Abstract: The present invention relates to a transfer apparatus for a wafer, in which the wafer may be transferred in a narrow space by reducing a transfer device footprint. The transfer device has a base, a lower arm, an upper arm and a hand. The lower arm is configured to be vertically adjustable and rotatable on a vertical axis. The upper arm is pivotably coupled to the lower arm, and the hand is horizontally coupled to the upper arm.

Abstract: A tool (7) for handling a semiconductor material wafer (100) is designed to be used in an epitaxial growth station; the tool (7) comprises a disk (20) having an upper side (21) and a lower side (22), the lower side (22) being so shaped as to get in contact with the wafer (100) only along its edge (103); the disk (20) is provided internally with a suction chamber (24) that is in communication with the outside of the disk (20) through one or more suction holes (25) and in communication with a suction duct of an arm of a robot through a suction port (26); the disk (20) entirely covers the wafer (100) and the suction holes (25) open to the lower side (22)of the disk (20), whereby, when the wafer (100) is in contact with the lower side (22) of the disk (20), it can be held by the tool (7) through suction.

Abstract: The invention provides an apparatus and method for reducing warpage of a substrate undergoing a molding process, comprising a conveying device for transporting the substrate during molding and pressure means adapted to act on the substrate whereby to maintain the flatness of the substrate. Using the invention, it is possible to provide an apparatus and method which are usable with conventional substrates and which reduce reliance on material formulation to maintain flatness of the substrate.

Abstract: A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.

Abstract: Bays 100, 200, 300 . . . are connected to an inter-bay transfer line 400 via bay stockers 130, 230, 330 . . . , respectively. The bay 100 is, in this embodiment, composed of a single wafer transfer line 120 having a looped planar shape and processing equipments 101–106 arranged side by side along the longitudinal transfer direction of the transfer line (direction crossing the transfer direction of inter-bay transfer line 400). Processing equipments 101–103 are arranged side by side along one side of the transfer line 120, and the remaining processing equipments 104–106 are arranged side by side along the other side of the transfer line 120. The processing equipments 101–106 are equipped with transfer robots 11–16, respectively. Moreover, processing equipments 101–106 are each equipped with a chamber (not shown) for processing wafers W one by one (single wafer processing chamber).

Abstract: A semiconductor wafer processing system in accordance with an embodiment of the present invention includes a loading station, a load lock, a process module, an intermediate process module, and a transport module which further includes a load chamber, a transfer chamber, and a pass-through chamber between the load chamber and the transfer chamber. The intermediate process module may be coupled to the load chamber, or both the load chamber and the transfer chamber. In one embodiment, the load lock is a single-wafer load lock capable of accommodating only a single wafer at a time to allow for fast pump down and vent cycles. In one embodiment, the pass-through chamber is configured as a cooling station to improve throughput for processes that require the wafer to be cooled in-between depositions, for example.

Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.

Abstract: A device and process are provided for identifying characters inscribed on a semiconductor wafer containing an orientation mark. A semiconductor wafer having characters inscribed on a surface near its periphery is supported about its periphery between three rotary supports mounted on a grasping arm. An orientation mark on the periphery of the wafer is located adjacent the inscribed characters. At least one of the three rotary supports is rotatably driven to orient the wafer such that the orientation mark is placed in a determined position. An optical reflector is positioned in a spatial zone in proximity to and above the characters to be identified. The characters to be identified are illuminated by a light beam reflected by the optical reflector. The characters reflect the light, which may be observed by an optical imager, such as a camera. An optical recognition subsystem may then be used to identify the characters.

Abstract: A flexible vacuum seal pad structure capable of, for example, sealingly securing a bowed substrate to a finger apparatus or “endeffector” used to robotically engage and/or move the substrate from one processing station to another, or capable of securing a wafer to a base member or susceptor during processing of the wafer, i.e., functioning as a chuck. The flexible vacuum seal pad structure of the invention comprises a hollow central post or shank which serves as a mounting or retention mechanism, a flexible arch-like member connected at one end to the central post, and a peripheral ring structure connected to the opposite end of the arch member. The peripheral ring structure contacts and forms a seal with the underside of the wafer, while the arch member provides the flexibility to permit the ring structure to make or form a sealing contact to a bowed wafer, and the central post provides a mechanism through which the flexible vacuum seal pad structure may be secured to the base or finger.

Abstract: A wafer or some other article is aligned while being held by an end-effector.

Abstract: The present invention provides grasping mechanisms, gripper apparatus/systems, and related methods. Grasping mechanisms that include stops, support surfaces, and height adjusting surfaces to determine three translational axis positions of a grasped object are provided. In addition, grasping mechanisms that are resiliently coupled to other gripper apparatus components are also provided.

Abstract: A wafer transfer apparatus includes a robot arm and a robot arm cleaning device that injects purge gas into a vacuum nozzle of the robot arm under a normal stand-by state wherein the robot arm does not suction a wafer, to clean the vacuum nozzle. The robot arm cleaning device comprises a solenoid valve adapted to supply and intercept air, a first air valve adapted to selectively maintain and release a vacuum state in response to the air supplied from the solenoid valve, and a second air valve adapted to selectively supply and intercept a purge gas in response to the air supplied from the solenoid valve. The robot arm holds a wafer by a vacuum state of the vacuum nozzle when the first air valve is opened, and the vacuum nozzle is cleaned by the purge gas supplied when the second air valve is opened.

Abstract: A multi-chamber system of an etching facility for manufacturing semiconductor devices occupies a minimum amount of floor space in a cleanroom by installing a plurality of processing chambers in multi-layers and in parallel along a transfer path situated between the processing chambers. The multi-layers number 2 to 5, and the transfer path can be rectangular in shape and need only be slightly wider than the diameter of a wafer. The total width of the multi-chamber system is the sum of the width of one processing chamber plus the width of the transfer path.

Abstract: A structure for use in a semiconductor processing environment is provided, including a first plate a second plate bonded to the first plate. A distal end of the second plate extends beyond a distal end of the first plate. The distal end of the first plate is tapered along a length at least one-half of a width of the first plate adjacent the tapered distal end of the first plate.

Abstract: The present invention has a first optical detection mark having a predetermined positional coordinate in a lateral direction with respect to a carrier opening of a processing unit through which a carrier apparatus enters and exits, a second optical detection mark having a predetermined positional coordinate in a vertical direction with respect to the carrier opening, and an optical sensor provided on the substrate carrier apparatus for detecting the first or second optical detection mark. The substrate carrier apparatus is rotated by a predetermined angle from a position of the substrate carrier apparatus where the optical sensor detects the first optical detection mark, and the substrate carrier apparatus is moved in the vertical direction by a predetermined amount of movement from a position of the substrate carrier apparatus where the optical sensor detects the second optical detection mark.

Abstract: Robotic reticle manipulators are disclosed for use in holding and conveying, with good stability, thin, circular reticles as used in charged-particle-beam microlithography. A manipulator embodiment includes at least one arm configured for executing movements in the X-, Y-, and Z-directions. Connected distally to the at least one arm is a U-shaped fork (as an exemplary reticle-support member) defining recessed surfaces and vacuum ports for holding the reticle at the reticle's narrow handling zone located along the periphery of the reticle. Each vacuum port includes an upwardly extending lip that defines, on its “upward”-facing surface, a respective reticle-contact surface. Three such vacuum ports are provided on the fork and are nearly equidistantly separated from one another. Thus, as the reticle is being held and conveyed by the manipulator, the reticle is securely held to prevent reticle damage.

Abstract: Robot arm end effectors rapidly transfer semiconductor wafers between a wafer cassette and a processing station. Preferred embodiments of the end effectors include proximal and distal rest pads, the latter having pad and backstop portions that support and grip the wafer at its peripheral edge or within an annular exclusion zone that extends inward from the peripheral edge of the wafer. Preferred embodiments of the end effectors also include fiber optic light transmission sensors for determining various wafer surface, edge, thickness, tilt, and location parameters. The sensors provide robot arm extension and elevation positioning data supporting methods of rapidly and accurately placing and retrieving a wafer from among a stack of closely spaced wafers stored in the wafer cassette.

Abstract: An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.

Abstract: A bonded wafer 27 and a residual wafer 28 are placed in a state of being superimposed on each other on a susceptor 20 disposed in a heat treatment 10. A Bernoulli chuck 1 is moved to a wafer holding position 60 on a susceptor 20 by driving an arm 56, sucks the bonded wafer 27 positioned on the upper side and then moves to a bonded wafer recovery table 50? to recover the bonded wafer there. Then, similarly, the Bernoulli chuck 1 suction holds the residual wafer 28 at the wafer holding position 60 and then moves to a residual wafer recovery table 50? to recover the residual wafer there. With such a construction adopted, in a method for manufacturing a bonded wafer according to a so-called smart-cut method, not only is the separated bonded wafer recovered suppressing occurrence of a defect, deficiency and contamination, but there is also provided a method for manufacturing a bonded wafer capable of automation suitable for mass production.

Abstract: A tool (10) for vacuum-holding an object, such as an integrated circuit die (20). The tool includes a body portion (16) having a vacuum outlet (16A) for being coupled to a vacuum source. The body portion is coupled to a plurality of tool leg portions (14A, 14B) each having an edge that defines a mating surface (15) for engaging an edge (20A, 20B) of the object. Each mating surface contains at least one vacuum inlet (12) in fluid communication with the vacuum outlet. In one preferred embodiment there are two leg portions providing two mating surfaces that meet at a corner, where the corner defines a 90 degree angle and corresponds to a corner of the integrated circuit die. A corner relief (15A) may be provided to ensure a good mating seal with the die edges. A gasket (18) can be provided to surround the at least one vacuum inlet for ensuring the quality of the vacuum seal.

Abstract: An apparatus and method for handling microelectronic workpieces initially positioned in a container. The container can be changeable from a first configuration where the microelectronic workpiece is generally inaccessible within the container to a second configuration where the microelectronic workpiece is accessible for removal from the container. The apparatus can include a container access device positionable proximate to an aperture of an enclosure that at least partially encloses a region for handling a microelectronic workpiece. The container access device can be movably positioned proximate to the aperture to change the configuration of the container from the first configuration to the second configuration. A container support can be positioned proximate to the aperture and can be configured to move the container to a fixed, stationary position relative to the aperture when the container is in the second configuration.

Abstract: In an apparatus for a treatment of a wafer at elevated temperatures, the wafer is taken out of the reactor after heat treatment with the help of a mechanical transport apparatus which preferably grips the wafer around the circumference and on the under side. The transport apparatus includes a wafer surrounding ring. The wafer is placed in a floating wafer reactor where it is cooled in a controlled manner. Transport for further action or treatment then takes place.

Abstract: Apparatus and methods for a wafer handling system that manipulates semiconductor wafers. The invention includes an end effector having a vacuum chuck, an internal vacuum plenum, and flow diverters positioned within the vacuum plenum that define vacuum distribution channels coupled in fluid communication with vacuum ports of the vacuum chuck. The invention also includes a vacuum chuck having flow diverters positioned in one or more internal vacuum plenums that are in fluid communication with the vacuum ports of the vacuum chuck. The flow diverters adjust the vacuum pressure supplied to the vacuum ports such that, as vacuum ports are occluded by the wafer, the vacuum pressure is preferentially applied to unblocked vacuum ports for increasing the attractive force applied to unengaged portions of the wafer. The apparatus of the present invention has particularly utility for securing thin semiconductor wafers with a significant warpage.

Abstract: The device comprises a carrier for a workpiece; the carrier can be moved along a vertical and a horizontal axis by use of a drive mechanism and has an approximately planar contact surface for the workpiece, whereby the workpiece can be held on the contact surface by a contact mechanism of the carrier, especially vacuum, a retaining ring on the carrier encircling the contact surface and projecting downwards beyond the contact surface and having an inner diameter which is slightly larger than the outer diameter of the workpiece. At least three centering cams are arranged on a circle, the centering cams can be moved synchronously and in a radial direction by use of a centering drive, the centering cams having a supporting surface oriented on the top.

Abstract: An epitaxial growth furnace is provided for effecting the formation of an epitaxial layer on the surface of a semiconductor wafer by CVD in a reaction chamber of the furnace. The furnace comprises a wafer holder having an opening for exposing a surface area of the wafer which is subject to epitaxial growth, an opening flange adapted for engagement with a chamfered tapered face of a whole peripheral edge of the wafer on the side of said surface area thereof, and a plurality of jaws for detachably engaging with an outer periphery of the wafer on a back surface side of said surface area.

Abstract: A semiconductor-manufacturing device is equipped with a load-lock chamber and a reactor, which are directly connected, wherein a semiconductor wafer is transferred by a transferring arm provided inside the load-lock chamber from the load-lock chamber onto a susceptor provided inside the reactor. The device includes a buffer mechanism for keeping a semiconductor wafer standing by inside the reactor. The buffer mechanism includes at least two supporting means, which are provided around the susceptor to support the semiconductor wafer and which rotate in a horizontal direction, a shaft means for supporting the supporting means in a vertical direction, a rotating mechanism for rotating the supporting means coupled to the shaft means, and an elevating means for moving the shaft means up and down.

Abstract: A substrate loading/unloading apparatus include a body part, an arm part connected to the body part for loading/unloading a substrate, a finger connector connected to the arm part, and a plurality of finger parts connected to the finger connector, wherein each of the finger parts include a plurality of protrusions to contact a bottom surface of the substrate.

Abstract: A semiconductor wafer processing system including a multi-chamber module having vertically-stacked semiconductor wafer process chambers and a loadlock chamber dedicated to each semiconductor wafer process chamber. Each process chamber includes a chuck for holding a wafer during wafer processing. The multi-chamber modules may be oriented in a linear array. The system further includes an apparatus having a dual-wafer single-axis transfer arm including a monolithic arm pivotally mounted within said loadlock chamber about a single pivot axis. The apparatus is adapted to carry two wafers, one unprocessed and one processed, simultaneously between the loadlock chamber and the process chamber. A method utilizing the disclosed system is also provided.

Abstract: A transfer apparatus (42) for a semiconductor processing system includes a transfer member (44) having a support portion (48) to place a target substrate (W) thereon, and a drive unit (68) for driving the transfer member (44). A reference mark (54) is disposed adjacent to the support portion (48). The target substrate (W) has optically observable first and second portions (84, 86). A storage section (63) stores a normal image that shows a positional correlation between the reference mark (54) and the first and second portions (84, 86), obtained when the target substrate (W) is placed on the support portion (48) at a normal position. An image pick-up device (62A) takes a detection image that shows a positional correlation between the reference mark (54) and the first and second portions (84, 86), when the transfer member (44) transfers the target substrate (W).

Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.

Abstract: A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.

Abstract: A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.

Abstract: A substrate processing pallet has a top surface and a plurality of side surfaces. The top surface has at least one recess adapted to receive a substrate. The recess includes a support structure adapted to contact a portion of a substrate seated in the recess and a plurality of apertures each adapted to accommodate a lift pin. Lift pins can extend through the apertures initially to support the substrate and retract to deposit the substrate onto the support structure. A side surface includes a process positioning feature adapted to engage with a feature located in a process chamber to position the pallet. A side surface includes a positioning feature adapted to engage with an end effector alignment feature to position the pallet with respect to the end effector during transport. A side surface includes support features adapted to engage with end effector support features to support the pallet during transport.

Abstract: The wafer clamping mechanism comprises a linkage mechanism and a wafer contact point coupled to the linkage mechanism. The linkage mechanism includes a four-bar linkage having: a first link having a first fixed pivot and a first floating pivot remote from the first fixed pivot; a second link having a second fixed pivot and a second floating pivot remote from the second fixed pivot; and a third link having a first coupling pivot rotatably coupled to the first floating pivot, and having a second coupling pivot rotatably coupled to the second floating pivot. In use motion of the linkage mechanism causes the wafer contact point to clamp a wafer.

Abstract: A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: The present invention provides a wafer handling device having a base plate (G; G′), which has a first and a second supporting surface for a respective wafer (W1, W2) to be laid on; and a fixing device (K1, K2, S; K1′, K2′, S′) for the detachable fixing of the respective wafer (W1, W2) on the first and second supporting surface; the fixing device (K1, K2, S; K1′, K2′, S′) being configured in such a way that it contacts the respective wafer (W1, W2) only in the outer edge region of the side facing away from the supporting surface.

Abstract: A linear motion assembly is provided as part of a robot for processing substrates in a vacuum. An effector assembly is mounted for linear movement on linear bearings. The end effectors are driven by cables which in turn are driven by a drive which is positioned in an adjacent pressure vessel maintained at atmospheric pressure.

Abstract: An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Abstract: The effector of a robot is constructed with positioning pads at its distal end. The pads provide an accurate registration surface for engagement of the substrate. A pair of idler rollers, which slide along the longitudinal axis of the effector, is moved by an actuator into engagement with the substrate and the assembly urges the substrate against the positioning pads. A pair of wheels is mounted on a platform independent of the effector with one of the wheels driven by a motor. An optical sensor mounted with the wheels detects an orientation mark on the edge of the substrate and allows the driven wheel to rotate the substrate to its specified angular position.

Abstract: A method of securing a substrate in a semiconductor processing machine. The method includes moving latch bodies between latched and unlatched positions while permitting contact between a clamping member of each latch body and the substrate only if the latch bodies are substantially in the latched position. In the latched position, the clamping members apply a clamping force effective to secure the substrate. Generally, contact is prevented by engagement between a support member and an ramp that is inclined such that the clamping member descends toward the substrate as the latch body moves from the unlatched position to the latched position and only contacts the substrate as the latched position is established.

Abstract: A wafer holder has a set of minimum contact wafer support members predefining support member contacting portions on a planar wafer surface of a wafer. The wafer chuck has a wafer support region for contacting the planar wafer surface. The wafer support region of the chuck includes recesses configured at predefined positions corresponding to support member contacting portions of the lower wafer surface. The wafer handling system further includes a wafer transport device including a rotational position adjusting device for adjusting the rotational position of a wafer that is transported between the wafer holder and the wafer chuck. Thereby, elevations on the lower wafer surface, like scratches or deposited material which are produced by the contact between the support members and the wafer, are encapsulated by the recesses of the wafer chuck. A method for moving a wafer between a wafer holder and a wafer chuck is also provided.

Abstract: A method of picking up a plurality of semiconductor chips formed by dividing a semiconductor wafer comprises the step of adhesively holding the plurality of semiconductor chips on an elastic adhesive pad which has innumerable pores in the surface and generates adhesion force when negative pressure is produced by the pores crushed by restoration force generated by elasticity and adhesion, and the step of picking up the semiconductor chips in a state of air in the pores being expanded by heating the elastic adhesive pad which adhesively holds the plurality of semiconductor chips at a predetermined temperature.

Abstract: A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus, the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position, the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.

Abstract: A method and apparatus for transferring a substrate is provided. In one embodiment, an apparatus for transferring a substrate includes at least one end effector. A disk is rotatably coupled to the end effector. The disk is adapted to rotate the substrate relative to the end effector. The end effector may additionally include a sensor coupled thereto. The sensor is adapted to detect an indicia of orientation of the substrate supported by the end effector. In another embodiment, a method for transferring a substrate includes rotating the substrate disposed on an end effector and detecting an indicia of orientation of the substrate.

Abstract: Generally, an end effector assembly for a substrate transfer robot is provided. In one embodiment, an end effector assembly for supporting a quadrilateral substrate during substrate transfer includes an end effector having an inner edge support disposed on a first end and a first outer edge support disposed on a distal end. The first end of the end effector is adapted for coupling to a robot linkage. The first inner edge support has a face that is oriented parallel to and facing the face of the first outer edge support. This configuration of edge supports captures the substrate to the end effector thereby minimizing substrate slippage during transfer. In another embodiment, lateral guides may be utilized to further enhance capturing the substrate along the edges of the substrate open between the inner and outer edge supports.

Abstract: Methods and apparatus for high speed workpiece handling are provided. The method for workpiece handling includes removing a workpiece from a first cassette with a first robot, transferring the workpiece from the first robot directly to a second robot without transferring the workpiece to a transfer station, placing the workpiece on a workpiece holder at a processing station with the second robot, and transferring the workpiece from the workpiece holder to the first cassette with the first robot following processing. End effectors of the first and second robots may each have a plurality of vertical positions for efficient workpiece handling. Displacement error and rotational error of the workpiece may be sensed and corrected without use of a transfer station. The methods and apparatus may be used for handling semiconductor wafers.

Abstract: The present invention provides an apparatus for bonding a semiconductor chip to substrate using a non-conductive adhesive tape. The non-conductive adhesive tape may be a polyimide tape. The apparatus may include a tape provider having a reel on which the non-adhesive tape may be spooled, rollers, and a tape cutter which cuts the tape to a suitable size. A tape holder and a tape presser may also be provided to hold the tape in place while the tape cutter cuts the tape. A tape pick-up tool may be provided to transfer the cut tape to a die bonding area on the substrate. The tape holder and the tape pick-up tool may include a suction opening for providing a suction force. The apparatus may further include a die pick up tool for transferring a semiconductor chip from a semiconductor chip provider to the adhesive tape affixed to the substrate.

Abstract: An end effector for installation on a robotic arm for transporting a plurality of semiconductor wafers from one location to another features a ceramic end effector body portion that includes a plurality of wafer engaging fingers that each feature wafer support pads. The wafer support pads are adapted to support a semiconductor wafer surface, and at least one of the support pads has a vacuum orifice. The body portion features an interior vacuum passageway having a first end that is adapted to connect to a vacuum source and a second end that terminates at the vacuum orifices such that a reduced gas pressure at the first end causes a vacuum to be exerted at the vacuum orifices. The interior passageway is formed from a groove in the end effector body portion and an end effector backplate that is sealingly connected to the end effector body portion to completely cover the groove from the first end to the second end. The ceramic body portion can be made of alumina or silicon carbide.

Abstract: The present invention provides grasping mechanisms, gripper apparatus/systems, and related methods. Grasping mechanisms that include stops, support surfaces, and height adjusting surfaces to determine three translational axis positions of a grasped object are provided. In addition, grasping mechanisms that are resiliently coupled to other gripper apparatus components are also provided.

Abstract: A method of securing a substrate in a semiconductor processing machine. The method includes moving latch bodies between latched and unlatched positions while permitting contact between a clamping member of each latch body and the substrate only if the latch bodies are substantially in the latched position. In the latched position, the clamping members apply a clamping force effective to secure the substrate. Generally, contact is prevented by engagement between a support member and an ramp that is inclined such that the clamping member descends toward the substrate as the latch body moves from the unlatched position to the latched position and only contacts the substrate as the latched position is established.