Abstract: A process for producing a gas electrode is disclosed, comprising sintering a mixture of carbon powder and a fluorine resin powder to form a sheet as a gas electrode base, coating one side of the sheet base with an organic solution prepared by dissolving a platinum group metal salt in an organic solvent capable of forming an organic complex with the metal salt, drying the coating layer, and calcining the coating layer at a temperature of from 250.degree. to 380.degree. C. in an inert atmosphere to reduce the platinum group metal oxide thereby forming a catalyst layer on the sheet base. Reduction (calcination) of the platinum group metal salt can be effected without using dangerous hydrogen gas and without being accompanied by decomposition of the fluorine resin and provides a uniform catalyst layer comprising fine platinum particles having a large surface area with a minimized thickness.

Abstract: An oxygen sensor has alumina porous layer on a surface of a solid electrolyte to cover electrodes and the alumina porous layer is simultaneously baked with the solid electrolyte. The alumina porous layer has baking contraction percentage which is the same range of the solid electrolyte. Alumina powder which is a starting material of the alumina porous layer includes 0.3 to 0.5 .mu.m of a 50% grain size, 0.4 to 1.1 .mu.m of a 70% grain size, and 0.8 to 4.0 .mu.m of a 90% grain size in a grain size distribution of weight integration frequency and further a specific surface area according to a BET method is approximately 8.5 to 11.0 m.sup.2 /g. It is preferable that the baking contraction percentages of the solid electrolyte and alumina porous layer are approximately 16 to 22%.

Abstract: Electrical resistors and resistor networks are provided on an insulative substrate with designated conductive terminations by direct and continuous writing of resistive lines in fine-line patterns between and over each two of neighboring terminations from heterogeneous resistive thick film compositions. The resistive lines of line width w and total length l between conductive terminations can be directly written by suitable writing apparatus to have a high aspect ratio n=l/w, thereby providing resistors and resistor networks of high resistance values on an overall substrate area significantly smaller than required for conventional thick film resistors of comparable resistance value and comparable operational characteristics.

Abstract: The instant invention relates to a method for manufacturing an electrolytic electrode comprising a core material made of a valve material, forming a plasma flame-coated layer containing the oxides of titanium and tantalum on the surface of the core material, forming an interlayer containing platinum and the oxides of titanium and tantalum on the surface of the plasma flame-coated layer, forming an .alpha.-lead dioxide layer on the interlayer and forming a .beta.-lead dioxide layer on the .alpha.-lead dioxide layer.

Abstract: A method is disclosed to deposit aluminum and platinum on substrates for improved corrosion, oxidation, and erosion protection. Low temperature chemical vapor deposition is used. A homogeneous biphase coating of aluminum and platinum may be deposited, as well as sequential layers of aluminum and platinum.

Abstract: Coating compositions of silver flake suspended in predominantly aqueous vehicle is disclosed for laying down a coating of electrically conductive metal on resistive or dielectric substrates useful in the electronics industry. The coating compositions provide an ideal combination of high silver loading and low viscosity for spray painting desired thickness coatings at high speed in a single pass. The novel compositions include silver flake, water soluble polymer binder, water and a substantially completely water soluble, organic co-solvent. The coating compositions have good green strength after drying and may be used to apply an electrically conductive base to enable electroplating plastic or elastomer parts. Optional sintering adhesives can be added to allow high temperature, permanent bonding of the silver to a ceramic substrate. The coating compositions have excellent storage stability such that settled solids can be redispersed readily with brief and/or mild agitation.

Abstract: The method and structure for providing a pair of electrical contact terminals on the back side of an electroluminescent (EL) lamp. The EL lamp has a first conductive layer, a layer of EL material, a first insulating layer, a second conductive layer, a second insulating layer and a film of conductive material, all disposed on a transparent substrate, respectively. The film of conductive material extends around the second insulating layer to come in electrical contact with the first conductive layer. This allows an electrical contact terminal to be established on the film of conductive material, rather than directly on the first conductive layer. The other electrical contact terminal is positioned on the second conductive layer. The second insulating layer serves to electrically separate the two contact terminals.

Abstract: A method of growing, in a vapor phase, a gold film having high electro-migration resistance and a flat surface, and capable of being buried in contact holes disposed in an insulating film of an integrated circuit device, for example, at a practical growing rate. Dimethylgold hexafluoroacetylacetonato (DMAu(hfac)), for example, is used as a starting gas, and vapor growth is carried out under specific conditions by utilizing thermal CVD. Adhesion of the gold film can be improved by converting it to a two-layered film by the combination of plasma enhanced CVD with thermal CVD.

Abstract: A method for making multi-layer ceramic packages. The method provides for attaching contact pins to a ceramic substrate after the application of an intermediate metal layer and an outer metal layer. This eliminates plating the contact pins with an intermediate metal layer and an outer metal layer, thereby saving material and process time.

Abstract: A method for producing microcomposite powders for use in superconducting and non-superconducting applications.

Abstract: A method for forming an electrical interconnect on a substrate. At least one pad (14) is formed on a substrate (11). The pad (14) is formed having a non-wetting surface (12) and a wettable surface (13). Photoresist (44) is patterned on a substrate (41) forming a cavity on a pad (46) leaving a non-wetting surface (42) and a wettable surface (43) exposed. Interconnect material (56) is formed on a non-wetting surface (52) and a wettable surface (53) of pad 57. Interconnect material (56) is reflowed forming an interconnect ball (74) on a wettable surface (73). Surface tension causes interconnect material (56) when reflowed to flow from a non-wetting surface (72) to the wettable surface (73) and ball up to form the interconnect ball (74).

Abstract: The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates the use of electroless nickel as the primary medium for interconnection, for building circuitry to the desired thickness and as an etch resist. The method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce these circuit boards.

Abstract: An oxygen concentration detector provides high durability by increasing the thermal stability of coating layers applied to an electrode face thereof. A catalyst layer is formed on an outer surface of an electrode at the analysis gas side of a partition wall made of an ion oxygen conductive ceramic for generating electromotive force according to the difference between the concentration of oxygen in the analysis gas and the concentration of oxygen in the reference gas. The catalyst layer is composed of heat resistant ceramic particles and a particulate metallic catalyst made of platinum, rhodium or the like, supported by the surface of the heat resistant ceramic particles. The catalyst layer is formed so that the catalyst is supported by the heat resistant support particles. The support particles are heat treated to grow to a particle size so that particle growth can be restrained when the support particles are exposed to the exhaust gas from an internal combustion engine.

Abstract: Three-dimensional RF coils suitable for use in NMR spectroscopy or imaging are described, as well as methods for making such coils. The coil is made from a thin-walled, non-magnetic, electrically insulating tube. The tube is then masked and a first conducting layer is applied, e.g., by evaporation. An additional insulating layer is provided on top of the first conducting layer, and then a second conducting layer is applied. An optional additional insulating layer may then be applied over the second conducting layer. The first and second conducting layer, in combination, are electrically connected to form a self-resonant structure at the selected frequency of the NMR apparatus. The coil may be fine-tuned conventionally by means of a series or parallel capacitor, or by changing the position of a conductive ring around the outside of the coil. Alternately, two tubes may be used, with only one conducting layer deposited on each.

Abstract: A sensing element, for use in determining the presence and/or concentration of a species in a solution, comprises a flat insulating substrate (10) having at least one thin metallic electrode (16) deposited on it and overlaid with an insulating layer (20). The electrode (16) and insulating layer (20) bridge a weakening groove (12) formed in the substrate. Immediately before use, the element is broken along the groove to expose a cross-sectional surface (24) of the element, and thus a cross-sectional working surface (26) of the electrode. The thickness (T) of the element is comparable to or less than the concentration boundary layer thickness of the solution. This exposed working surface is the only part of the electrode in contact with the solution. In use, the element can be vibrated so as to improve its sensitivity.

Abstract: The present invention describes a plated component and plating method in which the plating adheres to the reinforcement particles on the surface of a composite component. This allows the component to be processed above 400.degree. C. without blistering. The plating method allows brazing, such as gold/tin and gold/germanium brazing, maintains hermeticity, and prevents corrosion over a sustained period of time. By utilizing an activator such as palladium, which can produce catalytic sites on which electroless nickel can be deposited, a component with a surface of exposed reinforcement particles can be plated to form a uniform surface without voids. It has been found that by using a combination of nickel-boron and a palladium activator, that Al/SiC composites can be plated with good adhesion when exposed to temperatures above 400.degree. C.

Abstract: An electrical interconnection substrate (20) is prepared to receive both wire bonded and soldered connections (60,64,66) by forming a dielectric solder mask (30) over the substrate (20), with openings (36) in the mask (30) to expose the contact pads (22) for which soldered connections are desired. The substrate (20) is exposed to a molten solder alloy (44) in a wave soldering process that dissolves the wire bonding material (28) (preferably gold) from the exposed pads (22) and deposits solder bonding pads (52) in its place. Excess solder is then removed from the substrate, and openings (54) are formed through the solder mask (30) to expose the wire bond contact pads (22'). The selective dissolving of gold bonding layers (28) and their replacement by solder pads (52) prevents the establishment of brittle gold-solder intermetallics, and the deposited solder (52) requires no further heat treatment for correct alloy formation.

Abstract: a thin film printed circuit inductive element exhibiting low Q wherein a conductive spiral is deposited on an insulating substrate and resistive links are connected between adjacent turns of the spiral. Inherent resonance is thereby damped out.

Abstract: A method and apparatus for separating ions in a liquid sample based on electrophoretic mobility. The device includes a buried channel formed upon a semiconductor wafer and surrounded by an insulating material. A matrix liquid is disposed in the channel and facilitates movement of ions through the channel. A voltage source applies a voltage between first and second electrodes mounted in first and second reservoirs, respectively. The first and second reservoirs are located at opposite ends of the channel, and hold the matrix liquid. The applied voltage generates an electric field along the length of the channel that pulls molecules that are introduced into the channel along the channel, such that molecules having one polarity are attracted to the first electrode, and molecules having a second polarity are attracted to the second electrode.

Abstract: In an electrochemical sensor, a gas analyzing electrochemical cell is implanted directly on a substrate wafer. The entire wafer is coated with enamel layers except at the places needed for the electrical connections. A fixing part fixes the sensor in a housing in such a way that the electrochemical cell is inside the housing which contains the gas to be analyzed. This fixing part provides imperviousness and prevents the gases from reaching the electrical connections.

Abstract: A membrane and electrode structure is formed by applying ink of catalytically active particles on the surface of the membrane. The electrode ink comprises:(a) catalytically active particles;(b) a hydrocarbon having at least one ether, epoxy or ketone linkage and an alcohol group, preferably 1 methoxy 2 propanol; and(c) optionally, perfluorinated sulfonyl fluoride polymer or perfluorinated sulfonic acid polymer.

Abstract: Nonlinear optical composites with large third-order optical response compd of metal clusters uniformly dispersed in polymers are prepared by vapor deposition of a metal onto a cold support while simultaneously cocondensing a vapor of an organic material. Where the organic material is a monomer, it polymerizes either when it comes in contact of the metal and/or when the cold surface is warmed. The unpolymerized monomer is removed to yield a processable composite. When the organic material is a diluent, it deposits as a solid on the cold surface forming a dispersion of the solid metal clusters in the liquid diluent. A polymer solution is then mixed with the dispersion and the composite is formed after removal of the diluent and the solvent for the polymer.

Abstract: A biocompatible thin film electrical component is configured for use in a human body or other ionic liquid environment. A polyimide substrate is bonded to a glass carrier plate sized for handling by automatic equipment and a multiple-layer metal conductor is deposited on the substrate and patterned to define an electrical circuit or biosensor. The polyimide and the glass establish a bond therebetween that withstands handling yet is broken using biocompatible releasing agents and techniques. The polyimide substrate and glass carrier plate preferably have similar thermal expansion properties to reduce the likelihood of fracture and delamination problems during release of the substrate from the carrier plate. An insulation layer covers the metal conductor and, in one embodiment, is made of a polyimide having a cure temperature lower than the temperature at which interdiffusion occurs in the metal layers in the conductor.

Abstract: A surface acoustic wave device which can operate at a higher frequency range is produced by irradiation with a focused ion beam to produce a narrower electrode width and narrower spacing width between neighboring electrodes in contact with a piezoelectric body, without degrading the reliability of the device. The surface acoustic wave device includes a piezoelectric body 3 and interdigital electrodes 2a and 2b in close contact with the piezoelectric body 3 and formed by using the focused ion beam. In order to increase the frequency of the device, the piezoelectric body 3 may be formed on a substrate 1, for example of diamond.

Abstract: The present invention provides a methodology for increasing the critical current density carried by high transition temperature; superconductive materials. The methodology is employed using any Noble metal to form an electrically conductive coating; and is used with any high transition temperature superconductive material conventionally known. The resulting improved superconducting material demonstrates an enhanced critical current density capability in the order of 48%; and substantially decreases the degradation of the critical current density in the presence of an applied magnetic field; and offers a range of other advantages including environmental degradation protection, an increased mechanical strength, and an improved capability for adding electrical contacts.

Abstract: A member having a shank is selectively coated with a material such as a metal by loosely sliding a washer made of a material such as a thermoplastic or thermosetting polymer onto the shank, securing the washer such that the washer is in intimate contact with the shank, and immersing at least a portion of the member into at least one coating bath so that a portion of the member is coated and the portion of the shank in contact with the washer is not coated. The member can be an input/output pin for an electronic device and the coating can be applied by methods such as electroless plating or electrolytic plating.

Abstract: Gold can be selectively deposited onto a catalytically-activated region on a surface of a workpiece in the presence of a catalytically-inactive region on the surface by a chemical vapor deposition method. The method involves placing the workpiece in a vacuum chamber and evacuating the vacuum chamber to a base pressure equal to or less than a catalyst-activity-preserving upper pressure limit to eliminate effectively gaseous catalyst-deactivating contaminants from the chamber. The surface composition of at least one region of a target surface of the workpiece is altered to produce a catalytically-activated region on the target surface. At least one region of the target surface disjoint from the catalytically-activated region is a catalytically-inactive region. A gaseous alkylated (trialkylphosphine)gold compound is introduced into the vacuum chamber to expose the target surface of the workpiece to the compound.

Abstract: By virtue of an activating pretreatment with a polymer-stabilized Pd sol, patterns, such as transparent patterns of indium-tin oxide, can be deposited on glass by electroless metallization. For example polyvinyl alcohol is used as the polymer.

Abstract: The invention is to a method of spot plating parts of a plated semiconductor lead frame. The entire lead frame is first plated. Then parts of the lead frame, internal to the subsequent encapsulating package, are spot plated prior to encapsulating the semiconductor device. A spot of silver is plated in the mount and/or bond area of the lead frame.

Abstract: A process for fabricating an active electrode for an oxygen sensor involves preparing a solution by dissolving an alkoxide of a metal constituting an oxide semiconductor or solid electrolyte in a mixture of a solvent and diethanol amine, adding chloroplatinic acid to said solution to obtain a precipitation, calcining and pulverizing said precipitation to form a micro-composite power of an oxide of said metal and platinum, and forming an electrode on said oxide semiconductor or solid electrolyte using said composite powder.

Abstract: A method of forming a eutectic bond, of Cadmium Telluride to Sapphire utilizing the Gold/Silicon eutectic bonding of the Cadmium Telluride to the Sapphire. A multi-layer structure of: Chromium which provides adhesion to the Cadmium Telluride; a Titanium layer which functions as a diffusion barrier to the Gold, and a Gold layer are sequentially evaporated on the Cadmium Telluride; a separate multilayered structure of: Silicon grown on Sapphire, and Gold evaporated upon the Silicon. These two multilayered structures are then eutectically bonded. This method enables the expansion coefficient of the eutectic layer to be tailored through the Gold concentration to match that of the Cadmium Telluride. This method also allows the bonding stress to be confined between the Gold/Silicon eutectic and the Sapphire substrate, eliminating the bonding stress in the Cadmium Telluride. Also, due to the precision of the thickness of the evaporated layers, the bonded substrates are inherently planar and parallel.

Abstract: A process for forming a phosphor comprising the steps of:(a) providing a substrate for deposition and growth of an alkali halide phosphor,(b) forming a patterned surface on the substrate comprising a plurality of mesas, each of the mesas having an incline, a decline, and a horizontal surface, the mesas being separated from one another by horizontal segments of the substrate and wherein:(i) the ratio of the height of each of the mesas to the width of the horizontal segments is in the range of about 1:20 to 1:4;(ii) the ratio of the width of each of the mesas to the width of the horizontal segments is in the ratio of about 1:30 to 1:4; and(iii) the angles of incline and decline of each of the mesas are between about 5.degree. to 85.degree.; and(c) depositing an alkali halide phosphor on the patterned surface of the substrate of step (b), thereby forming cracks, in the deposited phosphor, originating from the inclines and/or declines of each of the mesas.

Abstract: A method for making a bimetallic or trimetallic electrical contact. Features that only its shank portion, made of copper or copper alloy, is covered by a thin layer of silver or silver alloy for protecting the shank portion from environmental erosion. This shank portion is made by cutting the silver-plated wire to a short piece.

Abstract: A method for applying a metal film barrier layer between a substrate and a superconductor coating or over a superconductivity coating using chemical vapor deposition in which low vapor pressure reactants are used, is disclosed, which comprises the steps of providing a substrate and a quantity of metal-bearing reagent and one or more reagents, placing the substrate within the furnace, introducing the metal-bearing reagent by a powder feeder means and then the reagents at different times into and reacting them in the furnace, resulting in the deposition first of a coating of metal onto the substrate and then of a coating consisting essentially of the superconducting reactant components onto the metal film; said reagents generally chosen to yield the group of oxide superconductors.

Abstract: An electrically resistive film of the type used for forming thick film resistors is formed predominantly of palladium and includes an addition of boron nitride to increase resistance, preferably in combination with tantalum oxide. A paste of palladium powder and boron nitride powder dispersed in a vaporizable vehicle is applied to a substrate and sintered to form the film. In a preferred embodiment, the substrate is a ceramic powder compact that is concurrently sintered in a co-firing process.

Abstract: Composite reactive articles are useful for quantifying cyanide ions in solution. The composite reactive articles can be porous reactive supports comprising an inert substrate having immobilized thereon finely divided gold. The porous reactive supports can be particulate, porous fibrous membranes, or solution-cast membranes. Alternatively, the composite reactive articles can comprise porous fibrous membranes having enmeshed therein the aforementioned porous supports which can be in particulate or fibrous forms.

Abstract: An electrode which comprises a substrate of a valve metal or an alloy thereof having properties similar to those of the valve metal and a coating comprising an outer layer which comprises RuO.sub.2, an oxide of at least one non-noble metal and at least one other noble metal or oxide thereof and an intermediate layer having a composition different from that of the outer layer and which comprises RuO.sub.2 and an oxide of at least one non-noble metal. The electrode is particularly useful as an anode for an electrolytic cell, eg a chlor-alkali cell, it has a lifetime therein which is greater than the sum of the operational life-times of electrodes which comprise a valve metal substrate and which separately comprise one of the above layers which together form a part of the coating of that electrode.

Abstract: A strain tolerant multifilamentary wire capable of carrying superconducting currents is provided comprising a plurality of discontinuous filaments formed from a high temperature superconducting material. The discontinuous filaments have a length at least several orders of magnitude greater than the filament diameter and are sufficiently strong while in an amorphous state to withstand compaction. A normal metal is interposed between and binds the discontinuous filaments to form a normal metal matrix capable of withstanding heat treatment for converting the filaments to a superconducting state. The geometry of the filaments within the normal metal matrix provides substantial filament-to-filament overlap, and the normal metal is sufficiently thin to allow supercurrent transfer between the overlapped discontinuous filaments but is also sufficiently thick to provide strain relief to the filaments.

Abstract: A method of producing a transparent conductive film provided with supplementary metal lines, comprises the steps of forming a transparent conductive film composed mainly of indium oxide, tin oxide, or antimony oxide on a transparent substrate and forming metal lines through printing on the transparent conductive film by an intaglio or litho offset printing procedure a line pattern of metallorganic ink composed mainly of an organic noble metal containing gold, silver, or platinum and baking it for metallization.

Abstract: A process for fabricating a porous, high surface area electrode and the use of that electrode in an electrolytic cell for manufacturing chlorine-free chlorine dioxide from dilute alkali metal chlorite solutions in a single step is disclosed. The electrolytic cell uses a porous flow-through anode and a cathode separated by a suitable separator.

Abstract: The invention relates to a method of providing a pseudoplastic paste on a substrate surface by dipping. The paste is provided in the form of a layer on a wire gauze, the layer thickness being adjusted to a desired value by means of a squeegee and a spacer. The paste layer is wiped off at the bottom side of the gauze by means of a squeegee. Subsequently, a substrate with the substrate surface to be covered is dipped in the paste layer up to the gauze and is removed again before the paste can flow over the parts of the substrate which are not to be covered. The method can be used, for example, to provide a ceramic multilayer actuator having piezoelectric layers 20 and inner electrodes 21 with end contacts 22, in such a manner that the end contacts fully cover the end faces of the actuator and that the side faces of the actuator are substantially completely left free by the end contacts.

Abstract: This invention relates to a method for producing a smooth continuous and adherent pressure bonded or cold welded layer of a metal containing composite on a base or target material through the driving force of a pulsed laser. The method includes the steps of selecting a laser transparent substrate, applying thereto a thin laser absorptive polymeric film characterized by a high optical coefficient of absorption to the wavelength of said laser, applying the metal containing composite to the absorptive polymeric film, and placing the base or target material in close proximity to said composite. The composite is a multilayered composite comprising laser absorptive polymer, gold, nickel and gold-flash, and the pulsed laser energy is directed through the transparent substrate toward said composite and is absorbed by the polymeric film causing heating and vaporization thereof while leaving portions of the polymeric film unvaporized.

Abstract: A method for forming interconnections in microelectronic devices, including interconnections through small vias between different layers in the microelectronic devices include the spin coating of a film comprising a polyoxometalate and an organic material on the substrate. The film is optionally patterned by lithography, the polymer is removed, and the polyoxometalate is reduced to a metal layer. The metal layer may in one embodiment provide a nucleating zone for the deposition of metal.

Abstract: A method of manufacturing an electrical contact between a current lead and a part made of a superconductive ceramic of the type RBa.sub.2 Cu.sub.3 O.sub.y, where R designates a lanthanide chosen from Y, La, Nd, Sm, Eu, Gd, Ho, Er, Tm, Yb, and Lu, and where y lies in the range 6.9 to 7, in which method a layer of a material based on a silver-containing resin is deposited on said part, the part is dried, and is then heat treated in oxygen by being heated to a temperature greater than 900.degree. C., and then cooled, with the temperature dwelling at 450.degree. C. for a certain length of time corresponding to the phase during which said ceramic is reoxygenated.

Abstract: A new metanization is described which is a composite of subsequent metal layers beginning with a layer of titanium and having in an ascending order the following composition: Ti - TiPd - Cu - Ni - Au. TiPd is an alloy of titanium and palladium containing from 0.3 to 14 weight percent Pd, by the weight of the alloy. The TiPd alloy is etchable in an aqueous BF solution containing from 0.5 to 2.0 and higher, preferably from 0.5 to 1.2 weight percent BF. The use of the TiPd alloy avoids the occurrence of Pd residues remaining after the etching of Ti layer and liftoff (rejection etching) of Pd layer in a prior art Ti-Pd-Cu-Ni-Au metanization. Ti and TiPd layers are present in a thickness ranging from 100 to 300 nm and from 50 to 300 nm, respectively, and in a total minimum thickness needed to maintain bonding characteristics of the metallization.

Abstract: A method for producing an oxide superconducting composite wire is disclosed, which comprises the steps of: (a) molding a powdered oxide superconductor material to form a wire; (b) heat treating the wire in an oxygen atmosphere thereby forming the wire into an oxide superconducting member; (c) forming a non-oxidizing metal intermediate layer on a surface of the oxide superconducting member; (d) bundling a plurality of the oxide superconducting members containing the intermediate layer; (e) inserting the bundled oxide superconducting members into an oxidizing metal support tube; and (f) drawing the product of step (e) to reduce its diameter and heat-treating it.

Abstract: The invention is directed to a method for forming a metal coating on a substrate by applying an oxalate of a Group VIII element from the Periodic Table of the Elements to the substrate. The oxalate is selected so that it will decompose to a complex of a zero valent Group VIII element or a Group VIII element on exposure to an energy source. Microelectronic circuits, etch masks or metal contacts on superconductors can be formed by the method when the oxalate coating is exposed to an energy source through a mask or the energy source beamed at the oxalate to trace a pattern on it.The metal thus obtained can be subsequently coated by electroless compositions especially where the Group VIII element is a catalyst for electroless coatings such as palladium. Additionally, the metal coating may be coated by an electrolytic composition.

Abstract: A method for manufacturing hygristors includes preparing a hygroscopic gel containing a substantially greater proportion of carbon than the prior art, and milling the gel for a period of at least 24 hours to produce a smooth mixture. Substrates are dipped into the milled gel at controlled rates to coat the substrates. The coated substrates are cured under controlled temperature and humidity. Adhesion of the coating is improved by the smoother mixture resulting from the longer milling time, and by the differences in components of the mixture compared to the prior art. Long term stability and dynamic range are both increased.

Abstract: A method of fabricating a gas sensor which comprises a substrate; a buffer layer coated on the substrate; at least one gas sensing layer arranged on the buffer layer; a pair of electrodes disposed on the gas sensing layer; and a catalytic layer coated on the gas sensing layer. A spin coating process is performed, using centrifugal force, to form the layers which are thin and evenly deposited on the substrate. The gas sensing layer of the gas sensor is formed before forming the electrodes of the same such that the heat treatment thereto can be carried out at 800.degree. C. which is much higher than the conventional temperature of 600.degree. C. The bonding of the gas sensing layer to the substrate is thereby much stronger than the conventional gas sensor.

Abstract: A Nb-Ti or Nb-Zr low temperature superconducting (LTS) wire is coat with ten AgN0.sub.3 which is then decomposed to form a uniform silver metal (Ag) coating on the LTS wire. A uniform coating of molten Al or Al alloy is formed on the Ag coated LTS wire and then solidified. A bundle of the coated LTS wires is inserted into an Al or Al alloy tube and cold worked to form a multifilamentary LTS cable comprising the Ag coated LTS wires each surrounded by an Al or Al alloy matrix.