Abstract: This invention has for an object thereof the provision of a leadless copper-based alloy which mends the deterioration of tensile strength at elevated temperatures and enables the mechanical properties thereof to approximate the CAC406 by forming in the alloy texture thereof an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. For the purpose of accomplishing the object, this invention incorporates in the copper-based alloy an additive element capable of forming an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. The additive element is one or more members selected from the group consisting of Te, P, Zr, Ti, Co, In, Ca, B and misch metal.

Abstract: [PROBLEMS] To provide a Cu—Bi—hard substance base sintered alloy in which the respective properties of Bi and hard substance can be satisfactorily exerted. [MEANS FOR SOLVING PROBLEMS] There is provided a Ph free copper base sintered alloy, comprising 1 to 30% of Bi and 0.1 to 10% of hard substance particles of 10 to 50 ?m average diameter, (1) wherein a Bi phase having an average particle diameter smaller than that of the hard substance particles is dispersed in a matrix of Cu, or wherein with respect to a Bi phase in contact with the hard substance particles, the ratio of presence of hard substance particles exhibiting a ratio of hard substance particle contact length to entire circumference of Bi phase of 50% or less is 70% or greater based on the total number of hard substance particles.

Abstract: Disclosed is a Cu—Fe—P alloy capable of enabling high strength, high electrical conductivity, and excellent softening resistance to coexist. The Cu—Fe—P alloy is suitable for use as a constituent material of a lead frame for a semiconductor device. With the Cu—Fe—P alloy with strength rendered higher by micronizing Fe-containing compounds, when enhancing softening resistance by increasing Sn content so as to exceed 0.5 mass %, at least one element selected from the group consisting of Ni, Mg, Ca, Al, Si, and Cr, in trace amounts, are caused to be additionally contained to thereby check cracking likely to occur at the time of forging and hot rolling in a process of producing the copper alloy, as a result of an increase in the Sn content.

Abstract: By exactly comprehending the true properties of the rare elements (such as Bi and Se) which are alternative components for Pb, the alloy is enabled to secure machinability equal to the bronze alloy (CAC406) generally used hitherto and acquire mechanical properties at least equal to the CAC406 as well in spite of a decrease in the content of the rare elements (such as Bi and Se) in the alloy. Further, it is possible to suppress the occurrence of casting defects by elucidating the unresolved influence of the decrease of the alternative components (such as Bi and Se) for Pb on the wholesomeness of a casting. Moreover, it is possible, by decreasing the rare elements, to produce a copper-based alloy containing rare elements at a low cost and to provide a cast ingot and a liquid-contacting part each using the alloy. The copper-based alloy, and the cast ingot and liquid-contacting part each using the alloy individually contain at least 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi and satisfying 0<Se?0.

Abstract: A Cu—Ni—Sn—P alloy is provided, which is excellent in stress relaxation property in a direction perpendicular to a rolling direction, and has any of high strength, high conductivity, and excellent bendability. A copper alloy contains 0.1 to 3.0% of Ni, 0.1 to 3.0% of Sn, and 0.01 to 0.3% of P in mass percent respectively, and includes copper and inevitable impurities as the remainder; wherein in a radial distribution function around a Ni atom according to a XAFS analysis method, a first peak position is within a range of 2.16 to 2.35 ?, the position indicating a distance between a Ni atom in Cu and an atom nearest to the Ni atom. Thus, distances to atoms around the Ni atom in Cu are comparatively increased, so that the stress relaxation property in a direction perpendicular to the rolling direction of the copper alloy is improved.

Abstract: Use of a low-alloyed, phosphorus-deoxidized copper alloy (DHP-Cu) for manufacturing hollow profile components by internal high-pressure forming, the copper alloy having the following composition: 0.030 to 0.080 wt-% of at least one element of a group including tin (Sn), Zinc (Zn), iron (Fe), silver (Ag) and at least 99.90 wt-% of (Cu) as well as unavoidable impurities as the remainder. Because of its cold work hardening properties, such a copper alloy is especially suitable for the manufacture of hollow profile components by internal high-pressure forming.

Abstract: Brass consists essentially of Cu, Sn, Bi, Fe, Ni and P in weight ratios respectively of 58.0-63.2%, 0.3-2.0%, 0.7-2.5%, 0.05-0.3%, 0.10-0.50% and 0.05-0.15% plus the balance of Zn and unavoidable impurities to exhibit excellent tolerance for dezincification, hot forgeability and machinability.

Abstract: The invention includes a sputtering target containing copper of a purity of at least about 99.999 wt. %, and at least one component selected from the group consisting of Ag, Sn, Te, In, B, Bi, Sb, and P dispersed within the copper. The total of Ag, Sn, Te, In, B, Bi, Sb, and P within the copper is from at least 0.3 ppm to about 10 ppm. The sputtering target has a substantially uniform grain size of less than or equal to about 50 micrometers throughout the copper and the at least one component.

Abstract: A lead-free copper alloy on the base of Cu—Zn—Sn and a method of manufacture. The copper alloy is built on the base of copper, zinc and tin without toxic additives and consists of: 60 to 70% Cu, 0.5 to 3.5% Sn and the further matrix-active elements: 0.01 to 0.5% Fe and/or Co, 0.01 to 0.5% Ni, 0.01 to 0.5% Mn and/or Si, the remainder Zn and unavoidable impurities. Selectively up to 3% Mg, up to 0.2% P and up to 0.5% Ag, Al, As, Sb, Ti, Zr can be added. The demands for a health-conscious and ecological compatibility are thus naturally met.

Abstract: A phosphorus-copper brazing material formed of a phosphorus-copper brazing alloy which can easily be cold-worked into a thin sheet, a brazing sheet having a brazing layer of the phosphorus-copper brazing alloy, and a flow path structure for heat exchangers constructed by brazing with the alloy, are such that the phosphorus-copper brazing material includes a phosphorus-copper brazing alloy containing Cu as a major component and phosphorus of not less than about 2.0 mass % to not more than about 3.2 mass %. The brazing sheet includes a metal sheet, and a brazing material layer that is integral with the metal sheet on at least one side of the metal sheet, the brazing material layer being formed of the phosphorus-copper brazing alloy. The metal sheet may be formed of copper or a copper alloy containing Cu as a major component.

Abstract: Use of a low-alloyed, phosphorus-deoxidized copper alloy (DHP—Cu) for manufacturing hollow profile components by internal high-pressure forming, the copper alloy having the following composition: 0.030 to 0.080 wt-% of at least one element of a group including tin (Sn), Zinc (Zn), iron (Fe), silver (Ag) and at least 99.90 wt-% of (Cu) as well as unavoidable impurities as the remainder. Because of its cold work hardening properties, such a copper alloy is especially suitable for the manufacture of hollow profile components by internal high-pressure forming.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from about 1.0 to about 15% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: Brass consists essentially of Cu, Sn, Bi, Fe, Ni and P in weight ratios respectively of 58.0-63.2%, 0.3-2.0%, 0.7-2.5%, 0.05-0.3%, 0.10-0.50% and 0.05-0.15% plus the balance of Zn and unavoidable impurities to exhibit excellent tolerance for dezincification, hot forgeability and machinability.

Abstract: A high copper alloy with good resistance to stress relaxation at temperatures of up to at least 150° C., consists, by weight, essentially of from 0.8% to 3% of iron, from 0.3% to 2% of nickel, from 0.6% to 1.4% of tin, from 0.005% to 0.35% phosphorous and the remainder copper and inevitable impurities. The alloy has an electrical conductivity in excess of 40% IACS and a yield strength of 70 ksi or higher at final gauge following a relief anneal. Over 75% of an imposed stress remains after exposure to 150° C. for 3000 hours. The combination of good electrical conductivity, high strength and high stress relaxation resistance makes the alloys particularly suitable for under the hood automotive electrical connectors.

Abstract: A solid phos-copper base brazing alloy component for forming a brazed joint with a raised shoulder and little to no black oxide. The brazing alloys of the present invention are visually distinguishable from copper and copper alloy parts and may provide a good color match for silver and silver alloys, including sterling silver. The solid brazing components of the present invention may be used in forming brazed joints at low brazing temperatures and result in a joint that is ductile, smooth and corrosion resistant. The solid brazing components are provided in the form of wire, strip, foil or a preform, and thus are advantageously used in a wide variety of brazing applications including copper tubing and intricate jewelry. The brazing components of the present invention are made of an alloy having a liquidus temperature above 840° F. and consist essentially of about 4-10% phosphorus, about 0.1-8% tin, up to about 4% antimony, about 0.

Abstract: A phosphorus-copper based brazing alloy comprising by weight: 4.0% to 8.0% phosphorus; about 0.1% to about 8% tin; 0% to about 2% antimony; and the balance copper.

Abstract: A phosphorus-copper based brazing alloy comprising by weight: 6.0% to 7.0% phosphorus; about 2% to about 8% tin; about 2% antimony; and the balance copper.

Abstract: An oxidation-resistant coating is described, formed of an alloy containing: about 40 to about 50 atom % aluminum and about 0.5 atom % to about 3 atom % tantalum; with a balance of nickel; cobalt, iron, or combinations thereof. The coating may also include chromium and a precious metal, as well as other components, such as zirconium or molybdenum. A method for applying the oxidation-resistant coating to a substrate is also described. The substrate can be formed of superalloy material, e.g., a turbine engine component. Related articles are also disclosed.

Abstract: An alpha brass (copper/zinc alloy with less than 39%, by weight, of zinc) stock alloy has controlled additions of nickel, tin and phosphorous. The combination of nickel and tin increase resistance of the alloy to elevated temperature stress relaxation. As a result, spring contacts formed from alloys of the invention maintain a higher percentage of initially imposed stress at elevated temperatures, in the range of 125° C. to 150° C., for significantly longer times than other brass alloys of comparable strength.

Abstract: A cutting-free bronze alloy which is substantially free of lead contains 1 to 13 wt. % of tin, not larger than 18 wt. % of zinc, 0.5 to 6 wt. % of bismuth, 0.05 to 3 wt. % of antimony, not larger than 1 wt. % of phosphorus, less than 0.4 wt. % of lead, and the balance being copper. The alloy may further contain 0.1 to 3 wt. % of nickel. When 3 to 8 wt. % of tin and 6 to 10 wt. % of zinc are present, the alloy is particularly suitable for use as a plumbing faucet and fixture. Likewise, when 8.5 to 13 wt. % of tin and not larger than 1 wt. % of zinc are present, the alloy is suitable for use as a sliding member.

Abstract: The present invention provides a copper-based alloy characterized by: having a composition of 58.0 to 63.0% by weight of Cu, 0.5 to 4.5% by weight of Pb, 0.05 to 0.25% by weight of P, 0.5 to 3.0% by weight of Sn, 0.05 to 0.30% by weight of Ni, and the balance of Zn and inevitable impurities; having a texture uniformly fragmented to acquire excellent corrosion resistance and hot working property; having undergone a given drawing work and heat treatment to acquire excellent mechanical properties including tensile strength, proof strength and elongation; and having internal stress thoroughly removed to excel in stress-corrosion cracking resistance.

Abstract: A phosphor bronze alloy which contains 0.4 to 3.0 weight % Ni, 0.1 to 1.0 weight % Si, 0.01 to 0.35 weight % P, 1.0 to 11.0 weight % Sn with remainder being substantially Cu.

Abstract: The present invention provides a copper-based alloy characterized by: having a composition of 58.0 to 63.0% by weight of Cu, 0.5 to 4.5% by weight of Pb, 0.05 to 0.25% by weight of P, 0.5 to 3.0% by weight of Sn, 0.05 to 0.30% by weight of Ni, and the balance of Zn and inevitable impurities; having a texture uniformly fragmented to acquire excellent corrosion resistance and hot working property; having undergone a given drawing work and heat treatment to be exalted in mechanical properties including tensile strength, proof strength and elongation; and having internal stress thoroughly removed to excel in stress-corrosion cracking resistance.

Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).

Abstract: A copper alloy which is adapted for use as terminals and connectors, which comprises from 0.1 wt % to less than 0.5 wt % of Ni, from larger than 1.0 wt % to less than 2.5 wt % of Sn, from larger than 1.0 wt % to 15 wt % of Zn, and further comprises from at least one element selected between from 0.0001 wt % to less than 0.05 wt % of P and from 0.0001 wt % to 0.005 wt % of Si, and the balance being Cu and inevitable impurities The alloy has an electrical conductivity of 90% or below relative to a maximum electrical conductivity of an annealed copper alloy and an area ratio of insoluble matters such as precipitates is 5% or below.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from about 1.0 to about 15% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: The copper-based sliding material has improved seizure resistance, even if it is free of Pb, and enables thinning of the overlay. The copper alloy provided consists of from 0.1 to 2% of Ag, from 1 to 10% of Sn, and the balance consisting of Cu and unavoidable impurities and, further said Ag and Sn do not essentially form the secondary phases but are in complete or essentially solid-solution state in the Cu matrix.

Abstract: A high-strength Cu based alloy, consists of:Ni: 0.5 to 2.0%;Sn: 1.2 to 2.5%;Si: 0.04 to 0.1%;Zn: 0.1 to 1%;Mg: 0.0001 to 0.02%;Mn: 0.0001 to 0.1%;P: 0.0001 to 0.02%; andCu and inevitable impurities: the balance,wherein the total content of Mg, Mn and P is 0.001 to 0.12%. The Cu based alloy is suitable for use as a material of electrical and electronic parts, and free from smutting during pretreatment for plating thereof.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 1.0 to 11.0% by weight, phosphorous in an amount from about 0.01 to 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: There is provided a phosphor bronze alloy having a grain structure that is refined by the addition of a controlled amount of iron. Direct chill cast alloys containing from 1.5% to 2.5%, by weight tin, from 1.65% to 2.65% iron, from 0.03% to 0.35% phosphorous and the remainder copper and inevitable impurities have an as-cast average crystalline grain size of less than 100 microns and are readily hot worked. When the iron content is too low, the average crystalline grain size increases and the alloy cracks during hot working. When the iron content is too high, iron stringers form, detrimentally impacting both the appearance and properties of a wrought strip.

Abstract: Copper base alloys consisting essentially of 1.0 to 4.0% tin, 0.01 to 0.20% phosphorous, 0.01 to 0.80% iron, 0.1 to 12.0% zinc and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix. The alloy is characterized by an excellent combination of physical properties. The process of the present invention includes homogenizing, rolling, process annealing and stress relief annealing.

Abstract: There is provided a tin brass alloy having a grain structure that is refined by the addition of controlled amounts of both zinc and iron. Direct chill cast alloys containing from 1% to 4%, by weight of tin, from 0.8% to 4% of iron, from an amount effective to enhance iron initiated grain refinement to 20% of zinc and the remainder copper and inevitable impurities are readily hot worked. The zinc addition further increases the strength of the alloy and improves the bend formability in the "good way", perpendicular to the longitudinal axis of a rolled strip.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 1.0 to 11.0% by weight, phosphorous in an amount from about 0.01 to 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: A copper-lead alloy bearing having a high corrosion resistance, especially a high corrosion resistance to sulfur, comprising a back metal and a copper-lead-based bearing alloy bonded thereto. The copper-lead-based bearing alloy consists of more than 10 but not more than 20% Ni, 0.5 to 8% Sn, 8 to 30% Pb, not less an 0.005 but not more than 0.2% P, and the balance of Cu and incidental impurities.

Abstract: Reduced-lead yellow brass alloys are disclosed. The alloys comprise copper; zinc; an amount of bismuth effective to enhance castability of the alloys; and an amount of selenium effective to increase machinability of the alloy. Preferably, the alloys further include an amount of antimony effective to inhibit dezincification of the alloys. In a particularly preferred embodiment, an alloy according to the present invention comprises zinc; copper in an amount ranging from about 62.5% to about 64.0% by weight; tin in an amount ranging from about 0.2% to about 0.4% by weight; iron in an amount ranging from about 0.1% to about 0.3% by weight; nickel in an amount ranging from about 0.15% to about 0.25% by weight; aluminum in an amount ranging from about 0.3% to about 0.6% by weight; bismuth in an amount ranging from about 0.8% to about 1.0% by weight; antimony in an amount ranging from about 0.02% to about 0.04% by weight; and selenium in an amount ranging from about 0.05% to about 0.25% by weight.

Abstract: There is provided a machinable .alpha.+.beta. brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100.degree. C.-350.degree. C. without a decrease in machinability due to phosphide formation. In preferred embodiments, the alloy further contains a tin addition for enhanced corrosion resistance. The combination of tin and phosphorous provides enhanced corrosion resistance to the alloy than could be predicted from either addition alone.

Abstract: A copper alloy for use in an electrical and electronic parts contains Fe of 1.8-2.0 weight %, P of 0.025-0.040 weight %, Zn of 1.7-1.9 weight %, Sn of 0.40-1.0 weight %, and Ca of 0.0001-0.01 weight %, the balance being Cu and inevitable impurities. Further the copper alloy may contain one kind or two kinds of the elements selected from the group of Cr of 0.001-0.01 weight % and Mg of 0.001-0.01 weight %, by 0.001-0.01 weight % at a total amount. This copper alloy for use in electrical and electronic parts can dissolve the prior problem that cracking is apt to occur on the ingot during heating on the hot working process or during hot working, and can prevent a short-circuit due to the migration phenomenon of copper which is apt to occur with the high density integration of the electrical and electronic parts made of copper alloy, and further can improve the tool service life (wear resistance) of the die and can decrease the producing cost thereof.

Abstract: A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, and from 3 to 10 wt. % of Sn and the remainder being Cu and unavoidable elements.

Abstract: A copper based alloy for use as a material for electrical and electronic parts has a chemical composition by weight, of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3 Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, 0.001 to 0.2% Mg, 0.0001 to 0.001% C, and if required, further containing 0.001 to 0.3% at least one element of Cr and Zr, and the balance being Cu and inevitable impurities. The obtained copper alloy is excellent in electric conductivity, solder-exfoliation resistance when bent, high-temperature creep strength, and migration resistance, while being superior in hot workability and blankability to the conventional copper based alloy.

Abstract: A hot working material of corrosion resistant copper-based alloy having a metal composition of 61.0 weight percent to less than 63.0 weight percent copper, 1.0 weight percent to 3.5 weight percent lead, 0.7 weight percent to 1.2 weight percent tin, 0.2 weight percent to 0.7 weight percent nickel, 0.03 weight percent to 0.4 weight percent iron, 0.02 weight percent to 0.10 weight percent antimony, and 0.04 weight percent to 0.15 weight percent phosphorus, with the balance composed of zinc and inevitable accompanying impurities. The alloy is subjected to hot working and subsequent heat treatment at 500.degree. C. to 600.degree. C. for 30 minutes to 3 hours and sufficient that the alloy has an .alpha. single-phase structure and addition elements are dispersed uniformly in the entire structure.

Abstract: Alloys for brazing used in heat exchangers, particularly in radiators. The alloys contain 14-31% by weight zinc, 0.1-15% by weight iron, 0.001-0.05% by weight phosphorus and 0-0.09% by weight arsenic, the balance being copper and incidental impurities.

Abstract: Lead-free copper-tin, low friction, castable bearing bronze alloy for industrial applications as bearing, bushing, and guide parts as well as threaded cast parts, with the following weight percentage range.Sn=3-9Bi=2.5-9P=0-0.3Zn=0-1Ni=0-2Pb=0-0.

Abstract: A copper base alloy for terminals that is of the Cu-Ni-Sn-P or Cu-Ni-Sn-P-Zn system and that has a tensile strength of at least 50 kgf/mm.sup.2, a spring limit of at least 40 kgf/mm.sup.2, a stress relaxation of not more than 10% and a conductivity of at least 30% IACS is provided. Terminals the spring portion or the entire part of which is produced from that copper base alloy, having an insertion/extraction force of 0.2-3 kgf and a resistance of not more than 3 m.OMEGA. at low voltage and current as initial performance, with the added characteristic that the terminals will experience not more than 20% stress relaxation are also provided. The alloy is superior to the conventional bronze, phosphor bronze and Cu-Sn-Fe-P alloys for terminals in terms of tensile strength, spring limits, stress relaxation characteristic and conductivity and, hence, the terminals manufactured from those alloys have higher performance and reliability than the terminals made of the conventional copper base alloys for terminals.

Abstract: The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphorus, tin and possibly small amounts of manganese. The alloys are produced by means of atomization methods. Their advantages are low liquidus temperature and narrow mushy zone, high joint strength and good corosion properties. The alloys are cadmium free and economical in price and they are mainly used for brazing copper and its alloys.

Abstract: An alloy consisting essentially of about 0.1 to 7% bismuth, up to about 16% tin, up to about 25% zinc, up to about 27% nickel, about 0.1 to 1% mischmetal and the balance copper and incidental impurities.

Abstract: Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue strength.

Abstract: The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphor, tin and possibly small amounts of manganese. The alloys are produced by means of rapid solidification. Their advantages are low liquidus temperature and narrow mushy zone. The alloys are mainly used for brazing copper and its alloys.

Abstract: Lead inclusion in copper-containing wrought alloys is coming into disfavor due to health and environmental considerations. Machinability, as well as retention of workability properties, associated with lead inclusion are assured by bismuth together with a modifying element, phosphorous, indium or tin, with such modifying element minimizes the workability-precluding embrittlement otherwise associated with bismuth. Fabrication of product dependent upon properties of the large variety of lead-containing alloys is so permitted by use of lead-free material.

Abstract: A laser padding material in accordance with the present invention comprises copper as its main component and at least one, as other contained elements, selected from the group consisting of 1-5 weight % of nickel (Ni), 0.2-5 weight % of silicon (Si), less than 1 weight % of boron (B), less than 2 weight % of phosphorus (P) and less than 3 weight % of manganese (Mn), whereby there can be easily formed at a high speed a padded layer which is high both in sliding friction resistance and in quality.In accordance with a laser padding method of the present invention, since material powder having such a composition as mentioned above is blown onto a metal base material and at the same time a laser beam is irradiated thereon in an inert gas atmosphere to thereby melt the material powder and form a padded layer, there can be easily formed at a high speed a padded layer which is high both in sliding friction resistance and in quality.

Abstract: The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphor, tin and possibly small amounts of manganese. The alloys are produced by means of rapid solidification. Their advantages are low liquidus temperature and narrow mushy zone. The alloys are mainly used for brazing copper and its alloys.