Copper Containing Patents (Class 420/560)
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Patent number: 6086687Abstract: A lead-free tin alloy for solder joints comprising up to 0.25% by weight of indium and a grain refiner which is an alloy consisting of, by weight, 2.5 to 10% aluminium, 1 to 5% magnesium and balance zinc. The alloys have improved mechanical properties, such as creep strength, and an improved thermal fatigue strength.Type: GrantFiled: January 28, 1998Date of Patent: July 11, 2000Assignee: Alpha Fry, LimitedInventors: Martinus Adrianus Oud, Roger Bilham
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Patent number: 6077477Abstract: A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy for joining electronic parts comprising Sn, Ag, Bi, Cu and In as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 81 to 91 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.Type: GrantFiled: February 5, 1998Date of Patent: June 20, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yoshinori Sakai, Kenichiro Suetsugu, Atsushi Yamaguchi
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Patent number: 6071359Abstract: Tin and zinc based shot for use as ammunition having a diameter of from 1.5 to 5.5 mm, containing, by weight, in addition to tin and the usual unavoidable contaminants, from 12 to 60% of zinc and from 0 to 5% of aluminum, but less than 0.1% of copper, less than 0.1% of iron, and less than 1% of lead.Type: GrantFiled: October 24, 1997Date of Patent: June 6, 2000Assignee: Grillo-Werke AGInventors: Jurgen Wisniewski, Jochen Spriestersbach
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Patent number: 5985212Abstract: Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.01 and 9.5 weight percent Cu, between about 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.5 and 6.5 weight percent Ag, between 0.5 and 8.0 weight percent Bi, and optionally including one or more of the following elements: between 0.1 and 10.0 weight percent In, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.1 and 0.8 weight percent Ag, between 0.Type: GrantFiled: December 12, 1996Date of Patent: November 16, 1999Assignee: H-Technologies Group, IncorporatedInventors: Jennie S. Hwang, Holger J. Koenigsmann
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Patent number: 5938862Abstract: A lead-free solder alloy suitable for forming solder joints of a surface-mount integrated circuit device, such as a flip chip. The solder alloy has a sufficiently low liquidus temperature to achieve desirable reflow properties at temperatures of 240.degree. C. and less, and is therefore compatible with integrated circuit processes. The solder alloy has a sufficiently high solidus temperature to ensure that solder joints formed with the alloy exhibit suitable mechanical properties at application temperatures up to 150.degree. C. when mounting a component to a laminate substrate. The solder alloy generally contains, in weight percent, about 7 to about 11% indium, about 2.5 to about 3.5% silver, and about 0.5 to about 1.5% copper, the balance tin and incidental impurities.Type: GrantFiled: April 3, 1998Date of Patent: August 17, 1999Assignee: Delco Electronics CorporationInventors: Shing Yeh, Curtis Wayne Melcher, Bradley Howard Carter
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Patent number: 5874043Abstract: A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.Type: GrantFiled: December 17, 1996Date of Patent: February 23, 1999Assignee: International Business Machines CorporationInventors: Amit Kumar Sarkhel, Charles G. Woychik
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Patent number: 5863493Abstract: Electrical solder compositions (by weight percent) having between 91.5-96.5% Sn; 2-5% Ag; 0.1-3% Ni; and 0-2.9% Cu; and having a melting temperature 220.degree. C. or less. The solder compositions have microstructure with uniformly dispersed fine grains of Sn--Ni, Sn--Cu and Sn--Cu--Ni intermetallic phases that provide resistance to grain growth during thermal cycling.Type: GrantFiled: December 16, 1996Date of Patent: January 26, 1999Assignee: Ford Motor CompanyInventors: Achyuta Achari, Mohan R. Paruchuri, Dongkai Shangguan
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Patent number: 5837191Abstract: A lead-free solder pursuant to the invention consists essentially of, in weight %, about 0.75% to about 2% antimony, about 0.05% to about 0.6% copper, about 0.05% to about 0.6% silver, about 0.05% to about 0.6% nickel and balance essentially tin. An even more preferred solder consists essentially of, in weight %, about 0.8% to about 1.8% antimony, about 0.05% to about 0.15% copper, about 0.05% to about 0.15% silver, about 0.05% to about 0.15% nickel and balance essentially tin.Type: GrantFiled: October 22, 1996Date of Patent: November 17, 1998Assignee: Johnson Manufacturing CompanyInventor: Alan E. Gickler
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Patent number: 5817194Abstract: A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag is 35 wt. % or less. This tin base soldering/brazing material is used as a tin base low melting point brazing material. Further, this tin base soldering/brazing material is used as a tin base lead-free solder wire having a diameter less than 100 .mu.m and pulling strength of the wire higher than a lead-tin solder wire, and a tin base lead-free solder ball having a diameter less than 1,000 .mu.m and a hardness higher than a tin base lead-free solder ball.Type: GrantFiled: January 6, 1997Date of Patent: October 6, 1998Assignee: Fukuda Metal Foil & Powder Co., Ltd.Inventors: Shozo Nagai, Kensuke Hidaka, Kanichi Tanaka, Yoshinobu Yagita, Osamu Kajita
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Patent number: 5718868Abstract: Described is a lead-free tin-zinc-based soldering alloy made up of 7 to 9 wt. % of Zn and 0.1 to 0.5 wt. % of Cu or which further contains not more than 3 wt. % of Bi and, in either case, the balance being Sn except for inevitable impurities. The present invention has made it possible to provide a lead-free soldering alloy which has mechanical properties, such as tensile strength and elongation, comparable with those of conventional Pb--Sn soldering alloys without adding thereto lead which causes environmental pollution, has a melting point not higher than 200.degree. C., which is lower than the heat-resistant temperature of an IC package, and has a low cost.Type: GrantFiled: July 30, 1996Date of Patent: February 17, 1998Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Ryuji Ninomiya, Junichi Matsunaga
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Patent number: 5653856Abstract: Methods of solder bonding sputter targets to backing plate members and solder bonded target/backing plate assemblies are disclosed wherein a gallium containing solder paste is used to bond adjoining target and backing plate surfaces. This paste comprises a gallium or gallium alloy liquid component and a finely divided solid solution component comprising at least one metal from groups IB, VIII, and IVB of the periodic chart and at least one metal from groups IVA, IIIA and VA of the periodic chart. The solder paste is applied to the surfaces to be soldered and is allowed to solidify. A durable solder bond is formed that is capable of withstanding high temperatures on the order of about 500.degree. C. without failure.Type: GrantFiled: July 19, 1996Date of Patent: August 5, 1997Assignee: Tosoh SMD, Inc.Inventors: Eugene Y. Ivanov, Tatyana F. Grigoriva, Vladimir V. Boldyrev
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Patent number: 5538686Abstract: Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183.degree. C..+-.10.degree. C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The novel compositions also can possess superior mechanical properties, compared to the 40/60 Pb-Sn composition, and readily wets copper. Bi and/or Sb may be added to the Sn-In-Zn base to reduce the tendency for the formation of lower temperature phases.Type: GrantFiled: June 27, 1994Date of Patent: July 23, 1996Assignee: AT&T Corp.Inventors: Ho S. Chen, Sungho Jin, Mark T. McCormack
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Patent number: 5527628Abstract: A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).Type: GrantFiled: February 24, 1995Date of Patent: June 18, 1996Assignees: Iowa State University Research Foudation, Inc., Sandia CorporationInventors: Iver E. Anderson, Frederick G. Yost, John F. Smith, Chad M. Miller, Robert L. Terpstra
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Patent number: 5523006Abstract: An ultrafine particle copper, tin, nickel, zinc lubricant with a surface area of from 5 to 70 m.sup.2 /g and a particle size of from about 0.01 to about 0.5 .mu.m. The powder dispersed in a carrier to form a dispersion stabilized by Brownian movement.Type: GrantFiled: January 17, 1995Date of Patent: June 4, 1996Assignee: Synmatix CorporationInventor: Emil E. Strumban
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Patent number: 5520752Abstract: A solder composition and method of soldering using composite solders comprising a solder alloy and intermetallic filler particles. The intermetallic filler particles are lead-free, have high strength, wet and disperse well in solder joints, remain uniformly distributed and resist degradation on long-term aging. When added to commercial bulk or paste solders, the intermetallic particles reduce the lead content of solder joints by consuming volume in lead-tin solder, and improve the mechanical properties of the solder by inhibiting localized shear deformation and interfering with crack growth.Type: GrantFiled: June 20, 1994Date of Patent: May 28, 1996Assignee: The United States of America as represented by the Secretary of the ArmyInventors: George K. Lucey, Jr., James A. Wasynczuk, Roger B. Clough, Jennie S. Hwang
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Patent number: 5500183Abstract: The invention relates to a bullet based on an Sn alloy, wherein the Sn alloy comprises Cu, Sb, Bi and/or Zn as an alloying element, wherein the Sn alloy preferably contains 0.2-10% by weight Cu, preferably 0.2-6% by weight Cu, or 0.2-10% by weight Cu and 0.5-20% by weight Sb, preferably 0.2-5% by weight Cu and 0.5-10% by weight Sb, or 1-15% by weight Sb, preferably 1-10% by weight Sb, or 0.5-30% by weight Bi, preferably 5-20% by weight Bi, or 0.005-10% by weight Zn, preferably 0.01-1% by weight Zn. The invention further relates to the use of an Sn alloy for manufacturing a bullet.Type: GrantFiled: November 23, 1994Date of Patent: March 19, 1996Assignee: Billiton Witmetaal B.V.Inventors: Jan Noordegraaf, Martinus A. Oud, Harry Behm, Roelof de Rooy
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Patent number: 5435968Abstract: An enhanced bonding design utilizing tin and copper to create tin alloy solders for use in the manufacturing of heat exchangers and other soldering applications. The tin alloy solders contain as primary constituent metals 3.0-15.0 wt. % copper and 79.0-97.0 wt. % tin, and containing as optional constituent metals 0.0-4.0 wt. % silver, 0.0-1.0 wt. % selenium and 0.0-1.0 wt. % bismuth. These solder alloys have lower toxicity levels and better corrosion resistance than the lead based alloy solders commonly employed. Also, because the application temperature range for these solder alloys is below the temperature where dezincification of copper/zinc base metal alloys occurs, joints on copper/zinc base metals subjected to cyclic loads are stronger when constructed using these tin alloy solders than when constructed of lead based alloy solders.Type: GrantFiled: January 21, 1994Date of Patent: July 25, 1995Assignee: Touchstone, Inc.Inventor: Robert E. Panthofer
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Patent number: 5410184Abstract: A microelectronic package comprises an integrated circuit component mounted on a substrate by solder bump interconnections formed of a lead-free, tin-base solder alloy that contains a significant copper addition. A preferred solder is composed of a tin alloy containing between about 2 and 8 weight percent copper, preferably between about 3 and 5 weight percent. In the absence of lead, it is found that precipitation of copper-containing intermetallics of the type that adversely affect tin-lead solders is reduced. Moreover, the lead-free copper-tin solder alloy exhibits a high surface tension to reduce collapse of component toward the substrate during solder reflow.Type: GrantFiled: October 4, 1993Date of Patent: April 25, 1995Assignee: MotorolaInventors: Cynthia Melton, Theresa L. Baker
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Patent number: 5405577Abstract: A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 90.3-99.2% tin, 0.5-3.5% silver, 0.1-2.8% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-216.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.Type: GrantFiled: April 11, 1994Date of Patent: April 11, 1995Inventors: Karl F. Seelig, Donald G. Lockard
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Patent number: 5352407Abstract: A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 93-98% tin, 1.5-3.5% silver, 0.2-2.0% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-215.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.Type: GrantFiled: April 29, 1993Date of Patent: October 4, 1994Inventors: Karl F. Seelig, Donald G. Lockard
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Patent number: 5102748Abstract: Non-leased solders formed of tin, copper and selenium or tellurium. Such solders display lower melting points than other non-leaded solders, and their narrow pasty range allows them to set up easily in the field. Such solders also display superior tensile strength, shear strength and hardness properties, and are less expensive to produce than conventional non-leaded solders which contain tin/copper/silver formulations or formulations of four or more elements.Type: GrantFiled: September 19, 1991Date of Patent: April 7, 1992Assignee: Taracorp, Inc.Inventors: Thomas E. Wylam, Thomas K. Leonard, Roy O. Newman
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Patent number: 5094813Abstract: A low temperature, non-toxic soldering alloy of the following composition by weight:2.80 to 3.50% copper0.20 to 0.50% zinc0.08 to 0.16% nickel0.08 to 0.16% silver95.68 to 96.84% tin.Type: GrantFiled: October 1, 1990Date of Patent: March 10, 1992Inventor: Sadashiv S. Kale
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Patent number: 5094700Abstract: A solder or brazing alloy having improved properties by reason of the presence of at least one uniformly dispersed non-acicular and non-dendritic intermetallic phase having a particle size of about 1 to 25 microns. A method of preparing the alloy comprises melting the alloy at a temperature sufficient to melt the intermetallic phase or phases, cooling to a semi-solid state, subjecting the semi-solid alloy to vigorous shearing and/or vibration at the solid-liquid interface, and solidifying the alloy.Type: GrantFiled: March 22, 1990Date of Patent: March 10, 1992Assignee: University of CincinnatiInventor: Jainagesh A. Sekhar
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Patent number: 5039479Abstract: A silver alloy composition exhibiting the desirable properties of reduced fire scale, reduced porosity, reduced grain size and reduced oxide formation when heated, consists essentially of the following parts by weight: about 89-93.5% silver, about 0.02-2% silicon, about 0.001-2% boron, about 0.5-5% zinc, about 0.5-6% copper, about 0.25-6% tin, and about 0.01-1.25% indium. A master alloy composition adapted to be alloyed with silver, consisting essentially of the following parts by weight: about 5-35% zinc, about 5-80% tin, about 5-35% copper, about 0.05-14% silicon, about 0.01-1.25% indium, and about 0.05-17% boron.Type: GrantFiled: September 5, 1990Date of Patent: August 13, 1991Assignee: United Precious Metal Refining Co., Inc.Inventors: Melvin Bernhard, James T. Sivertsen
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Patent number: 5011658Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.Type: GrantFiled: May 31, 1989Date of Patent: April 30, 1991Assignee: International Business Machines CorporationInventor: Daniel S. Niedrich
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Patent number: 4778733Abstract: An article of manufacture, such as is used in plumbing, is formed by soldering copper workpieces together with a lead-free solder having a tin content of from about 92 to 99%, a copper content of from about 0.7 to 6% and a silver content of from about 0.05-3%, by weight.Type: GrantFiled: July 3, 1986Date of Patent: October 18, 1988Assignee: Engelhard CorporationInventors: Alfonso T. Lubrano, Thomas S. Bannos, Malcolm Warren, Robert A. Dorvel
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Patent number: 4758407Abstract: A lead free, cadmium free tin and tin/antimony based solder alloy having a wide melting range for joining copper tubes and brass pipe and fittings. The non-toxic tin based solder composition has a range of 92.5-96.9% tin, 3.0-5.0% copper, 0.1-2.0% nickel and 0.0-5.0% silver. The non-toxic tin/antimony based solder composition has a range of 87.0-92.9% tin, 4.0-6.0% antimony, 3.0-5.0% copper, 0.0-2.0% nickel and 0.0-0.5% silver and is especially suited for plumbing applications having tight loose fitting solder joints which are exposed to potable water.Type: GrantFiled: June 29, 1987Date of Patent: July 19, 1988Assignee: J.W. Harris CompanyInventors: Richard E. Ballentine, Joseph W. Harris
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Patent number: 4695428Abstract: A low temperature, lead-free, cadmium-free solder for joining metals, primarily copper tube or brass pipe and fittings. The solder composition, being free of lead and other known toxic metals, has a composition range of 0.5-4.0% antimony, 0.5-4.0% zinc, 0.1-3.0% silver, 0.1-2.0% copper and 86.8-98.8% tin, is especially adaptable for plumbing applications where solder joints are exposed to potable water.Type: GrantFiled: August 21, 1986Date of Patent: September 22, 1987Assignee: J. W. Harris CompanyInventors: Richard E. Ballentine, Robert M. Henson
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Patent number: 4643875Abstract: An alloy for brazing ceramic to a ceramic or a metal consists essentially of 35 to 95% tin, 0.5 to 70% silver, 0.5 to 20% copper, 0.1 to 4% titanium and/or vanadium and/or zirconium, 0 to 5% nickel, 0 to 2% chromium, all percentages by weight.Type: GrantFiled: July 24, 1985Date of Patent: February 17, 1987Assignee: GTE Products CorporationInventor: Howard Mizuhara
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Patent number: 4540437Abstract: A tin alloy powder containing up to 5% P is disclosed. Reduced sensitivity to sintering conditions is achieved by use of present alloy powder in production of sintered bronze articles. Means for controlling the growth of the article during sintering are also disclosed.Type: GrantFiled: September 25, 1984Date of Patent: September 10, 1985Assignee: Alcan Aluminum CorporationInventor: Krishnakant B. Patel
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Patent number: 4453977Abstract: Conventional or non-conventional dental amalgam alloys in the form of lathe-cut, spherical shaped or irregular shaped particles of silver, tin, copper and zinc are improved by adding to the alloys at least one compound selected from Cu.sub.6 Sn.sub.5, Cu.sub.3 Sn or a mixture thereof. The resulting dental alloy mixture is low in silver, is corrosion resistant, and is used as a filling for dental cavities after amalgamation with mercury.Type: GrantFiled: June 15, 1982Date of Patent: June 12, 1984Assignee: Pennwalt CorporationInventors: Charles F. Burns, Edward J. Pilcicki
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Patent number: 4374904Abstract: In the preferred embodiment, a method is presented for filling depressions in fabricated steel surfaces by applying a metallic body solder consisting of 15 to 20 weight percent copper, 2 to 3 weight percent zinc and the balance tin. The body solder alloy is heated to a temperature above about 210.degree. C. to form a workable thixotropic paste that is applied with spreading onto the steel surface. Upon cooling, the body solder forms a dense, tightly adherent fill that is grindable and paintable in conjunction with the surrounding steel surface.Type: GrantFiled: April 14, 1982Date of Patent: February 22, 1983Assignee: General Motors CorporationInventor: Douglas J. Harvey