Abstract: Methods of protecting a submerged surface include applying an adhesion-promoting layer onto a surface. An inner polymer layer is applied onto the adhesion-promoting layer. The inner polymer layer is impregnated with a biologically active chemical substance that inhibits biofouling-induced chemical, biological, and bio-proliferative damage. An outer polymer layer is applied onto the inner polymer layer. The outer polymer layer is impregnated with a biologically active chemical substance that inhibits biofouling-induced chemical, biological, and bio-proliferative damage and that repels biofouling organisms to prevent invasion of the inner polymer layer.

Abstract: This free-cutting copper alloy contains Cu: more than 57.5% but less than 64.5%, Si: more than 0.20% but less than 1.20%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.10% but less than 1.00%, and P: more than 0.001% but less than 0.20%, with the balance being Zn and unavoidable impurities, wherein the total amount of Fe, Mn, Co and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, relationships of 56.3?f1=[Cu]?4.8×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5 and 0.12?f2=[Pb]+[Bi]<1.0 are satisfied.

Abstract: This free-cutting copper alloy includes Cu: more than 58.0% and less than 65.0%, Si: more than 0.30% and less than 1.30%, Pb: more than 0.001% and 0.20% or less, Bi: more than 0.020% and 0.10% or less, and P: more than 0.001% and less than 0.20%, with the remainder being Zn and unavoidable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.45%, a total amount of Sn and Al is less than 0.45%, relationships of 56.5?[Cu]?4.7×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5, and 0.025?[Pb]+[Bi]<0.25 are satisfied, in constituent phases of a metallographic structure, relationships of 20?(?)<85, 15<(?)?80, 0?(?)<5, 8.0?([Bi]+[Pb]?0.002)1/2×10+([P]?0.001)1/2×5+((?)?7)1/2×([Si]?0.1)1/2×1.2+(?)1/2×0.5?17.0, and 0.9?([Bi]+[Pb]?0.002)1/2×((?)?7)1/2×([Si]?0.1)1/2?4.0 are satisfied, and a particle containing Bi is present in ? phase.

Abstract: Methods of protecting a surface include applying an inner polymer layer onto a surface. The inner polymer layer is impregnated with a biologically active chemical substance that protects the surface from biofouling-induced chemical, biological, and bio-proliferative damage. The inner polymer layer is an epoxy polymer. An outer polymer layer is applied onto the inner polymer layer. The outer polymer layer is impregnated with a biologically active chemical substance that protects the inner polymer layer from biofouling-induced chemical, biological, and bio-proliferative damage. The outer polymer layer is selected from the group consisting of polyurethanes and fluorourethanes.

Abstract: The invention is a copper alloy with excellent comprehensive performance, including the following components in percentage by weight: 0.4 wt %-2.0 wt % of Ni, 0.2 wt %-2.5 wt % of Sn, 0.02 wt %-0.25 wt % of P, 0.001 wt %-0.5 wt % of Si, and the balance of Cu and unavoidable impurities. The copper alloy has a yield strength of 550 MPa or above, and an electrical conductivity of 38% IACS or above. A bending workability is as follows: the value of R/t in the GW direction is less than or equal to 1, and the value of R/t in the BW direction is less than or equal to 2; and after the copper alloy is kept at 150° C. for 1000 hours, a residual stress rate is greater than or equal to 75%, and the stress relaxation resistance is excellent.

Abstract: The present disclosure relates to a lead-free high tensile brass alloy containing 50-65 wt. % Cu; 0.4-3 wt. % Mn; 0.55-3 wt. % Sn; max 1 wt. % Fe; max 1 wt.-% Ni; max. 1 wt.-% Al; max 1.5 wt.-% Si; the remainder being Zn and inevitable impurities, and the sum of elements Mn and Sn being at least 1.3 wt.-% and not more than 6.0 wt.-%.

Abstract: Provided is a Cu-based sintered bearing comprising: 15-36 mass % of Ni; 3-13 mass % of Sn; 0.05-0.55 mass % of P; and 0.02-4 mass % of C in total, the balance consisting of Cu and inevitable impurities, wherein the content of C forming an alloy with a matrix within Cu—Ni-based main phase grains is 0.02-0.10 mass %.

Abstract: An electronic assembly has an electronic module and an electric part. The electronic module has an electric terminal having a press-fit section. The press-fit section includes at least one of the following CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg. The electric part has a contact hole. The electronic assembly includes a press-fit connection between the press-fit section and the electric part. In that press-fit connection, the press-fit section both mechanically and electrically contacts the electric part.

Abstract: Provided is a Cu-based sintered bearing comprising: 15-36 mass % of Ni; 3-13 mass % of Sn; 0.05-0.55 mass % of P; and 0.02-4 mass % of C in total, the balance consisting of Cu and inevitable impurities, wherein the content of C forming an alloy with a matrix within Cu—Ni-based main phase grains is 0.02-0.10 mass %.

Abstract: One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TSTD/TSLD of tensile strength TSTD in a direction perpendicular to a rolling direction to tensile strength TSLD in a direction parallel to the rolling direction exceeds 1.09.

Abstract: This copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which is composed of Mg at a content of 3.3 to 6.9 atomic %, and a remainder of Cu and inevitable impurities, and a conductivity ? (% IACS) is within the following range when the content of Mg is given as A atomic %, and/or an average number of intermetallic compounds having grain sizes of 0.1 ?m or more is in a range of 1/?m2 or less, ??{1.7241/(?0.0347×A2+0.6569×A+1.7)}×100.

Abstract: The invention provides a Cu—Ni—Sn—P alloy sheet satisfying the resistance property of stress relaxation in the direction perpendicular to the rolling direction and excellent in the other necessary properties as terminals and connectors.

Abstract: One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic %, with a remainder being Cu and inevitable impurities, and a conductivity ? (% IACS) is within the following range when the content of Mg is given as A atomic %, ??{1.7241/(?0.0347×A2+0.6569×A+1.7)}×100. Another aspect of this copper alloy is composed of a ternary alloy of Cu, Mg, and Zn which includes Mg at a content of 3.3 to 6.9 atomic % and Zn at a content of 0.1 to 10 atomic %, with a remainder being Cu and inevitable impurities, and a conductivity ? (% IACS) is within the following range when the content of Mg is given as A atomic % and the content of Zn is given as B atomic %, ??{1.7241/(X+Y+1.7)}×100, X=?0.0347×A2+0.6569×A and Y=?0.0041×B2+0.2503×B.

Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]?400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.

Abstract: A rolled copper foil for producing a two-dimensional hexagonal lattice compound, including P: 0.01 to 0.21 wt %, Fe: 0.006 wt % or less, and the balance being Cu and inevitable impurities, and having the following relationship: 2.0<=(I/I0) where I is a (111) diffraction intensity determined by an X ray diffraction of a rolled surface after heating at 1000° C. for 30 minutes and I0 is a (111) diffraction intensity determined by an X ray diffraction of fine powder copper.

Abstract: A brass alloy containing trace amounts of iron, manganese and aluminum is disclosed. Phosphorus is added to a zinc, copper melt and combined with the iron, manganese and aluminum to form intermetallics. Additional phosphorus is added so the melt contains between about 0.08 to 0.15% phosphorus. The alloy has tin in the range of 0.15% to 0.35%.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: Provided is one aspect of copper alloy sheet containing 4.5% by mass to 12.0% by mass of Zn, 0.40% by mass to 0.90% by mass of Sn, 0.01% by mass to 0.08% by mass of P, as well as 0.005% by mass to 0.08% by mass of Co and/or 0.03% by mass to 0.85% by mass of Ni, the remainder being Cu and unavoidable impurities. The copper alloy sheet satisfies a relationship of 11?[Zn]+7×[Sn]+15×[P]+12×[Co]+4.5×[Ni]?17. The one aspect of copper alloy sheet is produced by a production process including a finish cold rolling process at which a copper alloy material is cold-rolled. An average grain size of the copper alloy material is 2.0 ?m to 8.0 ?m, circular or elliptical precipitates are present in the copper alloy material, and an average particle size of the precipitates is 4.0 nm to 25.0 nm, or a percentage of precipitates having a particle size of 4.0 nm to 25.0 nm makes up 70% or more of the precipitates.

Abstract: There is provided a bearing for motor-powered fuel injection pumps, made from Cu—Ni-based sintered alloy, which is able to be obtained at a low cost, having excellent corrosion and abrasion resistances. The bearing contains 10 to 20% by mass of Ni, 5 to 13% by mass of Sn, 0.1 to 0.8% by mass of P, 1 to 6% by mass of C, and a remainder containing Cu and inevitable impurities, and is formed with a Ni—Sn—Cu—P phase containing at least 30% by mass of Sn in a grain boundary, and has a 8 to 18% porosity. The Ni—Sn—Cu—P phase contains 30 to 49% by mass of Ni, 10 to 30% by mass of Cu, 0.5 to 1.5% by mass of P, and a remainder containing Sn and inevitable impurities.

Abstract: A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: The invention relates to a copper alloy that has been subjected to a thermo-mechanical treatment, composed of (in wt %) 15.5 to 36.0% Zn, 0.3 to 3.0% Sn, 0.1 to 1.5% Fe, optionally also 0.001 to 0.4% P, optionally also 0.01 to 0.1% Al, optionally also 0.01 to 0.03% Ag, Mg, Zr, In, Co, Cr, Ti, Mn, optionally also 0.05 to 0.5% Ni, the remainder copper and unavoidable contaminants, wherein the microstructure of the alloy is characterized in that the proportions of the main texture layers are at least 10 vl % copper layer, at least 10 vl % S/R layer, at least 5 vl % brass layer, at least 2 vl % Goss layer, at least 2 vl % 22RD-cube layer, at least 0.5 vl % cube layer, and finely distributed iron-containing particles are contained in the alloy matrix.

Abstract: A copper alloy having excellent sliding performance is produced without relying on lead or molybdenum. The copper alloy contains a sintered Cu5FeS4 material produced by sintering a raw material powder that comprises Cu, Fe and S and is produced by a gas atomizing method.

Abstract: Provided is a copper-based sliding material including a steel back-metal layer and a Cu alloy layer. The Cu alloy layer contains, by mass %, 10 to 30% of Bi, 0.5 to 5% of an inorganic compound, and the balance being Cu and inevitable impurities. The Cu alloy layer may further contain 0.5 to 5% of Sn and/or at least one element selected from the group consisting of Ni, Fe, P and Ag in a total amount of 0.1 to 10%. The inorganic compound has an average particle size of 1 to 5 ?m and a specific gravity of 70 to 130% relative to the specific gravity of Bi. Bi phase is formed in the Cu alloy layer in an average particle size of 2 to 15 ?m, and the Bi phase is dispersed in the Cu alloy layer and isotropic.

Abstract: An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20?[Zn]+7×[Sn]+15×[P]+4.5×[Ni]?32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 ?m to 5.0 ?m, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70% or more.

Abstract: A hot-forged copper alloy part which has a tubular shape, in which an alloy composition contains 59.0 mass % to 84.0 mass % of Cu and 0.003 mass % to 0.3 mass % of Pb with a remainder of Zn and inevitable impurities, a content of Cu [Cu] mass % and a content of Pb [Pb] mass % have a relationship of 59?([Cu]+0.5×[Pb])?64, a shape of the forged part satisfies a formula of 0.4?(average inner diameter)/(average outer diameter)?0.92, 0.04?(average thickness)/(average outer diameter)?0.3, and 1?(tube axis direction length)/(average thickness))?10, a forging material which is to be hot-forged has a tubular shape and satisfies 0.3?(average inner diameter/average outer diameter)?0.88, 0.06?(average thickness)/(average outer diameter)?0.35, and 0.8?(tube axis direction length)/(average thickness))?12, and 0%?(degree of uneven thickness)?30%, 0?(degree of uneven thickness)?75×1/((tube axis direction length)/(average thickness))1/2 in any location in a tube axis direction.

Abstract: This copper alloy with high strength and high electrical conductivity includes: Mg: more than 1.0% by mass to less than 4% by mass; and Sn: more than 0.1% by mass to less than 5% by mass, with a remainder including Cu and inevitable impurities, wherein a mass ratio Mg/Sn of a content of Mg to a content of Sn is in a range of 0.4 or more. This copper alloy with high strength and high electrical conductivity may further include Ni: more than 0.1% by mass to less than 7% by mass.

Abstract: Provided is one aspect of copper alloy sheet containing 4.5% by mass to 12.0% by mass of Zn, 0.40% by mass to 0.90% by mass of Sn, 0.01% by mass to 0.08% by mass of P, as well as 0.005% by mass to 0.08% by mass of Co and/or 0.03% by mass to 0.85% by mass of Ni, the remainder being Cu and unavoidable impurities. The copper alloy sheet satisfies a relationship of 11?[Zn]+7×[Sn]+15×[P]+12×[Co]+4.5×[Ni]?17. The one aspect of copper alloy sheet is produced by a production process including a finish cold rolling process at which a copper alloy material is cold-rolled. An average grain size of the copper alloy material is 2.0 ?m to 8.0 ?m, circular or elliptical precipitates are present in the copper alloy material, and an average particle size of the precipitates is 4.0 nm to 25.0 nm, or a percentage of precipitates having a particle size of 4.0 nm to 25.0 nm makes up 70% or more of the precipitates.

Abstract: A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1}<3 4 6> is within 30° is 60 % or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.

Abstract: A brass alloy containing trace amounts of iron, manganese and aluminum is disclosed. Phosphorous is added to a zinc, copper melt and combined with the iron, manganese and aluminum to form intermetallics. Additional phosphorous is added so the melt contains between about 0.08 to 0.15% phosphorous. The alloy has tin in the range of 0.15% to 0.35%.

Abstract: Provided is a copper alloy plate that is for an FPC substrate and that has superior heat dissipation, repeated bending workability, shape retaining properties, and heat resistance. The copper alloy plate contains at least 0.01 mass % of the total of at least one element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, contains no more than 1.0 mass % of Ag, no more than 0.08 mass % of Ti, no more than 2.0 mass % of Ni, no more than 3.5 mass % of Zn, and no more than 0.5 mass % of Cr, Fe, In, P, Si, Sn, and Zr by the total of the at least one element selected from the group, the remainder comprising Cu and impurities, has a conductivity of at least 60% IACS, has a tensile strength of at least 350 MPa, and has I(311)/IO(311) determined by X-ray diffraction in the thickness direction of the plate surface that satisfies the formula I(311)/IO(311)?0.5.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: The invention relates to the use of a copper alloy, composed of (in wt %): 51.8 to 84.0% Cu, 15.5 to 36.0% Zn, 0.35 to 3.0% Sn, 0.12 to 1.5% Fe, 0.02 to 1.0% P, optionally also 0.1 to 2.0% Al, optionally also 0.05 to 0.7% Si, optionally also 0.05 to 2.0% Ni, optionally also respectively 0.1 to 1.0% Mn, Co, optionally also respectively 0.01 to 1.0% As, Sb, and unavoidable contaminants, wherein more than 95% of the structure consist of ?-mixed crystal, in which at least iron phosphides and/or iron are embedded as deposition particles, for metallic articles in breeding organisms living in seawater.

Abstract: The invention relates to a copper alloy that has been subjected to a thermo-mechanical treatment, composed of (in wt %) 15.5 to 36.0% Zn, 0.3 to 3.0% Sn, 0.1 to 1.5% Fe, optionally also 0.001 to 0.4% P, optionally also 0.01 to 0.1% Al, optionally also 0.01 to 0.03% Ag, Mg, Zr, In, Co, Cr, Ti, Mn, optionally also 0.05 to 0.5% Ni, the remainder copper and unavoidable contaminants, wherein the microstructure of the alloy is characterized in that the proportions of the main texture layers are at least 10 vl % copper layer, at least 10 vl % S/R layer, at least 5 vl % brass layer, at least 2 vl % Goss layer, at least 2 vl % 22RD-cube layer, at least 0.5 vl % cube layer, and finely distributed iron-containing particles are contained in the alloy matrix.

Abstract: A Cu—Ni—Sn—P alloy is provided, which is excellent in stress relaxation property in a direction perpendicular to a rolling direction, and has any of high strength, high conductivity, and excellent bendability. A copper alloy contains 0.1 to 3.0% of Ni, 0.1 to 3.0% of Sn, and 0.01 to 0.3% of P in mass percent respectively, and includes copper and inevitable impurities as the remainder; wherein in a radial distribution function around a Ni atom according to a XAFS analysis method, a first peak position is within a range of 2.16 to 2.35 ?, the position indicating a distance between a Ni atom in Cu and an atom nearest to the Ni atom. Thus, distances to atoms around the Ni atom in Cu are comparatively increased, so that the stress relaxation property in a direction perpendicular to the rolling direction of the copper alloy is improved.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: A copper alloy tube according to the present invention includes Sn 0.1 to 2.0 mass %, P 0.005 to 0.1 mass %, S 0.005 mass % or less, O 0.005 mass % or less, and H 0.0002 mass % or less, and the remainder has a composition consisting of Cu and unavoidable impurities. And, as is annealed, the copper alloy tube has the following characteristics: a tensile strength in the longitudinal direction of the copper alloy tube is 250 N/mm2 or more; an average grain diameter is 30 ?m or less when measured in the direction perpendicular to the thickness direction of the tube, in the cross section perpendicular to the tube axis; and assuming that a tensile strength in the longitudinal direction of the copper alloy tube is ?L, and a tensile strength in the circumferential direction of the same is ?T, ?T/?L>0.93 holds.

Abstract: Alloys comprising copper, iron, tin and, optionally, phosphorus or copper, zinc, tin and, optionally, phosphorus, which can be used in, for example, a copper alloy tube for heat exchangers that provides excellent fracture strength and processability for reducing the weight of the tube and for use in high pressure applications with cooling media such as carbon dioxide.

Abstract: A brazing alloy is provided in the form of a wire, rod or preform, and is made of, in weight percent: 3-7.5% P, 0.1-1.9% Zn, 0-74.7% Ag, 0-80% Au, 0-10% Sn, 0-5% Ni, 0-3% each of Si, Mn, Li, and Ge, and the balance copper in an amount of at least 21.7%. In additional embodiments, Zn may be present in an amount of 0.6-1.9%. A method of torch brazing is also provided. The method includes forming the alloy into a wire or rod, placing the tip of the wire or rod in contact with a surface of a joint, heating the joint surface using a torch flame, and contacting the tip of the wire or rod to the heated joint surface to melt and flow the alloy onto the joint surface and into the joint under capillary action.

Abstract: A lead-free copper alloy includes, in combination by weight, about 10.0% to about 20.0% bismuth, about 0.05% to about 0.3% phosphorous, about 2.2% to about 10.0% tin, up to about 5.0% antimony, and up to about 0.02% boron, the balance essentially copper and incidental elements and impurities. The alloy contains no more than about 0.05 wt. % or 0.10 wt. % lead.

Abstract: There is provided a bearing for motor-powered fuel injection pumps, made from Cu—Ni-based sintered alloy, which is able to be obtained at a low cost, having excellent corrosion and abrasion resistances. The bearing contains 10 to 20% by mass of Ni, 5 to 13% by mass of Sn, 0.1 to 0.8% by mass of P, 1 to 6% by mass of C, and a remainder containing Cu and inevitable impurities, and is formed with a Ni—Sn—Cu—P phase containing at least 30% by mass of Sn in a grain boundary, and has a 8 to 18% porosity. The Ni—Sn—Cu—P phase contains 30 to 49% by mass of Ni, 10 to 30% by mass of Cu, 0.5 to 1.5% by mass of P, and a remainder containing Sn and inevitable impurities.

Abstract: Alloys containing copper, iron, tin and, optionally, phosphorus or copper, zinc, tin and, optionally, phosphorus, which can be used in, for example, a copper alloy tube for heat exchangers that provides excellent fracture strength and processability for reducing the weight of the tube and for use in high pressure applications with cooling media such as carbon dioxide.

Abstract: The present invention is a Cu—Fe—P system copper alloy plate comprising Fe: 0.02-0.5% and P: 0.01-0.25% in mass % with the balance consisting of copper and unavoidable impurities and having the ratio Fe/P of Fe to P in mass % being 2.0 to 5.0, wherein: a ratio of the area of fine crystal grains less than 0.5 ?m in equivalent circle diameter to an observation area when a surface is observed by EBSD analysis is 0.90 or less; and the ratio C1s/Cu2p of a peak area of C1s to a peak area of Cu2p on the surface by XPS analysis is 0.35 or less.

Abstract: Provided is a method for preventing the elution of Bi from copper alloy, in which the elution of Bi is prevented in leadless copper-alloy plumbing equipment and the like containing a trace of lead and a predetermined amount of Bi. The present invention relates to a method for preventing the elution of Bi from copper alloy in which at least Bi present on the surface of copper alloy containing Bi is selectively removed by preferentially dissolving Bi in a 4 to 20 mass % concentration of nitric acid while suppressing Cu dissolution. Furthermore, elution of Pb is suppressed using a 10-20 mass % concentration of nitric acid. In this case, by removing at least Bi present on the surface of copper alloy containing Bi using nitric acid and then treating the surface of the copper alloy by shot-blasting corrosive products, such as oxides, produced from the nitric acid are removed, and gloss is imparted to the surface.

Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.

Abstract: A method of producing a brass is disclosed. The alloy contains trace amounts of iron, manganese or aluminum. Phosphorous is added to a zinc, copper melt and combined with the iron, manganese and aluminum to form intermetallics. Additional phosphorous is added so the melt contains between about 0.08 to 0.15% phosphorous. A low lead brass alloy is provided. The alloy has tin in the range of 0.15% to 0.35%.

Abstract: A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width ? of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 ?m or less.

Abstract: A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

Abstract: The present invention relates to a brazing alloy, and particularly, to a brazing alloy comprising copper (Cu), phosphorus (P), and strontium (Sr) and further including any one element of indium (In), boron (B), silver (Ag), tin (Sn), cesium (Cs), germanium (Ge), and nickel (Ni). The present invention includes 5.0 to 7.5 wt % of phosphorus (P) and 0.1 to 5.0 wt % of strontium (Sr), in which the remainder is composed of copper (Cu). The brazing alloy according to an exemplary embodiment of the present invention comprises copper (Cu), phosphorus (P), and strontium (Sr) unlike the existing alloy element and further includes, as alloy components, one or more elements selected from a group consisting of indium (In), boron (B), silver (Ag), and tin (Sn), such that the brazing alloy includes no silver (Ag) or the silver (Ag) content is remarkably reduced compared to an existing brazing alloy containing silver (Ag).

Abstract: A lead-free brass material exhibiting excellent forgeability and dezincification resistance is provided. The brass material includes 61.0 to 63.0 wt % of Cu, 0.5 to 2.5 wt % of Bi, 1.5 to 3.0 wt % of Sn, 0.02 to 0.10 wt % of Sb, and 0.04 to 0.15 wt % of P, with the balance being substantially Zn. The brass material is a lead-free, free-cutting alloy which can be suitably applied to forging and which exhibits excellent mechanical properties and dezincification resistance without substantially subjecting the brass material to a heat treatment after forging.