Abstract: A mold for forming a golf ball makes it possible to form minute dimples, and to improve mold release properties of the mold and wettability of the mold by a material when a urethane material is used for a cover layer. A mold according to the present invention is a mold for forming a urethane cover as an outermost layer of a golf ball, and includes: at least two split molds that are separably joined with each other, and that includes a cavity formed therein by the joining, the cavity being for forming the urethane cover; protrusions that are formed on a cavity surface of the split molds to form dimples of the golf ball; and a composite plating film that covers the cavity surface of the split molds, that comes into contact with a material of the urethane cover, and that contains a nickel-based matrix and fluororesin particles dispersed in the nickel-based matrix.

Abstract: A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.

Abstract: An apparatus for molding a semiconductor device includes an upper mold chase and a lower mold chase. The mold chases are capable of being aligned with each other, forming spaced cavities for receiving a lead frame array that includes semiconductor dies for encapsulation. The cavities are aligned in spaced, vertical columns and gates are provided at the opening of each column of cavities. A molding compound is passed through the gates and flows uninterrupted through each cavity and encapsulates the semiconductor dies.

Abstract: There are provided a first mold 2 and a second mold 1 that can be brought into and released from contact with the first mold 2. A substrate 70 provided in both the molds 1, 2 and mounted with electronic components is subjected to resin sealing and molding by filling with resin of cavities formed by both the molds 1, 2. The second mold 1 is placed on a base plate 9 so as to be capable of horizontally reciprocating, and has a cavity block 7 that can be brought into and released from contact with the first mold 2 and a mold clamping mechanism 16 that supports the cavity block 7 and that brings and releases the cavity block 7 into and from contact with the first mold 2 so as to perform mold clamping. On the base plate 9 is provided a horizontal actuation mechanism 11 for moving the second mold 1 to a facing position where the second mold 1 faces the first mold 2 and to a non-facing position where the second mold 1 has been moved sideways from the facing position.

Abstract: An insert mould tool for moulding an annular moulded portion onto an insert such as a filter sheet of a filter cartridge comprises a plurality of mould pieces and means for applying pressure to the mould pieces. Each mould piece comprises complementarily shaped mating surfaces and can be assembled to define an annular mould cavity intersecting at least one mating surface for defining the shape of the moulded portion and an insert-receiving cavity for receiving a portion of the insert. The insert-receiving cavity comprises a sealing portion extending radially inwardly of the annular mould cavity for sealing receipt of a portion of the insert, the sealing portion being exerting a substantially evenly distributed pressure across an area thereof when pressure is applied to the mould pieces. Also disclosed is a method of insert moulding, and a filter cartridge.

Abstract: The present invention relates to a mold having a parting line along dimples which allows manufacturing of golf balls free from burrs, and to golf balls manufactured using such a mold. The mold of the present invention is provided with a spherical cavity inside thereof; and an upper mold and a lower mold separable from each other, wherein a plurality of convex portions for forming dimples is provided in the inner surface of the cavity, at least one of the plurality of convex portions lies over the equator of the cavity, a parting line, which corresponds to the boundary between the upper mold and the lower mold, extends along the inner surface of the cavity, the parting line comprises first lines extending along the peripheries of the convex portions lying over the equator and second lines connecting the first lines, and the first line is disposed apart from the periphery by a distance of 0.1 to 0.5 mm.

Abstract: A man-made, molded article is provided. The article includes a profile including a planar wall, and an adjacent integral molded depression having a contoured wall extending downwardly from the planar wall. The contoured wall includes a bead portion, a cove portion, and a ledge between the bead and cove portions. The articles are stackable, one above another for transport, in a nestable relationship in which multiple contact zones are present between the contoured walls of an adjacently stacked pair of the molded articles. The contact zones include an arcuately extending contact interface zone between the bead exterior and interior surfaces. The depression has a substantially uniform thickness varying by no more than about +1 percent to about ?11 percent in relation to a thickness of the planar wall. Related methods and assemblies are also provided.

Abstract: The present disclosure relates to a handheld clamp device for applying heat to a golf ball. The clamp may have two lever arms each attached at one end to a pivot. A golf ball receiving unit may be attached to each lever arm at the opposite end as the pivot. Each golf ball receiving unit may include a heating element. The internal heating surface of each golf ball receiving unit may contain a pattern, which can be a dimple pattern. When in use, the handheld device may heat the surface of a golf ball such that the pattern on the internal heating surfaces forms a dimple pattern into the surface of the golf ball. The handheld clamp device may be included as part of a kit, along with multiple sets of golf ball receiving units, and sometimes at least one golf ball.

Abstract: There are provided a mold for forming a golf ball, which allows a dimple formed near the equator of golf ball corresponding to the partition surface of upper and lower molds to be formed so as to have the same shape as that of a dimple formed in other regions, and a golf ball manufactured using this mold. The mold for forming a golf ball in accordance with the present invention includes at least two body parts, a cavity is formed within the mold by the joining of the at least two body parts, and in at least one of the body parts, a groove for forming a projecting land part which is ground after the formation of the golf ball is provided in a cavity wall surface adjacent to the whole circumference of a parting line formed by the joining.

Abstract: A golf ball mold that is provided that has of a plurality of mold parts which removably mate to form a cavity having an inner wall with a plurality of dimple-forming protrusions thereon, wherein a non-circular resin injection port for injecting into the cavity a resin material is formed between a plurality of mutually adjoining dimple-forming protrusions which include a plurality of dimple-forming protrusions that lie across a parting line of the mold. By using the golf ball mold of the invention, even when manufacturing golf balls with a high dimple surface coverage on which the dimples are tightly arranged, particularly up to the vicinity of the resin injection port, imbalances in the resin injection pressure and flow rate during injection molding are suppressed, enabling golf balls to be manufactured without giving rise to production problems such as molding defects, scorching, or deformation and eccentricity of the core.

Abstract: A golf ball that, in the process of spherical grinding after forming, can maintain the dimple shape and achieve the designed dimple surface occupation ratio. A mold for forming a golf ball of the present invention has at least two body parts, a cavity being formed within the mold by the joining of the at least two body parts, the body part comprising a cavity wall surface which has a spherical surface shape with the center thereof being at the center of the cavity and dimple-forming protrusions provided on the cavity wall surface, the dimple-forming protrusions being connected to the cavity wall surface at an angle of about 60 or more degrees in a region from about 3 ?m to about 20 ?m from the cavity wall surface.

Abstract: An apparatus for forming a plastic molded collated fastener assembly includes a conveyor for carrying a plurality of fasteners in a horizontal plane defining an upper surface and a lower surface, a preheater for preheating the plurality of nails and a plastic collation molding station. The molding station includes injection nozzles for applying molten plastic to the upper surface of the fasteners and to the lower surface of the fasteners. The station further includes forming wheels including a holding section to, in cooperation with the conveyor, secure the fasteners. The wheels include a forming section to mold the molten plastic to the fasteners to form a collation having a collar encircling the fasteners' shanks and a connecting portion extending between the collars. The apparatus includes at least one cooling spray nozzle to spray a cooling vapor onto the fasteners and collations and at least one cooling spray nozzle to spray a cooling vapor onto the forming wheels.

Abstract: A method and apparatus for depositing a phosphor via a compression molding process, the method involving forming a plurality of light-emitting devices on a wafer, evaluating emission characteristics of the plurality of light-emitting devices, and re-arraying and aligning the plurality of light-emitting devices on a carrier substrate according to the emission characteristics; depositing the phosphor on the plurality of re-arrayed light-emitting devices via a compression molding process; and dicing the plurality of re-arrayed light-emitting devices on the carrier substrate.

Abstract: A mold assembly for insert-molding a heterogeneous object includes an upper mold and a lower mold. The upper mold includes a cavity for accommodating an insert object. The lower mold includes a rigid body and a resilient contact member for resting the insert object. The resilient contact member absorbs dimensional variations of the insert object during the insert molding process.

Abstract: The invention provides a golf ball mold that includes a mold body configured as a plurality of mold parts which have at least a parting surface that defines a parting line at a golf ball equator and removably mate to form a cavity having an inner wall with a plurality of dimple-forming protrusions thereon, and a support pin which has an end face with a plurality of dimple-forming protrusions thereon and is extendable into and retractable from the cavity. The support pin extends into the cavity to support a center sphere and, when in a retracted state, the end face thereof defines a portion of the inner wall of the cavity. The end face of the support pin includes a pole of the cavity and has a peripheral edge which intersects a parallel of latitude at 10 degrees from the pole. Using the golf ball mold of the invention, good molded pieces which do not give rise to problems such as appearance defects and irregular flash can be easily and reliably obtained, helping to improve golf ball productivity.

Abstract: A golf ball comprises two generally hemispherical portions joined together at a parting line and comprising dimples on respective outer surfaces thereof. The parting line comprises a repeating pattern of curved segments alternating with straight segments. The parting line crosses a geometric equator of the golf ball, and wherein the parting line intersects at least one dimple bordering the equator. A mold for producing a golf ball is also described.

Abstract: Molds are disclosed for forming golf-ball covers by casting. An exemplary mold includes first and second support members that are placeable in face-to-face opposition to each other. At least one respective mold-cavity insert, defining a respective hemispherical cavity, is mounted to each support member. The mold-cavity insert is floatable in at least three (e.g., x, y, z) degrees of freedom relative to the respective support member. Each mold-cavity insert on the first support member is in face-to-face opposition to a respective mold-cavity insert on the second support member whenever the support members are in face-to-face opposition to each other, such that the respective hemispherical cavities of each opposing pair of inserts form respective spherical ball-cover cavities. A respective z-direction bias is associated with each mold-cavity insert. Also, a respective self-centering device is associated with each opposing pair of inserts.

Abstract: A chewable animal toy having an edible core and a tearable outer shell molded around the edible core such that a portion of the edible core protrudes from the outer shell is provided. Further provided is a mold unit for making the chewable animal toy having a first mold half including a first mold cavity and a second mold half having a second mold cavity. The second mold half is engageable with the first mold half such that the first and second mold cavities cooperatively define an outer shell mold cavity. A first pocket is defined between the first and second mold halves that is adapted to receive a first protruding portion of the edible core. A first shut off defined within the first pocket is adapted to surround the first protruding portion of the edible core such that it is substantially isolated from the outer shell mold cavity.

Abstract: A gymnastic tool (1) is formed by at least two impermeable external walls (2, 3) which are each concave shaped and provided with respective edges (4,5). The at least two impermeable walls (2, 3) are mutually fixed together by a connector (6), the gymnastic tool having at least one inner cavity.

Abstract: Disclosed is a gypsum board forming device which provides improved slurry spread. The device includes a forming table with an arcuate or angled profile that promotes a uniform slurry spread. An arcuate or angled hinge plate can also be included to further promote the uniform distribution of slurry prior to an extrusion plate. As a result of the improved slurry spread, gypsum board with increased strength and durability can be created.

Abstract: The invention concerns a mold for forming a single-use floss holder containing a length of dental floss having a wax composition applied thereto, the mold including a first part having a first cavity disposed therein, the first cavity defined by a bottom base surface and a peripheral sidewall, and including a base portion, first and second spaced-apart portions having proximal and distal sections and extending from the base portion, and a second part having a second cavity disposed therein, the second cavity defined by a bottom base surface and a peripheral sidewall, and including a base portion, first and second spaced-apart portions having proximal and distal sections and extending from the base portion and terminating in the distal section; and a groove having an aspect ratio of about 10:1 or greater and having first and second terminal sections and a mid-section, the groove extending an entire width of the second part, where the first and second terminal sections of the groove traverse and are coincident

Abstract: Universal mold frames for producing multi-piece golf balls are provided. The mold frames include lower and upper frame plates having locator pins that are inserted into corresponding locator slots in the mold cavities. The eccentric pin layout of the frame plates and corresponding slots in the cavities means the cavities can be fitted easily and aligned in the frame plates. The interior surfaces of the mold cavities define a specific dimple pattern such as icosahedron or tetrahedron-based patterns. The mold frames can accommodate cavities having different dimple patterns. A castable liquid polymer, for example, polyurethane is dispensed into the mold cavities, which are then pressed together to form the spherical cover for the ball.

Abstract: The invention concerns a mold tool for the production of extrusion blow molded products, comprising at least three mold portions (2a, 2b, 3) which define a mold cavity (4) and of which two are in the form of outer molds (2a, 2b) and one is in the form of a central mold (3). The outer molds (2a, 2b) and the central mold (3) are displaceable from and towards each other in the sense of an opening and closing movement of the tool. The central mold (3) is provided with component holders (11) which can be moved out of and into the tool plane defined by the central mold and are arranged in turn on a carrier (10) which is also displaceable with respect to the central mold (3).

Abstract: An injection-molding die including: a fixed die; a movable die; a cavity defined by the fixed die and the movable die; and a gate for injecting a melt resin into the cavity. The cavity includes: a flow-dividing structure that divides a flow of the melt resin injected into the cavity into a plurality of resin flows; and a flow-advancing area in which the resin flows generated by the flow-dividing structure are merged together. The flow-advancing area is formed thicker than a flow-hesitating area of the flow-advancing area in the cavity.

Abstract: A man-made, molded article is provided. The article includes a profile including a planar wall, and an adjacent integral molded depression having a contoured wall extending downwardly from the planar wall. The contoured wall includes a bead portion, a cove portion, and a ledge between the bead and cove portions. The articles are stackable, one above another for transport, in a nestable relationship in which multiple contact zones are present between the contoured walls of an adjacently stacked pair of the molded articles. The contact zones include an arcuately extending contact interface zone between the bead exterior and interior surfaces. The depression has a substantially uniform thickness varying by no more than about +1 percent to about ?11 percent in relation to a thickness of the planar wall. Related methods and assemblies are also provided.

Abstract: This invention provides single-step pultrusion processes for producing fiber reinforced polymer (FRP) articles that may have variable cross sections and/or non-linear shapes. This unique capability results from the use of two sets of dies to form the article. The first is a set of moving dies connected together to form mating continuous loops of moving die links to: a) draw the FRP material into the apparatus; b) shape the cross section of the FRP material; c) cut the FRP material to the appropriate length; and d) hold the uncut FRP material in position for the next production cycle. The second set of dies forms a guide path mounted on opposing conveyers. The guide path includes heated die segments to define a curing section that may be non-linear. Cycling the moving die links through the curing section and/or cycling the conveyers provides a straightforward method for automated production of finished pultruded articles with unique shapes.

Abstract: An injection molding process for the preparation of an oral delivery device comprising a core which contains a pharmaceutically active agent, having a coating with one or more openings leading to such a core. The invention also relates to devices produced by the process, and to injection molds suitable for performing the process.

Abstract: A housing case for a small electric device and communication device includes a flat plate having a dimension substantially the same as that of the front portion of the housing case and comprising at least a glass plate, and a resin frame integrated with the flat plate to support the backside periphery of the flat plate.

Abstract: One aspect of the present invention relates to a molding system for use in packaging integrated circuits. The molding system includes a top cavity bar, a middle cavity bar, a bottom cavity bar, a tape and an injection unit. When an electronic substrate is positioned between the top and middle cavity bars, the top and middle cavity bars are arranged to sandwich the electronic substrate. The top and middle cavity bars are also arranged to help form one or more mold cavities over device areas of the electronic substrate. The tape is positioned below the middle cavity bar and is arranged to cover and relieve pressure on a bottom of each mold cavity. The bottom cavity bar is positioned below the tape and is arranged to support the tape. The injection unit is arranged to inject a molding material into the mold cavities.

Abstract: A mold to produce fiber composite components is described where a fiber ply (15) with matrix material (matrix material/resin) is saturated. The mold consists of a lower mold (11) and an upper mold (1) which is placed on top of the lower mold (11) with intermediate fiber ply (15) Lower mold (11) and upper mold (1) do have a contour matching each other and for the desired fiber composite component. The upper mold (1) and the lower mold (11) are made of a flexible material.

Abstract: According to one embodiment, a resin supply device is configured to supply granular resins to a resin mold device including a first mold provided with a cavity and a second mold mated to the first mold. The resin supply device includes a first mechanism and a second mechanism. The first mechanism is configured to juxtapose multiple granular resins on an adsorption surface by adsorbing the multiple granular resins on the adsorption surface larger than the granular resins, and form an adsorbed resin body with a uniform thickness. The adsorbed resin body is made of the adsorbed multiple granular resins on the adsorption surface. The second mechanism is configured to drop the multiple granular resins adsorbed on the adsorption surface into the cavity by adsorption-release of the adsorption surface.

Abstract: A mold for a battery, such as a secondary battery, and a method of molding a battery, such as a secondary battery, using the mold, uses a minimum amount of a molding substance, such as a resin, has its molding time shortened, and has a safety vent of a can being prevented from being fractured by high pressure during a molding process. Runners, through which a resin flows, are arranged parallel to cavities and the safety vent of the can is positioned closest to the gates, into which a resin is injected after the can and a protective circuit board are seated in the cavities. Due to the structure of the runners of the mold and the location of the safety vent of the can, the amount of resin used and the molding time are reduced. A fracture of the safety vent is avoided since a lower pressure occurs at the location closest to the gates during a resin filling process.

Abstract: An electronic device case includes: a radiator including an antenna pattern part transmitting or receiving a signal and a connection terminal part allowing the signal to be transmitted to or received from a circuit board of an electronic device; a radiator frame including the radiator injection-molded thereon, separated from the connection terminal part so that the connection part can have elasticity, and having a radiator support protruded from the opposite surface of one surface on which the antenna pattern part is formed; and a case frame covering one surface of the radiator frame to allow the antenna pattern part to be embedded between the case frame and the radiator frame.

Abstract: A golf ball mold that is composed of a plurality of mold parts which removably mate to form a cavity having an inner wall with a plurality of dimple-forming protrusions thereon, wherein a non-circular resin injection port is formed between a plurality of mutually adjoining dimple-forming protrusions which include dimple-forming protrusions that lie across a parting line of the mold. Also provided is a golf ball molded using such a mold, and a golf ball manufacturing method which uses such a mold. By using the mold of the invention, even when manufacturing golf balls with a high dimple surface coverage on which the dimples are tightly arranged particularly up to the vicinity of the resin injection port, imbalances in the resin injection pressure and flow rate during injection molding are suppressed, enabling golf balls to be manufactured without production problems such as molding defects, scorching, core deformation and core eccentricity.

Abstract: The invention provides a golf ball manufactured using a mold having a top half and a bottom half, which ball has formed on a surface thereof, near a seam line corresponding to a parting line between the top and bottom halves of the mold, a recessed and/or raised mark serving as an indicator for detecting the direction or position of the seam line. The invention also provides a golf ball mold composed of a top half and a bottom half that detachably join together so as to form therein a spherical cavity into which a material is injected to mold a golf ball, which mold bears, near a parting line between the top and bottom halves on a wall of the cavity, a raised or recessed feature for forming a mark as an indicator for detecting the direction or position of the parting line.

Abstract: A non-conforming golf ball has a plurality of dimples formed on the outer surface of the ball in a predetermined dimple pattern, the outer surface comprising one or more first areas which include a plurality of first dimples which together have a first dimple volume and at least one second area having a dimple volume less that the first dimple volume, the first and second areas being configured to establish a preferred spin axis. The second area may be a hand around the equator which has a lower dimple volume or no dimples, with the polar regions have a higher volume of dimples, creating a preferred spin axis through the poles.

Abstract: Example embodiments are directed to a lens module manufactured from a wafer and a wafer level lens module manufacturing apparatus. The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate disposed such that the wafer is between the first master substrate and the second master substrate. The wafer level lens module manufacturing apparatus also includes lens molding parts that enter the lens holes and are on at least one of the first master substrate and the second master substrate. The lens is molded to have a thickness less than that of the wafer using the first lens molding parts and second lens molding parts, and both surfaces of the lens are inside the lens hole. Therefore, even if wafers provided with lenses are stacked on each other, the lens does not contact the surfaces of the neighboring wafers or the lenses molded on the neighboring wafers.

Abstract: There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part and formed on a film is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.

Abstract: There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface thereof; a case frame injection molded upward of the radiator frame, such that the radiator is embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inward of the case frame.

Abstract: There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.

Abstract: A housing case for a small electric device and communication device includes a flat plate having a dimension substantially the same as that of the front portion of the housing case and comprising at least a glass plate, and a resin frame integrated with the flat plate to support the backside periphery of the flat plate.

Abstract: An insert molding apparatus includes a first mold and a second mold. The first mold has at least two cavity plates which cooperatively define at least one receiving groove therebetween. At least two connecting elements each have its one end positioned in one of the at least two cavity plates while the other end passing through the other cavity plate for movably connecting the at least two cavity plates with each other. At least one elastic element is compressibly disposed between and against the cavity plates in such a manner such that the at least two cavity plates are capable of contacting with each other or separating from each other. The second mold is engaged with the first mold for compelling one of the at least two cavity plates to move toward the other cavity plate so that the at least two cavity plates are in contact with each other.

Abstract: Methods and apparatus to evenly clamp semiconductor substrates in a transfer mold process are disclosed. A disclosed split mold base includes a first plate having a first surface, a second plate having a second surface opposite the first surface, and a plurality of springs that are disposed between the first and second plates to distribute a clamping pressure applied by a mold press.

Abstract: Disclosed herein is an apparatus for manufacturing a secondary battery by performing insert injection molding with respect to a portion of a battery cell while the battery cell is located in a mold, wherein the apparatus comprises a pair of upper and lower molds, at which are formed shapes corresponding to the battery cell, the upper and lower molds are provided at the inside surfaces thereof with elastic members, and the elastic members are constructed in a structure in which the elastic members support a cell body of the battery cell and isolate a non-molding region from a molding region while the battery cell is mounted in the upper and lower molds.

Abstract: Molds are disclosed for forming golf-ball covers by casting. An exemplary mold includes first and second support members that are placeable in face-to-face opposition to each other. At least one respective mold-cavity insert, defining a respective hemispherical cavity, is mounted to each support member. The mold-cavity insert is floatable in at least three (e.g., x, y, z) degrees of freedom relative to the respective support member. Each mold-cavity insert on the first support member is in face-to-face opposition to a respective mold-cavity insert on the second support member whenever the support members are in face-to-face opposition to each other, such that the respective hemispherical cavities of each opposing pair of inserts form respective spherical ball-cover cavities. A respective z-direction bias is associated with each mold-cavity insert. Also, a respective self-centering device is associated with each opposing pair of inserts.

Abstract: Provided is an electronic device case. The electronic device case includes a radiator including an antenna pattern portion transmitting or receiving a signal, and a connection terminal portion transmitting the signal to or receiving the signal from a circuit board of an electronic device, and an electronic device case frame manufactured by subjecting the radiator to injection-molding, supporting the radiator and forming an exterior of the electronic device. The antenna pattern portion includes an exposed portion exposed on the outermost edge of the electronic device case frame.

Abstract: There is provided an antenna pattern frame according to an exemplary embodiment of the present invention, including: a radiator that includes an antenna pattern part transmitting or receiving signals and a connection terminal part to transmit or receive the signals to and from a circuit substrate of an electronic device; and a radiator frame that supports the radiator, the radiator being manufactured by injection molding and the antenna pattern part being embedded in a case of the electronic device, wherein the radiator frame may be provided with a fastening part to be removed from the manufacturing mold for injection-molding the case of the electronic device in which the radiator is embedded.

Abstract: A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.

Abstract: There is provided an antenna pattern frame including: a radiator comprising an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; and a radiator frame manufactured by injection molding on the radiator, allowing the antenna pattern portion to be embedded in a case of the electronic device, and supporting the radiator. The radiator frame includes a hydraulic recess introducing a resin material to a mold for manufacturing a case of the electronic device in which the radiator is embedded through injection molding, so that the radiator frame contacts the mold by injection pressure.

Abstract: There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded.