Abstract: An improved electro-optical system has a planar waveguide coupled to a photodetector through a transparent substrate. The planar waveguide is within a planar optical structure that can be part of optical communication network. The photodetector is positioned to receive light that passes from the waveguide through the transparent substrate. The photodetector can be electrically coupled to electrical circuitry along the transparent substrate for connection to a electrical apparatus. Corresponding methods for forming the electro-optical structure are described. These improved electro-optical systems can be used for terminating an optical transmission system at an end user or a local network associated with a group of end users.

Abstract: An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 ?m or more.

Abstract: The present invention provides an optical system with waveguides, which comprises first, second and third optical input/output means (12, 14, 16), fourth and fifth multi-mode optical waveguides (20, 22) each capable of propagating light with plural propagation modes, and optical-filter mounting means (26) for mounting an optical filter (24) between the fourth and fifth multi-mode optical waveguides (20, 22) across a traveling direction of light in the fourth and fifth multi-mode optical waveguides (20, 22). The first optical input/output means (12) is connected to an end face of the fourth multi-mode optical waveguide (20) on a side thereof opposite to the optical-filter mounting means (26). Each of the second and third optical input/output means (14, 16) is connected to an end face of the fifth multi-mode optical waveguide (22) on a side opposite to the optical-filter mounting means (26).

Abstract: A luminometer is provided comprising a flow through waveguide and one or more detectors. The flow through waveguide has at least two openings and the sample is free to enter from one opening and exit from the other. The flow through waveguide can be made of material that guides emission light to a bottom end of the flow through waveguide. One or more detectors may be provided which detect the emission light coming out of the bottom of the flow through waveguide. A fluorometer/photometer is also provided that comprises a flow through waveguide, one or more excitation light sources, and one or more optical detectors. The flow through waveguide has a hollow region to hold the sample. The excitation light is introduced at an angle or perpendicular to one surface of the flow through waveguide. The flow through waveguide is made of material that can guide absorption and/or emission light to the bottom end of the flow through waveguide.

Abstract: An optical module includes a fiber array, a laser diode array, a photodiode array and a micro-lens array. The fiber array includes optical fibers which are divided to a transmitter group and a receiver group. The laser diode array includes laser diodes which are grouped in a transmitter group. The photodiode array includes photodiodes which are divided to a monitor group and a receiver group. The laser diode array is provided between the fiber array and the photodiode array. The optical fibers of the transmitter group are optically aligned with the laser diodes of the transmitter group, respectively. The micro-lens array is provided between the laser diode array and the photodiode array, and optically aligns the laser diodes of the transmitter group and the optical fibers of the receiver group with the photodiodes of the monitor group and the photodiodes of the receiver group, respectively.

Abstract: An optical connector system joining waveguides in two printed circuit boards. A flexible optical conductor is connected at one end to one of the boards. The flexible conductor includes at its free end an alignment structure that provides a separable, low loss interface to an alignment structure coupled to the waveguide on the other board. The ends of the waveguides are enclosed in housings that protect the waveguides from abrasion and contaminates, but expose the waveguides when the connectors mate.

Abstract: A reflector chip of the present invention integrates a planar lightwave circuit (PLC) waveguide wafer and an active component, such as a photo-detector or laser, e.g. vertical cavity surface emitting laser. Typically, the PLC waveguide wafer includes a waveguide core region bound by upper and lower cladding layers. An end of the waveguide core region is mounted within a channel, trench, notch or recess within the bottom surface of the body of the reflector chip. A V-notch is also formed in the bottom surface of the body of the reflector, including a reflective surface, which redirects the light between the active component and the waveguide core region.

Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).

Abstract: In one aspect, a planar illumination area includes two light-guide elements, each with an out-coupling region. At least a portion of each out-coupling region overlaps with at least a portion of the other. The overlapping region emits a substantially uniform light output power.

Abstract: An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the transparent substrate. A first substrate is in communication with the transparent substrate via the second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

Abstract: An optical apparatus comprises: an optical fiber, an optical device on a substrate, a circuit board, and an electrical connection therebetween. The substrate has a groove for positioning the fiber for optical coupling with the optical device. A proximal segment of the fiber is secured to the substrate in the groove. The substrate is mounted on the circuit board, and a second segment of the fiber is secured to the circuit board. A method comprises: mounting on the circuit board the substrate with the optical device; establishing the electrical connection; securing the proximal fiber segment to the substrate in the groove; and securing the second fiber segment to the circuit board. Multiple substrates can be secured to a single piece of circuit board material, which can be divided into individual circuit boards after establishing electrical connections and securing optical fibers to the corresponding substrates and to the circuit board material.

Abstract: An optical module comprising an opto-electronic component, a lens and a mirror that is hermetically sealed by a micro housing containing a lid and a base is disclosed. The optical module may be assembled onto a moveable holder for aligning an optical beam into an optical assembly having an optical waveguide.

Abstract: A multi-beam generating device has plural semiconductor lasers, optical fibers to propagate laser beams generated by the semiconductor lasers, an optical fiber array to propagate the laser beams passed through the optical fibers, and an optical waveguide device provided with waveguides to propagate the laser beams having passed through the optical fiber array. Each of the waveguides has a core layer and a clad layer; a pitch between adjacent waveguides in the arrangement is narrower on the output section side where the laser beams emit than on the input section side where the laser beams enter; a width of the core layer is narrower in the transverse direction that is the direction of the arrangement of the waveguides than in the vertical direction; and a difference in refractive index between the core layer and the clad layer is larger in the transverse direction than in the vertical direction.

Abstract: To provide a mounting structure of a semiconductor optical element, in which structure the turning of a refractive index matching gel is prevented. There is provided a mounting structure of a light emitting element, in which structure signal light emitted from one end of an SOA 2 with phase control mounted to a PLC platform 1 with an optical waveguide 1a formed therein is made incident on the optical waveguide 1a and is then again made incident on the SOA 2 with phase control to be emitted from the other end of the SOA 2, wherein the SOA 2 with phase control is mounted to the PLC platform 1 in a state where the other end of the SOA 2 with phase control is projected from the PLC platform 1, and wherein a refractive index matching gel 3 is arranged between the one end of the SOA 2 with phase control and the optical waveguide 1a.

Abstract: There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the pac

Abstract: An optical transceiver 10 includes an optical device 16 which is provided upon a substrate 11, an optical connector 14 which is connected to an optical fiber 15a, and a connector holder 13 for optically connecting together the optical device and the optical connector 14. The connector holder 13 includes an engagement means 13c which holds the optical connector 14. The engagement means 13c holds the optical connector 14 when the optical connector 14 is pressed in towards the substrate. The optical connector 14 supports the optical fiber 15a so that the optical axis of the optical fiber 15a subtends a fixed angle with respect to the optical axis of the optical device 16. And the optical connector 14 includes a mirror 14g for optically connecting between the optical device 16 and the optical fiber 15a.

Abstract: A flexible optical circuit comprising passive or active components is provided. The flexible optical circuit includes a first optical fiber having both first and second ends, a second optical fiber having both first and second ends, a flexible substrate attached to both the first and second optical fibers where the first and second pins of the first and second optical fibers extend to at least the edge of the flexible substrate and a component coupled to the first optical fiber between the first and second ends. The component can be used passive or active. A passive component requires no electrical trace lines to activate the component and the passive component will react upon the reception of a light-wave signal. The active component will require power from the back plane before the active component can modify or affect the light-wave signal. The first and second ends of the optical fibers extend at least to the edge of the flexible optical circuit or can extend beyond the edge of the flexible substrate.

Abstract: An optical waveguide element having a plurality of surface waveguide portions. A connecting portion for connecting the surface waveguide portions. An output light-outputting waveguide portion connected to the connecting portion each on a dielectric substrate. An output light optical fiber connected to an output end of the output light-outputting waveguide portion. A reinforcing capillary for a connection between the optical waveguide element and the output light optical fiber and a monitoring light receiver. The reinforcing capillary has a hole or groove for supporting the output light optical fiber, a connecting face bonded to an output end face of the substrate, and a terminal surface opposite to the connecting face. The light outputted from the optical waveguide element, therethrough to the outside of the capillary.

Abstract: In one embodiment, an apparatus includes a passive element including one or more first waveguides and one or more second waveguides. The apparatus also includes an active element integrated into the passive element. The active element includes one or more third waveguides that actively guide light from the first waveguides to the second waveguides. The third waveguides include polarization-independent electro-optical (EO) thin film.

Abstract: An optical waveguide bare module (11) is composed of an optical waveguide substrate wherein a circuit is formed on a substrate; and optical fiber arrays (22a, 22b) connected on the both sides of the optical waveguide substrate. The optical waveguide bare module (11) is stored in a case (12). The optical fiber arrays (22a, 22b) are provided by arranging and fixing one or more optical fibers (23), and the optical fiber arrays (22a, 22b) are adhered and fixed on the optical waveguide substrate by adjusting an optical axis. Sealing blocks (13a, 13b) are attached on the both sides of a case (12) to seal the inside of the case (12) airtight, and a structure wherein moisture does not easily enter into the case storing the optical waveguide is provided.

Abstract: A circuit board structure with optoelectronic component embedded therein comprises a carrier board with at least two through openings; a first optoelectronic component and a second optoelectronic component disposed in the openings respectively, wherein a plurality of electrode pads and optical active areas are formed on the active surfaces of the optoelectronic components; a dielectric layer formed on a surface of the carrier board and the active surface of the optoelectronic components, wherein a plurality of vias for exposing the electrode pads and two holes for exposing the optical active areas are formed in the dielectric layer; a circuit layer formed on a surface of the dielectric layer and electrically connected to the electrode pads of the optoelectronic components; an insulating protecting layer formed on the dielectric layer and the circuit layer; and at least one optical transmission element formed on a surface of the insulating protecting layer.

Abstract: There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the pac

Abstract: An optical semiconductor device has a heater, an optical waveguide layer, a first electrode and a second electrode. The heater is provided on a first semiconductor region and has more than one heater segment coupled or separated to each other. The optical waveguide layer is provided in the first semiconductor region and receives heat from the heater. The first electrode is coupled to a connecting point of the heater segments adjacent to each other. The second electrodes are electrically common and are coupled to other ends of the heater segments in opposite side of the connecting point respectively.

Abstract: A header-replaceable hybrid waveguide sensor comprises a header coupling section including a dielectric layer having an optical signal input section and an optical signal output section formed in one end thereof, the dielectric layer having two lines of protrusions formed on the upper surface thereof; and a polymer layer formed on and under the dielectric layer; and a sensor header including a dielectric layer having a protrusion formed on the upper surface thereof and a predetermined size of thin metal film provided therein; a polymer layer formed on and under the dielectric layer and having an opening formed in a portion corresponding to the thin metal film, the opening having a larger width than the thin metal film; and a receptor layer formed on the upper surface of the dielectric layer exposed by the opening.

Abstract: In an optical unit including a photoelectric conversion chip adapted to be optically connected to an optical fiber, and a semiconductor chip for driving the photoelectric conversion chip, both the photoelectric conversion chip and the semiconductor chip are wrapped with a flexible sheet, to thereby produce an enveloper enveloping the photoelectric conversion chip and the semiconductor chip therein. At least a part of the enveloper is formed as a transparent area for allowing an optical connection between the optical fiber and the photoelectric conversion chip.

Abstract: An integrated bi-directional transceiver device for multiple wavelength optical signals that has a high level of wavelength isolation at the receivers of the device and low cross-talk of light between an external laser transmitter and the receivers. A WDM planar light wave circuit (PLC) assembly combines high spatial light confinement waveguide structures and a variable thickness dielectric wavelength selective filter (WSF) on the surface of the device to reflect a first wavelength signal and to pass a second wavelength signal. Embodiments of the invention include branching waveguide structures and folded path waveguide assemblies with multiple WSF's.

Abstract: An optical element combination structure in which an optical fiber and an optical waveguide are combined with each other and which can reduce fluctuation of coupling loss due to a change in environmental temperature is provided. The present invention relates to an optical element combination structure in which an optical fiber and an optical waveguide are combined with each other. An optical element combination structure according to the present invention 1 comprises an optical fiber 2 and a substrate 6 on which an optical waveguide 4 is formed. The substrate 6 has a V-shaped cross-sectional groove 8 formed so that the optical fiber and the optical waveguide are aligned with each other, and a recess 10 formed on a waveguide side relative to the groove 8. The optical fiber is secured to the V-shaped cross-sectional groove 8 with an adhesive 22.

Abstract: An optical waveguide or first optical fiber whose one end optically connects with a light exit plane and/or light incidence plane of an optical element and whose other end optically connects with an second optical fiber and a connector for mechanically connecting the optical waveguide or the first optical fiber and the second optical fiber are included. The optical waveguide or first optical fiber is bent in order to change the traveling direction of light so that the light incoming from one end is emitted from the other end substantially in parallel with a board and the light incoming substantially in parallel with the board to the optical waveguide or first optical fiber from the other end is emitted from one end toward the optical element.

Abstract: There is provided an optical module for coupling with a fiber optic cable through an optical connector, including a module body connectable with a plug of the optical connector by a dedicated guide pin, with a side surface of the module body being opposed to a mating surface of the connector plug at which an end face of the fiber optic cable is exposed, and an optical element mounted to the module body and having an optical axis brought into alignment with an optical axis of the fiber optic cable upon fitting of the guide pin into the module body and the connector plug.

Abstract: An optical transmitting and receiving module, with which there is no need to provide a submount for disposing a photodiode on a substrate and with which spatial restrictions can be made small, is provided. An optical transmitting and receiving module 1 has a light transmitting substrate 10. A filter groove 13 is formed on a top surface of light transmitting substrate 10, and a dielectric multilayer film filter 23 is set in filter groove 13. An optical fiber 21 and a laser diode 25 are disposed at opposite positions across dielectric multilayer film filter 23. Also, a photodiode 26 is disposed on a rear surface side of light transmitting substrate 10. Photodiode 26 is positioned directly below a line connecting optical fiber 21 and laser diode 25.

Abstract: Considerable manufacturing efficiency and flexibility is provided by configuring the lower surface of a chip carrier to include multiple holes specifically designed to receive coupling fibers. By appropriately positioning these holes, the coupling fibers can be aligned with necessary optical elements of optoelectronic chips carried by the chip carrier. Similarly, the opposite end of the fibers can be appropriately configured and positioned for coupling to waveguide structures or fiber optic structures which may be embedded in printed circuit boards. By utilizing an appropriately configured chip carrier, and related fibers, a signal transmission structure is achieved which effectively bridges the gap between a chip carrier and a related printed circuit board.

Abstract: A launch system and method for microscopy having an optical fiber positioned proximate a sample slide with an optical fiber mounting element so as to deliver an EMR from the optical fiber into a first sample slide and to a surface of a second sample slide at a critical angle for total internal reflection at an interface of the surface of the second sample slide and a sample positioned proximate to the surface of the second sample slide.

Abstract: Provided are a method and structure for optical connection between an optical transmitter and an optical receiver. The method includes the steps of: forming on a substrate a light source device, an optical detection device, an optical transmission unit electrically connected with the light source device, and an optical detection unit electrically connected with the optical detection device; preparing a flexible optical transmission-connection medium to optically connect the light source device with the optical detection device; cutting the prepared optical transmission-connection medium and surface-finishing it; and connecting one end of the surface-finished optical transmission-connection medium with the light source device and the other end with the optical detection device. Fabrication of an optical package having a 3-dimensional structure is facilitated and fabrication time is reduced, thus improving productivity.

Abstract: The invention provides a multi-beam light source including a light guide array by which the yield can be improved. An array pitch P2 of entrance surfaces of light guide pattern is 1/N as wide as an array pitch P1 of exit surfaces of optical fiber arrays. The number of the light guide patterns is N or more times as large as the number of optical fibers. The exit surfaces of a plurality of the optical fibers are coupled with the entrance surfaces of a plurality of the light guide patterns opposed thereto.

Abstract: A mounting arrangement for an optical component in a planar lightwave circuit (PLC) is provided. The mounting arrangement includes a substrate, an input optical fiber associated with the substrate, an output optical waveguide manufactured on the substrate, and an optical component mounted on the substrate to transmit optical radiation from the input optical fiber to the output optical waveguide. The mounting arrangement also includes a length of optical waveguide on the substrate, in the same planar layers of the output optical waveguide, interposed on the substrate so that the at least one optical component is interposed between the length of optical waveguide and the output optical waveguide. In another embodiment, the mounting arrangement includes a length of optical fiber associated to the substrate so that the at least one optical component is interposed between the input optical fiber and the length of optical fiber.

Abstract: The present disclosure provides an apparatus, method of manufacturing an apparatus, and method for operation of the same. The apparatus, in one embodiment, includes an optical coupling structure disposed within a cladding region, wherein the optical coupling structure includes a first guiding portion and a second guiding portion. In this embodiment, the first guiding portion is located on a first plane and tapers from a first greater width to a first lesser width in a first direction. The second guiding portion, in turn, is located on a second different plane and tapers from a second greater width to a second lesser width in a second opposite direction.

Abstract: A structure comprises an inner strip waveguide (1) and an outer rib waveguide (2) on a common substrate. The thicker inner waveguide (1) is patterned into an inner core layer (3). The thinner outer waveguide (2) is patterned into an outer core layer (4). The inner and outer waveguides are separated by a gap (5) being less than 500 nm. The structure forms an adiabatic coupler. In the method, the first (inner) waveguide (1) is patterned into the thicker inner core layer (3) by etching trenches (8). A thinner outer silicon layer (4) is attached on top of the inner-core layer (3) and the first waveguide (1) to form an outer core layer (4). The second (outer) waveguide (2) is patterned into the outer core layer (4).

Abstract: Various embodiments of the present invention are related to photonic-interconnect systems for reading data from and writing data to memory cells of memory chips at approximately the same time. In one embodiment of the present invention, A photonic-interconnect system comprises a photonic interconnect coupled to a photonic device. The photonic interconnect is coupled to the memory chip and is configured to encode a first data set stored in the memory cells into a first set of electromagnetic signals at approximately the same time, decode a second data set encoded in a second set of electromagnetic signals at approximately the same time, and store the second data set in the memory cells. The photonic device is configured to transmit the first set of electromagnetic signals out from the photonic interconnect and transmit the second set of electromagnetic signals into the photonic interconnect.

Abstract: A low-cost alignment system suitable for aligning a wafer to a test fixture includes a bundle of optical fibers wherein at least one fiber serves to deliver illumination to the alignment target from an end thereof, and a plurality of receiver fibers, each having ends with a known spatial relationship to the end of the illuminator fiber. The ends of the fiber bundle have a known spatial relationship to the fixture. In some embodiments, the fiber bundle is disposed within the fixture such that there is an unobscured optical path between the wafer and the receiving and illuminating ends of the fibers. In some embodiments, the fiber bundle is coupled to a light source and a light sensor mounted on the fixture. In some embodiments the alignment target is one or more bonding pads disposed on a wafer.

Abstract: The first and second light-emitting regions are provided on the light source. When the first optical fiber having the first core diameter is connected, the light emitted from the first light-emitting region enters the first core. When the second optical fiber having a greater core diameter than the first core diameter is connected, the lights emitted from the first and second light-emitting regions enter the second core. It is thus possible to connect the optical transmission device with multiple optical fibers having different core diameters. It is thus possible to provide the optical transmission device and the communication device, which are low in cost and high in convenience.

Abstract: A waveguide includes a core part, clad layer surrounding the core part about an optical axis of the core part, and an optical path conversion mirror formed at the end face of at least one of the core part or the clad layer. The optical path conversion mirror converts an optical path of a signal light. The shape of the end face of the core part and the shape of the end face of the clad layer are different in the optical path conversion mirror.

Abstract: The invention relates to a method and a device for coupling fiber optic cables. Said device comprises at least one module, which is equipped with at least one retaining unit for retaining at least two cassettes. The invention is characterized in that: a cassette is configured with at least one coupling element; at least one strand bundle can be fixed to the module, whereby said strand bundle can be split into at least two strands comprising at least one fiber optic cable; an excess length of strand can be retained by a cassette, the fiber optic cable or cables being connected to the coupling element and the cassette together with its retained strand being detachably connected to the retaining unit.

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract: Printed circuit boards that include optical interconnects include a flexible optical waveguide embedded or locally attached to the board having at least one end mechanically decoupled from the board during fabrication that can be fitted with a mechanical connector. Also disclosed are processes for fabricating the circuit board.

Abstract: An optoelectronic coupling structure, a method of manufacture, and a method of operation are described. The optical coupling structure includes a waveguide that is formed within a device layer of an SOI substrate. A prism is located on a bottom side of the SOI substrate. A BOX layer of the SOI substrate, which is interposed between the prism and the waveguide, serves as a spacer region, which promotes an optical coupling of the prism to the waveguide. By positioning the prism below the waveguide, an optoelectronic IC may more readily accommodate a prism. The prism may be directly fabricated in a bulk layer of the SOI substrate or directly bonded to a bottom side surface of the BOX layer.

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract: An optical semiconductor module comprises a guide which has a positioning portion for an optical transmission line, an optical semiconductor mounting surface from which one end face of the optical transmission line disposed in the positioning portion is exposed, and a wiring layer formed on the optical semiconductor mounting surface. An optical semiconductor element is mounted on the optical semiconductor mounting surface of the guide, with a light-emitting surface or a light-receiving surface thereof facing the one end face of the optical transmission line, and is electrically connected to the wiring layer.

Abstract: An optical module 1 comprises a first optical element F1, a first light receiving subassembly PD1, a second optical element F2, a second light receiving subassembly PD2, a light emitting subassembly LD3 for generating light, and a light transmitting part 3 optically coupled to the first optical element. The light emitting subassembly LD3, the first optical element F1, the second optical element F2 and the first light receiving subassembly PD1 are arranged along a predetermined plane S1. The light emitting subassembly LD3, the first optical element F1, the second optical element F2, and the second light receiving subassembly PD2 are arranged along another predetermined plane S2. The predetermined plane S1 intersects at a predetermined angle with the other predetermined plane S2.

Abstract: A launch system and method for microscopy having an optical fiber positioned proximate a sample slide with an optical fiber mounting element so as to deliver an EMR from a terminal end of the optical fiber across a surface of the sample slide to an opposing side surface at a desired incident angle.

Abstract: An optical coupler for parallel coupling from a single mode optical fiber, or fiber ribbon, into a silicon-on-insulator (SOI) waveguide for integration with silicon optoelectronic circuits. The optical coupler incorporates the advantages of the vertically tapered waveguides and prism couplers, yet offers the flexibility of planar integration. The optical coupler may be fabricated using wafer polishing technology or grayscale photolithography. The optical coupler can be packaged using epoxy bonding to form a fiber-waveguide parallel coupler or connector.