Abstract: The rotary tablet press comprises a machine base assembly and detachable module. Granulation is fed into the module from the hopper and travels into the feeder chamber. The base assembly comprises motorized pressure roll assemblies and a turret drive assembly. The detachable module comprises a module base, turret base, turret, cam body, cams, feeder, tablet discharge chute, hopper, upper enclosure, and guard doors. The rotary turret comprises upper punches, dies, and lower punches. As the turret rotates, the dies move underneath the feeder chamber. The rotary feeder paddles move the granulation and assist with feeding powder to the dies. Punches travel along cam tracks as the turret rotates and compresses the powder into a tablet when the punches contact the pressure rolls. An ejection cam pushes the lower punch in the upward direction and a take-off bar mounted just above the die table directs the tablet into a discharge chute. The detachable module is sealed by incorporating an upper enclosure.

Abstract: The present disclosure relates to a mounting press for hot mounting a sample, comprising: a mounting cylinder which receives the sample and has a main cylinder axis and a cylinder opening, wherein the main cylinder axis extends inside the mounting cylinder and out through the cylinder opening, and a covering that extends around the cylinder opening, and a suction device for extracting granular material dust, granular material, or vapors, for example, wherein the suction device comprises a vacuum generator for providing a suction effect, and wherein the suction device is at least partly mounted on the covering or embedded in the covering.

Abstract: An electric wire with a terminal includes: an electric wire having a core wire, and a cover; a crimp terminal having a core wire crimping portion which is crimped to the core wire, a cover crimping portion which is crimped to the cover, and a connecting portion which extends from the core crimping portion to the cover crimping portion; and a resin which integrally covers the core wire and the crimp terminal. The core wire has an intermediate portion which extends between the core crimping portion and the cover crimping portion. The connecting portion has a bottom wall portion and a pair of side wall portions which extend in a height direction of the crimp terminal from end portions of the bottom wall portion in a width direction.

Abstract: A grip for a golf club includes a cylindrical portion into which a shaft is inserted; and an end cap portion. The cylindrical portion, on its outer surface, includes a minute projection region where a plurality of minute projections each of which has a maximum width of 0.2 mm or more and 1.2 mm or less are arranged at intervals of 0.05 mm or more and 0.7 mm or less. The minute projection region is disposed in a first region whose distance in an axial direction from a grip butt end is from 0 mm to 210 mm. Of the grip, a portion from the grip butt end up to 50 mm therefrom has a weight of 10 g or more, and the weight accounts for 39% or more of the whole weight of the grip.

Abstract: A terminal-equipped electric wire manufacturing apparatus, includes: a placing table on which a crimp terminal is placed while kept crimped to an electric wire; and a supply device that supplies an anticorrosive material to the crimp terminal placed on the placing table while kept crimped to the electric wire. While kept crimped to the electric wire, the crimp terminal has a communication hole allowing communication between a gap space portion in the crimp terminal and outside of the crimp terminal gap space portion. The placing table has a distribution hole positioned opposite the communication hole of the placed crimp terminal, the distribution hole allowing the anticorrosive material, supplied from the supply device, to flow in the distribution hole.

Abstract: A terminal-equipped electric wire manufacturing apparatus, includes: a placing table on which a crimp terminal is placed while kept crimped to an electric wire; and a supply device that supplies an anticorrosive material to the crimp terminal placed on the placing table while kept crimped to the electric wire. While kept crimped to the electric wire, the crimp terminal has a communication hole allowing communication between a gap space portion in the crimp terminal and outside of the crimp terminal gap space portion. The placing table has a distribution hole positioned opposite the communication hole of the placed crimp terminal, the distribution hole allowing the anticorrosive material, supplied from the supply device, to flow in the distribution hole.

Abstract: A packaging machine comprising a machine frame and at least one workstation with a lifting gear for supporting and moving a lower tool part between an open and a closed position. The workstation may include an upper tool part to act in cooperation with the lower tool part during a working operation. The lower tool part may be engaged with or near in proximity to an upper tool part in the closed position, and will be spaced apart from the upper tool part in the open position. A tilting mechanism is provided for a tool changing operation to tilt the lower tool part into a tilted position when the lower tool part is in the open position. In one embodiment, the lower tool part is removed from the packaging machine on a rail system in the direction corresponding to the tilted position.

Abstract: The present disclosure relates to an ice cream machine having a filling zone and an emptying zone. The ice cream machine may include a rotatable unit, a mould for receiving ice cream, a stick providing arrangement, and a guiding structure arranged to prevent more than one stick from entering the groove of the mould from the stick providing arrangement. The stick providing arrangement is arranged such that a rotation of the rotatable unit causes the groove to match the position of the stick providing arrangement and thereby allow a single stick to enter the groove, wherein further rotation of the rotatable unit causes one of the sidewalls of the groove to bring the stick along the rotational movement of the rotatable unit.

Abstract: Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments, one or more trench structures are formed according to partial substrate etching, such that respective trench structures are formed into a region of a substrate. In some embodiments, one or more trench structures are formed according to discontinued substrate etching, such that respective trench structures comprise one or more trench portions separated by separation regions of the substrate. The support structure mitigates stress energy from reaching the integrated circuitry, and facilitates process-induced charge release from the integrated circuitry.

Abstract: Devices and methods are disclosed for the centrifugal casting of spheres, particularly hollow spheres containing low air pressure. Molten or self-hardening casting material is introduced into a hollow spherical mold and the mold made to rotate about two axes intersecting at the center of the mold. The resulting centrifugal forces cause the casting material to be evenly distributed about the inner surface of the mold. The casting material is hardened and the resulting sphere is removed from the mold. One or more valves may be employed to transport fluent materials into and out of the mold. If gas is removed from a partially-filled mold prior to casting, the product will be a hollow sphere having an interior pressure less than ambient. Spheres made according to the present invention have a wide range of uses including insulation and bearing balls.

Abstract: A terminal-equipped covered electric wire and a wire harness in which an electrical connection portion where a terminal fitting and an electric wire conductor are electrically connected is covered with a resin cover portion. With the terminal-equipped covered electric wire and the wire harness, the terminal fitting is prevented from being damaged during insertion into a connector housing, and the resin cover portion has improved adhesiveness to the terminal fitting. Provided is a terminal-equipped covered electric wire in which a resin cover portion covering an electrical connection portion includes a first layer made of a thermoplastic elastomer having adhesiveness to the surface of a terminal fitting, and a second layer made of a polyester resin. The adhesive strength between the thermoplastic elastomer and the polyester resin is 1.3 MPa or more. A wire harness including such a terminal-equipped covered electric wire is configured.

Abstract: A device for producing plastics parts having at least one rod-shaped metal insert, and comprising first and second mold half elements. At least one of the mold half elements is movable along a closure direction (Z). The mold half elements together can form a closed cavity for molding a plastics part, the insert projecting at least in portions into the cavity in order to be overmolded with plastics material, and being substantially arranged between the two mold half elements in a dividing plane which comprises a longitudinal direction (X) and a width direction (Y). At least one of the mold half elements has at least one fixing means wherein the insert can be fixed in the width direction. A positioning means can be arranged at a proximal end of the insert, allowing the insert to be moved along the longitudinal direction (X) into an injection position.

Abstract: In a method and apparatus for producing a small pouch with a predetermined amount of particulate material therein, a predetermined amount of the particulate material is portioned from a bulk supply and compacted into a single discrete caplet. The caplet is then deposited into an open hollow pouch closed at one end thereof, and the open end is then closed with the caplet between the closed ends of the pouch. The caplet in the pouch is then compressed to return it to its particulate form. The particulate material may be granular or shredded tobacco.

Abstract: The method for removing a bar or coil from a slot of an electric machine includes weakening the bonding between the slot and the bar or coil, and then removing the bar or coil.

Abstract: A method of waterproofing a coated electric wire attached connector terminal which is formed of metal material and which includes a barrel part which is crimped to a conductor which is exposed from a sheath, a terminal part, a connecting plate which is formed between the barrel part and the terminal part, and connects the barrel part and the terminal part. The method includes an adhesive material applying step in which adhesive material is applied to the connecting plate, and a molded part molding step in which the coated electric wire attached connector terminal is placed in a metal mold to form an injection space around the connecting plate, the barrel part and the sheath and resin is injected into the injection space to cover the connecting plate, the barrel part and the sheath with a resin molded part.

Abstract: The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.

Abstract: Mold pieces (105 and 110) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer (118) include a primary cavity (117) and secondary cavities (120) into which excess mold compound from the primary cavity (117) flows. The secondary cavities (120) include a plunger (130) that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity (117) is forced to flow into the secondary cavities (120), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (118), which can then be removed, for example by grinding, in a relatively short time. Mold piece (105) further comprises a movable cavity bar (115) that can be moved away from mold piece (105) after molding and be cooled to detach the molded substrate that adheres to the cavity bar.

Abstract: A composite tube is made by applying a mixture of individual reinforcing fibers and a resin onto the interior cylindrical wall of the spinning mandrel.

Abstract: Disclosed is a method of manufacturing a golf ball having a multilayer structure. The method uses a forming apparatus including an upper mold, a lower mold, and an intermediate mold. The upper mold and the lower mold include a plurality of hemispheric cavities, respectively. The intermediate mold includes a plurality of protrusions having smaller diameters than those of the cavities, on a top and a bottom to correspond to the cavities.

Abstract: A method for protecting a terminal-connecting portion of an insulated electrical wire by means of insert molding, the terminal-connecting portion being disposed at one end portion of the insulated electrical wire, comprising the step of: grounding an opposite end portion of the insulated electrical wire before the terminal-connecting portion is introduced into a die.

Abstract: A golf ball mold body having a plurality of mold parts with a parting surface defining a parting line along an equator and removably mating to form a cavity having an inner wall with dimple-forming protrusions, and a support pin extendable into and retractable from the cavity, the support pin extending into the cavity to support a center sphere. An end face of the support pin defines a portion of the cavity inner wall when the support pin is retracted. The support pin has a shape satisfying certain conditions, and the support pin and mold body have a gap therebetween set within a specific range. The invention minimizes formation of uneven flash caused by deflection or shifting of support pins, appearance defects caused by damage to the cavity inner wall and contamination by rubbing debris, and the life of the mold is extended.

Abstract: The present invention relates to a method and a device for molding a soft and thin resin molded product, in which molten resin is injected into a molding space between a concave mold and a convex mold to mold the soft and thin resin molded product. The convex mold or the concave mold is opened while the soft and thin resin molded product is left in the concave mold in such a way as to become open in its concave-shaped portion. Then, at least two chuck tabs formed outside the concave-shaped portion of the soft and thin resin molded product left in the concave mold are each held by a chuck of a molded product removing machine, and the concave-shaped portion of the soft and thin resin molded product is supported by a support arm of the molded product removing machine.

Abstract: A process for molding a beading in particular on the periphery of a window or for molding a plastic window, in which a constituent plastic of said beading or of said plastic window respectively is introduced into a molding cavity in which at least one ferromagnetic insert, such as a trim, has been placed beforehand, wherein said insert is held in position in said molding cavity during the introduction of said plastic by at least one magnet which can move between two positions, an active position in which it exerts an attractive force on said insert across the internal surface of the molding cavity and an inactive position I in which it exerts no attractive force on said insert.

Abstract: A golf ball mold that includes a mold body configured as a plurality of mold parts which have at least a parting surface that defines a parting line at a golf ball equator and removably mate to form a cavity having an inner wall with a plurality of dimple-forming protrusions thereon is provided. The golf ball mold includes a support pin which has an end face with a plurality of dimple-forming protrusions thereon and is extendable into and retractable from the cavity. The support pin extends into the cavity to support a center sphere and, when in a retracted state, the end face thereof defines a portion of the inner wall of the cavity. The end face of the support pin includes a pole of the cavity and has a peripheral edge which intersects a parallel of latitude at 10 degrees from the pole.

Abstract: A mold assembly for insert-molding a heterogeneous object includes an upper mold and a lower mold. The upper mold includes a cavity for accommodating an insert object. The lower mold includes a rigid body and a resilient contact member for resting the insert object. The resilient contact member absorbs dimensional variations of the insert object during the insert molding process.

Abstract: A lower mold (2) of a set of upper and lower molds for resin encapsulation of a lead frame having a semiconductor chip mounted thereon is provided with a tapered positioning pin (3) to be engaged with a positioning hole formed in the lead frame. A columnar portion of the tapered positioning pin has an outer diameter larger than an inner diameter of a positioning hole. An ejector pin (4) and an ejector pin in a pair (5) for ejecting a package out of the molds after the molding are fixed town ejector pin coupling mechanism (6).

Abstract: In a sawing cord the three constituting elements of steel cord, sawing bead and sleeve polymer in between the beads must work optimally together. In order to improve the injection moulding quality the inventors disclose an injection mould wherein the injection channels inject polymer from opposite sides of the steel cord into the injection cavity. The injection mould comprises two half moulds that form the injection cavity when closed. Different preferred embodiments are described inclusive the use of channels having a tree structure, preferably a binary channel tree, preferably a balanced binary tree and most preferred a balanced binary tree with equal length pathways from feed channel to each injection channel. The use of heated channels is disclosed and the rules for balancing between the number of heated versus non-heated channels are explained. Furthermore the method to use such mould and the product resulting from the use of the mould are claimed.

Abstract: A method for encapsulating a device, such as an battery, having two opposite and parallel main faces and a peripheral edge, wherein one main face includes an electrical contact zone, includes the steps of retaining the device within an injection chamber of a mold and injecting encapsulation material into the injection chamber to overmold an encapsulation block on the device. The injection chamber is configured to hold a portion of the device, adjacent its peripheral edge, so as to center the device within the injection chamber. The mold includes centering structures that at least partially cover the electrical contact zone. Opposite positioning studs protrude into the injection chamber and bear on the opposite main faces of the device. The resulting packaged device includes an overmolded encapsulation block enveloping the device except for portions covered by the centering structure.

Abstract: A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.

Abstract: There is disclosed a mold comprising a first mold portion and a second mold portion engageable to define a mold cavity in a closed position of the mold. The first mold portion comprises a first part-line surface and the second mold portion comprises a second part-line surface. The first part-line surface comprises a projection portion and the second part-line surface comprising a resilient portion for substantially sealing engagement with the projection portion in the closed position of the mold. The present mold allows for the production of a so-called “positive seal” between the two mold halves at the part-line of the mold, particularly in the areas of the part-line where there is no vent. This allows for production of a molded part having minimal or no flash produced at the part-line of the mold.

Abstract: A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.

Abstract: A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.

Abstract: An assembly and method for preparing edible items on a stick, from material that may not be particularly pourable, using a mold, a mold compression piece and a stick.

Abstract: A system includes a dispensing station and top and bottom mold portion paths. The dispensing station is configured to dispense materials into one or more hemispherical cavities of a plurality of top mold portions and a plurality of bottom mold portions. The plurality of top mold portions are conveyed at a first speed along the top mold portion path, and the plurality of bottom mold portions are conveyed at a second speed along the bottom mold portion path. The dispensing station can include at least one nozzle coupled to a six-axis robotic member that is configured to move at variable speeds.

Abstract: A translating die apparatus and method for forming a piece of material into a part having complex contours. The translating die apparatus may comprise upper and lower mounts, fixed upper and lower dies fixed to the upper and lower mounts, respectively, and movable upper and lower dies translatably coupled with the mounts and configured to translate laterally toward and away from the fixed upper and lower dies. The piece of material may be placed between the upper and lower dies and one of the mounts may be actuated toward another of the mounts to sandwich the piece of material between the upper and lower dies. Simultaneously, the movable upper and lower dies may translate toward the fixed upper and lower dies, until the movable and fixed dies abut each other when the upper and lower dies are fully pressing the piece of material therebetween.

Abstract: There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded.

Abstract: The invention refers to a method to be used in a telecommunication network for providing individually marked digital signals (S1, S2) to be transmitted to a plurality of recipient user devices (UE1, UE2), wherein a content digital signal (SO) is received together with one or a plurality of mark signals (M1, M2), and wherein an individually marked signal (S1, S2) to be provided to one of the user devices (UE1, UE2) is generated by combining the content signal (SO) with one or a plurality of mark signals (M1, M2). The invention further refers to a program and to devices for performing the method.

Abstract: A mold assembly for insert-molding a heterogeneous object includes an upper mold and a lower mold. The upper mold includes a cavity for accommodating an insert object. The lower mold includes a rigid body and a resilient contact member for resting the insert object. The resilient contact member absorbs dimensional variations of the insert object during the insert molding process.

Abstract: The claimed subject matter relates to a rotary die device for producing soft capsules, comprising a capsule forming unit for forming a soft-capsule shell and a dosing unit for feeding a filling material into the capsule forming unit, characterized in that the dosing unit comprises a conveying apparatus of viscous melts and a portioner, wherein the portioner is connected at an end thereof to the conveying apparatus of viscous melts and is arranged in a filling wedge with a section in such a way that filling material from the portioner reaches the location of the capsule filling directly or by means of one or more channels having a length of at most 30 mm. Using said device, high-viscosity filling materials can be filled and thus novel soft capsules can be made accessible.

Abstract: Universal mold frames for producing multi-piece golf balls are provided. The mold frames include lower and upper frame plates having locator pins that are inserted into corresponding locator slots in the mold cavities. The eccentric pin layout of the frame plates and corresponding slots in the cavities means the cavities can be fitted easily and aligned in the frame plates. The interior surfaces of the mold cavities define a specific dimple pattern such as icosahedron or tetrahedron-based patterns. The mold frames can accommodate cavities having different dimple patterns. A castable liquid polymer, for example, polyurethane is dispensed into the mold cavities, which are then pressed together to form the spherical cover for the ball.

Abstract: The present disclosure relates to a handheld clamp device for applying heat to a golf ball. The clamp may have two lever arms each attached at one end to a pivot. A golf ball receiving unit may be attached to each lever arm at the opposite end as the pivot. Each golf ball receiving unit may include a heating element. The internal heating surface of each golf ball receiving unit may contain a pattern, which can be a dimple pattern. When in use, the handheld device may heat the surface of a golf ball such that the pattern on the internal heating surfaces forms a dimple pattern into the surface of the golf ball. The handheld clamp device may be included as part of a kit, along with multiple sets of golf ball receiving units, and sometimes at least one golf ball.

Abstract: There are provided an apparatus and an associated method for manufacturing superplastically formed structural assemblies from preforms. The apparatus includes first and second co-operable dies structured to define a die cavity therebetween for at least partially receiving the preform, at least one heater in thermal communication with the die cavity for heating the preform to a forming temperature, and at least one injector in fluid communication with the die cavity. The injector is structured for injecting pressurized gas into the die cavity to urge the preform against one of the dies to form the preform into the structural assembly. Further, at least one of the injectors is structured for injecting a quenchant into the die cavity to thereby heat treat the structural assembly while distortion of the structural assembly is being at least partially restrained by at least one of the dies.

Abstract: A combination scoop and mold press includes two generally cup-shaped half-mold members, which engage one another at mold member edges in mirror-image alignment to form a generally enclosed mold. The half-mold members of the scoop and mold press are carried on opposite ends of a unitary piece of injection molded polymeric material, which has a live hinge joint equidistantly spaced between the mold members. Either of the half-mold members may be utilized to scoop out an appropriate mass of bait dough having at least the volume of the closed mold. At least one of the half-mold members is equipped with a notch or slit through which the shank of a fish hook, or the line which is tied to the fish hook, may pass. Finger pressure is used to bring the mold half-members together, compressing the bait dough around the hook.

Abstract: Universal mold frames for producing multi-piece golf balls are provided. The mold frames include lower and upper frame plates having locator pins that are inserted into corresponding locator slots in the mold cavities. The eccentric pin layout of the frame plates and corresponding slots in the cavities means the cavities can be fitted easily and aligned in the frame plates. The interior surfaces of the mold cavities define a specific dimple pattern such as icosahedron or tetrahedron-based patterns. The mold frames can accommodate cavities having different dimple patterns. A castable liquid polymer, for example, polyurethane is dispensed into the mold cavities, which are then pressed together to form the spherical cover for the ball.

Abstract: Universal mold frames for producing multi-piece golf balls are provided. The mold frames include lower and upper frame plates having locator pins that are inserted into corresponding locator slots in the mold cavities. The eccentric pin layout of the frame plates and corresponding slots in the cavities means the cavities can be fitted easily and aligned in the frame plates. The interior surfaces of the mold cavities define a specific dimple pattern such as icosahedron or tetrahedron-based patterns. The mold frames can accommodate cavities having different dimple patterns. A castable liquid polymer, for example, polyurethane is dispensed into the mold cavities, which are then pressed together to form the spherical cover for the ball.

Abstract: A semiconductor module includes a plurality of semiconductor elements, a first tabular electrode coupled to one face side of the plurality of semiconductor elements, a second tabular electrode coupled to the other face side of the plurality of semiconductor elements, and a molding material that encapsulates the plurality of semiconductor elements between the first electrode and the second electrode. A protrusion extending toward the second electrode is provided in a circumferential edge portion of the first electrode, and the protrusion surrounds the molding material.

Abstract: A transfer mold assembly including a first mold chase; a second mold chase; a first lead frame; at least one first lead frame die mounted on the first lead frame; a second lead frame substantially identical to the first lead frame; at least one second lead frame die mounted on the second lead frame; and wherein the first and second mold chases define a transfer mold cavity and wherein the first and second lead frames are positioned in stacked relationship inside the transfer mold cavity. Also disclosed is a method of integrated circuit packaging.

Abstract: A modular molding assembly comprises an input module for loading electronic devices for molding, a press station including one or more molding presses for molding the electronic devices, an output module for offloading molded electronic devices after they have been molded and a carrier that is movable at least between the input module and the press station and/or the press station and the output module. The carrier has an adaptor located thereon for detachably mounting a first attachment or a second attachment which is operative to perform a function of transporting the electronic devices and/or introducing a molding compound to the press station for conducting molding. The first and second attachments each has a corresponding mounting device for detachably mounting the first or second attachment onto the adapter and the first attachment has a different function from the second attachment.

Abstract: The invention provides a golf ball mold that includes a mold body configured as a plurality of mold parts which have at least a parting surface that defines a parting line at a golf ball equator and removably mate to form a cavity having an inner wall with a plurality of dimple-forming protrusions thereon, and a support pin which has an end face with a plurality of dimple-forming protrusions thereon and is extendable into and retractable from the cavity. The support pin extends into the cavity to support a center sphere and, when in a retracted state, the end face thereof defines a portion of the inner wall of the cavity. The end face of the support pin includes a pole of the cavity and has a peripheral edge which intersects a parallel of latitude at 10 degrees from the pole. Using the golf ball mold of the invention, good molded pieces which do not give rise to problems such as appearance defects and irregular flash can be easily and reliably obtained, helping to improve golf ball productivity.

Abstract: A molding device for a semiconductor chip package includes a first molding die, a second molding die opposite to the first molding die and a plurality of pistons. The second molding die defines a plurality of cylinders for receiving the corresponding pistons. The first molding die and the second molding die collectively form a molding cavity to accommodate a substrate. The first molding die includes a protruding portion defining a groove opening towards the second molding die. The protruding portion and the second molding die collectively form an entrance and an exit on two sides of the groove. Each of the plurality of pistons is compressed to force a molding compound flowing through the entrance, the groove and the exit to fill into the molding cavity so as to encapsulate the substrate.