Abstract: A substrate fabrication system is provided which includes a buffer station located inline between a front docking port and a loadlock chamber, the buffer station being operatively joined with a front handling chamber. Preferred embodiments employ a buffer station having a rack with reduced pitch, or relative spacing between shelves. Additional embodiments provide variable pitch end effectors as part of the disclosed fabrication system. Methods of fabricating wafers by quickly transferring them to purgeable buffer stations upon wafers arriving at a docking port are also provided.

Abstract: A reticle storage system includes a reticle rack having a series of lateral slots, each for storing a reticle. Access to the reticles is provided on a lateral side of the rack. The enclosure has a series of doors for providing access to the reticles in the slots. An air circulation system flows filtered air past the reticles in the rack to prevent contaminants from accumulating on the reticles. The air circulation system is capable of providing positive air pressure within the enclosure with one door open, thereby preventing contaminants from entering the enclosure through the open door.

Abstract: A transport apparatus for transporting a carrier with a plurality of works placed thereon includes a loader for loading the carrier into a processing unit for performing a predetermined process for the works and a transporter for receiving the carrier loaded by the loader and intermittently transporting the carrier such that the plurality of works are sequentially positioned at a process position of the processing unit one by one. In addition, an unloading mechanism receives the carrier from the transporter after all of the plurality of works are subjected to the predetermined process at the process position, and unloads the carrier outside the processing unit, wherein the work is processed in the state it is placed on the carrier.

Abstract: Wafer order is randomized in-situ by use of a separate wafer staging area and randomly shuffling wafers to and from this staging area to shuffle the processing order of the wafer lot. Positional data is captured for each wafer at both the send and receive ends of the process.

Abstract: The mask guiding device of the present invention has a mask guiding device that guides a substrate received from the outside. The mask guiding device is provided with a plurality of receiving portions that receives said mask from the outside.

Abstract: A cassette table on which a wafer cassette is supported allows static electricity to be discharged from the cassette and hence, form the wafers disposed in the cassette. The cassette table includes a top plate, a cassette supporter that is mounted on the top plate and supports the cassette. At least part of the cassette supporter is made of a material that allows static electricity to be discharged to ground therethrough.

Abstract: The invention relates to a monitoring system for a conveying device for flat articles, especially wafers, which conveying device is provided with a carriage (28) that is movable along a predetermined path next to a flat article (10) that is located at a predetermined removal location, the carriage having a receiving device for the accommodation of the flat article (10), which monitoring system contains a light source (50) having a light-exit window and a light receiver (52) having a light-admission window, whereby the light-exit window and the light-admission window are positioned in such a way that a light beam (60) directed form the light-exit window to the light-admission window is partially covered by the carriage (28) during its movement through the light beam, and an evaluation unit that is connected to the light receiver and that compares a target signal derived from its movement of the carriage along a target path with an actual signal derived from an actual movement of the carriage, and indicates a d

Abstract: A pod for transporting reticles is made with a reticle support that has a &pgr;-shape and is provided with pins, whose arrangement matches the location of chrome-free areas on a reticle base. Due to that, the pins, when supporting the reticle, come into contact with the reticle in chrome-free areas thereof. Thus, scratching the metallic areas and releasing metallic particles is prevented from occurring.

Abstract: A wafer carrier device capable of detecting positioning precision of a supporting plate thereof. In the present invention, a supporting plate connected to a mechanical arm has three reflectors and a positioning window. A detection device has a vertical signal generator to output a vertical alignment signal to a vertical signal receiver, and three level detectors to each output a second signal to the corresponding reflector respectively and receive a corresponding reflected level detection signal from the corresponding reflector. A determining unit determines whether the supporting plate is aligned with the vertical signal receiver according to the vertical alignment signal. The determining unit outputs a position rectification signal when the supporting plate is not aligned with the vertical signal receiver. A driver moves the supporting plate by mechanical arm to align the vertical signal receiver according to the position rectification signal.

Abstract: A wafer loading system positioning method and device, comprising a loading system, having a base and a rear plate for docking on a positioning frame of a production equipment. The main characteristic thereof is that the loading system in an upper part of the rear plate has a holding seat and the positioning frame in an upper part of a front side has an upward extending positioning element. Two eccentric cams on the holding seat and the positioning element allow to adjust a relative position of the holding seat with respect to the positioning element. A lifting mechanism enables raising of the loading system for lifting said holding seat above said positioning element, so as to enable said holding seat to engage with said positioning element.

Abstract: A front-opening unified pod quick-opening apparatus. The apparatus is positioned in a front-opening unified pod loading system. The apparatus has a rail, a slide, a short linking rod having a first end rotatably fixed on the slide to drive the slide to move along the rail, a long rocker arm having a first end rotatably fixed on a second end of the short linking rod, and a second end rotatably fixed on a pin on the backboard; and a power source. When the power source drives the long rocker arm to rotate upwards around the pin on the backboard, the long rocker arm leads the short linking rod, and the short linking rod drives the slide to move upwards along the rail which results in an upward rectilinear motion, and vice versa.

Abstract: A device for the treatment of substrates has a fluid container and two substrate transport devices positionable above the fluid container. Each substrate transport device is a hood for receiving multiple substrates. Each substrate transport device has at least one substrate support device having a first position for locking the substrates and a second position for releasing the substrates. The substrate transport devices are rigidly connected to one another and linearly movable for alternatingly positioning one of the substrate transport devices above the fluid container.

Abstract: A method for operating a multi-station processing chamber is described. A wafer is loaded onto the first station then indexed to the second station prior to processing. The indexing causes the wafer to be well-seated on it spindle before being processed. This prevents an improperly seated wafer from being processed at the first station.

Abstract: A substrate detection sensor is operatively connected to a door moving mechanism for opening/closing a front door with respect to a sealed container accommodating therein a plurality of substrates. The substrate detection sensor enters the sealed container and detects the substrates successively as it is lowered integrally with the front door, and retracts from the sealed container when all of the substrates have been detected.

Abstract: A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section.

Abstract: A substrate-handling robot comprises an arm drive mechanism with a first arm connected to it. A multiple substrate batch loader is connected to the first arm. The multiple substrate batch loader includes a set of vertically stacked substrate-handling paddles. A control circuit is connected to the arm drive mechanism. A vacuum control system is connected to the multiple substrate batch loader and the control circuit. The vacuum control system includes a set of vacuum control valves corresponding to the set of vertically stacked substrate-handling paddles. The set of vacuum control valves includes a selected vacuum control valve for a selected substrate-handling paddle. A set of vacuum sensors is connected to the set of vacuum control valves. The set of vacuum sensors includes a selected vacuum sensor corresponding to the selected vacuum control valve. The selected vacuum sensor provides a substrate-absent signal when a substrate is not present at the selected substrate-handling paddle.

Abstract: The invention includes an engagement mechanism for semiconductor substrate deposition process kit hardware, including a body having a distal portion and a proximal portion. The body is sized for movement through a passageway of a semiconductor substrate deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing. At least engager is mounted to the distal portion of the body The engager is sized for movement through said passageway with the body. The engager is configured to releasably engage a component of process kit hardware received within said chamber. The invention includes methods of replacing at least a portion of semiconductor substrate deposition process kit hardware. The invention includes methods of depositing materials over a plurality of semiconductor substrates. Other implementations are contemplated.

Abstract: Systems and methods are described for wafer processing. A wafer processing apparatus includes: a first wafer transporter; a process station coupled to the first wafer transporter, the process station including: a first plurality of wafer processing stacks, each of the plurality of wafer processing stacks including a plurality of wafer processing modules, and a second wafer transporter coupled to the plurality of wafer processing modules, each of the plurality of wafer processing modules adjacent, and accessible by, the second wafer transporter; and a third wafer transporter coupled to the process station, wherein any of the plurality of wafer processing modules in any of the plurality of wafer processing stacks can be accessed by at least two adjacent wafer transporters from among the first, second and third wafer transporter.

Abstract: A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section.

Abstract: A cassette station, a processing station having a coating unit and a developing unit, and an inspecting station having a film thickness inspecting apparatus and a defect inspecting apparatus are disposed in the direction approximately perpendicular to the direction of the disposition of cassettes of the cassette station in such a manner that the inspecting station is disposed midway between the cassette station and the processing station. In the structure, the inspecting station and the processing station are connected and wafers are automatically transferred among the stations, operations from the substrate process to the inspection can be simplified and the time period necessary therefore can be shortened.

Abstract: A robot wafer alignment tool uses a reflector mounted on a multi-axis robot to determine the position of the robot or other objects within a chamber. The reflector reflects images to at least one camera from an area or object of interest in the chamber.

Abstract: A system and method of manufacturing wafers are provided suitable for a semiconductor manufacturing system and a method thereof capable of shortening the processing period composed of a series of processes applied to objects to be processed, mainly carry out processes and conveyance peace by peace, and which can manufacture even various kings of products. The system is provided with a plurality of processing units each having therein a conveying mechanism, and is provided therein with a conveyer device for conveying the objects to be processed to the processing units.

Abstract: An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.

Abstract: Apparatus for teaching robot station location relative to a work piece apparatus includes an attachment that can be temporarily coupled to the apparatus and positioned in known relationship to the robot station location. A plurality of positional sensors are mounted on the attachment ring, the sensors each configured to produce a signal when a work piece carried by a robot arm is positioned a predetermined distance from the sensor. A signal receiver is configured to receive signals from the sensors and to indicate which of the sensors has produced the signal. The indication may be the activation of an LED display that indicates to an operator what the next movement of the robot arm should be in order to center the work piece with respect to the robot station location.

Abstract: An adjustable wafer transfer machine that includes an adjusting mechanism for changing the spacing between adjacent wafers to accommodate placement of the wafers in either a smaller wafer carrier or a larger wafer carrier and a transfer mechanism for transferring the wafers between the smaller wafer carrier and the adjusting mechanism and for transferring the wafers between the larger wafer carrier and the adjusting mechanism. The adjusting mechanism comprises a pair of flat plates disposed parallel to and opposite one another and a plurality of elongated opposing dividers slidably mounted on the plates. The dividers are disposed vertically adjacent to one another at spaced apart intervals and they extend horizontally to support the wafers along a portion of their perimeter. A positioning mechanism is operatively coupled to the dividers for changing the spacing between the dividers and, correspondingly, between the wafers supported on the dividers.

Abstract: A method and apparatus for minimizing the surface contamination of semiconductor wafers (11) during the semiconductor device manufacturing process. Semiconductor wafers (11) are stored in a storage cassette (12) with their face sides (17) facing downward and their back sides (16) facing upward. Particulate contamination present on the back sides of the wafers is thereby secured to the wafers by the force of gravity, and the faces of the wafers are shielded from falling debris. An automated wafer handling device (19) is provided with a rotary joint (22) to accomplish the wafer flipping motion before inserting a wafer into a cassette and after removing the wafer from the cassette.

Abstract: A substrate processing apparatus includes a process tube for processing a plurality of substrates, two boats for accommodating the substrates, two boat elevators, a substrate transfer unit for loading and unloading the substrates into and from the boats when the boats are at the first position. In this apparatus, each boat elevator has one boat mounted thereon and each of the boat elevators carries a corresponding boat between a first position located below the process tube and two corresponding second positions. Each of the boat elevators performs loading and unloading the corresponding boat into and from the process tube at the first position. Further, in the apparatus, a center position of the process tube is disposed inside a triangle formed by connecting the substrate transfer unit and the two boat elevators.

Abstract: A first disk carrier constructed in accordance with the invention is substantially circular, and has a size and shape such that it can be placed in an opening in a second, larger disk carrier. In one embodiment, the second, large disk carrier is a conventional disk carrier, e.g. used to hold a substrate during a magnetic disk manufacturing process. The first disk carrier is circular, and has a diameter equal (or substantially equal) to common substrates currently being manufactured. Therefore, the first disk carrier fits in and can be held by the second disk carrier. The first disk carrier has one or more openings for holding one or more substrates that have a diameter substantially less than the diameter of the opening of the second disk carrier.

Abstract: A wafer handling device includes a platform having a plurality of movable grippers. A driver is mounted on the platform and selectively couples to at least one of the plurality of grippers to selectively move at least one of the plurality of grippers with regard to the platform. The driver may be magnetically coupled to at least one gripper to move it between a first proximal position and a first distal position. The driver may be mounted on the platform with a track assembly that effectuates a linear magnetic propulsion field to move the driver between the first axial position and the second axial position.

Abstract: Access to the interior of a substrate storage pod in which substrates such as semiconductor wafers are stored is gained using an access device provided within a micro environment enclosure. The access device has a telescoping enclosure door which serves to control access to the interior of the storage pod from the interior of the enclosure. A pre-aligner is mounted to the enclosure door, and substrates are passed through the pre-aligner as they are retrieved from the storage pod. The pre-aligner detects and adjusts the orientation of the substrates as necessary for processing. The level of the pre-aligner is incrementally adjusted to match that of a current substrate by incrementally adjusting the level of the enclosure door.

Abstract: The semiconductor material handling system is an EFEM that may either mount to the front end of a processing tool or be integrated into the processing tool. The EFEM is built from a unified frame that the EFEM components, such as a wafer engine and a SMIF pod advance plate, may mount to. The frame serves as a common mounting structure that the EFEM components may use as a reference for alignment purposes. Since the EFEM components do not have to align with respect to the position of each other, the calibration, if any is required, is greatly simplified. The EFEM also has a reduced footprint, allowing the EFEM to mount to the front end of a processing tool and not extend to the fab floor. Thus, space is freed up between the EFEM and the fab floor. By way of example only, this space may be used as a maintenance access area to the processing tool without having to first remove the EFEM.

Abstract: A semiconductor processing system includes a transfer apparatus for transferring a wafer. The transfer apparatus has a pick arm member with wings. The reference distances between the wafer located at the normal position and the wings are stored in a memory of a CPU. Detection ranges of line sensors are set in a standby position in front of a process chamber in order to detect the distances between the wafer and the wings. In the CPU, the amount of positional shift of the wafer is detected based on the reference distances and the detected distances.

Abstract: A substrate handling system with integrated door removal assembly for an environmentally controlled substrate processing chamber is provided. The system includes a robot positioned within the chamber. A drive mechanism is connected to the robot. A door interface mechanism is attached to the drive mechanism and includes a door key and a door key control assembly. The drive mechanism provides mechanical control of the door key control assembly such that that door key is manipulated to couple a substrate carrier door to a port door. The coupled doors are storable within the chamber or on the robot. The drive mechanism may also include a substrate end effector, thereby allowing the robot to transport substrates within the chamber. The robot is movable within the chamber to multiple processing stations.

Abstract: A cassette stocker includes a plurality of cassette storage shelves positioned adjacent a cleanroom wall and vertically disposed relative to a plurality of cassette docking stations, and a cassette mover to carry a cassette between the shelves and the docking stations. An interstation transfer apparatus includes a support beam and a transfer arm adapted to carry a cassette between processing stations.

Abstract: In a substrate processing apparatus, processing units are stacked in a multistage manner around a transport robot arranged at the center of a processing area for forming a processing part. In a second hierarchy, rotary coating units are arranged through an indexer and a transport robot. In a fourth hierarchy located above the second hierarchy, rotary developing units are stacked above the rotary coating units respectively. Multistage thermal processing units and an edge exposure unit are horizontally arranged above an interface mechanism part. Thus, a substrate processing apparatus capable of reducing the area for setting the same is provided.

Abstract: A multi-chamber system of an etching facility for manufacturing semiconductor devices occupies a minimum amount of floor space in a cleanroom by installing a plurality of processing chambers in multi-layers and in parallel along a transfer path situated between the processing chambers. The multi-layers number 2 to 5, and the transfer path can be rectangular in shape and need only be slightly wider than the diameter of a wafer. The total width of the multi-chamber system is the sum of the width of one processing chamber plus the width of the transfer path.

Abstract: An end-effector with integrated cooling features comprises heat transferring mechanisms that transfer heat energy away from the end-effector. The end-effector advantageously minimizes the cooling overhead of a processed substrate as it is transported from a process module to a low-cost storage cassette. The reduced cooling overhead of the processed substrate, as a consequence, improves substrate throughput. In the preferred embodiments, the heat transferring mechanisms include a high surface area heat sink connecting the substrate-supporting paddle with a robot arm. Cooling fins can enhance surface area and thus enhance heat dissipation from the heat sink. Cooling channels can extend through paddle and heat sink, either containing circulating fluid for carrying heat beyond the end-effector or a phase changing material in an enclosed heat pipe.

Abstract: The objective of the present invention is to provide a transfer device for substrate capable of preventing deformation or breakage of substrate due to bending stress, by reducing the amount of dead weight deflection of substrate, such as large mother glass boards, etc.

Abstract: A substrate processing apparatus includes a substrate holder for holding a plurality of wafers and being loaded therewith into a process tube through an opening in the process tube, in which a plurality of the wafers are processed, a wafer transfer system for charging a plurality of the wafers to the substrate holder, a boat waiting chamber installed on a line passing through the opening in the process tube and substantially hermetically accommodating the substrate holder before and after the substrate holder is loaded into and unloaded from the process tube and a wafer transfer chamber for substantially hermetically accommodating the wafer transfer system. An oxygen concentration of the boat waiting chamber is different from that of the wafer transfer chamber.

Abstract: The invention relates to a monitoring system for a conveying device for flat articles, especially wafers, which conveying device is provided with a carriage (28) that is movable along a predetermined path next to a flat article (10) that is located at a predetermined removal location, the carriage having a receiving device for the accommodation of the flat article (10), which monitoring system contains a light source (50) having a light-exit window and a light receiver (52) having a light-admission window, whereby the light-exit window and the light-admission window are positioned in such a way that a light beam (60) directed form the light-exit window to the light-admission window is partially covered by the carriage (28) during its movement through the light beam, and an evaluation unit that is connected to the light receiver and that compares a target signal derived from its movement of the carriage along a target path with an actual signal derived from an actual movement of the carriage, and indicates a d

Abstract: A substrate processing apparatus comprises a processing section for performing processing for a substrate, a substrate carrier transfer section into/out of which a substrate carrier holding a plurality of substrates is carried, and a substrate transfer mechanism for taking an unprocessed substrate out of the substrate carrier carried into the substrate carrier transfer section to deliver it to the processing section and for receiving a processed substrate from the processing section to deliver it into the substrate carrier placed on the substrate carrier transfer section. The substrate carrier transfer section shifts the position of the substrate carrier between a first position at which the substrate carrier is carried to/from the outside and a second position at which the substrate in the substrate carrier is delivered to/from the substrate transfer mechanism.

Abstract: An apparatus and method for controlling wafer temperature and environment is provided. The apparatus includes a batch processing fixture for batch processing wafers at a first elevated temperature. The batch of wafers is not substantially ramped in temperature within the batch processing fixture. The apparatus also includes a single wafer processing apparatus for rapidly ramping temperature of a wafer of the batch from the first elevated temperature wherein a uniform temperature across the wafer is maintained during the ramping. Another embodiment of the apparatus (10) includes an RTP chamber (20) having an inert or reducing environment and that includes a pedestal (24) for holding a single wafer (16) and a heater unit (22) arranged so as to uniformly and rapidly heat the single wafer.

Abstract: A substrate transport apparatus having a drive section, two independently movable arm assemblies connected to the drive section on a common axis of rotation, and substrate holders connected to the arm assemblies. The drive section includes three coaxial drive shafts with a pulley connected to one of the shafts. The arm assemblies are connected to respective ones of the two other shafts.

Abstract: The present invention generally provides a processing system having a robot assembly which includes a multiple sided robot blade that can support a substrate on at least two sides thereof and associated methods to transfer one or more substrates in a processing system. An unprocessed substrate can be supported on the blade while a processed substrate is retrieved from a location to which the unprocessed substrate is to be delivered. The processing throughput rate is increased by reducing the movements required by the robot to exchange processed substrates and unprocessed substrates, thus decreasing the swap time.

Abstract: In a load port mechanism of a substrate treatment unit, protuberances are provided on a sealing surface formed along a door with which a wafer carrier is to dock, or on a sealing surface formed around the door of the wafer carrier. The wafer carrier door is faced with the load port door with the protuberances therebetween, thereby separating the sealing surface of the substrate treatment unit from the sealing surface of the wafer carrier by only a predetermined distance. Thus, there is formed a channel along which clean air flows from the inside of the substrate treatment unit to the outside thereof. The load port structure and the wafer carrier structure improve the reliability of opening/closing action of the wafer carrier and prevent entry of extraneous particles into the treatment unit with sufficient reliability, and enable high-yield production of integrated circuits.

Abstract: A plant for processing wafers, having a plurality of fabrication units, a plurality of measuring units, and a transport system for transporting the wafers. The fabrication units and the measuring units are each assigned a registration system. The feeding-in and discharge of the wafers to and from the respective fabrication unit or measuring unit can be registered in order to determine the wafer occupancy in the unit. Depending on this occupancy, a supply request or disposal request can be generated for the respective fabrication unit and measuring unit.

Abstract: A FOUP opener opens and closes a FOUP door which closes a front opening portion of a FOUP which contains a plurality of semiconductor wafers. The FOUP opener includes a dock plate for carrying and positioning the FOUP; a dock moving mechanism for moving the dock plate to a position for detachment/attachment of the FOUP door; a port door including a detachment/attachment mechanism for detaching/attaching the FOUP door and a holder mechanism for holding the FOUP door; a port plate including an opening portion, the opening portion being closed by the port door; a port door horizontal-movement mechanism for horizontally moving the port door; and a port door vertical-movement mechanism for vertically moving the port door with the port door holding the FOUP door, so as to house the FOUP door. The port door includes a seal member for sealing a space defined between an outside wall of the FOUP door and an outside wall of the port door.

Abstract: A method and apparatus are provided for substrate handling. In a first aspect, a temperature adjustment plate is located below a substrate carriage and is configured such that a substrate may be transferred between the temperature adjustment plate and the substrate carriage by lifting and lowering the substrate carriage above and below the top surface of the temperature adjustment plate. The temperature adjustment plate may be configured to heat and/or cool a substrate positioned thereon. In a second aspect, the substrate carriage is magnetically coupled so as to rotate and/or lift and lower magnetically, thereby reducing particle generation via contact between moving parts (and potential chamber contamination therefrom). In a third aspect, a substrate handler positioned below the substrate carriage is both magnetically coupled and magnetically levitated, providing further particle reduction.

Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay: A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: A system and method for improved throughput of semiconductor wafer processing. In one aspect, a wafer carrier is provided having a flat zone capable of holding an additional lot of wafers for processing. In addition, a multiple fork wafer transfer mechanism is provided having a plurality of wafer forks for loading and unloading wafers in the wafer carrier at a reduced fork pitch.