Abstract: There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded.

Abstract: A forming mold of a light-emitting member includes a frame, an upper mold and a lower mold, and the frame is provided with carriers, pins and supporting portions. The upper and lower molds match with each other to provide a forming space for the base of the light-emitting member. The forming space contains the carriers and a part of the supporting portions. One or more projections are disposed at the position where the brinks of the upper and lower molds contact the supporting portions. After injection molding, the burrs formed by a plastic material along the supporting portions can be concealed in the recesses that are formed corresponding to each of the projections, thereby reducing the influence of the burrs on the external size of the base.

Abstract: The invention provides a golf ball mold that is composed of a plurality of mold parts which removably mate to form a cavity having an inner wall with a plurality of dimple-forming protrusions thereon, wherein a non-circular resin injection port is formed between a plurality of mutually adjoining dimple-forming protrusions which include dimple-forming protrusions that lie across a parting line of the mold. Also provided is a golf ball molded using such a mold, and a golf ball manufacturing method which uses such a mold. By using the golf ball mold of the invention, even when manufacturing golf balls with a high dimple surface coverage on which the dimples are tightly arranged particularly up to the vicinity of the resin injection port, imbalances in the resin injection pressure and flow rate during injection molding are suppressed, enabling golf balls to be manufactured without production problems such as molding defects, scorching, core deformation and core eccentricity.

Abstract: A method for the manufacture of a fiber-reinforced component includes heating a blank of a carbon-fiber-reinforced thermoplastic plastic material to at least a melting temperature of the thermoplastic plastic material; introducing the blank into an at least two-part moulding tool; forming the fiber-reinforced component by applying pressure on the blank using the moulding tool; and injecting a further thermoplastic plastic material into at least one edge region of the moulding tool so as to form an edge seal.

Abstract: A chewable animal toy having an edible core and a tearable outer shell molded around the edible core such that a portion of the edible core protrudes from the outer shell is provided. Further provided is a mold unit for making the chewable animal toy having a first mold half including a first mold cavity and a second mold half having a second mold cavity. The second mold half is engageable with the first mold half such that the first and second mold cavities cooperatively define an outer shell mold cavity. A first pocket is defined between the first and second mold halves that is adapted to receive a first protruding portion of the edible core. A first shut off defined within the first pocket is adapted to surround the first protruding portion of the edible core such that it is substantially isolated from the outer shell mold cavity.

Abstract: An exemplary injection mold for manufacturing a fiber optic connector includes a first mold, a second mold, an insert, two first positioning bar, and four second positioning bars. The first mold and the second mold cooperatively define a mold cavity. The mold cavity includes two lens molding recesses. The two inserts are attached to the second mold and located in the mold cavity. A dimension of each second bar in cross section is substantially smaller than that of each first positioning bar. One first positioning bar and two second positioning bars are arranged around each insert to position the insert, such that the inserts is suspended in the mold cavity and precisely aligns with the respective molding recesses.

Abstract: A process for manufacturing frozen aerated confectionery products is provided, the process comprising; providing two rollers wherein each roller has a multiplicity of open cavities on its surface and wherein the rollers are aligned so that the surfaces touch; providing filling means for filling said cavities with a frozen aerated confection at a temperature higher than the temperature of the rollers; filling two cavities, one on each roller, with a frozen aerated confection having an overrun of between 10% and 130%; allowing the frozen aerated confection to expand outside its cavity; and counter-rotating the rollers so that respective cavities in the two rollers lie opposite one another and the frozen aerated confection in a cavity of the first roller is pressed against the frozen aerated confection in an opposite cavity of the second roller; characterised in that the surfaces of the rollers in which the cavities are located are conical. An apparatus for operating the process is also provided.

Abstract: Disclosed herein is a membrane electrode assembly with a superior power generating efficiency and a method of manufacturing the same. Also disclosed is a manufacturing apparatus thereof wherein a gasket with an optimum thickness can be easily applied to the membrane electrode assembly without preparing various types of gaskets. A method of manufacturing the membrane electrode assembly with catalytic layers and gas diffusion layers on surfaces of the electrolyte membrane comprises controlling a molding thickness according to thicknesses of the catalytic layers and the gas diffusion layers and integrally molding the gasket portions formed with resin materials on at least one surface of the electrolyte membrane.

Abstract: An apparatus and process are provided for molding electronic devices in a mold, which apparatus comprises at least one runner in the mold connected to a mold supply pot for channeling a molding compound from the mold supply pot to the electronic devices. A plunger assembly is also provided that comprises a main body, and a supplementary body configured to be movable relative to the main body. The plunger assembly is locatable in the mold supply pot and is drivable in a direction towards the runner for forcing the molding compound into the runner. In order to avoid or reduce cull formation, a width of the runner at an opening connecting the runner to the mold supply pot is smaller than a width of the main body of the plunger assembly.

Abstract: A lens unit composed of different materials includes a base and a lens. A part of a camera module of a different material from the lens is used as the base. The lens of optical resin is directly replicated on the base such that the lens is integrally formed on the base. A camera module is provided with the lens unit. The lens/lenses is/are formed on the single base/multiple bases to form the lens unit/units, using a die whose surface contacting the base slopes in relation to its central axis to allow the base to self-align.

Abstract: A mold for forming a golf ball makes it possible to form minute dimples, and to improve mold release properties of the mold and wettability of the mold by a material when a urethane material is used for a cover layer. A mold according to the present invention is a mold for forming a urethane cover as an outermost layer of a golf ball, and includes: at least two split molds that are separably joined with each other, and that includes a cavity formed therein by the joining, the cavity being for forming the urethane cover; protrusions that are formed on a cavity surface of the split molds to form dimples of the golf ball; and a composite plating film that covers the cavity surface of the split molds, that comes into contact with a material of the urethane cover, and that contains a nickel-based matrix and fluororesin particles dispersed in the nickel-based matrix.

Abstract: An injection-molding arrangement for molding a molded part is disclosed. In particular a grommet can be molded onto a cable. The arrangement has at least two injection-molding tools, which are arranged in a holding device offset in relation to each other along a longitudinal extent of a cable located in the injection-molding arrangement and enclose at least certain portions of the cable during the injection-molding operation. Furthermore, a method of molding on a molded part and use of the injection-molding arrangement for molding on a molded part is disclosed.

Abstract: A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.

Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.

Abstract: A method is provided for producing a connector so that a terminal fitting is unlikely to move. A terminal fitting (20) is set in a molding die assembly that has a first die (60) and a second die (70). Resin then is injected to mold housing (40) including the terminal fitting (20) as an insert. A potting material (49) then is injected into a recess (45) in the housing (40) to produce a male connector. The first die (60) has a tab insertion hole (62) for fixing the terminal fitting (20), and the second die (70) has a gate (72) for injecting the resin. A cavity (81) is formed by placing the second die (70) on the first die (60) so that a projection (26) on the terminal fitting 20 is sandwiched between fitting pressing portions on the dies (60, 70).

Abstract: An over-molded harness including a plurality of bundled flexible electric wires, an electrical or electronic element electrically connected between at least two of the wires, and at least a portion of the bundled electrical wires having an over-molded insulative covering, whereby the electrical or electronic element is unsupported by other than primarily by the over-molded insulative covering and secondarily by the flexible electric wires, the electrical or electronic element being both precisely located and completely enclosed within the insulative covering.

Abstract: A device and a method are disclosed for producing an optical data medium, in particular high density optical media, such as the recently developed BlueRay™ disk for illumination with a blue laser (??405 nm). The required thickness of the data and/or protective layers is of the order of at most several tenths of millimeters. Such thin layers are difficult to produce with conventional injection molding processes. The disclosed device and method solve this problem by overflowing an element placed in a narrow cavity with a low-viscosity material having a viscosity lower than the viscosity of polycarbonate, which then forms the data or protective layer, or by bonding a layer produced in this manner to another layer using a low-viscosity adhesive.

Abstract: A shaping mold of an air filter includes an upper mold base and a lower mold base, and a filter material having a corresponding shape is placed and fixed at a partition plate of the lower mold base to reduce manufacturing time and material cost of the mold, and also achieve the effects of providing a higher precision of positioning the filter material and improving the production efficiency, quality and reliability of the product.

Abstract: A mold assembly includes an upper mold cavity, a base plate, and a flow element. The upper mold cavity defines a primary runner and a plurality of sub-runners on a top surface in communication with the upper mold cavity. A gate is defined in the primary runner for injecting liquefied plastic into the upper mold cavity. The base plate defines an outlet thereon corresponding to the gate for outputting the liquefied plastic. The upper mold cavity and the base plate corporately form a closed cavity therebetween. The flow element is received in the closed cavity and movable between a first position and a second position. In the first position, the flow element is engaged with the primary runner and plurality of sub-runners. In the second position, the flow element is separated with the primary runner and plurality of sub-runners.

Abstract: There are provided a golf ball molding die in which a mold deposit produced when a gas is discharged can be removed easily, and the area of a venting opening per unit area of the tip end of a pin can be increased tremendously, and a golf ball manufactured by using the golf ball molding die. A golf ball molding die in accordance with the present invention includes at least two die bodies which are configured so that a cavity for forming a golf ball is formed by joining the die bodies to each other; a venting hole which is provided in at least one of the die bodies to discharge a gas in the cavity; and a pin which is present in the venting hole, the pin being configured so that a plurality of layers are lapped on each other from the center thereof.

Abstract: The invention relates to a flat token, comprising a detection unit which is enclosed between two half-shells (1, 15) which are produced from rigid plastics material, the two half-shells (1, 15) being coated with a synthetic resin, the token being distinguished in that at least one of the two half-shells (1, 15) comprise(s) means (21) for centering in a mould for injecting the resin.

Abstract: A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity.

Abstract: A mold assembly includes an upper mold and a lower mold. The upper mold defines an upper mold cavity. A plurality of punch pins are movably mounted in the upper mold. A channel is defined in the upper mold and in communication with the upper mold cavity. The lower mold is closed with the upper mold. The lower mold defines a lower mold cavity together with which the upper mold cavity forms a closed cavity. The closed cavity receives a work piece located therein. The mold assembly is movable between a first position and a second position. In the first position, the punch pins of the upper mold are punched into the work piece to from the work piece into predetermined shape. In the second position, the punch pins are moved out of the upper mold cavity. Molten plastic flows in the closed cavity via the channel to from plastic ornaments on the work piece.

Abstract: There are provided a first mold 2 and a second mold 1 that can be brought into and released from contact with the first mold 2. A substrate 70 provided in both the molds 1, 2 and mounted with electronic components is subjected to resin sealing and molding by filling with resin of cavities formed by both the molds 1, 2. The second mold 1 is placed on a base plate 9 so as to be capable of horizontally reciprocating, and has a cavity block 7 that can be brought into and released from contact with the first mold 2 and a mold clamping mechanism 16 that supports the cavity block 7 and that brings and releases the cavity block 7 into and from contact with the first mold 2 so as to perform mold clamping. On the base plate 9 is provided a horizontal actuation mechanism 11 for moving the second mold 1 to a facing position where the second mold 1 faces the first mold 2 and to a non-facing position where the second mold 1 has been moved sideways from the facing position.

Abstract: An apparatus for moulding a thermoplastic package part(s) to an end portion of a container body includes inner and outer mould elements between which a mould cavity per package part is formed. At least one of these mould elements is at least partly freely suspended. When one package part is moulded with the mould elements, plastic melt is injected in a first number ?1 of points in the cavity, an island of plastic melt for each point is formed inside the cavity, and the distribution of the points causes a force centre to pass through a surface defined by a parallel projection of each first number of islands on a plane orthogonal to a direction of the compression force, and when the first number >1, a second number of imaginary straight lines interconnecting a third number of parallel projections such that the surface is at its maximum.

Abstract: A mold for making ceramic products (1) comprises at least two parts (2, 3) which can be coupled to each other to form, in a closed configuration, a cavity (4) for casting the ceramic product (1) by filling a liquid mixture (5) into it under pressure; internal constraining means (6) are positioned and operative between at least two inside surfaces (2a, 3a) of the mold (S) parts (2, 3), which form portions of the walls of the cavity (4) in order to keep the two parts (2, 3) securely in place after being positioned face to face relative to each other in the closed configuration; the internal constraining means (6) are made directly on the respective inside surfaces (2a, 3a) of the mold (S) parts (2, 3); the means (6) are designed to be interconnected, that is, to interpenetrate in such a way as to create a stable relative position between the mold (S) parts (2, 3).

Abstract: A foaming die device is provided, in which can be directly placed a basic armrest unit having a shaft element and a connecting bracket rotatably secured to the shaft element. The foaming die device comprises a lower die, an upper die, and an auxiliary die element of split type to be incorporated in a working die area defined by the lower and upper dies. The auxiliary die element comprises two die pieces that can be mated together so as to be in a slidable engagement about one end portion of the shaft element. Hence, the mated two die pieces or auxiliary die element is slidable along the shaft element for its partial engagement in a through-hole of the basic armrest unit, whereupon all the basic armrest unit and auxiliary die element may be directly placed in the working die area of lower and upper dies and subjected to foaming process.

Abstract: The invention relates to a plunger for feeding encapsulating material to a mould cavity, comprising at least one peripheral groove recessed into the cylinder casing of the plunger whereby a material part is placed in the groove which only partly fills the groove. The invention also related to a device for encapsulating electronic components mounted on a carrier. In addition, the invention also relates to a method for sealing a fitting of a plunger housing, which plunger is adapted to feed encapsulating material under pressure to a mould cavity.

Abstract: There are provided a golf ball in which the depths of dimples after grinding, which greatly affect the trajectory of golf ball, can be controlled readily and exactly, and a golf ball molding die for manufacturing the golf ball. The golf ball molding die in accordance with the present invention comprises two die bodies in which a cavity for molding a golf ball is formed by joining the die bodies to each other; and a protrusion formed on the cavity side surface of at least one of the die bodies, the protrusion having a uniform height from the surface or an imaginary spherical surface on which the protrusion is assumed to be absent toward the center of the cavity, wherein when a parting line is at latitude zero degree, the protrusion is arranged in the range of from latitude about 10 degrees to latitude about 80 degrees.

Abstract: The present invention is a system for molding a gasket to a membrane electrode assembly. The system comprises a cavity defined at least in part by closable mold blocks, at least one injection gate for injecting gasket material into the cavity, a mount for retaining the membrane electrode assembly adjacent to the cavity, and a mold insert independently movable relative to the closable mold blocks for applying pressure to the membrane electrode assembly retained on the mount.

Abstract: A multi-part injection mold (10) for producing a cuvette (1) or a receptacle vessel for liquid or gaseous media for spectroscopic, qualitative and/or quantitative analysis or measurement using a measuring region or measuring gap (2) through which radiation is able to penetrate is provided, with the cuvette being made of plastic through injection molding. To this end, the inner cavity or filling space (9) and the measuring gap (2) are formed and limited on the interior of the injection mold (10) by a contour core (11), the thickness of which is limited to about one millimeter or less in the region (11a) of the measuring gap (2). The contour core (11) is held on the end (11b) thereof having the smallest dimension during the injection molding process, initially by at least one support (14), and retracted during the injection molding process after partial filling of the mold with plastic such that the lower continuation of the walls of the measuring gap (2) is formed.

Abstract: The invention provides a golf ball mold composed of a plurality of mold parts which removably mate to form a hollow interior spherical cavity having a cavity wall with a plurality of dimple-forming protrusions thereon and which have a parting surface that is formed in a convex shape and a concave shape matching the convex shape. All or some of the dimple-forming protrusions are formed at positions at least about 0.03 mm away from an outside edge of a convex portion of the parting surface. The mold eliminates the possibility that molding flash projecting out from the parting surface of the mold will enter the dimples, as a result of which the dimples are not affected by the trimming of flash. Golf balls manufactured with such a mold are able to effectively manifest the aerodynamic performance of dimples tightly and uniformly arranged on the surface of the ball.

Abstract: Disclosed are an apparatus and method for molding an object. An object is compressed by an upper mold and a lower mold base part to form a top surface of a product, and the upper mold and the lower mold base part descend in a state where the object is compressed to form a lateral surface of the product through lateral surfaces of the upper mold and a lower mold.

Abstract: A resin-sealing mold for sealing a semiconductor element with resin includes an upper die (12), a lower die (14) disposed so as to be opposed to the upper die (12), and a plurality of middle dies (13a, 13b) sandwiched between the upper die (12) and the lower die (14), wherein the plurality of middle dies (13a, 13b) are provided with molding faces at tip ends and are placed so that the molding faces are opposed to each other during the sealing. Because of this, the middle dies (13a, 13b) can be opened to the right and left from dividing faces I, and even a resin package of a semiconductor device with a concave part formed in a side surface can be molded.

Abstract: Tensioning installation for the frameworks of pre-tensioned architectural elements designed for the two-way pre-tensioning of concrete or mortar plates, or the like, comprising a molding assembly made up of a flat molding plate (3) delimited on the perimeter by adjustably positioning side walls (4). The assembly rests on an oversized support platform (1)on which the molding assembly is surrounded by a perimeter area (10) of support platform (1) proper, in which perimeter area (10) hydraulic tensioning devices (7) are provided, which are integral to support platform (1) and are arranged in juxtaposition forming opposite facing pairs according to rectilinear alignments forming a grid. Said hydraulic tensioning devices (7) are all connected together serially forming a hydraulic circuit (8) which, in turn, is connected to a hydraulic pressure connection point (9).

Abstract: The method employs a stationary mold having depositing recesses equipped in its inside with a deposition element such as a target electrode, and movable molds made slidable. A primary molding is performed to form a body portion and a cover member to have joint portions around their opening. The body portion left in the vertically sliding mold is deposited after it was densely covered with the depositing recesses. Next, the deposited body portion and the cover member, as left in the molds, are registered and mold clamped, and the molten metal is injected to integrated the joint portions.

Abstract: Provided is a ceramic heater, which can be manufactured at a reasonable cost. The ceramic heater comprises a heating resistor comprising a first conducting portion and a second conducting portion which face each other and a ceramic base in which the heating resistor is embedded. The first conducting portion comprises a first burr which extends from the first conducting portion and is located between the first conducting portion and the second conducting portion. The second conducting portion comprises a second burr which extends from the second conducting portion and is located between the second conducting portion and the first conducting portion. At least a part of the first and second burrs is spaced apart from the line that linking a starting point of the first burr and a starting point of the second burr in a cross-section perpendicular to a conduction direction of the first and second conducting portions.

Abstract: A method and a casting mold for producing an optical semiconductor module is provided, wherein a semiconductor body having at least one optically active element on its top is introduced into a leadframe. Then conductive connections are established between the semiconductor body and the leadframe, and then the leadframe and semiconductor body are encapsulated in a casting mold. Wherein provided in the part of the casting mold that faces the top of the semiconductor body are masking bodies, which extend from the top inner wall of the casting mold towards the optically active elements and cover the elements with their respective end face in a way that seals out casting material.

Abstract: A mold (1) includes an upper mold half (U) and a lower mold half (L). The mold (1) includes a gate (G), a pole vent pin (P), a support pin (S) and an intermediate vent pin (M). The support pin (S) has a latitude (?s) of 45 degrees to 85 degrees. Each of the upper mold half (U) and the lower mold half (L) has at least three support pins (S). The intermediate vent pin (M) has a latitude (?m) of 45 degrees to 85 degrees. Each of the upper mold half (U) and the lower mold half (L) has at least three intermediate vent pins (M). A difference between the latitude (?m) of the intermediate vent pin (M) and the latitude (?s) of the support pin (S) is equal to or smaller than 15 degrees. A clearance between the intermediate vent pin (M) and a pin hole (13) is 5 ?m to 50 ?m. By the mold (1), a cover having a thickness of 1.4 mm or less is formed.

Abstract: An apparatus and related techniques for making a golf ball with deep dimples are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides deep dimples that extend through the cover layer and/or into a layer or component underneath are disclosed. At least one percent (1%), preferably about five percent (5%), of the dimples of the ball comprise deep dimples. The cover may be a single layer or include multiple layers. If the cover is a multi-layer cover, the dimples extend to or into at least the first inner cover layer, and may extend to or into two or more inner cover layers. If the cover is a single layer, the dimples extend to or into the core. The dimples may be spherical or non-spherical, and the portion of the dimple that extends to or into the next inner layer may be the same or different shape as the outer portion of the dimple.

Abstract: A mold comprises a spherical cavity, a support pin capable of being moved forward and backward with respect to the cavity, and a vent pin (8). The vent pin (8) includes two slits (S), an annular groove (20) and a vertical groove (22). An upper end (24) of the slit (S) is opened toward the cavity. A lower end (26) of the slit (S) is opened toward the annular groove (20). The annular groove (20) is coupled to the vertical groove (22). The lower end of the vertical groove (22) is opened toward air. A width (W) of the slit (S) is preferably equal to or greater than 1 ?m, is more preferably equal to or greater than 3 ?m, and is particularly preferably equal to or greater than 5 ?m. A depth (D) of the slit (S) is preferably equal to or greater than 10% of a diameter (?), is more preferably equal to or greater than 15% of the diameter (?), and is particularly preferably equal to or greater than 20% of the diameter (?). It is preferable that the same slit (3) should be formed on the support pin.

Abstract: A blow molding device capable of securely closing a lower end of a parison to prevent the parison from being crushed. The blow molding device includes a blow mold and a parison holding unit. The parison holding unit includes an inner holding plate adapted to be inserted in an interior of the lower end of the parison, and an outer holding plate adapted to hold an outer surface of the lower end of the parison, and the outer holding plate has a recess conforming to a configuration of the inner holding plate and is split into a plurality of holding plate members such that each of the split holding plate members is capable of sliding to hold the lower end of the parison.

Abstract: There are provided a golf ball molding die capable of manufacturing a golf ball having a satisfactory surface condition, and a golf ball manufactured by using the die. The present golf ball molding die comprises at least two die bodies within which a cavity for molding a golf ball is formed by jointing of the die bodies; and a pin accommodating hole provided in at least one of the die bodies, and is characterized in that at least one groove communicating directly with the cavity is provided in the wall surface of the pin accommodating hole.

Abstract: An apparatus for manufacturing a semiconductor device is provided. The semiconductor device includes a chip packaged with a resin mold. The apparatus includes a first mold, a second mold, and a buffer sheet. The first mold has a first cavity for forming the resin mold on a first side of the semiconductor device, and a convex part for forming an exposed area of the chip. The second mold has a second cavity for forming the resin mold on a second side of the semiconductor device. The buffer sheet is disposed between the convex part and the chip for covering the exposed area.

Abstract: A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging further a partial inner surface of the runner. A runner magnet attracts and attaches a metallic foreign matter contained in fluid transported in the runner to the inner surface of the foreign matter retention pocket.

Abstract: A water stopping apparatus for causing a water stopping material to penetrate exposed core wires of a sheathed wire forming a wire harness includes a pair of dies which can abut against each other in a mutually opposed condition, thereby forming a pressurizing space in which an exposed portion of the core wires of the wire harness can be mounted, a filling portion for filling a water stopping material in the pressurizing space in which the exposed portion of the core wires is mounted, and a pressurizing portion for supplying pressurized gas into the pressurizing space to pressurize the same.

Abstract: A mold for a nerve cuff having a first molding body defining a first molding cavity and a second molding body defining second molding cavity. The first and second molding bodies being mountable to one another thereby providing for the first and second molding cavities to interface. When interfacing the first and second molding cavities and injecting moldable material therebetween provides the nerve cuff following curing of the moldable material. An industrial mold including interfacing first and second cavities is also disclosed. A removable cassette for interposing between a first and a second molding cavity is also disclosed. Methods of making a nerve cuff are disclosed herein. Nerve cuffs produced by the foregoing molds, cassettes, industrial molds and methods are also disclosed.

Abstract: An improved mold for making a golf ball comprises a pair of mold cups which are assembled together along mating surfaces that form a parting line. The mold cups are completely without sprues (vents). A lower mold cup has an undercut section of p to 360° in the rim area of the mating surface that allows for a very restricted but controlled flow at the parting line. The undercut section is of a depth of about 0.002 inch or less. This provides for a significant increase in the shear strength that results in a golf ball having less delamination, smaller voids, and a significant increase in impact cover durability.

Abstract: The present teachings provide a modular articulating cement spacer mold for forming a temporary implant. The modular spacer mold includes a head component mold defining a first opening, a head connector positioned within the first opening of the head component mold, a stem component mold defining a second opening, and a stem connector to fit within the second opening of the stem component mold to mateably engage the head connector. Related kits and methods of forming a temporary implant are provided.

Abstract: A method and apparatus for producing bowl-shaped food products from a fat-containing compound. The apparatus includes a mold block having hollow molds formed by depressions so as to define an inside surface of the food product and a support frame having a die block formed by die elements, each having a bulge for determining an outside surface of the food product. The interchangeable support frame is movable with respect to the mold block between an operating position and a non-operating position, such that in the operating position the die elements are disposed within a respective hollow mold. The die block and the mold block can be independently cooled during operation. The support frames and the die blocks can be quickly changed to form food products having different shapes.