Abstract: The invention includes a method of electroless deposition of nickel over an aluminum-containing material. A mass is formed over the aluminum-containing material, with the mass predominantly comprising a metal other than aluminum. The mass is exposed to palladium, and subsequently nickel is electroless deposited over the mass. The invention also includes a method of electroless deposition of nickel over aluminum-containing materials and copper-containing materials. The aluminum-containing materials and copper-containing materials are both exposed to palladium-containing solutions prior to electroless deposition of nickel over the aluminum-containing materials and copper-containing materials. Additionally, the invention includes a method of forming a solder bump over an aluminum-containing material.

Abstract: In a process for manufacturing a conductive wire that is suitable for use in semiconductor packages, a core wire of an extensible metal other than gold is first prepared to have a diameter ranging from 300 &mgr;m to 500 &mgr;m. Thereafter, a gold-containing outer layer having a thickness ranging from 2.5 &mgr;m to 25 &mgr;m is plated onto an outer surface of the core wire so as to form a gold-plated core wire. Subsequently, the gold-plated core wire is drawn to result in the conductive wire having a diameter ranging from 1 &mgr;m to 50 &mgr;m.

Abstract: Precursor compositions having a low conversion temperature and methods for the fabrication of recessed electrical features from the precursor compositions. The electrical features can be conductors, resistors and dielectric features. The precursor compositions are deposited into recessed features, such as trenches, formed in a substrate and are reacted at a low temperature to form electrical features having good electrical and mechanical properties. The substrate can be a low temperature substrate, such as an organic substrate.

Abstract: An exhaust gas sensor element has an electrolyte body, an inner electrode disposed on an inner surface of the electrolyte body, an outer electrode disposed on an outer surface of the electrolyte body, and a ground isolating coating disposed over the outer electrode. The ground isolating coating is typically alumina and extends from an active end of the electrolyte body toward an opposing end of the electrolyte body. The invention also includes a method for constructing a gas sensor element, the steps of which comprise forming an electrolyte body having an inner surface and an outer surface, applying an electrode ink to the inner surface to form an inner electrode and to the outer surface to form an outer electrode, and depositing a combination poison resistant/ground isolating coating, which is typically alumina, over the outer surface such that the combination coating extends from an active end of the electrolyte body toward an opposing end of the electrolyte body.

Abstract: An electrode for a PTC thermistor of the present invention includes a base layer having electrical conductivity and a sintered layer formed on the base layer. The sintered layer is formed by sintering a conductive powder and has electrical conductivity, and has roughness on a surface thereof. Thus, the present invention can provide an electrode for a PTC thermistor that has a large adhesion to the conductive polymer and can be produced easily.

Abstract: A self-aligned (i.e., spatially selective) process for fabricating a corrosion-resistant conductive pad on a substrate, and an associated structure that includes an interconnect to allow a terminal connection to the conductive pad (e.g., a chip-to-package connection). The conductive pad may include a metal such as copper, aluminum, or tungsten. Examples of a relevant interconnect include a wirebond interconnect and a controlled collapse chip connection (C4) interconnect. The self-aligned process generates a metallic layer on an initially exposed metal layer, wherein the metallic layer is electrically conductive and corrosion resistant. The metallic layer includes an alloy or an unalloyed metal. The metal layer may include copper.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

Abstract: A separator for a fuel cell comprising a gold covering layer formed on the surface of stainless steel plate a method for producing a separator, in which exfoliation and fracture of the gold covering layer can be prevented and corrosion resistance and durability can be obtained, are provided. Voids are formed by intergranular corrosion treatment at a surface of the stainless steel plate, and the gold covering layer is formed so as to be embedded in the voids. Limit value of radius of curvature in bends in which exfoliations or fractures in the gold covering layer is formed can be reduced by satisfying the equation 0.2≦4/d/L≦80 wherein L(&mgr;m) is the average grain size of the surface of stainless steel plate, and d(&mgr;m) is the thickness of the gold covering layer.

Abstract: An neutral electroless gold plating method that minimises “black band” corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of a reducing agent, a complexing agent and an accelerator to allow a gold layer of the desired thickness to be plated under manufacturing conditions The gold layer produced thereof has good bondability and solderability.

Abstract: An activated substrate surface suitable for electronics and microsystems preparation is prepare by contacting the surface with a surface activation compound, e.g. organometallic based on palladium, platinum, rhodium or iridium. The photo labile ligand has an optical absorption band which overlaps with the wavelength of the UV. A UV lamp is used, in combination with a mask, to selectively irradiate the contacted surface. Irradiation of the surface with light of a suitable wavelength decomposes the organometallic compound to the activating metal. The surface is then ready for electroless plating with the desired conducting material. The mask is patterned to delineate areas where surface activation is not to occur. The organometallic compound absorbs ultraviolet radiation in the wavelength range 210-260 nm, or in the wavelength range 290-330 nm, in the solid state if the compound exists as a solid at 25° C. or in the liquid state if the compound exists as a liquid at 25° C.

Abstract: A silver/gold coated laminar substrate pearlescent product is improved by incorporating rhodium in an amount of up to about 2% into the coating and/or by overcoating with a silane in an amount of up to about 5%.

Abstract: A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

Abstract: This invention describes a method of rapidly monitoring the temperature of a medium and a method of preparing a quantum confined device that can enable such measurements. The monitoring principle uses changes in impedance of nanostructured devices, i.e. devices in which one or more materials have the domain size precision engineered to less than 500 nanometers, preferably to dimensions less than the domain sizes where quantum confinement effects become significant and modify the electrical or thermal properties of the materials. The invention can be used to monitor absolute values of and changes in temperature of gases, inorganic and organic liquids, solids, suspensions, and mixtures of one or more of the said phases. The invention can be used to monitor radiation, power, heat and mass flow, charge and momentum flow, and phase transformation.

Abstract: The present invention relates generally to improved cathodes (24) for use in an electrotransport device (10) for transdermally or transmucosally delivering a beneficial agent (e.g., a drug) to, or extracting a body analyte (e.g., glucose) from, the body surface of a patient. Most particularly, the present invention relates to a cathodic electrode (24) in the form of a silver halide foil which can be made, e.g., by forging particulate silver chloride. The cathode (24) does not absorb agent (e.g., drug), eliminates the need for binders, solvents and processing aids during the manufacturing process, and increases dimensional freedom of design.

Abstract: A method for making a metal-clad laminate product including: providing a carrier film; depositing directly onto the carrier film a release agent layer, the release agent layer comprising an aqueous soluble polymer; forming a conductive metal layer on the release agent layer, the metal layer having a thickness of less than about 10,000 Angstroms; bonding the metal layer to a circuit board laminate layer; and removing the carrier film from the metal layer by peeling the carrier layer from the release agent layer.

Abstract: A method of for electroless copper deposition using a Pd/Pd acetate seeding layer formed in using only two components (Pd acetate and solvent) to form an interconnect for a semiconductor device. The invention has two preferred embodiments. The first embodiment forms a Key seed layer composed of Pd/Pd acetate by a spin-on or dip process for the electroless plating of a Cu plug. The second embodiment forms a Pd passivation cap layer over the Cu plug to prevent the Cu plug from oxidizing.

Abstract: This invention relates to manufacturing of integrated circuits (ICs) and especially conductive layers suitable for use in an IC. According to the preferred method a metal oxide thin film is deposited on a substrate surface and reduced thereafter essentially into a metallic form with an organic reducing agent. The metal oxide is preferably deposited according to the principles of atomic layer deposition (ALD) using a metal source chemical and an oxygen source chemical. The reduction step is preferably carried out in an ALD reactor using one or more vaporized organic compounds that contain at least one functional group selected from the group consisting of —OH, —CHO and —COOH.

Abstract: A transparent electro-conductive structure comprising a transparent substrate and formed successively thereon a transparent electro-conductive layer and a transparent coat layer, which is used in, e.g., front panels of display devices such as CRTS. The transparent electro-conductive layer is composed chiefly of I) noble-metal-coated fine silver particles having an average particle diameter of from 1 nm to 100 nm, the fine silver particles being surface-coated with gold or platinum alone or a composite of gold and platinum, and ii) a binder matrix. A transport electro-conductive layer forming coating fluid used in the production of this transparent conductive structure comprises a solvent and noble-metal-coated fine silver particles dispersed in the solvent and having an average particle diameter of from 1 nm to 100 nm, the fine silver particles being surface-coated with gold or platinum alone or a composite of gold and platinum.

Abstract: An electrode substrate comprises a backing substrate carrying thereon a metal electrode layer and/or a recording layer, the layer or layers having a smooth surface area with a surface roughness of less than 1 nm by more than 1 &mgr;m2. The smooth surface of the metal electrode layer and/or the recording layer is formed by firstly forming the layer on another substrate having a corresponding smooth surface and then peeling the another substrate off the layer after the layer is bonded to the surface of the backing substrate, whereby the smooth surface profile of the another substrate is transferred to the surface of the layer formed on the backing substrate.

Abstract: The present invention relates to a method of and an apparatus for forming a thin metal film of copper, silver, or the like on a surface of a semiconductor or another substrate. A method of forming a thin metal film, comprises preparing a dispersed liquid having a metal-containing organic compound dispersed in a predetermined solvent, coating the dispersed liquid on a surface of a substrate and evaporating the solvent to form a coating layer, and applying an energy beam to the coating layer to decompose away an organic substance contained in the coating layer in an area irradiated with the energy beam and bond metal contained in the coating layer. According to the present invention, it is possible to form a thin metal film of good quality efficiently and stably. The thin metal film used as metal interconnects in highly integrated semiconductor circuits contributes to the progress of a process of fabricating semiconductor devices.

Abstract: This invention is directed to methods for depositing multilayered thin films onto substrates, for example in making thin film magnetic heads. In accordance with the invention a first film, such as Cr, is deposited onto the substrate at a first pressure and a second layer, such as CoCrPt is deposited at a second pressure.

Abstract: An automotive lambda oxygen sensor is formed by electroless plating of a thin, catalytically active, conductive electrode uniformly on the outer surface of a zirconia thimble. The process includes forming a pristine zirconia solid electrolyte thimble and drilling out a cylindrical cavity in it. A porous outer surface suitable for producing crystallization sites is formed by dipping the unfired thimble in a zirconia slurry containing spray-dried microspheres and firing the coated thimble to densify the thimble and the microspheres and to produce cavities on the surface of the thimble. An inner platinum electrode is formed by conventional conductive ink painting on the axial cavity of the sensor, and the sensor is again fired. The surface is activated by immersion in an acetone chloroplatinic acid bath to form multiple crystallization points, heat treated, then plated in an electroless platinum bath to a desired thickness.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, ampihateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

Abstract: The invention relates to a method for preparing a conductive electrode comprising applying a precursor for electrocatalytic or protective coatings on a conductive electrode substrate, irradiating the conductive electrode substrate and the precursor with near infrared (NIR) radiation to form an electrocatalytic or protective coating on the electrode substrate.

Abstract: The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a step of covering Cu electrodes of electronic equipment by a rust-proofing coating consisting of an organic compound including N and a step of forming soldered joints on the covered Cu electrodes, by using a solder material consisting of at least 2.0 wt % and less than 3 wt % of Ag, 0.5 to 0.8 wt % of Cu, and a balance of Sn and unavoidable impurities. The solder material used in the present invention further contains not more than 3 wt % in total of at least one element selected from the group consisting of Sb, In, Au, Zn, Bi, and Al.

Abstract: A laminated structure for electronic equipment includes a printed circuit board having copper foil, an undercoat plating layer made of tin or silver, formed on the printed circuit board, and a gold plating layer formed on the undercoat plating layer by electroless plating. Tin or silver is a metal which acts as an anticatalyst in electroless plating. After formation of the undercoat plating layer, the printed circuit board is dipped in catalyst-applying treating liquid to inhibit the anticatalyst.

Abstract: A process for producing an automatic-machine-bondable LTCC (Low Temperature Cofired Ceramics) circuit carrier includes the steps of applying a conductive paste having a glass content of less than 1.0 percent by weight onto a ceramic substrate having a glass content of at least 30 percent by weight, in order to form contact pads. The circuit carrier is fired such that glass melts out of the ceramic substrate and causes an adhesion between the conductive paste and the ceramic substrate. A ceramic circuit carrier has adhesion-promoting glass between the ceramic substrate and the conductive paste, wherein the adhesion-promoting glass originates from the ceramic substrate.

Abstract: The present invention provides a method for forming a substantially carbon- and oxygen-free conductive layer, wherein the layer can contain a metal and/or a metalloid material. According to the present invention, a substantially carbon- and oxygen-free conductive layer is formed in an oxidizing atmosphere in the presence of an organometallic catalyst using, for example, a chemical vapor deposition process. Such layers are particularly advantageous for use in memory devices, such as dynamic random access memory (DRAM) devices.

Abstract: A process for the selective activation and plating of a substrate is disclosed. The process involves the application of an activator composition to a substrate in a predetermined pattern by means of a print head wherein the print head moves across the surface of the substrate and selectively deposits the activator composition in said predetermined pattern upon the substrate. The selectively activated substrate is then subjected to electroless plating.

Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.

Abstract: This invention relates to electroless autocatalytic plating of platinum onto a substrate, an aqueous platinum plating bath, a process for plating a uniform coating of platinum onto various substrates using an electroless autocatalytic plating composition, and a platinum plated article formed therefrom. The plating bath of this invention allows direct autocatalytic plating of platinum on catalytically active and inactive, conductive and non-conductive substrates, avoiding the extra costs of activating a catalytically inactive substrate.

Abstract: The present invention includes a step of forming an Ni bump by non-electrolytic plating in an opening of a protecting film having an insulating property formed on an electrode pad which is provided on a semiconductor substrate, and a step of removing a plating solution residue remaining in a gap between the Ni bump and the protecting film. The plating solution residue is removed by cleaning in a cleaning solution containing hydrogen peroxide, or by applying an ultrasonic wave in a cleaning solution such as pure water.

Abstract: The invention describes a method for applying an electrocatalytic or a protective coating to a metal substrate or repairing a damaged area of the same, consisting in a thermal treatment of a precursor of said catalytic coating by means of a hot air jet from a blower. The temperature of the substrate is locally controlled by means of surface temperature sensors or by an infrared measuring system. The metal substrate may be an exhausted electrode structure, in which case the reactivation is easily carried out at the plant site without any need of sending the structure to the producer. The method of the invention is particularly useful for reactivating anodes for oxygen evolution as it permits to avoid the risky procedure of detaching the anode from the current conductor.

Abstract: This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances that may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.

Abstract: A first metal film of a first metal is deposited on a silicon-containing film containing silicon as a principal constituent, and a second metal film of a nitride of a second metal is deposited on the first metal film. Thereafter, a metal film with a high melting point is deposited on the second metal film, so as to form a multi-layer film of the silicon-containing film, the first metal film, the second metal film and the metal film with a high melting point. The multi-layer film is then subjected to annealing at a temperature of 750° C. or more. In this case, the first metal is nitrided to be changed into a nitride of the first metal and a silicide layer of the first metal is not formed in a surface portion of the silicon-containing film before the annealing.

Abstract: A transparent chromogenic panel in which color changes are selectively effectable over predefined areas comprises a pair of facing glass substrates each covered with a conductive layer divided into individual energizeable areas each provided with as set of busbars. An electrochromic electrode layer overlies at least one of the conductive layers. An insulating adhesive sealant spaces apart the substrates and insulates the busbar sets from each other and from exposure to the electrolyte and the electrochromic layer, so that each busbar set may be individually energizeable to effect a color change through a respective one of the individual areas. A passive layer is advantageously superimposed over one of the substrates, its color being chosen so that the color and the transmissivity of the passive layer accommodates the range of color change and transmissivity of the electrochromic layer to maintain the transmitted color of the panel in a warm or neutral shade.

Abstract: Methodology for providing a smooth, thin, highly reflective coating to the walls of microchannels disposed in a plate or substrate. Such plates are commonly used in image intensifiers and have more recently been used to provide high resolution X-ray imaging screens. In the process silver nitrate solution is reacted so as to provide a silver amine complex. In a first embodiment of the process, the microchannel plates are disposed vertically in a beaker and immersed, without stirring, in a solution including the silver amine complex and a reducing agent. In a second embodiment of the process, a fluid flow of filtered reactant is directed through the microchannels. In each embodiment the walls of the microchannels become plated with a highly reflective (>90%), thin (20-50nm) and smooth coating of metallic silver.

Abstract: A semiconductor wafer having copper bondpads (17) that are free of voids (13) and a method for coating the copper bondpads (17) with solderable or wirebondable metals such that the copper bondpads (17) are free of the voids (13). The void free metal coatings are achieved using a dual activation process. In a first activation step (27), the copper bondpads (17) are activated by placing them in a palladium bath. In a second activation step (28), the bondpads are placed in a nickel-boron bath. After the dual activation, the copper bondpads (17) are coated with a layer of nickel-phosphorous or palladium. The nickel-phosphorous or palladium layer may be coated with a layer of gold for subsequent formation of solder balls or wirebonds thereon.

Abstract: The present invention provides a process of forming an antimicrobial coating on a surface of a medical implant, the coating comprising an antimicrobially effective amount of antimicrobial metal atoms incorporated into a coating of amorphous carbonaceous material.

Abstract: A gas sensor and a method for its manufacture are described. The gas sensor has a solid electrolyte (11) having at least one measuring electrode (15) and one porous protective coating (16). The measuring electrode (15) has an electrically conductive base layer (25) and a further layer (27), the further layer (27) being deposited in the pores of the porous protective coating (16) adjacent to the base layer (25) via galvanic deposition. In order to deposit the further layer (27) via galvanic deposition, the basic body (10), which has been fused with the base layer (25) and the protective coating (16) via vitrification, is immersed in a galvanizing bath, the base layer (25) being connected as the cathode.

Abstract: A screen-printing paste as a starting material for fabricating a gas diffusion electrode through screen-printing includes at least one polymer, at least one metallic catalyst, and a high-boiling solvent. The polymer is a binder including poly(butyl acrylate)-polymethacrylate copolymer, a poly(vinyl alcohol), and a poly(ethylene oxide). The polymer can be two polymers, a first being used for hydrophobicization and present in an amount of between 0 to 10% by weight based on a content of the metallic-catalyst, and a second being a binder. A screen-printing method of fabricating the electrode for a fuel cell includes forming a screen-printing layer having a thickness between 3 and 40 &mgr;m by applying the screen-printing paste to a base. The solvent and the polymer serve as a screen-printing medium. The screen-printing layer is baked to allow only residues of the solvent and the polymer to remain, which do not interfere with using the electrode in a fuel cell.

Abstract: A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

Abstract: A limiting-current-type hydrocarbon sensor comprising a solid electrolyte formed of a barium-cerium-based oxide, capable of detecting hydrocarbon stably and accurately regardless of whether no oxygen is present or a high concentration of oxygen is present. The cathode on the surface of the solid electrolyte is formed of an alloyed layer including Au and Al. In particular, an alloyed layer including an Al—Au intermediate phase is suited for the alloyed layer of the cathode. The alloyed layer comprises a first layer including an Al—Au intermediate phase and making contact with the surface of the solid electrolyte and a second layer including a metal Al phase and covering the first layer. The Al phase of the alloyed layer blocks oxygen, and the Al—Au intermediate phase smoothens hydrogen association and reduces the resistance of the electrode. The hydrocarbon sensor can thus detect hydrocarbon accurately even when oxygen is included in an atmosphere.

Abstract: A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the viscosity of the paste is increased. In an alternative method, the low viscosity paste contains a cross-linking agent which causes the paste to increase its viscosity after screening.

Abstract: Removing the electrical field from the internal volume of high-voltage structures; e.g., bushings, connectors, capacitors, and cables. The electrical field is removed from inherently weak regions of the interconnect, such as between the center conductor and the solid dielectric, and places it in the primary insulation. This is accomplished by providing a conductive surface on the inside surface of the principal solid dielectric insulator surrounding the center conductor and connects the center conductor to this conductive surface. The advantage of removing the electric fields from the weaker dielectric region to a stronger area improves reliability, increases component life and operating levels, reduces noise and losses, and allows for a smaller compact design. This electric field control approach is currently possible on many existing products at a modest cost. Several techniques are available to provide the level of electric field control needed.

Abstract: A method of producing a crystalline silicon film having superior crystalline properties is characterized by a method of adding catalytic metal for accelerating crystallization of the amorphous silicon film. The catalytic element is adsorbed on the surface of the amorphous silicon film by using a vapor or a gas, so that a low temperature short time crystallization is made possible by using the catalytic metal at heat crystallization. Especially, by controlling partial pressures, when adsorption state is made into monomolecular layer adsorption with covering rate 1, superior uniform crystalline silicon film can be obtained.

Abstract: A method for preparing a copper pad surface for electrical connection that has superior diffusion barrier and adhesion properties is provided. In the method, a copper pad surface is first provided that has been cleaned by an acid solution, a protection layer of a phosphorus or boron-containing metal alloy is then deposited on the copper pad surface, and then an adhesion layer of a noble metal is deposited on top of the protection layer. The protection layer may be a single layer, or two or more layers intimately joined together formed of a phosphorus or boron-containing metal alloy such as Ni-P, Co-P, Co-W-P, Co-Sn-P, Ni-W-P, Co-B, Ni-B, Co-Sn-B, Co-W-B and Ni-W-B to a thickness between about 1,000 Å and about 10,000 Å. The adhesion layer can be formed of a noble metal such as Au, Pt, Pd and Ag to a thickness between about 500 Å and about 4,000 Å.

Abstract: A recording medium based on the organic dye having excellent storage reliability is to be produced. In producing an optical recording medium having on a substrate a recording layer containing an organic dyestuff and a metal layer, the metal layer is first formed, and the atmosphere of a transport path used for transferring the resulting product to the next stage is set to the relative humidity of 40% or less. The metal layer may e.g., be a reflective layer. In controlling the relative humidity, a shielding plate is provided around the transport path and the relative humidity of an area encircled by this shielding plate is controlled by an air conditioner.

Abstract: Removing the electrical field from the internal volume of high-voltage structures; e.g., bushings, connectors, capacitors, and cables. The electrical field is removed from inherently weak regions of the interconnect, such as between the center conductor and the solid dielectric, and places it in the primary insulation. This is accomplished by providing a conductive surface on the inside surface of the principal solid dielectric insulator surrounding the center conductor and connects the center conductor to this conductive surface. The advantage of removing the electric fields from the weaker dielectric region to a stronger area improves reliability, increases component life and operating levels, reduces noise and losses, and allows for a smaller compact design. This electric field control approach is currently possible on many existing products at a modest cost. Several techniques are available to provide the level of electric field control needed.

Abstract: An electrode with large active surface area is made by winding a Ti-fiber tow around a rectangular Ti-plate, and an electrocatalytic coating of three layers is applied. A precoat comprising a mixture of iridium dioxide and tantalum pentoxide is applied first, using a solution of the corresponding chloride salts in hydrochloric acid with some nitric acid added to inhibit corrosion of the metal. A sealing coat is then applied, comprising tin dioxide doped with antimony, in order to improve adhesion of the final oxide coat to the precoat. The third and final coat comprises particles of titanium dioxide doped with niobium in the +4 oxidation cemented with titanium dioxide that is doped with antimony. Anodes of this description are preferably assembled together with corrosion resistant cathodes in an alternating sequence, with a plastic coated fiber glass mesh placed between the anodes and cathodes to prevent short circuiting.