel to the first surface of the filter member.

Abstract: At least one optical waveguide is supported on a substrate and has a plurality of key apertures formed in a complaint element thereof. An optoelectronic device such as a vertical cavity surface emitting laser (VCSEL) has a plurality of projections that register with corresponding key apertures to position the optoelectronic device in a predetermined alignment relative to the optical waveguide.

Abstract: High-speed optoelectronic devices having a waveguide densely integrated with and efficiently coupled to a photodetector are fabricated utilizing methods generally compatible with CMOS processing techniques. In various implementations, the waveguide consists essentially of single-crystal silicon and the photodetector contains, or consists essentially of, epitaxially grown germanium or a silicon-germanium alloy having a germanium concentration exceeding about 90%.

Abstract: A fluorescence analysis optical multiplexer/demultiplexer, a fluorescence analysis optical module, a fluorescence analyzer, a fluorescence/photothermal conversion spectroscopic analyzer, and a fluorescence analysis chip, according to which LIF analysis can be carried out easily and with high sensitivity, and moreover photothermal conversion spectroscopic analysis can be carried out easily and simultaneously with the LIF analysis. A microchemical system 100 as the fluorescence analyzer is comprised of a fluorescence analysis optical module 100a, a probe 50 that condenses exciting light onto a sample solution in a channel 204 inside a fluorescence analysis chip 20, and a sample stage 21 on which the fluorescence analysis chip 20 is mounted.

Abstract: An optical recording apparatus includes a plurality of laser modules, an optical fiber array unit, a photosensitive member, and an optical system. Each laser module includes a light source and an optical fiber. The optical fiber array unit bundles a plurality of optical fibers to form an optical fiber array. The photosensitive member has a photosensitive surface. The optical system scans laser beams outputted from the array of the optical fiber array in a first direction on the photosensitive surface, the laser beams forming dots aligned in a second direction to form an angle with respect to the first direction.

Abstract: In an optical module, a member has a hole and a mounting surface in which the hole is open and electric wiring is formed. A recess is formed in the mounting surface. The electric wiring is formed in the recess and is continuously extended to an outside the recess. The electric wiring is provided with a connecting portion on a bottom surface of the recess. An optical transmission line is inserted into the hole and its optical input or optical output end is faced to the optical semiconductor device so as to be optically coupled to the optical transmission line. The semiconductor device is mounted on the mounting surface and electrically connected to the connecting portion. The gap between the optical semiconductor device and the opening end face of the optical transmission line is filled with an adhesive.

Abstract: A semiconductor optical package for optical communication includes a cooling plate dissipating internal heat generated from the semiconductor optical package and having one or more grooves passing through top and bottom surfaces thereof. There is a housing having one or more slots formed on its bottom face, the housing at least partly enclosing an optical transmission module resting on the cooling plate such that the respective slots thereof correspond to the respective grooves of the cooling plate. There are also one or more screws passing through the grooves and inserted into the slots for coupling the housing to the optical transmission module.