Abstract: A wafer ring supplying and returning apparatus including a magazine that accommodates wafer rings, a jig holder that holds the wafer rings, a drier that causes contraction of the wafer sheets on used wafer rings, and a wafer chucking member that chucks and conveys the wafer rings, and the apparatus further including buffer sections having two (upper and lower) wafer supporting grooves that support wafer rings and a wafer pushing member disposed on or below the wafer chucking member so as to push the wafer rings. The wafer chucking member is disposed so as to face one of the wafer supporting grooves of the buffer sections, and the wafer pushing member is disposed so as to face another one of the wafer supporting grooves.

Abstract: A central position of a wafer 10 set on a place table 41 is calculated, a turn angle of the place table 41 when the wafer 10 is in the predetermined orientation is calculated based on the calculation result of the central position and positional information of an ID mark 11 received in advance and the quantity of expanding and contracting a transfer arm 30 and the turn angle of a turntable 39 are calculated for setting the wafer 10 such that the ID mark 11 is in the predetermined position and orientation to an OCR 43, and the turn angle of the place table 41 calculated based on the turn angle of the turntable 39 is corrected, the place table 41 is turned only by the corrected turn angle and the wafer 10 is turned and transferred to the OCR 43 by the transfer unit 3.

Abstract: A semiconductor device fabricating method includes the steps of loading one or more substrates into a boat disposed in a waiting room positioned next to a reaction furnace; vacuum-evacuating the waiting room to a vacuum state at a base pressure; loading the boat into the reaction furnace at a first ambient pressure; and recovering a temperature of the reaction furnace at a second ambient pressure. The first or the second ambient pressure is greater than the vacuum state but less than the atmospheric pressure. Further, the method includes the step of increasing the temperature of the one or more substrates at a third ambient pressure, and also the third ambient pressure is greater than the base pressure but less than the atmospheric pressure.

Abstract: A semiconductor processing system for wafers or other semiconductor articles. The system uses an interface section at an end of the machine accessible from the clean room. A plurality of processing stations are arranged away from the clean room interface. A transfer subsystem removes wafers from supporting carriers, and positions both the wafers and carriers onto a carrousel which is used as an inventory storage. Wafers are shuttled between the inventory and processing stations by a robotic conveyor which is oriented to move toward and away from the interface end. The system processes the wafers without wafer carriers.

Abstract: The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.

Abstract: There is disclosed an apparatus for supporting singulated electronic devices during a testing operation, comprising: a main body and a support member, wherein said support member is made of non-conducting high-resistivity material and comprises a plurality of recesses, each said recess being adapted to receive an individual singulated device. There is also disclosed a method for testing such devices in which the devices are carried on support members through a testing process including one or more environmental control chambers.

Abstract: In an automated guided vehicle including a transfer equipment which transfers a wafer, a buffer cassette which temporarily stores the wafer, and a pressing member which is provided at an opening of the buffer cassette, when traveling the automated guided vehicle, if the pressing member is slid to a center position from an end position of the opening of the buffer cassette to contact and press against the edge of the wafer, the pressing member was easily damaged by being rubbed against a periphery of the wafer, and there was a problem in durability of the pressing member.

Abstract: An I/O minienvirornent including a port door within an I/O port, and a system for removing the port door and pod door coupled thereto, and setting down the pod and port doors at a convenient location within the I/O minienvironment. After wafer processing has been completed and the wafers have been transferred back through the I/O port to the SMEF pod, the system may retrieve the port and pod doors, and return the port door to their sealing positions within the I/O port and cassette, respectively. In a preferred embodiment, the system for gripping and transporting the port and pod doors may be located on the back end of the end effector of the wafer handling robot within the I/O minienvironment. The back end of the end effector is the end of the end effector opposite that used to transport the wafers and/or cassette.

Abstract: An alignment processing mechanism 10 according to the present invention includes: a conveying mechanism 11 for conveying a substrate W to be processed, an alignment mechanism 12 for aligning the substrate W conveyed by the conveying mechanism 11 to a predetermined direction, and a buffer mechanism 13 for relaying the substrate W from the conveying mechanism 11 to the alignment mechanism 12. The buffer mechanism 13 is adapted to temporarily hold the substrate W conveyed by the conveying mechanism 11, and to pass the temporarily holding substrate W to the alignment mechanism 12 based on a state of the alignment mechanism 12. According to the present invention, the alignment mechanism 12 can be used with greater efficiency in order to achieve a high speed of an alignment process.

Abstract: An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.

Abstract: A method for transferring a thin plate is provided, in which three or more grasping claws of a transfer arm grasp the periphery of the thin plate in order to transfer it to a predetermined transfer position, and three or more holding claws hold the periphery of the thin plate in the transfer position. The transfer arm rotates about a shaft which is in a direction of a vector sum of a first vector perpendicular to a surface of the thin plate before transfer, and a second vector perpendicular to the surface of the thin plate after the transfer, to transfer the thin plate with changing the posture thereof.

Abstract: A system for handling stiff but flexible discs, particularly semiconductor wafers, including fail safe mechanisms that prevent the disc from being dropped if power to the unit is interrupted. Also, the electronics controlling operation resumes functioning at the point in the operation cycle existing when power was interrupted. A wafer hand assembly member is slipped under a wafer, or between parallel stacked but spaced wafers, and one or more fingers are rotated 90° to a position perpendicular to the plane of the stiff hand assembly member. The hand assembly also has one or more posts positioned perpendicular to the surface of the hand assembly. The finger(s) and post(s) or rear barrier constitute three upright projections or points forming the corners of a triangle with the wafer to be grasped there between.

Abstract: An apparatus for processing wafers one at a time. The apparatus has a vacuum chamber into which wafers are loaded through a pair of loadlocks which are spaced one above the other. A robot within the vacuum chamber has a pair of gripper arms which are moveable along and rotatable about a vertical axis so as to be moveable between the loadlocks and a wafer processing position. Each of the loadlocks has a vertically moveable portion which is moveable away from the remainder of the loadlock to provide access in a horizontal plane for one of the gripper arms. Signals from encoders and optical sensors are used to determine that a handoff position has been reached.

Abstract: An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported wafer. In one example, the end-effector has a detector for detecting the presence of a wafer. The detector is mounted at a shallow angle to allow the end-effector to be positioned close to a wafer to be picked-up, thereby allowing detection of deformed wafers contained in a wafer cassette. The shallow angle of the detector also minimizes the thickness of the end-effector. Also disclosed is a wafer station with features similar to that of the end-effector.

Abstract: The wafer clamping apparatus is disclosed including a cam rotatably coupled to a base plate. The cam is configured to couple with a robot arm. The clamping apparatus also includes a rotating clamp mechanism rotatably coupled to the base plate about a single fixed point. A biasing mechanism, coupled to the rotating clamp mechanism, urges the rotating clamp mechanism towards a clamped position. The rotating clamp mechanism is configured to interact with the cam to engage and disengage the rotating clamp mechanism from the clamped position. The rotating clamp mechanism preferably comprises a hub rotatably coupled to the base plate and a clamping arm and cam follower extending from the hub. The clamping arm is configured to clamp a wafer when the rotating clamp mechanism is in the clamped position, while the cam follower is configured to interact with the cam.

Abstract: An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported wafer. In one example, the end-effector has a detector for detecting the presence of a wafer. The detector is mounted at a shallow angle to allow the end-effector to be positioned close to a wafer to be picked-up, thereby allowing detection of deformed wafers contained in a wafer cassette. The shallow angle of the detector also minimizes the thickness of the end-effector. Also disclosed is a wafer station with features similar to that of the end-effector.

Abstract: An apparatus for processing wafers one at a time. The apparatus has a vacuum chamber 1 into which wafers are loaded through a pair of loadlocks 3, 4 which are spaced one above the other. A robot within the vacuum chamber 1 has a pair of gripper arms 22, 29 which are moveable along and rotatable about a vertical axis 23 so as to be moveable between the loadlocks 3, 4 and a wafer processing position. Each of the loadlocks 3, 4 has a vertically moveable portion 8, 26 which is moveable away from the remainder of the loadlock to provide access in a horizontal plane for one of the gripper arms 22, 29.

Abstract: A wafer carrier device capable of detecting positioning precision of a supporting plate thereof. In the present invention, a supporting plate connected to a mechanical arm has three reflectors and a positioning window. A detection device has a vertical signal generator to output a vertical alignment signal to a vertical signal receiver, and three level detectors to each output a second signal to the corresponding reflector respectively and receive a corresponding reflected level detection signal from the corresponding reflector. A determining unit determines whether the supporting plate is aligned with the vertical signal receiver according to the vertical alignment signal. The determining unit outputs a position rectification signal when the supporting plate is not aligned with the vertical signal receiver. A driver moves the supporting plate by mechanical arm to align the vertical signal receiver according to the position rectification signal.

Abstract: An article holder has sensors that detect whether an article held in the holder is a workpiece or a piece of packaging material. Examples are end effectors suitable for picking up semiconductor wafers and packaging material from a pod or some other carrier.

Abstract: Methods for selectively moving a microelectronic-device substrate assembly in a processing machine having a first side, a second side opposite the first side, and a processing path extending from the first side to the second side. The processing machine can also include a cassette proximate to a second side of the processing station that moves to position a substrate at the processing path. In one aspect of the invention, the substrate handling apparatus includes a guide member attached to the processing machine, an arm slidably attached to the guide member, and a clamp attached to the arm. The guide member is generally fixedly attached to the processing machine, and the guide member generally has a shape corresponding to the processing path. The arm can include a first section moveably attached to the guide member to translate along the guide member, and a second section projecting from the first section to position at least a portion of the second section at least proximate to the processing path.

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a, rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: A semiconductor wafer holding assembly that secures a semiconductor wafer for wafer handling by a semiconductor processing machine. The wafer holding assembly includes a clamp ring that is mounted to a support frame and that has a wafer-engaging surface. A plurality of latch assemblies are mounted about the periphery of the clamp ring and adjacent to the wafer-engaging surface. Each latch assembly includes a latch body that carries a clamping roller assembly and a supporting roller assembly. A rolling element of the supporting roller assembly rolls along a circular path on an inclined surface on the clamp ring as the latch body is rotated through a pivot arc between an unlatched position and a latched position. Unless the latch body is positioned in the latched position, the rolling engagement between the supporting roller assembly and the inclined surface suspends the rolling element of the clamping roller assembly above the wafer surface until the latch body is in the latched position.

Abstract: A device for handling substrates, used in an epitaxial apparatus or reactor (20) for chemical vapour deposition (CVD) onto the said substrates, comprises an internal robot (30) provided with means (60) for gripping and transporting substrates, which are in the form of semiconductor slices (24), in order to transfer them from cassettes (38, 40) containing the semiconductor slices (24) to be processed, the gripping and transportation means (60) having precisely the task of transporting the slices (24), which are present in a purging chamber (34) and supplied from a cassette (38) for storage of the said slices (24), from the purging chamber (34) into a reaction chamber (22) of the epitaxial reactor (20) and, more particularly, into seats (28a-e) formed on a flat disk-shaped susceptor (26) which is present in the reaction chamber (22) of the epitaxial reactor (20) and vice versa, from the reaction chamber (22) again passing through the purging chamber (34), to the cassettes (38, 40).

Abstract: A retreat permission position of a carrier arm when the carrier arm is moved back to retreat outside a mounting table after the carrier arm carries a substrate to a position above the mounting table while holding a peripheral portion of the substrate, to thereby place the substrate on a plurality of supporting pins vertically movable through the mounting table. A disk substantially equal in size to the substrate, having insertion holes formed to allow the supporting pins to be inserted therethrough and being supportable by the carrier arm, and a sensor to detect whether or not the supporting pin inserted through the insertion hole of this disk exists.

Abstract: An article holder has protrusions that contact the article. The friction between the protrusions and the article impedes the article movement relative to the holder yet allows the article to slide when the article is pushed against some object. The article is pushed against the object in order to position the article more precisely.

Abstract: A robot arm having wafer-scratching prevention function is disclosed. A touch control method is used in the robot arm to detect the abnormal situation of scratching a wafer, thereby promptly stopping the motion of robot arm from continuously accessing the wafer, so as to prevent a large amount of wafers from scrapping. The robot arm having wafer-scratching prevention function has an electrically conductive layer and an electrically non-conductive layer, wherein the non-conductive layer is located on one surface of the robot arm contacting a target wafer to be accessed, and the conductive layer is on the other surface opposite to the non-conductive layer. The conductive layer is connected to a circuit to generate a stopping signal for stopping the robot arm from continuously accessing the wafer.

Abstract: Generally, an end effector assembly for a substrate transfer robot is provided. In one embodiment, an end effector assembly for a substrate transfer robot includes an end effector having a plurality of metallic pads disposed thereon. A polymer pad is disposed on each metallic pad wherein a ratio of an exposed portion of an upper surface of the metallic pad to a top surface of the polymer pad is at least about 3.5 to 1. In another embodiment, an end effector assembly for a substrate transfer robot includes an end effector having a plurality of polymer pads disposed thereon. Each polymer pad includes a fluoropolymer coating disposed on at least a top surface of the polymer pad. The metallic pad and/or the coating allows the polymer pad to be at least temporarily utilized in applications above its normal operating temperature.

Abstract: Method and apparatus for suction-holding a semiconductor pellet on a positioning stage of a bonding apparatus without causing the pellet to be misaligned after positioning thereof including a suction force control device. The suction force control device comprises a suction-switching electromagnetic valve, a suction force-adjusting electromagnetic valve, a vacuum source, a compressed air source and a throttle valve so that a semiconductor pellet is held on a positioning stage by a suction force that is weak enough that a positioning claw can move the semiconductor pellet for positioning; and upon completion of the positioning, the semiconductor pellet is held to the positioning stage by a suction force that is stronger than the weak suction force used for positioning.

Abstract: An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported wafer. In one example, the end-effector has a detector for detecting the presence of a wafer. The detector is mounted at a shallow angle to allow the end-effector to be positioned close to a wafer to be picked-up, thereby allowing detection of deformed wafers contained in a wafer cassette. The shallow angle of the detector also minimizes the thickness of the end-effector. Also disclosed is a wafer station with features similar to that of the end-effector.

Abstract: An end effector alternately (or simultaneously) transports susceptors and wafers. Separate contact surfaces are provided for wafer transport and for susceptor transport. In one embodiment, the wafer contact surface is spaced above the susceptor contact surface, and the susceptor is a plate with a recess sized and deep enough to accommodate the wafer contact surface without touching it, while being supported upon the susceptor contact surface. The wafer contact surface is a complete or C-shaped ring having an annular opening connected to a vacuum pump. In another embodiment, the wafer contact surface is spaced below the susceptor contact surface, and both comprise peripheral edge support surfaces. The edge support surfaces can be formed from a single sloped surface for each contact pad, with a smaller wafer supported below the position of a larger susceptor plate.

Abstract: An article holder has sensors that detect whether an article held in the holder is a workpiece or a piece of packaging material. Examples are end effectors suitable for picking up semiconductor wafers and packaging material from a pod or some other carrier.

Abstract: A substrate transfer system comprises plural end-effectors that are placed so as to touch a periphery of a cone having a vertical angle at a 2&thgr; angle with respect to a central axis at an arbitrary &thgr; angle to a horizontal plane, wherein substrates are interchanged and simultaneously transferred where the end-effectors are in a horizontal position. Besides, since the end-effectors are vertically located, the minimum rotational radius of the system that is projected to a horizontal plane, can be reduced. This contributes toward the reduction of an installation area for a substrate processing equipment in which the substrate transfer system is equipped.

Abstract: A chip removal apparatus, chip removal system, fitting system and method of removing chips from a wafer, involve a removal tool and a turning tool, designed to be rotatable. The removal tool is used for removing chips from a wafer. The chips removed can either be transferred in a turned state to a fitting head at a first transfer position, or can be transferred from the removal tool to the turning tool and rotated by the latter into a second transfer position, where then they can be removed in an unturned state by a fitting head of a fitting system. This allows continuous and flexible removal of chips from a wafer in large numbers.

Abstract: A vacuum chamber used for processing articles, such as integrated circuit wafers, display panels, and the like, has a small load lock chamber formed at an opening in a wall of the chamber by a moveable article supporting surface within the chamber and a cover outside of the chamber. The supporting surface and cover are sealed to the chamber wall when urged against it. Articles placed into the load lock chamber, when the cover is opened, are moved into the vacuum chamber for processing by moving the supporting surface away from the wall after the cover has been closed and a vacuum established in the load lock chamber. Articles are removed from the vacuum chamber in a reverse manner. Various mechanisms are describe for moving the articles, including a particular robotic device that simultaneously swaps the positions of two articles between the supporting surface and a processing location within the vacuum chamber by first pulling the articles together and then rotating them in a half-circle.

Abstract: A semiconductor exposure apparatus includes an exposure stage for holding a substrate when a predetermined exposure process is performed to the substrate, a transfer station for receiving a substrate from a resist coating unit, the transfer station having a temperature adjusting device for adjusting a temperature of the substrate, and a conveying device for conveying a substrate from the transfer station to the exposure stage.

Abstract: In order to provide a method of carrying out working steps in at least one work station on miniaturized modules which are held by a module carrier provided with a holding device, whereby the method enables a plurality of processing steps to be carried out on a module, it is proposed that the module be moved by one of the module carriers to a plurality of work stations for carrying out the working steps and that it be precisely positioned for carrying out one of the working steps by means of a relative movement between the module carrier and the currently relevant one of the plurality of workstations, and in that the positioning of the module relative to the module carrier be maintained for carrying out the working steps.

Abstract: A cassette station, a processing station having a coating unit and a developing unit, and an inspecting station having a film thickness inspecting apparatus and a defect inspecting apparatus are disposed in the direction approximately perpendicular to the direction of the disposition of cassettes of the cassette station in such a manner that the inspecting station is disposed midway between the cassette station and the processing station. In the structure, the inspecting station and the processing station are connected and wafers are automatically transferred among the stations, operations from the substrate process to the inspection can be simplified and the time period necessary therefore can be shortened.

Abstract: A gripper apparatus for grasping an object such as a specimen holder. The gripper apparatus comprises two arms. In one embodiment the arms are pivotable, and in a second embodiment, each arm includes a pivotable member. The arms are moveably coupled to each other and are structured to grasp the object therebetween.

Abstract: An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.

Abstract: The present invention provides a substrate holder for holding and transferring a thin substrate, comprising a substrate support member having a recessed area for placing a thin substrate therein and substrate mount portions formed in the recessed area in the vicinity of a circumferential edge thereof. The substrate mount portions is adapted to be engaged with an outer circumferential portion of a backside of the substrate placed in the recessed area. The substrate holder further comprises a substrate detector for detecting presence or absence of the substrate in the recessed area.

Abstract: Disclosed are apparatus and methods used for handling semiconductor wafers or similar articles. In particular, the apparatus disclosed is capable of flexibly gripping items of various shapes and sizes in a manner that substantially reduces or eliminates the likelihood of damage thereto. The apparatus is particularly suited to being used as a robotic end effector for handling wafers using edge-gripping techniques.

Abstract: An object of the invention is to provide a substrate transport apparatus which enables prompt transfer of a substrate, and a substrate processing apparatus incorporating this. A substrate transport apparatus of the invention comprises a transport arm (45, 46, 145, 146) for supporting a peripheral portion of a substrate (W) at at least two places on the peripheral portion, and transporting the substrate to a stage (7).

Abstract: An automated workpiece processing system has a transfer robot including an end effector having arms which move linearly towards each other to pick up a workpiece. Each arm has two workpiece contactors for engaging the edges of the workpiece. The contactors are positioned equally distant from the workpiece edges. The arms are moved linearly together, while they remain parallel to each other. The contactors contact the edges of the workpiece without causing sliding or displacement of the workpiece. Transfer robot movement or pre-positioning of the end effector is minimized, expediting handling of workpieces within the automated system.

Abstract: Apparatus, method and system for the treatment of a wafer. After a treatment at elevated temperature, a wafer is taken out of the reactor in question with the help of a mechanical transport apparatus which preferably grips the wafer around the circumference and on the under side and consists of a wafer surrounding ring. The wafer is then placed in a floating wafer reactor where it is cooled in a controlled manner. Transport for further action or treatment then takes place.

Abstract: A wafer blade for picking up wafers immersed in a wafer tank and a method for using the wafer blade are described. The wafer blade is constructed by a blade body of generally elongated rectangular shape that has a wafer pick-up side and a backside. The wafer pick-up side of the blade body has a recessed vacuum port for contacting a wafer with a vacuum passageway in the blade body connected to an external vacuum source. The backside of the blade body has at least two recessed slots that are open to an edge of the blade body, wherein each has a width of at least 5 mm and a length of at least 5 cm for providing ventilation and preventing the backside of the blade body from sticking to a wafer by capillary reaction caused by water entrapped in between the wafer and the backside of the blade body.

Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of abutments and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments.

Abstract: An apparatus and a method for handling individual wafers (2) that are temporarily in an essentially horizontal position. The apparatus (1) comprises at least one supporting part (5) with supporting areas (6), comprising at least three supporting points (9), for supporting an edge region of the wafer, and at least one holding part (7) with holding areas (8), comprising at least two holding points (10), for gripping the edge (4) of this wafer (2), with the holding points (10) being moveable relative to the supporting points (9) and, to grasp the wafer (2), relative to one another. Moreover, at least one of these holding points (10) is arranged on a rotatable rod (12) designed, for reliable holding of the wafer, as a holding part (7), with rod (12) extending coaxially with an axis (11) running through the wafer center (3) and essentially parallel to the surface of the wafer (2).

Abstract: A first disk carrier constructed in accordance with the invention is substantially circular, and has a size and shape such that it can be placed in an opening in a second, larger disk carrier. In one embodiment, the second, large disk carrier is a conventional disk carrier, e.g. used to hold a substrate during a magnetic disk manufacturing process. The first disk carrier is circular, and has a diameter equal (or substantially equal) to common substrates currently being manufactured. Therefore, the first disk carrier fits in and can be held by the second disk carrier. The first disk carrier has one or more openings for holding one or more substrates that have a diameter substantially less than the diameter of the opening of the second disk carrier.

Abstract: A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.

Abstract: An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported wafer. In one example, the end-effector has a detector for detecting the presence of a wafer. The detector is mounted at a shallow angle to allow the end-effector to be positioned close to a wafer to be picked-up, thereby allowing detection of deformed wafers contained in a wafer cassette. The shallow angle of the detector also minimizes the thickness of the end-effector. Also disclosed is a wafer station with features similar to that of the end-effector.