Abstract: A substrate processing apparatus having a plurality of substrate processing modules connected to a substrate transport. The substrate transport has a housing and a substrate transport mechanism. The housing forms a substantially closed main transport chamber with doorways into the main transport chamber for the substrate processing modules. The transport mechanism has a substrate holder movably located in the transport chamber. The housing includes a front end extension that is connected to load locks. The front end extension has an aligner, a cooler, and a buffer directly connected to the housing and located in the front end extension in part of the main transport chamber.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: The present invention is an orientation flat aligner for preventing the angle deviation of the flat edge of the wafer. This invention applies two new designs to the aligner: (1) The two parallel rollers with different radius instead of two parallel rollers the same radii prevent the problem of the angle deviation to line up the flat edge of the wafer. (2) placing the photosensor on the orientation flat aligner instead of on the sensor bracket avoids the detection error because of the photosensor position relate to the orientation flat aligner position and saves time on checking whether the flat edge of the wafer line up or not.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A notched wafer aligning apparatus capable of aligning a number of notched wafers received in a cassette with each other at a predetermined position and facilitating shifting of the thus-aligned wafers to any desired position. A plurality of notch detection rollers are rotatably arranged in juxtaposition to each other on a rotation drive shaft so as to be rotated while being abutted against a lower portion of peripheral edges of the wafers through a lower open end of the cassette. The notch detection rollers are individually rotated due to friction between the notch detection rollers and the rotation drive shaft.

Abstract: A detector is provided to optically monitor the outer periphery of a wafer rotated by rotation of a rotary stage, so as to detect how much the center of the wafer placed on the rotary inspection stage is offset from the rotational center of the rotary stage as well as an angular position, on the stage, of a V-shaped notch formed in the wafer. From the detected eccentricity of the wafer, it is determined whether a precise positioning operation, using at least three positioning pins, to locate the center of the wafer at the rotational center of the rotary stage should be performed or not. When the detected eccentricity is so great as to necessitate the precise positioning operation, one of the positioning pins is caused to fit into the V-shaped notch of the wafer on the basis of the detected angular position of the notch and then the precise positioning of the wafer is performed using the other two positioning pins.

Abstract: An apparatus for conveying a wafer to wafer work suction-holding stage and then discharging a worked wafer from the wafer work suction-holding stage, including a loader side elevator device, a wafer position correcting stage, a wafer work suction-holding stage, a wafer carrying table and an unloader side elevator device which are successively disposed in this order; and the apparatus further including a conveyor which conveys a wafer inside a loader side magazine carried on the loader side elevator device to a point above the positional correction suction-holding stage, a stopper which positions the wafer conveyed by the conveyor to the wafer position correcting stage, and a feeding pawl moving device which operates after the wafer position correcting stage and wafer work suction-holding stage have been moved vertically so that the upper surface of the wafer position correcting stage is at substantially the same height as the upper surface of the stopper and so that the upper surface of the wafer work suction

Abstract: A wafer cassette for storing a wafer is provided vertically above (direction Z) a transport path for a wafer which is carried by a robot arm driven by a drive mechanism to move along a transport guide extending from a wafer inlet from a wafer outlet. The wafer cassette is disposed at a position between the inlet and a pre-alignment mechanism. The wafer cassette is supported by a cassette retaining base. Drive members driven by a wafer up-down mechanism are fixed to both ends of the cassette retaining base which face opposite each other in a direction perpendicular to the transport path. Thus, the wafer cassette is vertically moved by the wafer up-down mechanism to deliver a wafer between the robot arm and the wafer cassette.

Abstract: A method of orienting wafers in an apparatus having a wafer receiving-workpiece holder such as an electro-static chuck for processing of the wafers and eliminating etch debris build-up at the wafer orienting notch. The method comprises the steps of first providing a plurality of wafers, each wafer having an orientation mark thereon and then securing a first wafer in the chuck with the first wafer orientation mark in a first position with respect to the chuck. Thereafter, the first wafer is removed from the chuck after desired processing of the first wafer. A subsequent wafer is secured in the chuck with the subsequent wafer orientation mark in a second position with respect to the chuck different than the first position.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A semiconductor processing system, such as a system for scrubbing both sides of a wafer at the same time, that includes a brush box containment apparatus for use with highly-acidic or other volatile chemical solutions, a roller positioning apparatus and a (brush) placement device.

Abstract: An apparatus for transferring a wafer in a semiconductor manufacturing process, and for carrying a wafer between a cassette and a wafer chuck without an additional tool such as a tripod. The apparatus includes: a holder capable of holding the side of the wafer; a wafer transfer assembly including an actuator of the holder and a detector that detects a malfunction of the holder; and a process reactor having a vacuum exhaust port installed under a wafer chuck so as to guide gas in an axially-symmetric flow pattern. The holder grasps the rounded side of a wafer. Removal of additional tools makes the structure of an overall system more simple and an exhaust port can be installed under the reactor so as to cause processing gas to be guided in an axially-symmetric flow, resulting in an enhancement of the process uniformity.

Abstract: The presence and absence of a semiconductor wafer on a wafer holder in a vacuum chamber having an optically transparent window is detected by an optical system including a source of optical energy positioned outside the chamber and a receiver for the optical energy positioned outside the chamber. A light path extends from the source through the window and an opening in the wafer holder when no wafer is on the wafer holder. The optical path is bent downstream of the wafer holder, thence continues back through another opening in the wafer holder, and through the window to the receiver. The optical receiver is positioned and arranged so optical energy reflected from a wafer (even a wafer having dispersive mirror properties) in situ on the wafer holder cannot be reflected or otherwise incident on the optical receiver.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: The invention provides a manually operated machine for radially aligning one or more semiconductor wafers. The machine includes an elongated first "notch" roller for rotatably engaging the edge of the wafers, a gear train, and a hand crank for manually rotating the first roller in cooperation with the gear train. The wafers are aligned according to the notches as the wafers are engaged and rotated by the notch roller until the notch in each wafer falls over and is disengaged by that roller. The manual notch finder may also include an elongated second "position" roller for rotatably engaging the edge of the wafers. The position roller is disposed laterally near the notch roller and sized and shaped to engage the edge of the wafers fully along the periphery of each wafer so that the aligned wafers can be positioned to any degree of radial orientation. The invention also provides a combination notch or flat finder machine integrated with a wafer transfer machine.

Abstract: A transport container for transporting a plurality of semiconductor wafers as stacked therein. The container includes a box-shaped container body having four peripheral walls, and an upper lid for closing and opening an upper opening of the container body. The front wall of the container body is pivotable between an open position and a closed position. The upper lid and front wall are opened when the semiconductor wafers are loaded into or unloaded from the transport container. An apparatus is provided for loading and unloading the semiconductor wafers into/from the transport container.

Abstract: Transfer and processing of semiconductor wafers are performed while maintaining the wafer surfaces in a vertical orientation by holding the water substrate with electrostatic chucking of the rear face thereof. Thereby, the floor area of the transfer and processing system becomes almost the same regardless of the wafer size. Because only the back of the wafer comes in contact with a transfer member, the wafer front surface is kept clean and moreover wafer transfer can be done quickly.

Abstract: An apparatus for and method of holding a semiconductor wafer (11) during a manufacturing process supports the semiconductor wafer (11) in a substantially planar form (15) with a two-platform wafer chuck (19). The two-platform wafer chuck (19) is compatible with handling warped and unwarped wafers, wafer transferring and handling techniques which maintain wafer flatness, and semiconductor manufacturing processes such as photolithography and auto-probing which require semiconductor wafers to be held in a flat configuration.

Abstract: Two lithographic substrate stages are used in a single lithographic system. While a substrate on one stage is being exposed, a second substrate is being loaded, unloaded, or aligned on a second stage. After exposure, the first stage is unloaded, reloaded, and the newly-loaded substrate is aligned, while the second substrate on the second stage is being exposed. The two stages are thus used alternately in different steps of the process. One of the steps is being performed on one stage while a different step is being performed on the other stage. The substrates on both stages are, therefore, being acted upon simultaneously. The two stages are carried on a single linear motor platen, and moved about the platen by use of linear motors. The two stages alternately both move in clockwise directions about the platen, or both move in counterclockwise directions. When both move in clockwise directions, the first stage is moving to the exposure position, and the second stage is moving to the unload/load/align station.

Abstract: A method and system for detecting focus spots. Data from a file created during stepper operation is extracted to get field coordinate position, leveling scheme, and tilt with respect to the x- and y-axes, and wafer height with respect to the focal plane for the multiple fields on the multiple wafers in a production batch. A delta value is calculated for the x- and y-axes tilt data which averages the tilt of each field with its surrounding fields. Delta values are placed in a 3-dimensional data structure linking neighboring fields and corresponding fields on subsequent wafers. Focus spots are detected by the repeated presence of data spikes over the sum of the arithmetic mean and some multiple of the standard deviation of the delta values.

Abstract: A semiconductor wafer pre-aligning apparatus includes a wafer transfer unit for transferring a semiconductor wafer, and a wafer stopping unit for stopping and disposing the transferred semiconductor wafer on a predetermined position of a transferring path. The wafer stopping unit includes a stop elevatably disposed on the wafer transferring path and having a plurality of stepped and arc-shaped walls whose radii are different from one another but whose curvature centers coincide, and a device for elevating the wafer stopping unit. Thus, changes in wafer size can be dealt with easily and a clean work environment for wafer treatment can be maintained.

Abstract: A stage assembly for a substrate processing system including a cassette support assembly for receiving and supporting a cassette and an actuation and support assembly for supporting and moving the cassette and cassette support assembly between a loading position and a processing position. The processing position provides convenient and efficient access by a central processing system, and the loading position preferably places each cassette closer to, and aligned with, a front panel of the processing system for convenient access by an operator. The actuator and support assembly preferably includes a frame assembly and a rotating plate pivotally mounted to the frame assembly, where the cassette support assembly is mounted to the rotating plate for pivoting relative to the frame assembly. An actuator assembly mounted to the frame assembly flits the cassette support assembly between the loading and processing positions. A shaft assembly pivotally mounts the cassette support assembly to the rotating plate.

Abstract: An apparatus and method for aligning indexing notches of disk-shaped members, such as semiconductor wafers, include providing an alignment rod that is driven by another roller to cause rotation of the disk-shaped members. The circumferential surfaces of the alignment rod and the drive roller are in frictional contact. Initially, the disk-shaped members rest upon the alignment rod, so that rotation of the alignment rod causes rotation of the disk-shaped members until indexing notches are seated on the alignment rod. In the preferred embodiment, the seating of the indexing notches transfers at least a portion of the weight of the disk-shaped members to a reciprocating structure, such as a comb member. After all of the indexing notches have been aligned, a second weight transfer occurs, with the reciprocating structure following the contour of the drive roller and the disk-shaped members coming to rest on the drive roller. The disk-shaped members can then be uniformly rotated to locate the notches as desired.

Abstract: In a vertical heat treatment apparatus, a transfer apparatus is used to transfer a wafer between a wafer carrier and a wafer boat. The transfer apparatus comprises a base unit, a fork, three non-contact type sensors, and a main controller. The base unit can move between a first position at which to transfer the wafer to and from the wafer carrier and a second position at which to transfer the wafer to and from the wafer boat. The fork can move back and forth with respect to the base unit, for supporting the wafer. The non-contact type sensors are mounted on the fork, for detecting the position of the wafer. The main controller controls the base unit and the fork in accordance with the data detected by the non-contact type sensors.

Abstract: A measurement station which rotates a wafer in a vertical plane and moves a scanning sensor linearly along an axis which is parallel to the wafer rotation plane, thus providing a spiral, or other, scan path across the wafer. The vertical orientation reduces errors from weight induced sagging, especially of large, e.g. 300 mm wafers. The measurement station includes wafer grippers which move in the wafer's plane for securing the wafer in position for rotation. The measurement station also includes master calibration gauges which simplify calibration and obviate the need for calibration test wafers. A technique for reducing vibration and assuring scan repeatability includes coasting of the wafer in rotation and coordinated linear probe motions for scanning. Probe measurement data obtained is digitized early and calibration, demodulation, filtering and other processing is done digitally.

Abstract: An apparatus according to the present invention includes a cassette in which a plurality of substrates are stored, a contact guide member provided to face a side surface of the cassette, and pressing end surfaces of substrates stored in the cassette, an alignment device for moving the contact guide member to approach the cassette, and pressing the contact guide member against the end surfaces of the substrates in the cassette, thereby aligning the substrates all at one pressing time, and detectors, provided for the alignment device at positions corresponding to spaces of substrates held in the cassette, in the same or multiple number of the spaces for holding substrates, for detecting whether or not a substrate is present in each of the spaces for holding the substrates of the cassette.

Abstract: An improved substrate processing system. The system may be used for double sided scrubbing of a semiconductor substrate. The wet stations of the system has covers which prevent accumulated liquid from dripping outside of the station and which minimize dripping on the substrates. Transport tunnels are provided between modules to prevent leakage between the modules. A substrate transport mechanism which is moveable along a rail is provided with the stabilizer to provide for stable substrate transfer. The processing system has two brush stations which are placed within a single enclosure. The sensors located throughout the system, which sense the presence of a wafer, are fixedly mounted in a frame so that they are self-aligned to one another. In the sender station, two sensors are used, with the system requiring both sensors to sense the presence of a wafer to increase the reliability. In the dry station, the heating lamp is shielded from the substrate to reduce particulate contamination.

Abstract: A substrate processing apparatus comprises a processing part and a transferring part. In the processing part there are a plurality of stages in which a plurality of processing units are arranged in a row along a horizontal direction and the stages are arranged in a stack vertically. Thus, the processing units are arranged in matrix. The transferring part includes a plurality of horizontal transferring devices each movable in the horizontal direction and a vertical transferring device movable in the vertical direction. Hence, a substrate is movable both horizontally and vertically to be transferred to the desired processing unit.

Abstract: A wafer holder which grips a wafer by its edges is disclosed. The wafer holder is mounted on a spindle assembly which spins the wafer so held, for example, to spin dry both the front and back side of the wafer. The wafer holder includes two pairs of wafer holding bumpers, each pair coupled to one end of a reciprocating arm which swings each pair inward and outward to define an open position for releasing or loading a wafer, and a closed position for holding the wafer. Each arm is coupled to an insert and thrust bearing allowing for rotation to provide the reciprocating motion. After the insert and thrust bearing have toggled past a predefined position while the wafer holder is in the closed position, further motion is prevented, to lock the wafer holder in the closed position. Further, the insert member rotates back and forth in response to up and down movement of a rod within the spindle to allow for opening and closing of the wafer holder.

Abstract: A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

Abstract: In a photolithography system, baking and cooling of semiconductor substrates is done in a thermal process module that uses a unique mechanism including pulleys to route vacuum tubing to a transfer arm. Specifically, the mechanism includes a pair of pulleys and a vacuum tube wrapped around the pulleys. The vacuum tube has a movable portion connected to the transfer arm which is reciprocable between the pair of pulleys. The vacuum tube also has a stationary portion that is connected to the movable portion to form an endless loop. The stationary portion of the vacuum tube is rigidly connected to a vacuum supply line in the housing of the thermal process module.

Abstract: A method for handling wafers one at a time for processing without the necessity for transporting the wafers in a carrier such as a wafer cassette or basket. After a manufacturing step such as a polishing step, the wafers are carried to a loader assembly in a horizontal orientation under the influence of flowing liquid. The wafers are then individually erected into a vertical orientation by being first stopped by stopper pins which stand vertically on a wafer receiving plate of a suction arm including a suction nozzle which firmly holds the wafers while the arm is pivotally rotated until the wafer is positioned into a vertical orientation. The vertical orientation thus achieved allows the wafer to be gripped by a wafer gripping portion of a transportation robot including grooved gripping arms operated by a mechanism which limits the force applied to the wafer.

Abstract: According to this invention, there is provided a notch position aligning mechanism and a process for using the mechanism including a base which can be vertically movably inserted into a cassette through a lower opening of the cassette for storing a plurality of targets to be aligned having notches formed in edge portions of the targets wherein can be fitted, a rotating/supporting mechanism, including a first rotary member which is arranged on the base, and has a plurality of fitting grooves in which the notches of the targets can be fitted, a second rotary member which can be rotated and is arranged on the base, and a drive unit for rotating at least one of the first and second rotary members, the rotating/supporting mechanism supporting and rotating the targets using the first and second rotary members while the targets are spaced apart from the cassette, and a support member, arranged on the base, for supporting the targets having the notches fitted in the fitting grooves of the first rotary member to stop

Abstract: A device for carrying a thin plate-like substrate such as a semiconductor wafer and controlling its position by floating it with an inert gas of low impurity concentration. A transferring unit and a controlling unit are respectively provided with gas nozzles for floating a thin plate-like substrate and with a gas exhausting and circulating system, and a plurality of them are in combination with each other in a sealing state. The controlling unit, further, has a vacuum suction hole at its controlling center, and is provided with nozzles for controlling the thin plate-like substrate in its radial and circumferential direction respectively and with nozzles for stopping the thin plate-like substrate or sending out it to the next unit too.

Abstract: There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

Abstract: A prealigner (10) employs an X-Y stage (20) and a rotary stage (26) to position and orient a specimen (12) without centering it on the prealigner. The rotary stage is mounted on the X-Y stage and receives a semiconductor wafer (12) in a substantially arbitrary position and orientation. The prealigner employs the rotary stage and translation in only an X-axis direction to scan a peripheral edge (76) of the wafer across an optical scanning assembly (36, 270) to form a polar coordinate map of the wafer. A microprocessor (162) determines the location and orientation of the wafer from the map and cooperates with a motor drive controller (122, 280) to generate control signals for positioning and orienting the wafer in the preselected alignment without changing the location at which the wafer is held.

Abstract: A prealigner (10) employs an X-Y stage (20) and a rotary stage (26) to position and orient a specimen (12) without centering it on the prealigner. In a preferred embodiment, the rotary stage is mounted on the X-Y stage and receives a semiconductor (12) in a substantially arbitrary position and orientation. The prealigner employs the rotary stage and translation in only an X-axis direction to scan the peripheral edge (76) of the wafer across an optical scanning assembly (36) to form a polar coordinate map of the wafer. A microprocessor (162) determines the location and orientation of the wafer from the map and cooperates with a motor drive controller (122) to generate control signals for positioning and orienting the wafer in the preselected alignment without changing the location at which the wafer is held.

Abstract: A vacuum processing apparatus in which LCD substrates are processed includes three process chambers. Each of the process chambers is connected to a first load lock chamber through a gate valve. A second load lock chamber is also connected to the first load lock chamber through a gate valve. The second load lock chamber is opposed to a carrier member, which is arranged in the atmosphere, through a gate valve. A carrier arm is arranged in the first load lock chamber to carry the substrates between each of the process chambers and the second load lock chamber. A buffer rack for supporting two substrates thereon and positioners for aligning the two substrates, which are supported on the buffer rack, simultaneously are arranged in the second load lock chamber.

Abstract: A holder mechanism tilts and rotates a vertically oriented wafer-loaded cassette for proper presentation in a horizontal orientation to the robotic arm of a workstation. The mechanism includes a cassette holder, a support member, and a motor. The cassette holder has first and second supports that define orthogonal first and second planes. In two embodiments, the support member connects the cassette holder to the motor shaft and, as the motor shaft rotates, the cassette holder is rotated about a single pivot axis that is oblique to the first and second planes. This rotation tilts a cassette placed in the holder through a tilt angle of about 45.degree. to 90.degree., and simultaneous rotates the cassette through an angle .theta. about the vertical axis. The support member shape determines whether tilting and rotation is away from or toward the motor, and also determines the angle of rotation .theta. and the tilt angle.

Abstract: A semiconductor wafer and magnetic disk edge detection system having a sensor unit comprising a dual beam light source spatially oriented so that the beams focus and converge at a single point external to the sensor unit, and dual light detectors spatially oriented to allow detection of light reflected from the edges of the wafers and disks even where the angle of incidence of the light onto the edge deviates significantly from the perpendicular. The sensor unit works in operative combination with a scanning motion means to move the sensor across the edges of the wafers or disks to be detected, typically by attachment of the sensor unit to a linear motor or a robotic arm, or alternately, by manually detecting the edges of the wafers and disks.

Abstract: An apparatus for carrying a substrate having a substrate storage part for storing substrate casings that encase substrates, and a carrier system for carrying the substrate to a substrate stage from the substrate storage part. The apparatus comprises a first carrier device, a temporary storage part and a second carrier device. The first carrier device carries the substrate to a first substrate carry position from the substrate storage part. The temporary storage unit incorporates a holding mechanism for individually adsorptively holding the substrate by vacuum in a predetermined state and is provided between the first substrate carry position and the substrate stage. The second carrier device is capable of carrying the substrate to the substrate stage from the first carry position and also carrying the substrate between the temporary storage unit and the substrate stage.

Abstract: In a sample holding apparatus including a main body, a holding body movably provided to the main body, a spring disposed to urge the main body and the holding body toward one another, pins fixed to the main body and the holding body for holding a sample, holding and releasing of the sample are effected by action of a moving stroke of the sample holding apparatus itself and a support member fixed to the sample holding apparatus without requirement for special drive components.

Abstract: A cassette carrier unit for carrying a cassette, in which a plurality of substrates are housed, into and out of cassette chambers of the multi-chamber system including a hand on which the cassette is mounted. A multi-joined arm for supports the swingable hand, and a base supports the multi-joined swingable arm. The multi-joined arm includes a first shaft member rotatably attached to the hand, a second shaft member rotatably attached to the base, a third shaft member rotated associating with the first shaft member but in a direction reverse to the direction in which the first shaft member is rotated, and a fourth shaft member rotatably attached to the base and to which rotation drive force is transmitted. A first arm is rotatably attached to the first shaft member at the front end thereof and to the second shaft member at the base end thereof.

Abstract: A container for storing a plurality of semiconductor wafers comprises two end walls and two side walls. The container has a main opening through which the wafers are inserted into or withdrawn from the container and a sub-opening through which a wafer counter approaches the wafers. A plurality of slots are formed in the container to hold the wafers one by one at intervals. Each slot includes a pair of grooves which are formed in inner surfaces of both the side walls, have a V-shaped cross-section, and which divergently open toward a central portion of the container. One surface of each groove serves as a supporting surface on which a wafer is disposed substantially horizontal when the container is positioned such that the reference plane is horizontal. The supporting surfaces of the pair of grooves have a pair of converging portions which converge toward the second opening.

Abstract: A cassette (2) or storage box for integrated circuit wafers or memory disks arranged and constructed for directly being placed onto the driven rollers (6) of contaminant free conveyors. The cassettes have a flat canted surface (10) for riding on the rollers. The cant is enough such that the loaded wafers lean against the sides of their individual pockets as the cassette travels. The leaning reduces damaged to the wafers by the vibrations involved with physically moving the cassette.

Abstract: This invention teaches an apparatus and method for detection and correction of eccentricity and angular misalignment of a wafer. The position of a wafer is determined while the wafer is stationary on a robot arm by position sensors that locate four points on the periphery of the wafer. A microprocessor selects and uses a specific combination of three of the four points to calculate the actual location of the center of the wafer. The microprocessor produces signals which are used to correct the wafer's eccentricity using two rotatable shafts, an inner shaft mounted inside an outer shaft. The outer shaft is rotated prior to arrival of the wafer, in order to position the inner shaft at a pre-determined location depending on the eccentricity to be corrected. After the wafer is placed on a turntable mounted on and rotatable by the inner shaft, the inner shaft is rotated by the requisite angle to eliminate the wafer's eccentricity in a single movement.

Abstract: A load-lock unit is disposed between first and second atmospheres, for storing a wafer transferred from the first atmosphere, and which is blocked off from the first atmosphere, thereafter being set in an atmosphere at least substantially similar to the second atmosphere, and opened so as to communicate with the second atmosphere in order to transfer the wafer to the second atmosphere. The load-lock unit includes a load-lock chamber, a holding mechanism, disposed in the load-lock chamber for holding the wafer, a rotating mechanism for rotating the wafer held by the holding mechanism, and an error detecting mechanism for detecting a positional error of the center of the wafer and an orientation error of the wafer on the basis of data obtained by radiating light on the wafer which is rotating.

Abstract: A method for transferring wafers from one processing station to another station sequentially, utilizing a transfer system which is installed in a clean bench forming a downward flow of clean air. A plurality of stations is provided for processing wafers in the clean bench. The transfer system comprises at least a single transfer robot carrying a plurality of wafers, the transfer robot being movable from one station to another sequentially for processing, and an exhaust duct is provided along a path of the transfer robot movement, the duct having a plurality of inlets for exhausting the air.

Abstract: A device for detecting and locating substrates in a cassette including a homogeneous columnar radiation source adjacent to and radiating the edges of the substrates, rod-shaped directional lenses transmitting and replicating the substrate edges in their field of view and directing the transmitted reflected radiation and image of the field of view onto sensing pixels activated to produce indications of the presence and location of the substrates in the cassette.

Abstract: A semiconductor wafer-detecting apparatus is provided with a main support body formed of synthetic resin. A pair of substantially-parallel longitudinal channels and a plurality of substantially-parallel transverse channels are formed in the main support body. The longitudinal channels are located away from each other by a predetermined distance, and the transverse channels are arranged at intervals corresponding to the intervals at which wafers are arranged. Between the adjacent transverse channels, a plurality of pairs of holding portions are defined such that each pair is associated with the longitudinal channels. A pair of light-emitting elements and a pair of light-receiving elements are alternately arranged with reference to the holding portions. The light-emitting elements of each pair have their light-emitting faces oriented in opposite directions; likewise, the light-receiving elements of each pair have their light-receiving faces oriented in opposite directions.