Abstract: A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is configured to receive the substrate, and a cavity plate configured to be clamped to the molding plate further comprises a plurality of molding cavities each constructed in the shape of the said carriers. The cavities are operative to create molded packages onto the carrier conforming to a shape of the memory card device without need for further forming of the molded compound after molding. Additionally, a nozzle on the surface of each cavity is operative to introduce molding material into the cavity in a direction that is substantially perpendicular to a plane of the substrate placed on the molding plate.

Abstract: A combination scoop and mold press includes two generally cup-shaped half-mold members, which engage one another at mold member edges in mirror-image alignment to form a generally enclosed mold. The half-mold members of the scoop and mold press are carried on opposite ends of a unitary piece of injection molded polymeric material, which has a live hinge joint equidistantly spaced between the mold members. Either of the half-mold members may be utilized to scoop out an appropriate mass of bait dough having at least the volume of the closed mold. At least one of the half-mold members is equipped with a notch or slit through which the shank of a fish hook, or the line which is tied to the fish hook, may pass. Finger pressure is used to bring the mold half-members together, compressing the bait dough around the hook.

Abstract: An electric connection part between a bulb and a terminal is masked without using a special masking material when a lamp unit is produced through a primary injection step of molding a lamp main body and a lens part while using a movable mold and a fixed mold, a film forming step of covering the lamp main body with a film, and a secondary injection step of uniting the lamp main body and the lens part together with a resinous material. The bulb is incorporated through a step set between the primary injection step and the film forming step. In the state in which the bulb is incorporated in the lamp main body, the surface of the top of the bulb is covered with a film, and a part hidden by the shadow of the film is masked, and hence electric insulation properties are secured.

Abstract: In a method of packaging a semiconductor IC, a tape is attached to a back surface of a lead frame array, and the lead frame array is held between an upper mold chase and a lower mold chase of a mold, with the back surface of the lead frame array upward. The upper and lower mold chases form an upper cavity and a lower cavity with respect to the lead frame array respectively. A mold compound is injected into the upper and lower cavities respectively. With respect to clearances between leads, between die pads and/or between the leads and the die pads, the mold compound injected into the upper cavity covers the portion of the tape over the clearances before the mold compound injected into the lower cavity fills the clearances, so that the tape is depressed.

Abstract: A chip packaging apparatus including an upper mold chase, a lower mold chase, a carrier delivering unit, a molding compound thickness adjusting unit, and a molding compound supplying unit is provided. The lower mold chase is disposed below the upper mold chase. The carrier delivering unit delivers a carrier to a position between the upper mold chase and the lower mold chase. The molding compound thickness adjusting unit provides a thickness adjusting film between the upper mold chase and the carrier and/or between the lower mold chase and the carrier, and adjusts the thickness of the molding compound according to the thickness of the thickness adjusting film. The molding compound supplying unit is connected to the upper mold chase or the lower mold chase for providing the molding compound into a cavity defined by the upper mold chase and the lower mold chase.

Abstract: Methods and apparatus to evenly clamp semiconductor substrates in a transfer mold process are disclosed. A disclosed split mold base includes a first plate having a first surface, a second plate having a second surface opposite the first surface, and a plurality of springs that are disposed between the first and second plates to distribute a clamping pressure applied by a mold press.

Abstract: An apparatus for in-mold-decoration includes a mold, a foil, and a press member. The mold includes a female mold and a male mold with a protrusion protruding therefrom towards the female mold. The foil is applied to a surface of the female mold facing the male mold and corresponding to a surface of a molded product to be decorated. The press member is positioned between the male mold and the female mold and the foil is further extended to be on a surface of the press member to be urged thereby to cover an end of the molding space as the press member is positioned to cooperate with the male and female molds to define a molding space thereamong, thereby ensuring the foil with a printed layer thereon completely and uniformly covers the surface of the molded product to be decorated, even unto its very edges.

Abstract: Device (1) for manufacturing injection moulding pieces (2) which mainly consists of a stack mould (3) with a central cubical part (4) and two mould impressions (9,10), whereby the device (1) is provided with a cooling station (15) and an ejection station (16) as well as four holders (17-20) for holding an injection moulding piece (2), which are formed as a piece (17-20) which can be taken out of the cube and which partly co-determines a mould impression (9,10), and with means (24) to detach the holders (17-20) from the cube faces (5, 13, 6, 14) with mould impressions (9, 10) and to put them in the latter again, as well as means (25) to each time move the holders (17-20) a quarter of a turn to a following cube face (13, 6, 14, 5) after the injection moulding.

Abstract: An apparatus for an in-mold-decoration molding includes a female mold and a male mold. The female mold has an enclosing portion protruding therefrom. The male mold has a protrusion protruding therefrom. The protrusion is step-shaped and includes a receiving portion and a protruding portion protruding from the receiving portion. The receiving portion is configured for fitting with the enclosing portion and allowing a foil to attach thereto, therefore the male mold and the female mold cooperate to define a molding space with an end thereof being covered by the foil.

Abstract: An apparatus and method for demolding golf balls from a mold cavity are disclosed. More specifically, an apparatus and method for demolding a golf ball from a mold cavity subsequent to forming a cover layer without the use of ejector or knockout pins are disclosed. The molding apparatus utilizes an undercut configuration that, upon opening the molds after molding a golf ball, serves to impart a rotational force upon the ball and dislodge it from the molds.

Abstract: A high-hardness and corrosion-tolerant integrated circuit packing mold comprises a package mold including at least one filling channel, at least one mold cavity, and at least one channel between the mold cavities; a protecting layer deposited upon surfaces of the package mold and the protecting layer being an amorphous coating layer. In one case, the protecting layer is a graded layer including an amorphous coating layer and a middle layer. In a second case, the protecting layer is a multiplayer structure formed by at least one amorphous coating layer and at least one polycrystal coating layer. In the third case, the protecting layer is a compound structure formed by distributing polycrystal material into an amorphous coating layer.

Abstract: The invention provides a mold for use in a compression molding apparatus that has a frame part with a hole through its center; a bottom plunger; and a top plunger; wherein the plungers are fabricated to fit substantially snugly in the hole in the frame part, and wherein at least one plunger comprises at least one low-thermal conductivity insert. The mold is useful in compression molding processes used in the preparation of unitized membrane electrodes.

Abstract: Mold 2 includes a pair of mold halves (upper mold half 4 and lower mold half 6). A spherical cavity is formed by mating upper mold half 4 and lower mold half 6. A large number of pimples 10 are provided on the cavity face of the upper mold half 4 and lower mold half 6. The upper mold half 4 and the lower mold half 6 have flat plane 14, protrusion 16 and recess 18, respectively. The protrusion 16 projects from the equator Eq. The recess 18 is depressed from the equator Eq. The protrusion 16 includes a part of the pimple 10. The proportion P1 of the number of the protrusion 16 that is adjacent to other protrusion 16 belonging to other mold half distinct from the mold half to which itself belongs, to the total number of the protrusions 16 is equal to or greater than 50%. The proportion Pw of the sum total of the widths of the protrusions 16 measured along the equator, to the entire length of the equator is equal to or greater than 35%.

Abstract: There are provided a golf ball molding die capable of manufacturing a golf ball having a satisfactory surface condition, and a golf ball manufactured by using the die. The present golf ball molding die comprises at least two die bodies within which a cavity for molding a golf ball is formed by jointing of the die bodies; and a pin accommodating hole provided in at least one of the die bodies, and is characterized in that at least one groove communicating directly with the cavity is provided in the wall surface of the pin accommodating hole.

Abstract: A foaming die device is provided, which has a closure element rotatably provided therein. The foaming die device allows a three-dimensional trim cover assembly with an opening defined therein to be placed therein and also allows a liquid foaming agent to be injected into an inside of so placed trim cover assembly for foaming operation. In operation, when the trim cover assembly is placed in foaming die device prior to the foaming operation, the closure element is able to be rotated toward and easily inserted in the opening to prevent leakage of the liquid foaming agent therethrough, whereas, when the trim cover assembly is taken out from the foaming die device subsequent to the foaming operation, the closure element is able to be rotated and easily removed from that opening.

Abstract: An object is to prevent internal stress from remaining in a molded product to thereby improve the quality of the molded product. A mold apparatus (10) includes a first plate and a second plate which is disposed to face the first plate and is made of the same material as that of the first plate. At least one of the first and second plates has voids formed in its surface facing the other plate. Since at least one of the first and second plates has a plurality of voids formed in its surface facing the other plate, a molding material present in a cavity can be prevented from suffering local temperature unevenness. The pattern of a cavity insert can be satisfactorily transferred to a molded product to thereby improve the quality of the molded product. Since the first and second plates are made of the same material, diffusion bonding can be easily conducted. Furthermore, since the first and second plates have the same coefficient of thermal expansion, the mold apparatus (10) can have improved durability.

Abstract: A technique of accurately recognizing a semiconductor device and of specifying a package type thereof. By forming, on the package surface, projections having a geometric pattern such as a circle pattern using an ejector pin and by judging only presence or absence of the circular projections using an image processor, it is possible to reduce a risk of recognition failure of the geometric pattern even if the pattern has some omission in the constitutive line thereof or has any addition of a new line. For example, when the circular projections are provided on the surface of a package, an image processor reads only presence or absence of the circular projections even if disconnection of the line or addition of a line should occur, and this allows the circular projections to be always read as being “present”.

Abstract: The present invention relates to a mold having a parting line along dimples which allows manufacturing of golf balls free from burrs, and to golf balls manufactured using such a mold. The mold of the present invention is provided with a spherical cavity inside thereof; and an upper mold and a lower mold separable from each other, wherein a plurality of convex portions for forming dimples is provided in the inner surface of the cavity, at least one of the plurality of convex portions lies over the equator of the cavity, a parting line, which corresponds to the boundary between the upper mold and the lower mold, extends along the inner surface of the cavity, the parting line comprises first lines extending along the peripheries of the convex portions lying over the equator and second lines connecting the first lines, and the first line is disposed apart from the periphery by a distance of 0.1 to 0.5 mm.

Abstract: A die for encapsulating an IC structural body having bonding wires with a molten resin is provided with at least one first half having an ejector-pin-through-hole and at least one second half coupled together to form a cavity therebetween. An ejector pin having a mirror-finished surface at a tip end thereof is inserted into the ejector-pin-through-hole and positioned at a position where a surface of the tip end of the ejector pin coincides with an intermediate surface height of a satin-finished surface formed on an upper inner wall of the cavity of the first half. The IC structural body is then encapsulated with a molten resin, and the mirror-finished surface of the ejector pin and the satin-finished surface of the upper inner wall surface of the cavity are stamped on the semiconductor package in substantially the same plane.

Abstract: A golf ball mold having a non-planar parting surface that is formed a computerized modeling system such as CAD or CAE in combination with a CNC machine tool. The mold is comprised of hemispherical upper and lower mold halves being removably mated along the non-planar parting line that is distinct from the position corresponding to an equator line of the spherical cavity. Each mold half having an interior cavity detail for creating a pattern of dimples on the cover of the golf ball, wherein at least one dimple lies across an equator of the ball and the parting line passes around and between interdigitated dimples without intersecting them, therein creating a “seamless” golf ball. The non-planar surface of the upper mold half comprising at least three true sprues for venting of air and excess material; and at least three false sprues for the placement of tabs on the cover for use in aligning the golf ball as it is spun in a buffing machine.

Abstract: The invention relates to a method and an apparatus for replicating planar, thin-layered, and microstructured flat lens system and optical mask (LM) that are provided with such microstructured lens system which are hardened from a highly viscous transparent fluid on a supporting substrate plate (TP). The fluid is introduced between a plate-shaped master plate (M) and a movable supporting substrate plate and remains joined to said substrate plate after hardening. The inventive method is carried out in a non-rotational manner while the molding space is not delimited by sidewalls or similar in the direction of expansion of the fluid. The inventive flat lens systems or optical masks are embodied as lenticular arrays, field lenses, or Fresnel lenses. The final shape of the mask is homogeneous, has a geometrically accurate layer thickness, and is free from air pockets. The inventive method and apparatus allow for controlled replication at great geometrical accuracy and extremely good optical quality.

Abstract: In one embodiment, a method for molding a molded-in-color panel in a mold includes providing a mold having a first mold member and a second mold member. One of the first mold member and the second mold member has an appearance portion forming surface and the other of the first mold member and the second mold member has a concealed portion forming surface corresponding with the appearance portion forming surface. The concealed portion forming surface forms a concealed portion of a panel and is free of any protuberances and ancillary structural members for facilitating ideal surface characteristics of an appearance portion of the panel. Molded-in-color resin is injected in the mold and cooled to form a molded-in-color panel. At least one ancillary structural member is welded to the concealed portion of the panel.

Abstract: A wedge-lock system for injection molds, using a protrusion on one side of the mold and a mating opening and sets of wedges which act together upon mold closing to provide and maintain accurate centering of the core and cavity halves in reference to each other, to prevent core shifts and compensate for uneven thermal expansion of mold components.

Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.

Abstract: A molding apparatus includes a bottom platen, a bottom mold portion carried by the bottom platen, and a top platen overlying the bottom platen and the bottom mold portion. The top platen includes slots extending therethrough for receiving a molding material. The molding material is to be gravity deposited into the bottom mold portion. A top mold portion is carried by the top platen and is moveable between a molding material loading position and an article forming position. An actuator is coupled to the top mold portion for moving the top mold portion between the molding material loading position and the article forming position. The molding material loading position corresponds to when the top mold portion is non-overlying the bottom mold portion so that the molding material can be gravity deposited therein. The article forming position corresponds to when the top mold portion is overlying the bottom mold portion for molding an article.

Abstract: To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional CCD element 14 mounted thereon. The thermal coefficient of expansion of the heat sink 21 is matched with that of a hollow molded case 12 for integrally molding the heat sink 11 and a lead frame 20. A plurality of projections 21 formed on the side of the hollow molded case 12 are disposed at a bonding interface between the glass cap 13 which closes an upper opening of the hollow molded case 12 and side walls of hollow molded case 12.

Abstract: There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.

Abstract: Molding equipment and related techniques for forming a golf ball are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that extend through the cover layer to and/or into a layer or component underneath are disclosed. The molding equipment provides one or more selectively positionable knock-out pins along the surface of the molding chamber. These pins are specially tailored such that subsequent to molding, the resulting voids are traditional or deep dimples. The molding equipment and related processes are particularly useful when forming the various layers by reaction injection molding.

Abstract: A method is provided for manufacturing a painted plastic component such as painted air bag covers, side cladding or exterior bumpers, which includes a painted film sheet and a one-piece thermoplastic elastomeric structural carrier. A bottom contact surface of the film sheet bonds with a front contact surface of the structural carrier by diffusion between the contact surfaces thereof within a mold cavity of an injection mold separate from the mold cavity of a vacuum mold which is utilized to vacuum-mold the film sheet to form the desired painted plastic component.

Abstract: A waterproof slide fastener and a manufacturing apparatus thereof are disclosed, wherein each fastener element has a coupling head, a neck portion, a body portion, and leg portions which are continuously fused and integrated, a terminal end is projected from a gap between upper/lower half portions of the coupling head, upper/lower flanges of a slider make a sliding contact with a surface of each of upper/lower half portions of each leg portion, each half portion of the leg portion extending from the body portion via a crotch portion and guiding the flanges, two or more leg portions are disposed with a predetermined interval in a sliding direction, an entire shoulder width of a shoulder portion is larger than a body width of the body portion if it is provided, thereby intensifying fixing strength between a fastener tape and fastener elements and waterproofness, and allowing a smooth sliding of a slider.

Abstract: A system and method for manufacturing composite material components having substantially uniform properties comprising means to control the metering of constituent composite material components during manufacture. The resulting composite material components may, for example, be used in the construction of decking systems, railing, porches, fences, stairs, or other similar or suitable applications that may benefit from aesthetically pleasing appearances.

Abstract: A die for encapsulating an IC structural body having bonding wires with a molten resin is provided with at least one first half having an ejector-pin-through-hole and at least one second half coupled together to form a cavity therebetween. An ejector pin having a mirror-finished surface at a tip end thereof is inserted into the ejector-pin-through-hole and positioned at a position where a surface of the tip end of the ejector pin coincides with an intermediate surface height of a satin-finished surface formed on an upper inner wall of the cavity of the first half. The IC structural body is then encapsulated with a molten resin, and the mirror-finished surface of the ejector pin and the satin-finished surface of the upper inner wall surface of the cavity are stamped on the semiconductor package in substantially the same plane.

Abstract: A molding die includes an upper die, upper-die pins arranged in the upper die to be movable up and down, springs arranged in the upper die to urge the upper-die pins downwardly, a lower die, lower-die pins arranged in the lower die to be movable up and down and springs arranged in the die to urge the pins upwardly. In molding, a hollow primary molded piece is accommodated in a cavity defined by the upper die and the lower die. Then, the piece is mounted on the pins with retained apart from a concave bottom surface of the lower die. Before closing the molding die, it is started to inject molten resin into the cavity. As a result, the molten resin enters a space between the primary molded piece and the concave bottom surface of the lower die. Even after completing to close the molding die, the injection of the molten resin is continued.

Abstract: Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective injection of mold resin through a corner gate controlled by a gate block whereby the flow of the mold resin is neither perpendicular nor parallel to the side surfaces of the semiconductor chips arranged in the chip array. In this manner failures associated with the sweeping effects of the mold resin flowing past the bonding wires on the semiconductor chips may be reduced.

Abstract: A machine for moulding containers, comprising a unit for extruding plastic tubes, a blow-moulding unit, a mould for containing containers which is formed by two half-moulds movable, upon operation of associated first actuator, in a longitudinal direction (X-X) and symmetrically with respect to a fixed axis (Z-Z) perpendicular to said longitudinal direction, the unit formed by the mould and by the associated first actuator being movable, upon operation of second actuator, in a transverse direction (Y-Y) from a first position where it is substantially aligned with the extrusion unit into a second position where it is substantially aligned with the blow-moulding unit and vice versa, said first actuator for operating the half-moulds in the longitudinal direction comprising at least one motor, the shaft of which has, keyed thereon, a cam for actuating a pair of connecting rods which are arranged in-line and are respectively connected to the first half-mould and to the second half-mould.

Abstract: A method for the manufacture of plastic products in a mold (2), provided with at least one label, comprising the steps of: feeding a strip of film comprising at least one label; feeding-through the strip of film (34) over a joining surface of the mold in open condition such that said label (36) is positioned between two parts (47, 48) of a mold cavity of the mold; closing the mold such that said label is stored in said mold cavity; moving a moveable wall part (8) of the mold cavity within the mold cavity such that said label is pressed from said strip of film; injecting plastic into the mold cavity for forming a product therein such that the label is attached to or on the product.

Abstract: An improved mold for making a golf ball comprises a pair of mold cups which are assembled together at an angular interlock. An upper mold cup has a projection rim that mates with a recess in the lower mold cup to provide for a substantially perfect registration, wherein the shift on the molded golf ball is minimized, and the parting line has a minimal amount of flashing that needs to be removed. The upper and lower mold cups have mating surfaces that can produce a corrugated parting line. Each mating surface comprising a plurality of peaks and valleys which are created by multiple radii, whereby when assembled the parting line follows the dimple outline pattern and allows the dimple outline pattern of one mold cup to interdigitate with the dimple outline pattern of the mating mold cup, to form a golf ball of substantially seamless appearance.

Abstract: A mold for fabricating a device for repairing torn tissue or muscle such as the meniscus of the knee is provided. The mold includes a mold cavity adapted to receive molten material. The mold cavity has an inlet channel, a first portion, a second portion, and a first channel extending between the first and second portions. The inlet channel communicates with the first and second portions and is spaced from the first channel such that the molten material must flow from the inlet channel through the first portion or second portion before communicating with the first channel. The first channel is dimensioned to receive a first component such that the flow of molten material from the first and/or second portions into the first channel is substantially prevented when the first component is received in the first channel.

Abstract: A method and assembly for molding golf balls is disclosed herein. The invention includes an injection mold assembly (20) with a first mold half (22a) having a plurality of cavities and at least one locating pin (92) and a second mold half (22b) having a plurality of cavities and at least one aperture for engagement with at least one bushing (94) and a spring (250) for exerting a lateral force against the second mold half (22b). Preferably, the locating pin has a first taper section (93) and a second taper section (95). Preferably, the bushing (84) has a first cavity 1(1150 and a second cavity (117).

Abstract: An apparatus and method of forming a vessel is disclosed, wherein a plurality of bosses are disposed in a pattern die having a die cavity with a desired shape, a material is extruded through the mold, the material is blow molded to take the shape of the cavity, and the bosses are adhered to the material.

Abstract: A process for making a toothbrush head comprising widthways adjacent sections, the process comprising the stages of first making the head in an injection moulding process with the sections relatively spaced apart from each other in a widthways direction, then secondly moving the sections of the so formed head relatively spaced closer to each other in a widthways direction. An apparatus for performing the process is also disclosed.

Abstract: An apparatus and method for demolding golf balls from a mold cavity are disclosed. More specifically, an apparatus and method for demolding a golf ball from a mold cavity subsequent to forming a cover layer without the use of ejector or knockout pins are disclosed. The molding apparatus utilizes an undercut configuration that, upon opening the molds after molding a golf ball, serves to impart a rotational force upon the ball and dislodge it from the molds.

Abstract: At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7, is sandwiched between the top mold member 10 and bottom mold member 20, a movable disc 12 is urged by a spring device 13, into close engagement with the bottom mold member 20. While the movable disc 12 is closely engaged with the bottom mold member 20, the stack 2 of the resolver is sandwiched between the bottom mold member 20 and the top mold member 10. This method prevents the generation of gaps between the stator stack 2 and mold 10, 20 due to unevenness of the thickness in the stator stack 2.

Abstract: An In-Mould Labelling process comprising: clamping a label within a mould void of an injection moulding tool; and injecting material into the mould void while the label is clamped. An In-Mould Labelling process comprising: placing a label between a first mould void and a second, separate mould void; and injecting material into the first and second mould voids.

Abstract: An apparatus for manufacturing a semiconductor device is provided. The semiconductor device includes a chip packaged with a resin mold. The apparatus includes a first mold, a second mold, and a buffer sheet. The first mold has a first cavity for forming the resin mold on a first side of the semiconductor device, and a convex part for forming an exposed area of the chip. The second mold has a second cavity for forming the resin mold on a second side of the semiconductor device. The buffer sheet is disposed between the convex part and the chip for covering the exposed area.

Abstract: The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.

Abstract: A replaceable cavity insert for use in a multi-cavity compression mold, wherein each cavity insert is friction fitted into a respective mold recess. Each insert has a substantially semi-spherical insert surface and defined in the surface is an inverted dimple pattern of a golf ball. Each cavity insert has an O-ring recessed in the upper perimeter to limit the flow of heating and cooling fluids beyond the perimeter. The cavity insert and the O-ring are retained in the recess of the frame by a pair of removable cavity retainer screws and washers, which are countersunk into the frame and have an edge of the washer disposed in a cut-out section of the insert. Each cavity insert may be separately and individually removed from the frame by just loosening the retaining screws without the need to remove the entire frame from the press or disconnecting the utility lines leading to the frame.

Abstract: A process and manufacturing system for manufacturing injection molded parts with integrated flexible printed circuit board (9), provided with a cover (39/47) of plastic, fixed in a recess (2) of a carrier strip (1) by projecting carrier elements (14, 15, 16, 17). A circuit board (9) fixed in the carrier strip (1) is inserted into the cavity (21) of first casting mold half (20) of an injection mold, held in position by the carrier elements (14 through 17). The cavity (21) of the first casting mold half is closed by a closing mold part, which has no cavity, including the printed circuit board (9), and the cavity (21) is filled with injection molding compound in a first casting operation. The closing mold part (35) is removed and replaced with a second casting mold half (45) with a cavity (46), which is filled with injection molding compound in a second casting operation.

Abstract: The disclosure relates to a tool (1a, 1b, 2)for injection moulding of an opening arrangement (20) of plastic in a hole in a packing material (9), the hole defining a hole edge (8) and the tool displaying a mould cavity (7) which surrounds the hole edge (8) together with a part of a first side (9a), as well as a part of a second side (9b) of the packing material in connection with the hole edge, the mould cavity (7) displaying an inlet (10) for molten plastic and, opposing the inlet, an end gap (11) for the extension of the packaging material (9) out of the tool, the inlet (10) displaying a deflection from a first flow direction (F1) in a flow gap (5) to a second flow direction (F2) into the mould cavity (7). According to the invention, the tool (1a, 1a) displays, at said inlet (10), a throttle lip (12) which projects in a direction which substantially coincides with said first flow direction (F1).

Abstract: A method for producing a fiber molded article comprising the step of transferring a fiber molded article 10 formed in a papermaking mold 2 composed of splits 20 and 20? to a split 30? of a drying mold 3, in which the papermaking mold 2 is once opened while attracting the fiber molded article 10 to the inner surface of the split 20? by suction to separate the fiber molded article 10 from the inner surface of the split 20, the papermaking mold 2 is closed, the suction by the split 20? is stopped, the papermaking mold 2 is opened again while attracting the fiber molded article 10 to the inner surface of the split 20 to separate the fiber molded article 10 from the split 20?, the split 20 is joined with the split 30?, the fiber molded article 10 is attracted to the inner surface of the split 30? by suction, and the fiber molded article 10 is separated from the split 20.