Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.

Abstract: Objects of the present invention are to prolong the life of a sealing portion by using bellows and to prevent the generation of dust and the effect thereof. A support member for positioning is extended to the outside through an opening of a vacuum vessel and bellows connected to the circumference of the opening with a play such that positioning movement can be performed without being in contact with the opening and the bellows, and the support member is received by roller bearings in a bulkhead portion connected to a free end of the bellows and closing the bellows of a bearing support. Necessary rotation is given to the support member from outside via inside and outside magnetic couplings facing each other on the inside and outside of the bulkhead portion, and movement in the X direction perpendicular to the axis is given to the support member from outside by moving the bearing support in the direction perpendicular to the axis with respect to the vacuum vessel.

Abstract: A processing system comprises a plurality of processing vessels (8A to 8D) provided with openings in which a wafer (W) is subjected to predetermined processes, and a common transfer vessel (4) connected to the openings of the processing vessels. A transfer mechanism (14) capable of turning, bending and stretching is installed in the common transfer vessel to transfer the wafer (W) between the common transfer vessel (4) and the processing vessels (8A to 8D). Stand-by spaces (24A to 24D), where the wafer (W) is held temporarily, are determined so as to correspond to the openings of the processing vessels (8A to 8D), respectively. Position sensors (26-1 to 26-5) are assigned in pairs to the stand-by spaces to measure the position of the perimeter of the wafer. The position sensors are arranged so that each stand-by space (24A to 24D) shares one of the pair of position sensors with the adjacent stand-by space for common use.

Abstract: A hand mechanism and a library apparatus capable of performing cartridge detection at a high speed as well as reducing the production cost. The library apparatus includes an entry/exit mechanism (container shelf) having a plurality of cells (container chambers) for containing a cartridge and a hand mechanism for taking a cartridge out of the entry/exit mechanism. The cells have a reflection plate (reflector), and the hand mechanism has a sensor (cartridge detector) emitting a detection light and receiving the detection light reflected from the reflection plate. The detection light is simultaneously applied to two or more cells.

Abstract: A method and apparatus for handling deadlocks in a multichamber semiconductor wafer processing system known as a cluster tool. A plurality of software routines execute upon a sequencer of a cluster tool to perform deadlock avoidance, deadlock detection and deadlock resolution towards achieving optimal wafer throughput for a cluster tool.

Abstract: A semiconductor processing system comprises a first vacuum processing unit and a second vacuum processing unit connected thereto. The first and second vacuum processing units respectively comprise I/O transfer chambers. Casings of the transfer chambers are connected to each other, and a common transfer robot is arranged in the casings. The transfer robot is moved along horizontal guide rails and formed by connecting rails of the transfer chambers. A rail adjusting mechanism is provided to obtain linearity of the horizontal rails.

Abstract: Two pairs of lifters 9A and two pairs of lifters 9B are arranged on a table 7 in a processing chamber 2. In a transporting chamber 3 communicating with the processing chamber 2, a transporting mechanism 10 of an articulated robot is provided with a catch plate 10E in a single stage arrangement. The elevation of a rotating spindle 10A of the transporting mechanism 10 allows the catch plate 10E to be moved up and down. By rising and falling the catch plate 10E while stopping the lifters 9A, 9B, it is possible to transfer a substrate between the catch plate 10E and the lifters 9A or between the catch plate 10E and the lifters 9B.

Abstract: The invention relates to a reactor (1) for processing wafers (7) comprising at least one process chamber (5), at least one transport chamber (2) with a transport robot (3) for the wafers (7), and at least one magazine (6) for wafers (7) with a lifting mechanism (12). To safeguard a better protection against damage also for wafers (7) stored in a magazine (6), an optical detection device (13, 14, 15, 16) is provided in the reactor (1) for monitoring the position of the wafers (7) stored in a magazine (6).

Abstract: An ergonomic loading assembly for an I/O port onto which a bare cassette may be easily loaded and unloaded. The loading assembly further provides isolation between the operator and the I/O port after loading of a cassette to minimize safety risks and to minimize the amount of particulates and contaminants around the workpieces while on the port. In a preferred embodiment, the loading assembly includes a cover assembly having a stationary cover section around the port plate, and two pivoting cover sections which open and close like jaws to allow a cassette to positioned within the cover assembly when opened and which enclose the cassette within the cover assembly when closed. The loading assembly further includes a pivoting deck onto which the cassette is loaded when the pivoting cover sections are open. The deck receives the cassette with the workpieces oriented at or near vertical.

Abstract: A system for inspecting semiconductor wafers of at least one lot of semiconductor wafers for proper integrated circuit fabrication includes multiple different inspection stations. Each of the different inspection stations inspects a respective integrated circuit fabrication feature of a semiconductor wafer. In addition, a semiconductor wafer robotic handling system, that is coupled to each of the inspection stations, transfers the semiconductor wafers between the inspection stations. Furthermore, a host server is coupled to the inspection stations and the semiconductor wafer robotic handling system. The host server controls the semiconductor wafer robotic handling system to transfer a predetermined one of the semiconductor wafers to a predetermined one of the inspection stations at a predetermined time.

Abstract: A semiconductor fabricating apparatus having a vertical reaction furnace, a boat for holding plural wafers in a multi-layered fashion and being loaded into the vertical reaction furnace, a storage disposed at a location corresponding to the boat for storing at least one of the wafer cassettes, a wafer transfer device for transferring the wafer between the storage and the boat, a cassette transfer unit for transferring the wafer cassettes between the apparatus and outside thereof, a cassette transfer device for effecting the transfer of the wafer cassettes between the cassette transfer unit and the storage, and a plurality of cassette shelves disposed within a range allowing transfer of the wafer cassettes from the cassette transfer device for receiving the wafer cassettes in upwardly-oriented positions.

Abstract: The present invention provides a method and apparatus for determining whether a substrate is in a clamped or unclamped state on a robot blade and preferably allows the position of a properly clamped substrate to be compensated for misalignments due to substrates not at or very near to their nominal positions on the blade. A sensor unit comprising a radiation source and a detector and capable of transmitting and receiving a signal is mounted outside a transfer chamber and is positioned to direct the signal therein. A robot blade having a reflecting member is actuated through the transfer chamber and into the path of the signal. The reflecting member is preferably positioned on a clamp finger and causes the signal to be reflected to the detector of the sensor unit when the signal is incident on the reflecting member. As the reflecting member moves through the signal the output of the sensor unit switches states, thereby generating values corresponding to the position of the reflecting member.

Abstract: The present invention provides a wafer positioning device having wafer storage capability. The wafer positioning device has a wafer platform with wafer lift pins, a wafer position sensor, and a storage location in close proximity to the wafer platform and the wafer position sensor. The storage location may be above the wafer position sensor, in which case the wafer position sensor retracts or rotates so that the wafer lift pins may elevate a positioned wafer past the position sensor to the storage location. Alternatively, the storage location may be between the wafer platform and the wafer positioning device. The storage location is preferably formed by a plurality of rotatable towers or a plurality of retractable lift pins that are operatively coupled to the wafer platform and that have wafer support portions capable of assuming both a wafer storage position and a wafer passage position.

Abstract: In a substrate conveying system, the temperature adjustment for a substrate is performed by use of a temperature adjusting plate which is provided at a substrate transfer station where a substrate can be transferred from or to an outside structure, by which the substrate temperature adjustment can be accomplished without a decrease of a processing speed of a semiconductor manufacturing apparatus and without deposition of contaminations.

Abstract: A processing unit structure 1 a plurality of processing units 2, . . . , assembled together continuously in a horizontal direction, wherein a transfer portion 3 is provided on the top of each processing unit 2, . . . , for transferring the plate-like material to be processed between adjacent one of the processing units. A transfer device, such as a shuttle (SH) is provided in each of the transfer portions 3. Each processing unit 2 performs a series of processes on the plate-like material and is constructed with processing blocks 4 and 4 and a transfer portion 3 in the form of a transfer robot (R) positioned between the processing blocks 4 and 4. Further, each processing unit 2. . . is independent from one another so that it is possible to selectively add and remove different ones of the processing units with respect to the processing unit structure 1.

Abstract: An alignment device for use with a robot for manipulating and aligning a series of semiconductor wafers with respect to an edge fiducial and the center of each wafer is disclosed. The device includes a rotary vacuum chuck for holding a wafer, and an edge detector comprising a light source that extends across the wafer edge as it moves and creates a shadow that falls on a charge coupled device (CCD) below. Output data from the CCD relative to the wafer edge position is processed by a programmable logic circuit and converted to quadrature data which is fed to the logic section of a controller. The controller is programmed to calculate the location of the wafer fiducial relative to the chuck axis and further to calculate the angular and distance offset of the wafer center from the longitudinal axis of the robot arm so that the robot arm can be moved to center the wafer with its fiducial at a preselected location before the wafer is removed from the rotary chuck.

Abstract: A vacuum processing system has a load lock chamber for transitioning wafers between an ambient environment pressure and a transfer chamber vacuum pressure. The load lock chamber has wafer supports for two wafers, but contains only one wafer during pressure transitioning. The load lock chamber further has a processing element, so that the load lock chamber performs a pre-processing or post-processing process on the wafer. The processing element may be a wafer heater, so that the load lock chamber may heat the wafer before or after the system performs a primary process on the wafer. The processing element may be a wafer cooler, so that the load lock chamber may cool down a wafer that has been heated before, during or after the primary process. The load lock chamber may have either a wafer heater or a wafer cooler or both.

Abstract: A vacuum processing system has a wafer handling chamber, such as a mini-environment, for moving wafers therethrough. The wafer handling chamber has a wafer aligner, or orienter, for aligning the wafers according to the requirements of a process that the wafer is to undergo in the system. The wafer aligner is disposed at a location in the wafer handling chamber to minimize the number of movements that the wafer makes as it passes through the wafer handling chamber, to minimize interference between wafer handlers, or robots, when more than one wafer handler is used in the wafer handling chamber and to minimize the footprint area of the system. The presence of the wafer aligner in the wafer handling chamber eliminates the need to provide a separate wafer aligning chamber in the system.

Abstract: A force compensating apparatus is for use in a wafer-handling machine. The wafer-handling machine includes a rotatable rim adapted to be concentric with and external to a wafer, and a plurality of wafer-supporting fingers disposed about the rim. Each finger is supported by a floating arm, part of a support mechanism utilizing first and second fixed arms bracketing the floating arm where the fixed arms attach the support to the rim. Each the finger is preloaded with sufficient force to support the wafer among the plurality of fingers and each the finger is generally positioned in a radial plane with the rim.

Abstract: An apparatus and method for inverting a plurality of plate-like materials to provide for the treatment of plate-like material using techniques that must be applied to the surface from a direction other than from above the material, such as for beneath the material in meniscus coating techniques. The apparatus includes a base, a back attached to the base, a top that is removably attachable to the base for retaining a cassette between the top and the base and retractable material holders attached to the base for engaging and disengaging the plate-like material. In a preferred embodiment, the retractable material holders are in the form of support blocks having notches corresponding the edges of the plate-like material that are reciprocally moved by a side actuator to enable the blocks to engage and disengage the plate-like material.

Abstract: An apparatus capable of high accuracy position and motion control utilizes one or more linear commutated motors to move a guideless stage in one long linear direction and small yaw rotation in a plane. A carrier/follower holding a single voice coil motor (VCM) is controlled to approximately follow the stage in the direction of the long linear motion. The VCM provides an electromagnetic force to move the stage for small displacements in the plane in a linear direction perpendicular to the direction of the long linear motion to ensure proper alignment. One element of the linear commutated motors is mounted on a freely suspended drive assembly frame which is moved by a reaction force to maintain the center of gravity of the apparatus. Where one linear motor is utilized, yaw correction can be achieved utilizing two VCMs.

Abstract: An apparatus capable of high accuracy position and motion control utilizes one or more linear commutated motors to move a guideless stage in one long linear direction and small yaw rotation in a plane. A carrier/follower holding a single voice coil motor (VCM) is controlled to approximately follow the stage in the direction of the long linear motion. The VCM provides an electromagnetic force to move the stage for small displacements in the plane in a linear direction perpendicular to the direction of the long linear motion to ensure proper alignment. One element of the linear commutated motors is mounted on a freely suspended drive assembly frame which is moved by a reaction force to maintain the center of gravity of the apparatus. Where one linear motor is utilized, yaw correction can be achieved utilizing two VCMs.

Abstract: An apparatus capable of high accuracy position and motion control utilizes one or more linear commutated motors to move a guideless stage in one long linear direction and small yaw rotation in a plane. A carrier/follower holding a single voice coil motor (VCM) is controlled to approximately follow the stage in the direction of the long linear motion. The VCM provides an electromagnetic force to move the stage for small displacements in the plane in a linear direction perpendicular to the direction of the long linear motion to ensure proper alignment. One element of the linear commutated motors is mounted on a freely suspended drive assembly frame which is moved by a reaction force to maintain the center of gravity of the apparatus. Where one linear motor is utilized, yaw correction can be achieved utilizing two VCMs.

Abstract: Systems and methods are described for direct skew control and interlock of a gantry. An apparatus includes a gantry that includes a first member defining a gantry primary axis Z, a cross member defining a secondary axis X that is coupled to the first member via a trunnion, and a second member defining a gantry primary axis Z′ coupled to the cross member via an elastic hinge. A method for controlling skew on a cross member moved by a first and second driver includes moving the first and second drivers to a first position, measuring a resulting skew value, and correcting the skew on the cross member by moving the first driver and/or the second driver.

Abstract: This invention provides a wafer inspecting apparatus which enables macroscopic inspection of the entire surface of a wafer. According to the wafer inspecting apparatus of this invention, the edge portion of a wafer 8 is held by suction with the distal ends of wafer holding portions 702 of a wafer holding arm 7, and first-time observation of the lower surface of the wafer 8 is performed. Then, the wafer 8 is transported onto a center table 6. The center table 6 is rotated through a predetermined angle. The edge portion of the wafer 8 is held by suction again with the distal ends of the wafer holding portions 702 of the wafer holding arm 7. Then, second-time observation of the lower surface of the wafer 8 is performed.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has a pusher for transferring the workpiece between a top ring of a polishing apparatus and the pusher. The polishing apparatus includes a turntable having a polishing surface, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing surface, and a pusher for transferring the workpiece between the top ring and the pusher. The pusher comprises a workpiece support for supporting the workpiece, an actuating unit for moving the workpiece support in a vertical direction, a sliding mechanism movable within a horizontal plane, and a positioning mechanism for positioning the workpiece support and the top ring with respect to each other in association with the sliding mechanism when the workpiece is transferred between the workpiece support and the top ring.

Abstract: A furnace for thermal processing of substrates includes a substrate cassette that supports at least one substrate and a process chamber for thermal processing. A process chamber that includes a port for receiving a substrate, a heater that generates a thermal distribution, and a rotatable member having a substrate support. The rotatable member rotates a substrate positioned on the substrate support so that a temperature of the substrate is controlled according to a temperature profile. A transport mechanism transports substrates between the substrate cassette and the substrate support of the rotatable member.

Abstract: In a device processing system, an apparatus and method for retaining a device that is to be transferred to or from the apparatus at a transfer location and processed at a processing location that is spaced from the transfer location is shown and described. A first device is placed on a first chuck at the transfer location with the chuck facing a first direction. The apparatus then rotates from a first position to a second position in which the device is at the processing location and facing in a second direction which is different from the first direction. While the apparatus is in the second position, a second device may be placed on a second chuck that is now oriented in the first direction at the transfer location. When the apparatus is rotated from the second position to the first position, the first device is returned to the transfer location and the second device is moved into the processing location.

Abstract: A multiple reaction chamber system includes a transfer chamber, a load lock chamber connected to the transfer chamber, and a plurality of reaction chambers connected to the transfer chamber. An alignment chamber is connected to the transfer chamber, disposed along a path of wafer transfer from the load lock chamber to the plurality of reaction chambers, and includes a wafer aligner. A wafer recognition, disposed along a post-aligner portion of the path of wafer transfer system, recognizes an identification code of an individual wafer. A controlling system is in data communication with the wafer recognition system for selecting a selected chamber of the plurality of reaction chambers into which the individual wafer is to be transferred. Because individual wafers can be associated with each reaction chamber, a defective reaction chamber can be identified immediately and its use discontinued so that unproductive operations can be eliminated.

Abstract: A principal part of an attitude control system comprises: holding means 30 for holding wafers W so that the wafers W are rotatable in circumferential directions; rotation transmitting means 40 for contacting a peripheral portion of each of the wafers W to rotate the wafers W; a stepping motor 50 for rotating the wafers W; transmission switching means 60 for selectively transmitting a power from the stepping motor 50 to the rotation transmitting means 40; a photo sensor 70 for detecting a notch Wa formed in the peripheral portion of each of the wafers W; and a CPU 80 for controlling the operations of the stepping motor 50 and the transmission switching means 60 on the basis of a detection signal outputted from the photo sensor 70. Thus, the notch Wa of each of the rotating wafers W is detected, and the stepping motor 50 and the transmission switching means 60 are controlled on the basis of the detection signal, so that it is possible to carry out the positioning of the wafers W.

Abstract: A method and device for detecting an incorrect position of a semiconductor wafer during a high-temperature treatment of the semiconductor water in a quartz chamber which is heated by IR radiators, has the semiconductor wafer lying on a rotating support and being held at a specific temperature with the aid of a control system. Thermal radiation which is emitted by the semiconductor wafer and the IR radiators is recorded using a pyrometer. The radiation temperature of the recorded thermal radiation is determined. The semiconductor wafer is assumed to be in an incorrect position if the temperature of the recorded thermal radiation fluctuates to such an extent over the course of time that the fluctuation width lies outside a fluctuation range &Dgr;T which is regarded as permissible.

Abstract: A system for providing the reliable and numerically efficient generation of time-optimum trajectories with easy-to-track or continuous acceleration profiles for simple and blended moves of single- and multi-arm robotic manipulators, such as an extension and retraction move along a straight line or a rotary move following a circular arc, with velocity, acceleration, jerk, and jerk rate constraints. A time-optimum trajectory is the set of the position, velocity, and acceleration profiles which describe the move of a selected end effector along a given path in the shortest time possible without violating given constraints, with a special case being an optimum abort trajectory, which brings the moving arm into complete rest in the shortest time. The invention involves firstly identifying the set of fundamental trajectory shapes which cover all possible combinations of constraints for a given category of moves, e.g.

Abstract: An interface apparatus places, in a boat, plural wafers transported thereto one by one from an application apparatus for performing single wafer processing, then transports the boat having the wafers placed therein to a heating apparatus for subjecting plural wafers to a heat treatment process, and after completion of the heat treatment process, receives the boat. The interface apparatus includes a stage, a rotary table rotatably arranged on the stage for placing the boat thereon, and a positioning mechanism for turning the rotary table in a direction of displacement of the boat to permit the boat to be placed on the rotary table when the boat is being placed on the rotary table with the position thereof displaced from a reference position in a rotatable direction of the rotary table, and after completion of the placement, turning the rotary table in a direction opposite to the displacement direction to thereby position the boat at the reference position.

Abstract: An apparatus is provided with a plurality of stages of mounting bases on each of which is disposed upwardly orientated, narrow tapered pins around the periphery of a semiconductor wafer, and a plurality of stages of turntables, one for each of the mounting bases, with the mounting bases being capable of moving independently of the turntables. When a wafer is transferred from a transporter arm to the tapered pins, the peripheral edge of the wafer comes into contact with the inner peripheral surfaces of the tapered pins and the wafer is centered thereby. The turntable then picks up the wafer and aligns the orientation thereof. This makes it possible to position the centers of a plurality of wafers and position the orientations thereof in a simple manner.

Abstract: An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.

Abstract: An apparatus and method for monitoring the level of a semiconductor processing chamber susceptor and the inclination of a wafer residing within a pocket of the susceptor. In one embodiment, a light beam transmitter is positioned to direct a light beam, such as a laser beam, onto the top surface of a wafer that has been positioned within a susceptor pocket. The light beam forms a target spot of a particular size and shape on the surface of the wafer. A camera is positioned to observe the target spot. A change in the angular orientation of the wafer or susceptor will result in a change in the size and shape of the target spot. The camera is configured to detect changes in the target spot size and shape. A logic circuit is provided at the output of the camera to correlate the observed shape and size of the target spot to a value indicative of the levelness of the susceptor and/or the inclination of a wafer located within the pocket of the susceptor.

Abstract: A liquid phase deposition method of mass producing substantially uniform silicon dioxide films on wafers by forming wafer sets from at least four wafers. The wafer sets are placed in a slotted polytetrafluroethylene polymer boat wherein a proper and short distance between the front surface of a wafer and another surface is created. Finally, a substantially uniform silicon dioxide film is deposited on the wafer surfaces by contacting the wafer sets with an aqueous supersaturated silicon dioxide solution comprising a mixture of hydrofluosilicic acid and boric acid.

Abstract: A system is provided for determining an eccentricity vector &egr; which defines the magnitude and direction of an initial placement displaced from a desired location of a centroid O of a right quadrilateral semiconductor wafer which may be clear or opaque. With an initial point of reference desirably established on its peripheral edge for detection by an edge sensor, the wafer is rotated about a point P and a curve defining the profile of the peripheral edge is obtained. The eccentricity vector is computed from the sensed positions of the corners of the wafer and has a magnitude representative of the spatial dislocation of the centroid O relative to the point P and having an orientation &phgr; representative of the angle subtended by a first line connecting the point P and the centroid O relative to a second line connecting opposite corners of the wafer.

Abstract: A fixture and method for providing accurate and repeatable alignment and attachment of a semiconductor wafer to a corner cube exposure fixture includes a vacuum-assisted wafer holder of rectangular shape. The wafer holder is first placed upon an L-shaped loading fixture so that a wafer may be positioned against the front surface of the holder and manipulated until the pair of wafer flats abut each leg of the L-shaped fixture. When so aligned, a vacuum is applied to secure the attachment and alignment of the wafer vis-à-vis the wafer holder. The wafer holder is thereafter inserted in a corner cube exposure fixture, where the fixture is formed to include a right-angle bracket with alignment features formed in one leg of the angle. The wafer holder also includes alignment features in its bottom surface, where these features are formed to mate with the bracket upon attachment.

Abstract: A wafer chuck for positioning and releasably holding a wafer includes a support platform having an upper surface for positioning and supporting the wafer. Wafer banking pins are affixed to the support platform for positioning the wafer. A lift device acting on the wafer when it rests on the support platform to move the wafer relative to the support platform in a slanted direction away from the support platform and wafer banking pins. The lift device has a plurality of wafer lifting fingers that cooperatively extend in a biased and substantially vertical direction are disposed in a pattern to be supportive of the wafer. Each of the wafer lifting fingers has an end portion that is movable relative to the support platform between a first position at which it is retracted from the upper surface of the support platform and a second position at which it protrudes from the upper surface of the support platform so as to engage the wafer to lift it relative to the support platform.

Abstract: A method of testing semiconductor wafers wherein a cassette (3) containing a plurality of semiconductor wafers for fabrication is provided. The location and orientation of each of the wafers within the cassette is determined and at least one processing step is performed on the wafers. At least one of an alteration of the location in the cassette (5) and orientation of the wafers (7) is provided and at least one additional processing step is performed on the wafers. At least one of an alteration of the location and orientation of the wafers is provided including alteration of the location or orientation of the wafers if not yet altered. At least one like parameter of each of the wafers is measured (9). The variation across the wafer of the at least one parameter is correlated with the orientation and the location on a wafer by wafer basis and processing errors are determined from the step of correlating which can be used to alter and reduce variation in the fabrication process.

Abstract: In the work crystal orientation adjusting method, the crystal orientations of a work 22 in the rotational direction and in the horizontal direction thereof are measured by an orientation measuring device 76. In accordance with the measured value of the crystal orientation of the work 22 in the rotational direction, the work 22 is rotated about the axis thereof to thereby adjust the crystal orientation of the work 22 in the rotational direction. On the outer surface of the work 22, there are put marks M1 and M2 indicating reference positions for adhesion of an auxiliary plate B which is used to cut the work 22. The auxiliary plate B is adhered to the outer peripheral surface of the work 22 based on the marks M1 and M2. A work mounting plate 53 is mounted onto a support base 40 to thereby support the work 22 on the support base 40.

Abstract: An alignment system includes two or more alignment devices arranged in close proximity and sharing a common processing device. The alignment devices are located adjacent to one another, yet while one substrate is being processed, a second substrate can be prepared for processing without affecting or interfering with the first substrate, thereby resulting in greater utilization of the process resource.

Abstract: A wafer handling and testing apparatus and method include a station for supporting a wafer carrier, such as a cassette or pod, that holds one or more wafers, where the carrier can be moved in a z-direction. A wafer handling assembly is moveable in an x-direction and removes a wafer from the wafer carrier. The handling assembly includes an end effector and a sensor for detecting an edge of the wafer. A chuck includes a platform that is movable in a z-direction and is used to lift the wafer from the handling assembly and rotate the wafer so that the sensor maps the edge of the wafer. The wafer is then centered on the platform, lowered onto the chuck, and is tested by a test head that is preferably coupled to the handling assembly.

Abstract: The present invention provides a method and apparatus for determining whether a substrate is in a clamped or unclamped state on a robot blade and preferably allows the position of a properly clamped substrate to be compensated for misalignments due to substrates not at or very near to their nominal positions on the blade. A sensor unit comprising a radiation source and a detector and capable of transmitting and receiving a signal is mounted outside a transfer chamber and is positioned to direct the signal therein. A robot blade having a reflecting member is actuated through the transfer chamber and into the path of the signal. The reflecting member is preferably positioned on a clamp finger and causes the signal to be reflected to the detector of the sensor unit when the signal is incident on the reflecting member. As the reflecting member moves through the signal the output of the sensor unit switches states, thereby generating values corresponding to the position of the reflecting member.

Abstract: A machine for manufacturing semiconductor devices has a. processing chamber for processing the semiconductor wafer. A transfer chamber has at least two positions, one position to facilitate the transfer of a wafer to be processed into the transfer chamber and to facilitate the transfer of a processed wafer from the transfer chamber to the cassette from which the wafer originated. The second position facilitates the transfer of a wafer to and from the processing chamber. A transfer arm simultaneously transfers an unprocessed wafer from the first position to the second position with the transfer of a processed wafer from the second position to the first position.

Abstract: Apparatus for detection of an edge of a generally disk-shaped workpiece, such as a semiconductor wafer, includes a light source positioned to direct a light beam at the surface of the workpiece near the edge thereof such that a first part of the light beam passes the workpiece and a second part of the light beam is intercepted by the workpiece. An angle between the light beam and a normal to the surface is equal to or greater than a critical angle that produces total internal reflection of the light beam in the workpiece. The apparatus further includes a mechanism for rotating the workpiece and a light sensor positioned to sense the first part of the light beam and to generate an edge signal that represents the edge of the workpiece as the workpiece is rotated. The apparatus may be used for sensing orientation and location of semiconductor wafers of different materials, including those which are transparent to the light beam.

Abstract: A transport apparatus for holding and transporting a conductive, planar object without contact is provided. The transport apparatus includes pairs of floating-use electrodes to which a certain potential difference is applied to produce electrostatic attraction force for attracting and floating the object in a non-contact state, pairs of driving-use electrodes to which suitable potential differences are applied to cause currents to flow in portions of the object that face these electrodes, and magnetic devices for generating magnetic fields that interact with the currents to produce drive forces or Lorentz forces acting on the object.

Abstract: A stage system includes a stage movable along a path, a first driving mechanism for accelerating or decelerating the stage on the basis of a resilience force of a resilient member, a first holding mechanism for holding a resilience force being accumulated through compression of the resilient member of the first driving mechanism, and a second holding mechanism for holding a resilience force being accumulated through extension of the resilient member of the first driving mechanism, wherein resilience energy of the resilient member is used for stage acceleration, which is very effective to prevent large heat generation, and wherein resilient energy accumulated in the resilient member during deceleration is used for subsequent stage acceleration, which is very effective for energy efficiency and for heat generation suppression.

Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.