Abstract: There is disclosed a copper base alloy which contains specified additions of chromium, zirconium, cobalt and/or iron, and titanium as well as methods for the processing of the copper alloy. One method of processing results in a copper alloy having high strength and high electrical conductivity. A second method of processing results in a copper alloy with even higher strength and a minimal reduction in electrical conductivity.

Abstract: A Cu-based wear-resistant alloy of a sliding material consists essentially of, by weight, 10-35% Zn, 2-20% Pb, 1-10% Ni, 0.1-1% B and, as required, 0.5-10% of Sn. The alloy can be used under severe conditions of use at elevated speed and temperature with reduced risk of seizure and corrosion. The alloy can be produced by mixing Pb powder and Ni--B alloy powder with Cu--Zn powder or Cu--Zn--Sn alloy powder, or mixing Ni--B alloy powder with Cu--Zn--Pb alloy powder or Cu--Zn--Sn--Pb alloy powder. The alloy can be compacted and sintered to form a sliding member or a composite sliding member is obtained by sintering and integrating the alloy on a steel backing plate optionally having a surface plated with copper.

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract: This invention relates to a high performance copper alloy and its manufacturing methods for electrical and electronic parts which have good electrical conductivity, superior mechanical properties, and high thermal stability of tin-lead plating. The copper alloy consisting essentially of copper and from copper-nickel-silicon-phosphor-magnesium alloys for semiconductor leadframe alloys consisting essentially of copper and from 0.5 to 2.4% by weight nickel, from 0.1 to 0.5% by weight silicon, from 0.02 to 0.16% by weight phosphorus, and from 0.02 to 0.2% by weight magnesium.

Abstract: A slide bearing comprising a copper-nickel-tin alloy consisting essentially of______________________________________ 4-8% by wt nickel, 4-8% by wt tin, 0.005-1.0 by wt zinc, 0.005-0.5 by wt iron, 0.005-1.0 by wt lead, ______________________________________the remainder being copper and common impurities, the alloy having a multi-phase granular state with a preferred linear orientation and including:at least one of discontinuous gamma phase precipitations and continuous gamma phase precipitations, the precipitations being formed followed cold forming of the alloy by heat treatment at a temperature of 300.degree. to 450.degree. C. for 10 minutes to 50 hours so as to provide about 0.1 to about 30 volume % of the gamma phase in the alloy,up to 15 volume % of highly concentrated tin and nickel grain areas (GSnNi) characterized by the atomic formula Cu.sub.43 Ni.sub.17 Sn.sub.40,up to 15 volume % of highly concentrated tin and nickel grain areas (GSn) characterized by the atomic formula Cu.sub.80 Ni.sub.6 Sn.sub.

Abstract: Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue strength.

Abstract: An alloy, in particular for the manufacture of spectacle frames, and a spectacle wire or a spectacle frame and connecting wires for electronic component parts manufactured using the alloy of the invention. In order to obtain good mechanical characteristics, for example, of the spectacle frame at low expense, the invention provides the following alloy which, in percentage by weight, is composed as follows: 63-78% copper, 3-7% nickel, 1-3% iron, 0.01-0.20% phosphorus, the remainder being zinc.

Abstract: A copper alloy for an electronic device comprises 2.0 wt% -8 wt% of Ni, 0.1 wt% -0.8 wt% of P, 0.06 wt% -1 wt% of Si and the rest being Cu and unavoidable impurities.The rest may include 0.03 wt% -2.0 wt% of Zn. The copper allow has an oxygen content of 20 ppm or less.

Abstract: Lead-free copper-nickel corrosion resistant, low friction, castable alloy, particularly for food processing machine parts, with the following weight percent rangeNi=15-45Zn=2-6Tin=2-7Bi=1-6Fe=0-3Mn=0-3Cu=balanceand food processing machine parts made therefrom.

Abstract: The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphor, tin and possibly small amounts of manganese. The alloys are produced by means of rapid solidification. Their advantages are low liquidus temperature and narrow mushy zone. The alloys are mainly used for brazing copper and its alloys.

Abstract: A laser padding material in accordance with the present invention comprises copper as its main component and at least one, as other contained elements, selected from the group consisting of 1-5 weight % of nickel (Ni), 0.2-5 weight % of silicon (Si), less than 1 weight % of boron (B), less than 2 weight % of phosphorus (P) and less than 3 weight % of manganese (Mn), whereby there can be easily formed at a high speed a padded layer which is high both in sliding friction resistance and in quality.In accordance with a laser padding method of the present invention, since material powder having such a composition as mentioned above is blown onto a metal base material and at the same time a laser beam is irradiated thereon in an inert gas atmosphere to thereby melt the material powder and form a padded layer, there can be easily formed at a high speed a padded layer which is high both in sliding friction resistance and in quality.

Abstract: An improved method for producing a copper alloy, wherein a molten metal consisting essentially of 1.0 to 8% by weight of Ni, 0.1 to 0.8% by weight of P, 0.06 to 1.0% by weight of Si, and a remainder of Cu and unavoidable impurities (or a molten metal consisting essentially of 1.0 to 8% by weight of Ni, 0.1 to 0.8% by weight of P, 0.06 to 1.0% by weight of Si, 0.03 to 0.5% by weight of Zn, and a remainder of Cu and unavoidable impurities) is quenched to solidify, at a cooling rate in the range from 10.sup.2 .degree. C./sec. to 10.sup.5 .degree. C./sec., and continuously cooling in succession said solidified metal to a normal temperature, to cause an intermetallic compound of Ni-P and Ni-Si to be finely and uniformly dispersed into the matrix material.

Abstract: An electrical resistance heater is provided which utilizes a copper-nickel alloy heating cable. This metallurgy heating cable is significantly less prone to failure due to localized overheating because the alloy has a low temperature coefficient of resistance. Used as a well heater, the heating cable permits heating of long segments of subterranean earth formation with a power supply of 400 to 1200 volts.

Abstract: The present invention provides an improved casting alloy for use in costume jewelry and jewelry samples. In accordance with the present invention, a gold colored metal alloy is disclosed which is tarnish resistant and consists of the following ingredients such as, 75 to 85% copper, 5 to 15% nickel, 0 to 12% indium, and 0 to 12% zinc. It is also desirable to add approximately 0.01% iron and/or 0.05% silicon to act as a grain refiner and fluidity enhancer respectively. The alloy in accordance with the subject invention is a rich gold color which approximates a fourteen carat alloy. In addition, tarnish resistance and workability is greatly increased.

Abstract: Disclosed herein is a wear-resistance aluminum bronze alloy comprising 4 to 15 wt % of Al, 0.1 to 10 wt % of Cr and the balance Cu, and optionally containing not more than 6 wt % of Ni and not more than 15 wt % of Mn.

Abstract: Sockets for receiving metal lamp bases of electric lamps which contain metal parts fabricated from certain relatively high copper and low zinc content copper alloys are resistant to corrosion and to corrosion cracking in corrosive environments.

Abstract: A copper alloy for an electronic device comprises 1.0 wt %-4.0 wt % of Ni, more than 0.2 wt % and less than 0.8 wt % of P, 0.5 wt %-6.0 wt % of Zn and the rest being copper and unavoidable impurities. The rest may include 0.05 wt %-1.0 wt % of Mg.A wire of the above-mentioned copper alloy is prepared by heating the copper alloy having the composition described above at temperature of 750.degree. C.-950.degree. C. for more than one minute before the final rolling operation, and then, heating the material at a temperature of 350.degree. C.-500.degree. C., or slowly cooling it at a rate of 4.degree. C./min. or less, or cooling it at a rate of 1.degree. C./min. or more until temperature reaches 500.degree. C. and keeping its temperature for at least one hour in a temperature range of 500.degree. C.-350.degree. C.

Abstract: Metal lamp bases for electric lamps fabricated from certain relatively high copper and low zinc content copper alloys and lamps employing same are resistant to cracking in corrosive environments.

Abstract: Disclosed is a corrosion-resistant copper alloy having a composition consisting essentially, by weight, of 5 to 9% of Al, 0.5 to 4% of Ni, 0.5 to 4% of Fe, 0.1 to 3% of Mn, 0.001 to 1% of Ti, at least one selected from 0.001 to 1% of Co and 0.001 to 0.1% of B, and the balance Cu and unavoidable impurities, and a substantially single-phase structure consisting essentially of .alpha.-phase. This alloy has excellent weather resistance whereby its beautiful color tone close to gold is able to last for a long time, and further has superior corrosion resistance, particularly, high resistance to corrosion by seawater, together with high strength and excellent cold formability.

Abstract: A corrosion-resistant copper-based alloy contains 0.1-5 percent by weight of nickel; 0.01-1.5 percent by weight total of titanium and niobium; 0.2-5 percent by weight total of iron and chromium; 0.01-0.25 percent by weight total of germanium and gallium; and up to 0.01 percent by weight each of the trace elements phosphorus, silicon and manganese. The alloying elements passivate and cathodically protect the copper while the trace elements function as stabilizers. The alloy may be used for the facades of buildings, for roofs, for the gutters of buildings and for applications involving flowing corrosive media.

Abstract: A copper alloy is disclosed, which contains 0.1 to 3.0 wt % of Ni, 0.1 to 1.0 wt % of Ti, the ratio of Ni to Ti being 4.ltoreq.Ni/Ti thereby, 0.1 to 6.0 wt % of Sn, and 0.005 to 3.0 wt % in total of one or more elements selected from the group consisting of Zn, Mn, Mg, Ca, RE, B, Sb, Te, Si, Co, Fe, Zr, Ag, Mm and Al, and consists of the remainder of Cu and the inevitable impurities. The method for the manufacture of the alloy is characterized in that, after copper alloy ingot was maintained and homogenized for 0.5 to 15 hours at 750.degree. to 960.degree. C. prior to rolling, the hot rolling is carried out starting from a temperature of 700.degree. to 880.degree. C. and the cooling is made immediately after the end of rolling.

Abstract: A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4. This copper-base alloy has high mechanical strength of about 50 kgf/mm.sup.2 or more and electric conductivity of 30% IACS or more as well as good solderability and solder durability. Thus, it may be used as a highly reliable material for leadframes of semiconductor devices.

Abstract: Reactive metal-precious metal ductile alloys containing controlled amounts of Cu and Ni and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: In construction of a clad material for ornamental use such as eyeglass frames and watch bands, use of age-hardenable alloy sheath followed by age-hardening enables production of product with light weight, high mechanical strength, excellent workability and good fit to brazing and plating.

Abstract: Brazing alloys of copper-indium-titanium alloy can be used to braze ceramic to metal. Other elements such as gold, manganese, palladium, nickel, aluminum, tin singly or in combination can also be added.

Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: The invention contemplates a thermomechanical process applicable to beryllium copper alloys consisting essentially of about 0.2 wt % to about 0.7 wt % beryllium; from about 1.0 wt % to about 3.5 wt % nickel and cobalt in the aggregate, where nickel comprises at least about 1.0 wt %; up to about 1.0 wt % zirconium; up to about 0.005 wt % lead; up to about 0.1 wt % magnesium; up to about 1.5 wt % silver; up to about 0.5 wt % incidental impurities including lead; and the balance essentially copper; which process comprises solution annealing said alloy at a temperature of at least about 90% of the incipient melting point of the alloy expressed in degrees Fahrenheit, cold working the solution treated alloy to reduce the section thickness thereof at least about 60% or much more, and then aging the alloy to produce therein an improved combination of properties including strength, ductility, formability and conductivity.

Abstract: A copper-base alloy for leadframes comprising 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, and balance Cu and inevitable impurities, the ratio of Ni to Ti being 1-4. It may also comprise 0.1-2.0 weight % of Zn. It may further comprise 0.01-2.0 weight % of at least one of Fe and Co and 0.005-0.5 weight % of at least one element selected from the group consisting of Al, Si, Mn and Mg. The copper-base alloy has good electric conductivity and high mechanical strength. It further has good solderability and solder durability.

Abstract: Malleability and resistance to cracking of alloys containing nickel, copper, sulfur, etc. are enhanced through the co-presence of cerium and magnesium.

Abstract: Reactive metal-precious metal ductile alloys containing controlled amounts of Cu and Ni and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: Reactive metal-precious metal ductile alloys containing controlled amounts of Cu and Ni and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: This invention is directed to the treatment of copper beryllium alloys, and to articles and parts made therefrom, containing special small amounts of beryllium and nickel, e.g., about 0.05% to about 0.5% beryllium and about 0.05% to about 1% nickel where cobalt may be substituted for up to about one-half of said nickel content at a substitution ratio of about 1 part by weight cobalt for about 2 parts by weight nickel, which imparts to these alloys a superior combination of stress relaxation resistance, formability, ductility, conductivity and strength by the process of solution annealing, cold working at least about 50% or at least about 70% or 90% or more and age hardening.

Abstract: A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide improved bead formability at some sacrifice in strength. The alloy in the stabilized condition shows surprising improvement in stress relaxation resistance. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.

Abstract: A lead material for semiconductor devices comprising from 0.4 to 4.0 wt % of Ni, from 0.1 to 1.0 wt % of Si, from 0.05 to 1.0 wt % of Zn, from 0.01 to 1.0 wt % of Mn, from 0.001 to less than 0.01 wt % of Mg, from 0.001 to less than 0.01 wt % of Cr, up to 0.003 wt % of S, and the balance of Cu and inevitable impurities. The material may further comprise up to 5 ppm of hydrogen and up to 5 ppm of oxygen.

Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: Reactive metal-palladium-copper-nickel alloys are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: A copper based low melting point metal alloy composition consists essentially of about 5 to 52 atom percent nickel, about 2 to 10 atom percent tin, about 10 to 15 atom percent phosphorus and the balance essentially copper and incidental impurities. The composition is such that the total of copper, nickel and tin ranges from about 85 to 90 atom percent.

Abstract: This invention provides an economic copper-nickel alloy having high strength and high conductivity for lead conductor materials and/or lead frames for transistors, integrated circuits, and the like. The copper alloy comprises a composite of copper and inexpensive elements comprising 3.0% by weight nickel; from 0.01 to 1.0% by weight silicon; and from 0.01 to 0.1% by weight phosphorus. In one preferred embodiment a specific weight % of iron is also added. Still further, an improved method is provided for fabricating the alloy according to a specific series and sequence of steps, including steps at specific conditions and for specific times, for providing precipitation hardening. Other advantageous properties comprise desirable elongation.

Abstract: A copper based low melting point metal alloy composition consists essentially of about 10 to 52 atom percent nickel, about 2 to 10 atom percent tin, about 10 to 15 atom percent phosphorus and the balance essentially copper and incidental impurities. The composition is such that the total of copper, nickel and tin ranges from about 85 to 90 atom percent.

Abstract: A copper based low melting point metal alloy composition consists essentially of about 2.5 to 11 atom percent tin, about 0 to 12 atom percent nickel and about 11 to 15 atom percent boron, the balance being essentially copper and incidental impurities. The composition is such that the total of copper and tin ranges from about 85 to 89 atom percent.

Abstract: A Cu-Ag alloy brazing filler material with low Ag content that exhibits excellent brazability and has a low vapor pressure is disclosed. The filler material comprises 5 to 35% by weight of Ag, 2.5 to 13% by weight of Si, with the balance being Cu and incidental impurities. The properties of the filler material can be improved further by addition of at least one element selected from the group consisting of Sn, In, Fe, Ni, Co, B and Li.

Abstract: An alloy containing Mn in an amount of from 5 to 30 weight percent, at least one member selected from the group consisting of Sn of an amount of not more than 5 weight percent, Al of an amount of not more than 8.5 weight percent, Zn of an amount of not more than 7 weight percent, Fe of an amount of not more than 2.5 weight percent, and Ni of an amount of not more than 2.5 weight percent, and the balance to make up 100 weight percent of Cu plus normally entrained impurities produces a metallic material proof against the attachment thereto of marine organisms when the alloy fulfils a requirement that it should possess an .alpha.(face-centered cubic lattice) single-phase structure.

Abstract: Copper alloys are disclosed which contain nickel and tin and Fe, Zn, Mn, Zr, Nb, Cr, Al, or Mg in amounts within specified limits. When cold worked and aged according to a critical schedule these alloys develop a predominantly spinodal structure which renders them strong as well as ductile. The disclosed alloys are useful, for example, in the manufacture of components of electrical apparatus such as springs, connectors and relay elements.