Abstract: Spray cast alloys having reduced porosity and increased ductility are provided as well as a process for the manufacture of the alloys. An effective amount of a reactive metal which reacts with the spray casting atmosphere but not with the desired alloy is dissolved into the alloy prior to spray casting. Preferred reactive metals readily form a nitride which is finely dispersed throughout the spray cast alloy.

Abstract: A phosphorous copper based alloy having combined tin and antimony contents up to approximately six percent each for brazing filler metal joining copper and copper alloys producing strong clean joints at lower brazing temperatures. Silver added in amounts of 1-18% offers the ability to lower brazing temperatures further.

Abstract: A valve guide and a method for the manufacture thereof are described. The valve guide is a tubular article having a length to outer diameter ratio greater than about 1.5 and is made of a ferrous material by a PM route. The pressed guide is infiltrated by preparing a sheet of the infiltrant alloy, rolling the sheet into a cylinder and inserting it into the guide bore followed preferably by, simultaneous sintering and infiltration.

Abstract: A copper-based alloy connector excellent in electrical conductivity, adherence of solder of the connector when bent, high-temperature creep strength, and migration resistance, consists essentially by weight percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3% Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, and the balance of Cu and inevitable impurities. The copper-based alloy connector can withstand use for a long term in a high-temperature and high-humidity environment.

Abstract: A wrought metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The alloy composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces the tensile strength of the matrix so the liner slug is pulverized on striking a well casing. The slug does not penetrate the hole perforated in the well casing by the liner jet and the oil flow into the well bore is not impeded.

Abstract: A copper alloy suitable for use as the material of a heat exchanger contains 1 to 4.5 wt % of Zn, 1.0 to 2.5 wt %, preferably 1.5 to 2.0 wt % of Sn, 0.005 to 0.05 wt %, preferably 0.01 to 0.04% of P, and the balance substantially Cu and inevitable impurities, and has grain size not greater than 0.015 mm, preferably below 0.01 mm. The alloy exhibits high resistance levels to corrosion such as stress corrosion cracking, dezincification corrosion and so forth, as well as superior workability, strength and solder wettability, and, hence, can suitably be used as the materials of the constituents of a heat exchanger such as tanks, tube plates and tubes.

Abstract: A copper alloy excellent in migration resistance comprising from 0.05 to 0.20% by weight of Fe, from 0.02 to 0.05% by weight of P, from 1.0 to 5.0% by weight of Zn, less than 2.5% by weight of Sn and the substantial balance of Cu and impurities. The copper alloy of this invention is excellent in migration resistance as comparable with brass and also excellent in stress corrosion crackings, as well as have higher strength than the copper alloy or the pure copper or the like.

Abstract: A spring copper alloy for electric and electronic parts having a high modulus of elasticity, a good electrical conductivity and a good solderability is disclosed, which alloy consists of 1.5.about.3.0% by weight of Ni, 1.2.about.2.0% by weight of Sn, 0.05.about.0.30% by weight of Mn, 0.01.about.0.1% by weight of P, inevitable impurities and the remainder of Cu.

Abstract: A copper base lead material for leads of a semiconductor device, which consists essentially of from 0.05 to 0.25 percent by weight tin, from 0.01 to 0.2 percent by weight silver, from 0.025 to 0.1 percent by weight phosphorus, from 0.05 to 0.2 percent by weight magnesium, and the balance of copper and inevitable impurities, wherein the P/Mg ratio is within a range from 0.5 to 0.85, preferably within a range from 0.60 to 0.85, so as to form a compound of magnesium and phosphorus or Mg.sub.3 P.sub.2. The copper base lead material possesses satisfactory properties required of a metal material for leads in semiconductor devices, such as strength, thermal resistance, and stampability, and further possesses excellent heat radiation to an extent suitable for use as leads of semiconductor devices having high wiring densities. The invention also includes the semiconductor device containing said leads.

Abstract: A filler metal for the welding of steel and iron, copper and copper alloys, with and without surface finishing, which shows a good wetting and also a good flow for surface-treated base metals, which does not form any scales and any visible crusting and does not build up too much, thus has an insignificant pore formation and a comparatively insignificant splatter formation, has the following composition in percentage by weight:0.01-2.5% Si,0.1-0.4% Sn,0.6-1.5% Mn,0.005-0.020% P and/or0.002-0.020% B,whereby P and B together are less than 0.020%, the remainder being copper, impurities Pb less than 0.02%, other impurities together less than 0.5%.

Abstract: A lead material for ceramic package ICs which comprises Ni 1.0-5.0 wt %, Co 0.2-1.0 wt %, Si 0.2-1.5 wt %, Zn 0.1-5.0 wt %, Cr 0.001-0.1 wt %, and Mn 0.02-1.0 wt %, with the remainder being Cu and inevitable impurities. It does not cause cracking to the ceramic substrate in the cooling step after silver soldering at 800.degree. to 950.degree. C., even though its coefficient of thermal expansion differs from that of ceramics. Moreover, it retains its high strength and conductivity after brazing.

Abstract: A high-strength, high-conductivity copper alloy comprises, all by weight, from 0.8 to 4.0% of Sn, from more than 0.01 to 0.4% of P, from 0.05 to 1.0% of Ni, from 0.05 to 1.0% of one, two or more elements selected from Al, Hf, Be, Mo, Zn, Te, Pb, Co, Zr, and Nb, and the remainder of Cu and inevitable impurities. The impurities include not more than 0.0020% of oxygen.

Abstract: A copper-based alloy is described consisting essentially of:______________________________________ Tin 25-225 ppm Tellurium or Selenium 25-225 ppm Phosphorus 10-50 ppm Copper Balance ______________________________________The alloys can be used in many forms, including sheet, strip, bar, rod and wire. Sheet stock made from this alloy is useful as automotive radiator fin stock. In addition, electrical components can be made from the alloy of this invention. All of these materials have thermal and electrical conductivity properties and softening temperatures equal to or better than the prior art alloys adapted for these applications. In addition, the alloys of this invention can utilize relatively inexpensive materials and do not present significant toxicity problems and are readily analzyed using common industrial analysis equipment.

Abstract: A copper-based alloy for use in electrical and electronic devices, particularly as a material used for forming lead frames of semiconductor devices, which is less expensive than phosphor bronze while providing a mechanical strength and durability to repeated bending comparable with those of phosphor bronze, and also a relatively high conductivity. The inventive alloy is a copper-based alloy containing 1.2 to 2.5 wt % tin, 0.01 to 0.15 wt % phosphorous, 0.1 to 0.6 wt % nickel, 0.05 to 1 wt % zinc, and the remainder being copper and minute amounts of unavoidable impurities.

Abstract: A spring material for electric and electronic parts having a high modulus of elasticity and good electrical conductivity. The material is made by melting Cu, Ni, Ti or mother alloy thereof and Cu--P as deoxidizer at a temperature between a melting point and 1,400.degree. C. to obtain a molten alloy consisting of 0.5.about.2.0% by weight of Ni, 0.1.about.1.0% by weight of Ti, less than 0.2% by weight of P and the remainder being Cu; casting the molten alloy into a metal mold to obtain an ingot; subjecting the ingot to hot (or warm) working, cold working and annealing; and finally rolling the annealed sheet above 50% and annealing it at low temperature with air cooling to obtain a formed product having a stable structure.

Abstract: A copper base alloy having an improved combination of conductivity and strength for applications such as lead frames or electrical connectors. The alloys consists essentially of from about 0.3 to 1.6% by weight iron, with up to one-half the iron content being replaced by nickel, manganese, cobalt, and mixtures thereof; from about 0.01 to about 0.20% by weight magnesium; from about 0.10 to about 0.40% by weight phosphorus; up to about 0.5% by weight tin or antimony and mixtures thereof; and the balance copper. The phosphorus to magnesium ratio and phosphorus to the total content of phosphide formers ratio are maintained within critical limits.

Abstract: A copper-tin alloy having improved wear performance and a process for forming the alloy is described herein. The alloy consists essentially of about 2% to about 11%, preferably about 3.5% to about 9% tin, about 0.03% to about 0.75%, preferably about 0.08% to about 0.5% phosphorous and the balance essentially copper. The processing for improving the wear performance includes a final heat treatment at a temperature in the range of about 400.degree. C. to about 650.degree. C., preferably about 500.degree. C. to about 600.degree. C. in an atmosphere having a dew point in the range of about -75.degree. C. to about +95.degree. C., preferably -57.degree. C. to +21.degree. C. and an oxygen level in the range of about 0.001 ppm to about 225 ppm.

Abstract: A tin alloy powder containing up to 5% P is disclosed. Reduced sensitivity to sintering conditions is achieved by use of present alloy powder in production of sintered bronze articles. Means for controlling the growth of the article during sintering are also disclosed.

Abstract: A sliding member highly improved with lubricating performance, wear resistant property and strength has a thin steel sheet or plate and sintered metal layer deposited on the steel sheet, wherein the sintered metal layer, comprises copper as a main component incorporated with a certain amount of tin, nickel, phosphorus, graphite and, optionally, with iron, and a sliding member exhibiting excellent lubricating performance, wear resistant property and strength even under impact and heavy loads includes a thick steel sheet or plate with which thin steel sheet of the above-mentioned sliding member is integrally joined.

Abstract: A copper based low melting point metal alloy composition consists essentially of about 5 to 52 atom percent nickel, about 2 to 10 atom percent tin, about 10 to 15 atom percent phosphorus and the balance essentially copper and incidental impurities. The composition is such that the total of copper, nickel and tin ranges from about 85 to 90 atom percent.

Abstract: Copper-based alloy consists essentially of 1.7% to 2.5% of tin, 0.03% to 0.35% of phosphorus, 0.1% to 0.6% of nickel, and remainder of copper and unavoidable impurities, the percentage ratio being all by weight.

Abstract: A copper based low melting point metal alloy composition consists essentially of about 10 to 52 atom percent nickel, about 2 to 10 atom percent tin, about 10 to 15 atom percent phosphorus and the balance essentially copper and incidental impurities. The composition is such that the total of copper, nickel and tin ranges from about 85 to 90 atom percent.

Abstract: Corrosion-resistant copper alloys for the manufacture of radiators are composed of, by weight, 25-40% zinc, 0.005-0.070% phosphorus, 0.05-1.0% each tin and aluminum, and the balance copper and inevitable impurities.

Abstract: Copper-nickel-tin alloys having high tensile strength and conductivity suitable for lead conductor materials for integrated circuits are produced by melting a starting material containing 0.5-3.0% by weight of Ni, 0.3-0.9% by weight of Sn, 0.01-0.2% by weight of phosphorus and 0-0.35% by weight of at least one of Mn and Si other than Cu, casting the molten metal, rolling conventionally the cast into a sheet having a thickness corresponding to more than 60% of cold reduction rate of the final necessary gauge, annealing such a rolled sheet at a temperature of 300-395.degree. C. for 1 hour, cold rolling the annealed sheet and annealing the cold rolled sheet at a temperature of 150-250.degree. C. for 1 hour.