Opposed Registering Coacting Female Molds Patents (Class 425/116)
  • Patent number: 10531677
    Abstract: The present disclosure relates to an ice cream machine having a filling zone and an emptying zone. The ice cream machine may include a rotatable unit, a mould for receiving ice cream, a stick providing arrangement, and a guiding structure arranged to prevent more than one stick from entering the groove of the mould from the stick providing arrangement. The stick providing arrangement is arranged such that a rotation of the rotatable unit causes the groove to match the position of the stick providing arrangement and thereby allow a single stick to enter the groove, wherein further rotation of the rotatable unit causes one of the sidewalls of the groove to bring the stick along the rotational movement of the rotatable unit.
    Type: Grant
    Filed: May 29, 2017
    Date of Patent: January 14, 2020
    Assignee: TETRA LAVAL HOLDINGS & FINANCE S.A.
    Inventors: Ole Bendixen, Tommy Bonde
  • Patent number: 10535694
    Abstract: Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments, one or more trench structures are formed according to partial substrate etching, such that respective trench structures are formed into a region of a substrate. In some embodiments, one or more trench structures are formed according to discontinued substrate etching, such that respective trench structures comprise one or more trench portions separated by separation regions of the substrate. The support structure mitigates stress energy from reaching the integrated circuitry, and facilitates process-induced charge release from the integrated circuitry.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Volume Chien, Yun-Wei Cheng, I-I Cheng, Shiu-Ko JangJian, Chi-Cherng Jeng, Chih-Mu Huang
  • Patent number: 10507519
    Abstract: Devices and methods are disclosed for the centrifugal casting of spheres, particularly hollow spheres containing low air pressure. Molten or self-hardening casting material is introduced into a hollow spherical mold and the mold made to rotate about two axes intersecting at the center of the mold. The resulting centrifugal forces cause the casting material to be evenly distributed about the inner surface of the mold. The casting material is hardened and the resulting sphere is removed from the mold. One or more valves may be employed to transport fluent materials into and out of the mold. If gas is removed from a partially-filled mold prior to casting, the product will be a hollow sphere having an interior pressure less than ambient. Spheres made according to the present invention have a wide range of uses including insulation and bearing balls.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: December 17, 2019
    Inventor: Jean-Paul Ciardullo
  • Patent number: 10361492
    Abstract: A terminal-equipped covered electric wire and a wire harness in which an electrical connection portion where a terminal fitting and an electric wire conductor are electrically connected is covered with a resin cover portion. With the terminal-equipped covered electric wire and the wire harness, the terminal fitting is prevented from being damaged during insertion into a connector housing, and the resin cover portion has improved adhesiveness to the terminal fitting. Provided is a terminal-equipped covered electric wire in which a resin cover portion covering an electrical connection portion includes a first layer made of a thermoplastic elastomer having adhesiveness to the surface of a terminal fitting, and a second layer made of a polyester resin. The adhesive strength between the thermoplastic elastomer and the polyester resin is 1.3 MPa or more. A wire harness including such a terminal-equipped covered electric wire is configured.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: July 23, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Takuya Yamashita
  • Patent number: 10137618
    Abstract: A device for producing plastics parts having at least one rod-shaped metal insert, and comprising first and second mold half elements. At least one of the mold half elements is movable along a closure direction (Z). The mold half elements together can form a closed cavity for molding a plastics part, the insert projecting at least in portions into the cavity in order to be overmolded with plastics material, and being substantially arranged between the two mold half elements in a dividing plane which comprises a longitudinal direction (X) and a width direction (Y). At least one of the mold half elements has at least one fixing means wherein the insert can be fixed in the width direction. A positioning means can be arranged at a proximal end of the insert, allowing the insert to be moved along the longitudinal direction (X) into an injection position.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: November 27, 2018
    Assignee: Gerresheimer Regensburg GMBH
    Inventors: Josef Hutter, Michael Wiglenda, Gerhard Schloegl
  • Patent number: 9957075
    Abstract: In a method and apparatus for producing a small pouch with a predetermined amount of particulate material therein, a predetermined amount of the particulate material is portioned from a bulk supply and compacted into a single discrete caplet. The caplet is then deposited into an open hollow pouch closed at one end thereof, and the open end is then closed with the caplet between the closed ends of the pouch. The caplet in the pouch is then compressed to return it to its particulate form. The particulate material may be granular or shredded tobacco.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: May 1, 2018
    Assignee: PHILIP MORRIS USA INC.
    Inventors: Martin T. Garthaffner, Barry S. Smith
  • Patent number: 9871428
    Abstract: The method for removing a bar or coil from a slot of an electric machine includes weakening the bonding between the slot and the bar or coil, and then removing the bar or coil.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: January 16, 2018
    Assignee: General Electric Technology GmbH
    Inventors: Massimiliano Visintin, Janusz Bialik, Luigi Cattaneo
  • Patent number: 9673586
    Abstract: A method of waterproofing a coated electric wire attached connector terminal which is formed of metal material and which includes a barrel part which is crimped to a conductor which is exposed from a sheath, a terminal part, a connecting plate which is formed between the barrel part and the terminal part, and connects the barrel part and the terminal part. The method includes an adhesive material applying step in which adhesive material is applied to the connecting plate, and a molded part molding step in which the coated electric wire attached connector terminal is placed in a metal mold to form an injection space around the connecting plate, the barrel part and the sheath and resin is injected into the injection space to cover the connecting plate, the barrel part and the sheath with a resin molded part.
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: June 6, 2017
    Assignee: Yazaki Corporation
    Inventors: Kei Sato, Shinji Kodama
  • Patent number: 9561604
    Abstract: The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: February 7, 2017
    Assignee: Dialight Corporation
    Inventors: Kenneth Jenkins, Kevin A. Hebborn, William S. Leib, III, David Weimer
  • Patent number: 9524885
    Abstract: Mold pieces (105 and 110) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer (118) include a primary cavity (117) and secondary cavities (120) into which excess mold compound from the primary cavity (117) flows. The secondary cavities (120) include a plunger (130) that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity (117) is forced to flow into the secondary cavities (120), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (118), which can then be removed, for example by grinding, in a relatively short time. Mold piece (105) further comprises a movable cavity bar (115) that can be moved away from mold piece (105) after molding and be cooled to detach the molded substrate that adheres to the cavity bar.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: December 20, 2016
    Assignee: ADVANCED SYSTEMS AUTOMATION LTD.
    Inventors: Jimmy Chew Hwee Seng, Dingwei Xia
  • Patent number: 9511513
    Abstract: A composite tube is made by applying a mixture of individual reinforcing fibers and a resin onto the interior cylindrical wall of the spinning mandrel.
    Type: Grant
    Filed: January 24, 2015
    Date of Patent: December 6, 2016
    Assignee: THE BOEING COMPANY
    Inventors: John Ralph Hull, Mark Alan Negley, Michael Strasik, John A. Mittleider
  • Patent number: 9375889
    Abstract: Disclosed is a method of manufacturing a golf ball having a multilayer structure. The method uses a forming apparatus including an upper mold, a lower mold, and an intermediate mold. The upper mold and the lower mold include a plurality of hemispheric cavities, respectively. The intermediate mold includes a plurality of protrusions having smaller diameters than those of the cavities, on a top and a bottom to correspond to the cavities.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: June 28, 2016
    Assignee: VOLVIK INC.
    Inventors: Hie Tack Ryu, Jung Soo Kim, Jae Ho Lee, Kyung Ahn Moon
  • Patent number: 9368929
    Abstract: A method for protecting a terminal-connecting portion of an insulated electrical wire by means of insert molding, the terminal-connecting portion being disposed at one end portion of the insulated electrical wire, comprising the step of: grounding an opposite end portion of the insulated electrical wire before the terminal-connecting portion is introduced into a die.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: June 14, 2016
    Assignee: Yazaki Corporation
    Inventor: Kouichiro Matsushita
  • Patent number: 9278467
    Abstract: A golf ball mold body having a plurality of mold parts with a parting surface defining a parting line along an equator and removably mating to form a cavity having an inner wall with dimple-forming protrusions, and a support pin extendable into and retractable from the cavity, the support pin extending into the cavity to support a center sphere. An end face of the support pin defines a portion of the cavity inner wall when the support pin is retracted. The support pin has a shape satisfying certain conditions, and the support pin and mold body have a gap therebetween set within a specific range. The invention minimizes formation of uneven flash caused by deflection or shifting of support pins, appearance defects caused by damage to the cavity inner wall and contamination by rubbing debris, and the life of the mold is extended.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: March 8, 2016
    Assignee: BRIDGESTONE SPORTS CO., LTD.
    Inventors: Takuma Nakagawa, Katsunori Sato
  • Patent number: 9211667
    Abstract: The present invention relates to a method and a device for molding a soft and thin resin molded product, in which molten resin is injected into a molding space between a concave mold and a convex mold to mold the soft and thin resin molded product. The convex mold or the concave mold is opened while the soft and thin resin molded product is left in the concave mold in such a way as to become open in its concave-shaped portion. Then, at least two chuck tabs formed outside the concave-shaped portion of the soft and thin resin molded product left in the concave mold are each held by a chuck of a molded product removing machine, and the concave-shaped portion of the soft and thin resin molded product is supported by a support arm of the molded product removing machine.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: December 15, 2015
    Assignees: CALSONIC KANSEI CORPORATION, NISSAN MOTOR CO., LTD.
    Inventors: Yoshihito Kobune, Kenjiro Sugimoto, Kaoru Ishii
  • Patent number: 9114556
    Abstract: A process for molding a beading in particular on the periphery of a window or for molding a plastic window, in which a constituent plastic of said beading or of said plastic window respectively is introduced into a molding cavity in which at least one ferromagnetic insert, such as a trim, has been placed beforehand, wherein said insert is held in position in said molding cavity during the introduction of said plastic by at least one magnet which can move between two positions, an active position in which it exerts an attractive force on said insert across the internal surface of the molding cavity and an inactive position I in which it exerts no attractive force on said insert.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: August 25, 2015
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Emmanuel Depierre, Romain Debailleul, Jean-Pierre Roze
  • Patent number: 9108347
    Abstract: A golf ball mold that includes a mold body configured as a plurality of mold parts which have at least a parting surface that defines a parting line at a golf ball equator and removably mate to form a cavity having an inner wall with a plurality of dimple-forming protrusions thereon is provided. The golf ball mold includes a support pin which has an end face with a plurality of dimple-forming protrusions thereon and is extendable into and retractable from the cavity. The support pin extends into the cavity to support a center sphere and, when in a retracted state, the end face thereof defines a portion of the inner wall of the cavity. The end face of the support pin includes a pole of the cavity and has a peripheral edge which intersects a parallel of latitude at 10 degrees from the pole.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: August 18, 2015
    Assignee: BRIDGESTONE SPORTS CO., LTD.
    Inventors: Takuma Nakagawa, Katsunori Sato, Yoichi Omura
  • Patent number: 9004894
    Abstract: A mold assembly for insert-molding a heterogeneous object includes an upper mold and a lower mold. The upper mold includes a cavity for accommodating an insert object. The lower mold includes a rigid body and a resilient contact member for resting the insert object. The resilient contact member absorbs dimensional variations of the insert object during the insert molding process.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: April 14, 2015
    Assignee: Pioneer Material Precision Tech Co., Ltd.
    Inventors: Yuan-Shun Tsai, Yu-Cheng Hsu
  • Publication number: 20150086666
    Abstract: A lower mold (2) of a set of upper and lower molds for resin encapsulation of a lead frame having a semiconductor chip mounted thereon is provided with a tapered positioning pin (3) to be engaged with a positioning hole formed in the lead frame. A columnar portion of the tapered positioning pin has an outer diameter larger than an inner diameter of a positioning hole. An ejector pin (4) and an ejector pin in a pair (5) for ejecting a package out of the molds after the molding are fixed town ejector pin coupling mechanism (6).
    Type: Application
    Filed: September 24, 2014
    Publication date: March 26, 2015
    Inventors: Yasuo TERUI, Masaru AKINO
  • Publication number: 20140374954
    Abstract: In a sawing cord the three constituting elements of steel cord, sawing bead and sleeve polymer in between the beads must work optimally together. In order to improve the injection moulding quality the inventors disclose an injection mould wherein the injection channels inject polymer from opposite sides of the steel cord into the injection cavity. The injection mould comprises two half moulds that form the injection cavity when closed. Different preferred embodiments are described inclusive the use of channels having a tree structure, preferably a binary channel tree, preferably a balanced binary tree and most preferred a balanced binary tree with equal length pathways from feed channel to each injection channel. The use of heated channels is disclosed and the rules for balancing between the number of heated versus non-heated channels are explained. Furthermore the method to use such mould and the product resulting from the use of the mould are claimed.
    Type: Application
    Filed: December 13, 2012
    Publication date: December 25, 2014
    Inventors: Dieter Ghillebert, Raf Clauws, Tom Baekelandt
  • Publication number: 20140370373
    Abstract: A method for encapsulating a device, such as an battery, having two opposite and parallel main faces and a peripheral edge, wherein one main face includes an electrical contact zone, includes the steps of retaining the device within an injection chamber of a mold and injecting encapsulation material into the injection chamber to overmold an encapsulation block on the device. The injection chamber is configured to hold a portion of the device, adjacent its peripheral edge, so as to center the device within the injection chamber. The mold includes centering structures that at least partially cover the electrical contact zone. Opposite positioning studs protrude into the injection chamber and bear on the opposite main faces of the device. The resulting packaged device includes an overmolded encapsulation block enveloping the device except for portions covered by the centering structure.
    Type: Application
    Filed: September 2, 2014
    Publication date: December 18, 2014
    Applicant: STMICROELECTRONICS (TOURS) SAS
    Inventor: Patrick Hougron
  • Patent number: 8859339
    Abstract: A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: October 14, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Zhigang Bai, Jinzhong Yao
  • Patent number: 8851874
    Abstract: There is disclosed a mold comprising a first mold portion and a second mold portion engageable to define a mold cavity in a closed position of the mold. The first mold portion comprises a first part-line surface and the second mold portion comprises a second part-line surface. The first part-line surface comprises a projection portion and the second part-line surface comprising a resilient portion for substantially sealing engagement with the projection portion in the closed position of the mold. The present mold allows for the production of a so-called “positive seal” between the two mold halves at the part-line of the mold, particularly in the areas of the part-line where there is no vent. This allows for production of a molded part having minimal or no flash produced at the part-line of the mold.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: October 7, 2014
    Assignee: Proprietect L.P.
    Inventors: Jaime J. Rawlings, Scott Neidig, Paul R. Norris
  • Patent number: 8851875
    Abstract: A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: October 7, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Young-jin Hwang
  • Publication number: 20140295013
    Abstract: A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.
    Type: Application
    Filed: June 16, 2014
    Publication date: October 2, 2014
    Inventors: Shu Chuen HO, Si Liang LU, Swee Kwong MOK, Kar Weng YAN
  • Publication number: 20140287115
    Abstract: An assembly and method for preparing edible items on a stick, from material that may not be particularly pourable, using a mold, a mold compression piece and a stick.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 25, 2014
    Inventors: Natalie A. Plank, Jennifer L. Grubbs
  • Patent number: 8840388
    Abstract: A system includes a dispensing station and top and bottom mold portion paths. The dispensing station is configured to dispense materials into one or more hemispherical cavities of a plurality of top mold portions and a plurality of bottom mold portions. The plurality of top mold portions are conveyed at a first speed along the top mold portion path, and the plurality of bottom mold portions are conveyed at a second speed along the bottom mold portion path. The dispensing station can include at least one nozzle coupled to a six-axis robotic member that is configured to move at variable speeds.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: September 23, 2014
    Assignee: Taylor Made Golf Company
    Inventors: Hyun J. Kim, Jaerim Kim, Kwangjin Choi
  • Patent number: 8794947
    Abstract: A translating die apparatus and method for forming a piece of material into a part having complex contours. The translating die apparatus may comprise upper and lower mounts, fixed upper and lower dies fixed to the upper and lower mounts, respectively, and movable upper and lower dies translatably coupled with the mounts and configured to translate laterally toward and away from the fixed upper and lower dies. The piece of material may be placed between the upper and lower dies and one of the mounts may be actuated toward another of the mounts to sandwich the piece of material between the upper and lower dies. Simultaneously, the movable upper and lower dies may translate toward the fixed upper and lower dies, until the movable and fixed dies abut each other when the upper and lower dies are fully pressing the piece of material therebetween.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: August 5, 2014
    Assignee: Spirit AeroSystems, Inc.
    Inventors: Blaise F. Bergmann, Michael C. Dowling, Mark S. Williams
  • Patent number: 8773314
    Abstract: There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: July 8, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ha Ryong Hong, Sung Eun Cho, Duk Woo Lee, Dae Kyu Lee, Chan Gwang An, Jae Suk Sung, Ki Won Chang, Chang Mok Han, Sang Woo Bae
  • Patent number: 8756648
    Abstract: The invention refers to a method to be used in a telecommunication network for providing individually marked digital signals (S1, S2) to be transmitted to a plurality of recipient user devices (UE1, UE2), wherein a content digital signal (SO) is received together with one or a plurality of mark signals (M1, M2), and wherein an individually marked signal (S1, S2) to be provided to one of the user devices (UE1, UE2) is generated by combining the content signal (SO) with one or a plurality of mark signals (M1, M2). The invention further refers to a program and to devices for performing the method.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: June 17, 2014
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Frank Hartung, Daniel Catrein, Thomas Rusert
  • Publication number: 20140154348
    Abstract: A mold assembly for insert-molding a heterogeneous object includes an upper mold and a lower mold. The upper mold includes a cavity for accommodating an insert object. The lower mold includes a rigid body and a resilient contact member for resting the insert object. The resilient contact member absorbs dimensional variations of the insert object during the insert molding process.
    Type: Application
    Filed: February 10, 2014
    Publication date: June 5, 2014
    Applicant: PIONEER MATERIAL PRECISION TECH CO., LTD.
    Inventors: Yuan-Shun Tsai, Yu-Cheng Hsu
  • Patent number: 8727754
    Abstract: The claimed subject matter relates to a rotary die device for producing soft capsules, comprising a capsule forming unit for forming a soft-capsule shell and a dosing unit for feeding a filling material into the capsule forming unit, characterized in that the dosing unit comprises a conveying apparatus of viscous melts and a portioner, wherein the portioner is connected at an end thereof to the conveying apparatus of viscous melts and is arranged in a filling wedge with a section in such a way that filling material from the portioner reaches the location of the capsule filling directly or by means of one or more channels having a length of at most 30 mm. Using said device, high-viscosity filling materials can be filled and thus novel soft capsules can be made accessible.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: May 20, 2014
    Assignee: Swiss Caps Rechte und Lizenzen AG
    Inventors: Erich Brocker, Alois Peter, Georg Sydow
  • Patent number: 8714956
    Abstract: Universal mold frames for producing multi-piece golf balls are provided. The mold frames include lower and upper frame plates having locator pins that are inserted into corresponding locator slots in the mold cavities. The eccentric pin layout of the frame plates and corresponding slots in the cavities means the cavities can be fitted easily and aligned in the frame plates. The interior surfaces of the mold cavities define a specific dimple pattern such as icosahedron or tetrahedron-based patterns. The mold frames can accommodate cavities having different dimple patterns. A castable liquid polymer, for example, polyurethane is dispensed into the mold cavities, which are then pressed together to form the spherical cover for the ball.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: May 6, 2014
    Assignee: Acushnet Company
    Inventors: Michael R. Madson, Nicholas M. Nardacci, Mark R. Verronneau, Thomas L. Mydlack
  • Patent number: 8698047
    Abstract: The present disclosure relates to a handheld clamp device for applying heat to a golf ball. The clamp may have two lever arms each attached at one end to a pivot. A golf ball receiving unit may be attached to each lever arm at the opposite end as the pivot. Each golf ball receiving unit may include a heating element. The internal heating surface of each golf ball receiving unit may contain a pattern, which can be a dimple pattern. When in use, the handheld device may heat the surface of a golf ball such that the pattern on the internal heating surfaces forms a dimple pattern into the surface of the golf ball. The handheld clamp device may be included as part of a kit, along with multiple sets of golf ball receiving units, and sometimes at least one golf ball.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: April 15, 2014
    Assignee: NIKE, Inc.
    Inventor: Chia-Chyi Cheng
  • Patent number: 8684721
    Abstract: There are provided an apparatus and an associated method for manufacturing superplastically formed structural assemblies from preforms. The apparatus includes first and second co-operable dies structured to define a die cavity therebetween for at least partially receiving the preform, at least one heater in thermal communication with the die cavity for heating the preform to a forming temperature, and at least one injector in fluid communication with the die cavity. The injector is structured for injecting pressurized gas into the die cavity to urge the preform against one of the dies to form the preform into the structural assembly. Further, at least one of the injectors is structured for injecting a quenchant into the die cavity to thereby heat treat the structural assembly while distortion of the structural assembly is being at least partially restrained by at least one of the dies.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: April 1, 2014
    Assignee: The Boeing Company
    Inventors: Gary W. Coleman, John R. Fischer, Marc R. Matsen, Elizabeth M. Mull, David S. Nansen
  • Patent number: 8641401
    Abstract: A combination scoop and mold press includes two generally cup-shaped half-mold members, which engage one another at mold member edges in mirror-image alignment to form a generally enclosed mold. The half-mold members of the scoop and mold press are carried on opposite ends of a unitary piece of injection molded polymeric material, which has a live hinge joint equidistantly spaced between the mold members. Either of the half-mold members may be utilized to scoop out an appropriate mass of bait dough having at least the volume of the closed mold. At least one of the half-mold members is equipped with a notch or slit through which the shank of a fish hook, or the line which is tied to the fish hook, may pass. Finger pressure is used to bring the mold half-members together, compressing the bait dough around the hook.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: February 4, 2014
    Inventor: Randall L. Leininger
  • Publication number: 20140004217
    Abstract: Universal mold frames for producing multi-piece golf balls are provided. The mold frames include lower and upper frame plates having locator pins that are inserted into corresponding locator slots in the mold cavities. The eccentric pin layout of the frame plates and corresponding slots in the cavities means the cavities can be fitted easily and aligned in the frame plates. The interior surfaces of the mold cavities define a specific dimple pattern such as icosahedron or tetrahedron-based patterns. The mold frames can accommodate cavities having different dimple patterns. A castable liquid polymer, for example, polyurethane is dispensed into the mold cavities, which are then pressed together to form the spherical cover for the ball.
    Type: Application
    Filed: September 6, 2013
    Publication date: January 2, 2014
    Applicant: Acushnet Company
    Inventors: Michael R. Madson, Nicholas M. Nardacci, Mark R. Verronneau, Thomas L. Mydlack
  • Patent number: 8529816
    Abstract: Universal mold frames for producing multi-piece golf balls are provided. The mold frames include lower and upper frame plates having locator pins that are inserted into corresponding locator slots in the mold cavities. The eccentric pin layout of the frame plates and corresponding slots in the cavities means the cavities can be fitted easily and aligned in the frame plates. The interior surfaces of the mold cavities define a specific dimple pattern such as icosahedron or tetrahedron-based patterns. The mold frames can accommodate cavities having different dimple patterns. A castable liquid polymer, for example, polyurethane is dispensed into the mold cavities, which are then pressed together to form the spherical cover for the ball.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: September 10, 2013
    Assignee: Acushnet Company
    Inventors: Michael R. Madson, Nicholas M. Nardacci, Mark R. Verronneau, Thomas L. Mydlack
  • Publication number: 20130178018
    Abstract: A semiconductor module includes a plurality of semiconductor elements, a first tabular electrode coupled to one face side of the plurality of semiconductor elements, a second tabular electrode coupled to the other face side of the plurality of semiconductor elements, and a molding material that encapsulates the plurality of semiconductor elements between the first electrode and the second electrode. A protrusion extending toward the second electrode is provided in a circumferential edge portion of the first electrode, and the protrusion surrounds the molding material.
    Type: Application
    Filed: November 10, 2011
    Publication date: July 11, 2013
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Shuuji Adachi, Fumiyuki Komiyama, Shuuji Kobayashi
  • Publication number: 20130140737
    Abstract: A transfer mold assembly including a first mold chase; a second mold chase; a first lead frame; at least one first lead frame die mounted on the first lead frame; a second lead frame substantially identical to the first lead frame; at least one second lead frame die mounted on the second lead frame; and wherein the first and second mold chases define a transfer mold cavity and wherein the first and second lead frames are positioned in stacked relationship inside the transfer mold cavity. Also disclosed is a method of integrated circuit packaging.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 6, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lim Jin Keong
  • Patent number: 8419404
    Abstract: A modular molding assembly comprises an input module for loading electronic devices for molding, a press station including one or more molding presses for molding the electronic devices, an output module for offloading molded electronic devices after they have been molded and a carrier that is movable at least between the input module and the press station and/or the press station and the output module. The carrier has an adaptor located thereon for detachably mounting a first attachment or a second attachment which is operative to perform a function of transporting the electronic devices and/or introducing a molding compound to the press station for conducting molding. The first and second attachments each has a corresponding mounting device for detachably mounting the first or second attachment onto the adapter and the first attachment has a different function from the second attachment.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: April 16, 2013
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Shu Chuen Ho, Jian Wu, Choon Hong Cheong, Chee Toh Teh, Fu Sun Huang
  • Patent number: 8408891
    Abstract: The invention provides a golf ball mold that includes a mold body configured as a plurality of mold parts which have at least a parting surface that defines a parting line at a golf ball equator and removably mate to form a cavity having an inner wall with a plurality of dimple-forming protrusions thereon, and a support pin which has an end face with a plurality of dimple-forming protrusions thereon and is extendable into and retractable from the cavity. The support pin extends into the cavity to support a center sphere and, when in a retracted state, the end face thereof defines a portion of the inner wall of the cavity. The end face of the support pin includes a pole of the cavity and has a peripheral edge which intersects a parallel of latitude at 10 degrees from the pole. Using the golf ball mold of the invention, good molded pieces which do not give rise to problems such as appearance defects and irregular flash can be easily and reliably obtained, helping to improve golf ball productivity.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: April 2, 2013
    Assignee: Bridgestone Sports Co., Ltd
    Inventors: Takuma Nakagawa, Katsunori Sato, Yoichi Omura
  • Publication number: 20130071505
    Abstract: A molding device for a semiconductor chip package includes a first molding die, a second molding die opposite to the first molding die and a plurality of pistons. The second molding die defines a plurality of cylinders for receiving the corresponding pistons. The first molding die and the second molding die collectively form a molding cavity to accommodate a substrate. The first molding die includes a protruding portion defining a groove opening towards the second molding die. The protruding portion and the second molding die collectively form an entrance and an exit on two sides of the groove. Each of the plurality of pistons is compressed to force a molding compound flowing through the entrance, the groove and the exit to fill into the molding cavity so as to encapsulate the substrate.
    Type: Application
    Filed: November 10, 2011
    Publication date: March 21, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., Ambit Microsystems (Zhongshan) LTD.
    Inventor: JUN-YI XIAO
  • Patent number: 8388882
    Abstract: A mold for forming a golf ball makes it possible to form minute dimples, and to improve mold release properties of the mold and wettability of the mold by a material when a urethane material is used for a cover layer. A mold according to the present invention is a mold for forming a urethane cover as an outermost layer of a golf ball, and includes: at least two split molds that are separably joined with each other, and that includes a cavity formed therein by the joining, the cavity being for forming the urethane cover; protrusions that are formed on a cavity surface of the split molds to form dimples of the golf ball; and a composite plating film that covers the cavity surface of the split molds, that comes into contact with a material of the urethane cover, and that contains a nickel-based matrix and fluororesin particles dispersed in the nickel-based matrix.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: March 5, 2013
    Assignee: Bridgestone Sports Co., Ltd.
    Inventors: Youichi Omura, Hirotaka Shimosaka
  • Publication number: 20130037990
    Abstract: A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.
    Type: Application
    Filed: August 11, 2011
    Publication date: February 14, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing-Cheng Lin, Chin-Chuan Chang, Jui-Pin Hung, Szu Wei Lu, Shin-Puu Jeng, Chen-Hua Yu
  • Publication number: 20130005087
    Abstract: An apparatus for molding a semiconductor device includes an upper mold chase and a lower mold chase. The mold chases are capable of being aligned with each other, forming spaced cavities for receiving a lead frame array that includes semiconductor dies for encapsulation. The cavities are aligned in spaced, vertical columns and gates are provided at the opening of each column of cavities. A molding compound is passed through the gates and flows uninterrupted through each cavity and encapsulates the semiconductor dies.
    Type: Application
    Filed: June 6, 2012
    Publication date: January 3, 2013
    Applicant: FREESCALE SEMICONDUCTOR, INC
    Inventors: Quan Chen, Wei Gao, Yanbo Xu
  • Patent number: 8342837
    Abstract: There are provided a first mold 2 and a second mold 1 that can be brought into and released from contact with the first mold 2. A substrate 70 provided in both the molds 1, 2 and mounted with electronic components is subjected to resin sealing and molding by filling with resin of cavities formed by both the molds 1, 2. The second mold 1 is placed on a base plate 9 so as to be capable of horizontally reciprocating, and has a cavity block 7 that can be brought into and released from contact with the first mold 2 and a mold clamping mechanism 16 that supports the cavity block 7 and that brings and releases the cavity block 7 into and from contact with the first mold 2 so as to perform mold clamping. On the base plate 9 is provided a horizontal actuation mechanism 11 for moving the second mold 1 to a facing position where the second mold 1 faces the first mold 2 and to a non-facing position where the second mold 1 has been moved sideways from the facing position.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: January 1, 2013
    Assignee: Dai-Ichi Seiko Co., Ltd.
    Inventors: Kenji Ogata, Shin Nagaoka
  • Publication number: 20120312735
    Abstract: An insert mould tool for moulding an annular moulded portion onto an insert such as a filter sheet of a filter cartridge comprises a plurality of mould pieces and means for applying pressure to the mould pieces. Each mould piece comprises complementarily shaped mating surfaces and can be assembled to define an annular mould cavity intersecting at least one mating surface for defining the shape of the moulded portion and an insert-receiving cavity for receiving a portion of the insert. The insert-receiving cavity comprises a sealing portion extending radially inwardly of the annular mould cavity for sealing receipt of a portion of the insert, the sealing portion being exerting a substantially evenly distributed pressure across an area thereof when pressure is applied to the mould pieces. Also disclosed is a method of insert moulding, and a filter cartridge.
    Type: Application
    Filed: February 14, 2012
    Publication date: December 13, 2012
    Applicant: Fenchurch Environmental Group Limited
    Inventor: Frederick Ian WOOD
  • Patent number: 8287261
    Abstract: The present invention relates to a mold having a parting line along dimples which allows manufacturing of golf balls free from burrs, and to golf balls manufactured using such a mold. The mold of the present invention is provided with a spherical cavity inside thereof; and an upper mold and a lower mold separable from each other, wherein a plurality of convex portions for forming dimples is provided in the inner surface of the cavity, at least one of the plurality of convex portions lies over the equator of the cavity, a parting line, which corresponds to the boundary between the upper mold and the lower mold, extends along the inner surface of the cavity, the parting line comprises first lines extending along the peripheries of the convex portions lying over the equator and second lines connecting the first lines, and the first line is disposed apart from the periphery by a distance of 0.1 to 0.5 mm.
    Type: Grant
    Filed: July 19, 2008
    Date of Patent: October 16, 2012
    Assignee: Mizuno Corporation
    Inventors: Norikazu Ninomiya, Yoshihiro Fujikawa, Masahiro Michishita
  • Patent number: 8283022
    Abstract: A man-made, molded article is provided. The article includes a profile including a planar wall, and an adjacent integral molded depression having a contoured wall extending downwardly from the planar wall. The contoured wall includes a bead portion, a cove portion, and a ledge between the bead and cove portions. The articles are stackable, one above another for transport, in a nestable relationship in which multiple contact zones are present between the contoured walls of an adjacently stacked pair of the molded articles. The contact zones include an arcuately extending contact interface zone between the bead exterior and interior surfaces. The depression has a substantially uniform thickness varying by no more than about +1 percent to about ?11 percent in relation to a thickness of the planar wall. Related methods and assemblies are also provided.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: October 9, 2012
    Assignee: Masonite Corporation
    Inventor: Steven K Lynch