Abstract: Overmould comprising a base having a central section, from a first side of which hooks project which form the male part of a self-gripping member, two sections forming selvages, laterally from each side of the central section, and magnetic means which can cooperate with a magnet in order to attract the overmould, is characterized in that the selvages each comprise at least two ribs, preferably at least three or four ribs, which project from the selvages on the same side of the base as the hooks.

Abstract: A molding mold and a molding method are disclosed, for molding a flange configuration in which a flange of a reel hub portion can be maintained in a predetermined configuration. Also a tape cartridge is disclosed, which can securely prevent a tape-shaped recording medium from touching at the flange while the tape cartridge is being used.

Abstract: An integrated circuit leadframe has a pair of leadframe rails that are specially treated to adhere to injection mold compounds to a lesser or greater degree than portions of the leadframe rails outside of the treated areas. By adhering to mold compounds to a greater degree, mold compound not removed during a deflashing procedure does not flake off to form mold compound debris during a trimming and forming procedure. By adhering to mold compounds to a lesser degree, substantially all of the mold compound is removed during the deflashing procedure so there is no mold compound to flake off to form mold compound debris during the trimming and forming procedure. The leadframe rails may be treated by forming apertures in the rails, by increasing or decreasing the roughness of the leadframe rails, or by coating the leadframe rails with an adhesion promoting or reducing material.

Abstract: A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such that corners of the body segments do not include the trapped air.

Abstract: Molding apparatus for rapid transfer of molten resin or pitch in an infiltration molding process. The apparatus includes e.g. an extruder (4) for melting and conveying a resin or pitch and a mold (10) arranged so that resin or pitch is conveyed to a mold insert cavity (19) within the mold. The mold insert contains an internal protrusion such as a locating ring (25) for positioning a porous body (1, 18) within the mold insert cavity in a position that brings about unidirectional flow of the molten resin or pitch through the porous body. Also, rapid resin or pitch infiltration molding process that includes injecting a high melting point, high viscosity, molten resin or pitch into the mold to effect a unidirectional impregnation of a heated preform via a pressure gradient in the mold.

Abstract: A mold used to form a rubber or resin article which includes a shaping surface for shaping a surface of an object to be molded, and a vent structure for releasing air between the shaping surface and the surface, wherein the vent structure includes EDM vents each having a gap of not more than 0.1 mm at the shaping surface.

Abstract: A mold for molding semiconductor devices mounted on a package substrate is provided. The mold comprises a top mold and a bottom mold. The top mold has a top runner, at least a first dummy runner and a plurality of mold cavities. The first dummy runner connects with the top runner and the top runner extends into a space between the mold cavities. The mold cavities for accommodating the semiconductor devices are connected to the top runner. The bottom mold has a bottom runner and at least a second dummy runner. The second dummy runner connects with the bottom runner. The second dummy runner is above but separated from the first dummy runner by the package substrate.

Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.

Abstract: A machine for the manufacture of flexible moulds is described, in particular for the obtainment of lipsticks or the like, which comprises a female mould including at least one moulding cavity fillable with a plastic fluid, a male mould including at least a male stem and means to insert said male stem into said cavity of the female mould after the same has been filled with said plastic fluid and to extract it from the same after a prefixed cooling period suitable to transform said fluid plastic into a flexible mould.

Abstract: The present invention is directed to a mold and method for forming a golf ball with at least a core. The mold and method comprise or use members with projections for forming multiple dimples on the core. The members can be retractable pins or sleeves or vent pins. In the case of the retractable pins, sets of pins with multiple dimple projections on the ends thereof are used to center the golf ball core within the mold. The members can have circular or non-circular cross-sections so that the dimple-forming projections can conform to any dimple pattern.

Abstract: Systems, methods and apparatuses for manufacturing dosage forms, and to dosage forms made using such systems, methods and apparatuses are provided. Novel compression, injection molding, and thermal setting molding modules are disclosed. One or more of such modules may be linked, preferably via a transfer device, into an overall system for making dosage forms. The injection molding module having at least one mold shell with an interior surface capable of producing non-uniform coatings over compressed cores or molded inserts contained therein.

Abstract: A mold is provided in which a molding portion, formed between joint surfaces of upper and lower molds superimposed one upon the other, is filled with UV curable resin after arranging a coating formation portion of an optical fiber in the molding portion, the coating formation portion is coated with the UV curable resin when the resin is cured by irradiating light thereto from outside, and a shading plate is arranged in the periphery of the molding portion. In a case equipped with the mold, there is provided a mirror or a lens for reflecting UV light to UV curable resin.

Abstract: This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.

Abstract: A device for impregnating an insulation of a winding bar of an electric machine includes a container accommodating the winding rod and connected to a tank containing an impregnation agent. The container, which remains open during the impregnation process, is surrounded by an evacuation container to create a negative pressure within the container. To achieve a more rapid penetration of the impregnation agent and to simplify the overall process, a vacuum-tight sleeve acts as the container, the sleeve being encompassed by a pressure-resistant sleeve, and a conduit of an assembly that generates a vacuum leads into the interior of the sleeve. The impregnation agent is supplied with a pressure that is lower than the prevailing pressure in the pressure-resistant sleeve. The container can be a multi-part tool defining an interior for surrounding and accommodating the winding bar in a positive fit at least during an evacuation and impregnation process.

Abstract: A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air vent being provided on an opposite side from the resin inlet with respect to the cavity.

Abstract: A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by the fixed platen; a movable die being held by the movable platen; an open-close mechanism including a screw shaft connected to the movable platen, the open-close mechanism turning the screw shaft so as to move the movable die to and away from the fixed die, whereby the dies can be opened and closed. The fixed die can be taken out from the fixed platen in the direction crossing the open-close direction of the movable die.

Abstract: A resin transfer molding (RTM) process is disclosed for rapidly filling a fibrous preform and/or a rigid, porous body with high viscosity resin or pitch. The process is suitable for impregnated multiple porous bodies stacked in a single mold. The process uses a fibrous preform or rigid porous body which is placed into a mold matching the desired part geometry. A resin is injected into the mold at temperature and pressure. After cooling, the infiltrated component is removed from the mold. The mold is constructed from two halves fitted to form at least one mold cavity. A gate fitted with a nozzle is set into one of the mold halves, and a valve admits resin or pitch into the gate area. Venting or vacuum can be applied to the mold. The mold is held in a hydraulic press and an extruder, optionally fitted with an accumulator, supplies molten resin or pitch to the mold.

Abstract: According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that includes a first non-planar surface and a second mold plate that includes a second non-planar surface. The first and second non-planar surfaces form upper and lower surfaces of a mold cavity when the first and second mold plates are engaged. The mold tool also includes a distribution system coupled to the mold cavity. The distribution system transfers a mold compound into the mold cavity to substantially encapsulate an integrated circuit. The distribution system includes a gate runner coupled to the mold cavity. The gate runner funnels the mold compound into the mold cavity. The distribution system also includes a bridge insert that decreases wear on the gate runner as the mold compound is transferred through the gate runner.

Abstract: A multi-chip package comprises a double-sided circuit board having first and second surfaces. Each surface has a package area and a peripheral area. Each package area has a chip mounting area on which a chip is attached, and a bonding area with which the chip is electrically connected. The peripheral area of the first surface has a runner area on which molding compound flows, and the peripheral area of the second surface has external connection pattern with which the bonding areas are electrically connected. In particular, the circuit board has gate holes, which are co-located on each surface to result in a common hole.

Abstract: A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen with a single cavity for encapsulating substantially the entire second chip side of the carrier substrate. Support elements are provided for supporting the multi-chip carrier substrate. The support elements are configured to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The support elements may be integral to a mold cavity or may be removable. The support elements may further be aligned along lines representing a series of individual device packages. The molded assembly may then be cut along marks left in the encapsulant to define individual device packages.

Abstract: Disclosed is an injection mod for a display panel of a washing machine, by which the display panel can be simply formed in one body. The present invention includes a first mold having a first film attached to an inside and a second mold assembled to the first mold to form a cavity with the first mold, the second mold having a second film attached to an inside, the second mold having a gate communicating with an opening provided to the second film.

Abstract: The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with resin. The resin molding machine comprises: a press section having a molding die; a cavity plate having a cavity hole, which defines a shape and thickness of a resin mold section of the work; a mechanism for repeatedly carrying the cavity plate into and out from the press section; and a mechanism for positioning the cavity plate onto the molding die.

Abstract: A mold for a golf ball includes an upper portion (1) and a lower portion (3). A large number of projections (7) for dimple formation are provided on a cavity surface (5) of each of the upper portion (1) and the lower portion (3). A parting surface (8) of the upper portion (1) and the lower portion (3) has a concavo-convex shape. The parting surface (8) includes a first horizontal plane (13), a second horizontal plane (15) and an inclined surface (17). Circumferential central angles ? of the first horizontal plane (13) and the second horizontal plane (15) are 55 degrees or less. A total value ?? of the circumferential central angles ? is 30 degrees to 330 degrees. An inclination angle ? of the inclined surface (17) to a horizontal direction is 10 degrees to 60 degrees. A central angle ? between the horizontal planes (13) and (15) and an equator (E) is 1 degree to 8 degrees. A boundary corner portion of the horizontal planes (13) and (15) and the inclined surface (17) is subjected to rounding.

Abstract: A method and molding tool for the molding of both one- or multi-component parts preferably comprising plastic material which may be integrated together with parts of another material, such as steel and copper, where the turnable middle section during the molding process is supplied with material on at least one of the surfaces thereof, that in contrast to the normal procedures are not at a right angle to the closing direction between the stationary mold part and the movable mold part of the tool. This can be realized by molding a part or a piece of a part and/or by molding around a special part for the in-molding on at least one of these surfaces of the turnable middle section. This molding and/or insertion can take place while the tool is closed and can be performed on several surfaces at the same time in order to save cycle time.

Abstract: A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The encapsulation compound has a plurality of side areas (812) reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed (813) along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.

Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.

Abstract: An injection moulding process for making a toothbrush involving a stack mould assembly of at least three mould blocks (1, 2, 3, 4) arranged for use along a longitudinal stack axis (A—A), with two end mould blocks (3, 4), and an intermediate mould block (1, 2), with part mould cavities (11A, 21, 31, 41, 51) in the blocks. Plastic toothbrush skeletons are made in a cavity (11A, 21, 31) between the intermediate block (1, 2) and one end block (3), then elastomer parts are made in a cavity (41, 51) between the intermediate block (1, 2) and the other end block (4). Preferably the intermediate block (1) rotates so its part cavity (11A) faces the other end block (4). Stack mould assemblies (1, 2, 3, 4) for this process are provided. The assembly (1, 2, 3, 4) provides a compact mould with high output.

Abstract: A manufacturing device for a synthetic resin hollow molded body molds a first split assembly member, a second split assembly member, and a third split assembly member by a first injection, and joints each of contact portions of the three members with a corresponding contact portion by a second injection. The manufacturing device includes an ejecting mechanism which moves the second split assembly member in a die opening/closing direction, a rotating mechanism which rotates the third split assembly member around a shaft center in the die opening/closing direction, and a sliding mechanism which slides the second split assembly member and the third split assembly member in a direction perpendicular to the die opening/closing direction.

Abstract: The invention concerns a device for making soft cheese or fresh paste cheese comprising at least a first set of perforated cheese-moulds and at least a second set of perforated cheese-moulds arranged in a chamber. The invention is characterized in that said first and second sets of cheese-moulds are designed to be fitted one into the other.

Abstract: Molding equipment and related techniques for forming a golf ball with one or more deep dimples are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that extend through the cover layer to and/or into a layer or component underneath are disclosed. Preferably, the deep dimples are at least twice the depth of conventional dimples, more preferably, three or four times the depth of the conventional dimples. The deep dimples may be spherical or non-spherical, and the portion of the dimple that extends to or into the next inner layer may be the same or different shape as the outer portion of the dimple.

Abstract: An apparatus and related techniques for making a golf ball with deep dimples are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides deep dimples that extend through the cover layer and/or into a layer or component underneath are disclosed. At least one percent (1%), preferably about five percent (5%), of the dimples of the ball comprise deep dimples. The cover may be a single layer or include multiple layers. If the cover is a multi-layer cover, the dimples extend to or into at least the first inner cover layer, and may extend to or into two or more inner cover layers. If the cover is a single layer, the dimples extend to or into the core. The dimples may be spherical or non-spherical, and the portion of the dimple that extends to or into the next inner layer may be the same or different shape as the outer portion of the dimple.

Abstract: Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold to inject a molding compound that will encapsulate the semiconductor devices in the mold. The plurality of plungers are assembled with the plunge block to operate at the same time. Each of the plurality of plungers includes a load sensor and/or a contact sensor, so as to sense separately whether the plungers are improperly operating.

Abstract: An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.

Abstract: Disclosed herein is a press and mould apparatus for moulding cementitious articles comprising a precast mould and a press head having a pressing surface and being moveable between precast mould engaging and disengaging positions, wherein the pressing surface comprises a coating of deformable and resilient material such as urethane. Also disclosed is a process for moulding building blocks. This process comprising filling a precast mould with material, such as concrete, this is to be pressed; and pressing the material with a pressing surface comprising a deformable and resilient coating so as to solidify the material into a green shape ready for cutting.

Abstract: The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so that the leadframe space acts as a virtual gate. This reduces the need for trimming and lowers stress on the finished package.

Abstract: A first injection mechanism of an apparatus for molding articles injects coating material into a cavity defined in a clamped mold, thereby forming a predetermined coating on the inner surface of the cavity. After the coating material is injected into the cavity, a decompression mechanism lowers the pressure in the cavity through at least one vent. After the coating is formed on the inner surface of the cavity, a second injection mechanism injects molding material into the cavity. When the pressure in the cavity is being lowered, an opening-closing mechanism opens the vent. Before or during the injection of the molding material, the opening-closing mechanism closes the vent.

Abstract: Method and apparatus for manufacturing a synthetic resin-made hollow member incorporating an intermediate element are provided which enable operations of molding half bodies, abutting and joining the half bodies together, and molding an intermediate element in a series of steps, and which eliminate the necessity of such a manual work as may otherwise be required in incorporating the intermediate element into the half bodies. A pair of rotary injection molding dies are used which can be opened and closed relative to each other and are rotatable relative to each other over an angle of 60° for each turn, each die having a half body molding section including one male molding portion and two female molding portions in the direction of rotation for each rotational run over an angle of 120°, each die also having an intermediate element molding portion provided between specified half body molding portions in the direction of each rotational run over an angle of 120°.

Abstract: A molding apparatus for molding semiconductor devices using a molding compound in which a mold is automatically treated with a mold releasing agent is provided. A lead frame strip in-magazine part and a tablet loading part are designed so that dummy lead frame strips and releasing tablets used in a mold releasing agent treatment process are automatically supplied to the molding apparatus in a mold releasing agent treatment mode or a mold cleaning mode. After the mold releasing agent treatment mode or mold cleaning mode is complete, the molding apparatus is switched back to a normal molding process and normal lead frame strips and molding compound tablets are to the mold part. In addition, a pick-up part and a stack magazine part are designed to distinguish by-products generated during the mold releasing agent treatment process from normally molded products by switching from a normal molding process to either a mold releasing agent treatment process or a mold cleaning process.

Abstract: A form, fill and seal packaging machine for forming, filling and sealing a carton, molds a closure directly onto the carton. The machine includes a carton erection station adapted to receive a carton in a generally flat form and to erect the flat form carton into a tubular form defining an internal carton region. A direct injection molding station has an internal mold tool and an external mold tool. The internal mold tool is configured for receipt within the internal carton region and the internal mold tool and the external mold tool are configured to receive and clamp the carton therebetween. The direct injection molding station further includes a polymer injection system for injecting polymer from a location external of the carton to the internal mold tool. The closure is directly molded in place on the carton. A mold tool set, a method for carrying out the molding and a closure molded thereby are also disclosed.

Abstract: Apparatus for manufacturing a multicolor slide fastener includes an upper die 110, a lower die 120, and a plurality of unit fastening teeth-forming slots 101 formed in a lengthwise direction. Molding material-injecting passages and a plurality of sprue holes 102 are provided for injecting the molding materials S into the slots 101. Inclined passages 201 and 202 are connected to the molding material injecting passages respectively, for carrying the molding materials S from a raw material source. Heaters 240 and heat sensors 241 heat the passages 201 and 202. Pressing means 300 press the molding materials S into the inclined passages 201 and 202. Valves 400 control injection of the molding materials S into the sprue holes 102 of the upper die 110.

Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.

Abstract: A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen with a single cavity for encapsulating substantially the entire second chip side of the carrier substrate. Support elements are provided for supporting the multi-chip carrier substrate. The support elements are configured to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The support elements may be integral to a mold cavity or may be removable. The support elements may further be aligned along lines representing a series of individual device packages. The molded assembly may then be cut along marks left in the encapsulant to define individual device packages.

Abstract: In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit, a middle-mold cleaning unit, and an ejecting pressing unit adapted to separate an encapsulated object, a runner, and a gate from the middle mold. Resin encapsulation molding is performed in the circulating process described above.

Abstract: A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

Abstract: A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.

Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.

Abstract: A solid golf ball includes a core formed from a rubber composition and a cover directly covering the core. The cover is formed from a cover material mainly containing a thermoplastic urethane resin by injection molding using a mold composed of upper and lower mold halves. The core has a hardness, expressed by a deflection measured under an applied load of 5 kg to 130 kg, in a range of 2.0 mm or more. The cover has a thickness in a range of 0.9 mm to 1.7 mm. Assuming that a parting plane of the upper and lower mold halves is taken as an equator, each of the upper and lower mold halves has air vent portions in a region within a radius of 10 mm, measured as that projected on the equator plane, from a pole of the mold half. The total length of gaps of the air vent portions formed in the upper and lower mold halves is in a range of 90 mm or more. The width of each of the gaps of the air vent portions is in a range of 0.01 to 0.08 mm.

Abstract: A coil of tubing can have either adjacent tubes or tubes with a space therebetween. To hold the tubes in place a material such as an adhesive can be placed across the top of the coil, on the bottom of the coil or both to hold the coil in place. The material can also envelope the coils such that the coils are banded. The coils may have a length of a straight portion of tubing prior to the coil beginning and an angled portion on the inside diameter for inserting or extracting a product in the tubing which may be similarly retained. The tubing may be coiled by insertion between two templates. The templates have injection ports for inserting material to hold or encase the tubing. Thus the tubing may be inserted in the templates, a material to hold the tubing in the coiled position inserted and the coiled tubing removed from the templates ready for use in their coiled position with the material on the tubing holding the tubing in the coiled position.

Abstract: The present invention is directed to an apparatus and method for venting trapped air and gasses in a mold. The mold and method comprise or use at least one pin formed from multiple pin sections. When assembled, the pin sections provide space on the interior of the pin through which trapped air and gasses can escape from the mold. The present invention may also be used to assist in ejecting an object from the mold. The pins can have circular or non-circular cross-sections and also may have dimple-forming projections to conform to a golf ball dimple pattern.

Abstract: A rotor 1 can prevent from cracking a magnet when molding the rotor and a molding die for the rotor can prevent from reducing yield of rotors. The rotor 1 formed into disk shape includes a rotor body 12 and an annular shape magnet 13. The rotor body 12 has inner and outer cover portions 18, 19 for covering respectively inner and outer surfaces 13a, 13b of the magnet 13, and first and second end cover portions 20, 21 for covering respectively one end face 13c and the other end face 13d of the magnet 13. The rotor 1 is formed by injection molding with the molding die, whose a cavity receives the magnet 13.