Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.

Abstract: An electroconductive paste for forming an electric circuit which is low in resistivity, high in electroconductivity and minimized in change of resistivity even after a thermal shock test and/or a humidity and DC applied test, can be obtained by using a composite electroconductive powder comprising a flake-like electroconductive powder made of a material such as silver, a silver alloy, a silver-coated copper powder or a silver-coated copper alloy powder and an unsteady-shaped electroconductive powder such as a reduced silver powder.

Abstract: Nanosize powders with particle size smaller than the critical length for specific material properties are used to form the ceramic layers of passive electronic components. Ceramic substrates are coated with electrodes, which are then coated with a ceramic layer from a suspension, preferably a low viscosity suspension, of nanoscale powders. The ceramic layer is dried at low temperatures (preferably below 200 .degree. C.) and it is sintered to high density (preferably above 90%) at moderate temperatures (preferably low and less than 1,000 .degree. C.). Once sintered, an electrode layer is coated on top of the ceramic layer to yield an electrode/ceramic/electrode structure.

Abstract: An oxygen sensor element includes a solid electrolyte having cavities on a surface thereof and an electrode formed on the surface of the solid electrolyte. In a method of producing the oxygen sensor element, a solution containing a noble metal compound for nucleus formation is first applied to an electrode forming portion of the solid electrolyte to form a coating film. Then, the coating film is heat-treated to form a nucleus forming portion where noble metal nuclei are deposited. Subsequently, metal plating is applied to the nucleus forming portion to form a plating film deeply entering the cavities. Thereafter, the plating film is burned to form the electrode deeply entering the cavities.

Abstract: A process for making a field emitter cathode is disclosed, which comprises the steps of depositing a solution of a metal compound in a solvent and an electron emitting powder onto the surface of a substrate and heating the substrate containing the solution and the electron emitting powder deposited thereon for a time and temperature sufficient for the metal compound to be completely reduced to a metal.

Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.

Abstract: In accordance with the present invention, it has been discovered that conductive traces made from transient liquid phase sintering (TLPS) pastes, plated by electroless or electrolytic means, result in improved solderability, adhesion and conductivity of the circuitry. Transient liquid phase sintering pastes employed in the practice of the present invention differ from conventional metal loaded polymer thick film (PTF) inks in that they contain, in addition to a binder, they also contain both a relatively high melting metal powder and a relatively low melting solder powder capable of forming a continuous intermetallic/metallic phase after sintering. The present invention is particularly useful, for example, for the fabrication of single and multi-layer printed circuit boards, providing horizontal and vertical conductive interconnects, metallized through-holes, and conductive pads for electronic component attachment.

Abstract: A process for preparing a toner donor roll having an integral electrode pattern involving: (a) providing a cylindrically shaped insulating member; (b) coating the insulating member with a photo or thermally sensitive composition comprised of a polymeric material and a conductive metal nucleating agent; (c) patterning the composition, resulting in a first composition portion corresponding to the electrode pattern and a second composition portion; and (d) depositing conductive metal on the first composition portion, resulting in the electrode pattern which is capable of being electrically biased to detach toner particles from the donor roll. In an alternative embodiment, there is provided an insulating member comprised of an insulating polymeric material and a conductive metal nucleating agent.

Abstract: Thin film capacitors are formed by a multi-level dry processing method that includes simultaneous ablation of via openings through both the dielectric and the metal electrode layers of a capacitor. Preferably, the dielectric films are formed of barium strontium titanate and the metal electrode layers are formed of platinum. The present invention overcomes the problems associated with the use of strong etchants to sequentially form separate via openings through the electrode and dielectric layers, prevents the potential for delamination of the respective layers during wet etching and the possible undesirable effects of etching solutions on substrate materials.

Abstract: This invention relates to a process for producing a selective absorber which contains one or more layers of a non-homogeneous material (cermet), the non-homogeneous material having been produced by means of a sol-gel process.

Abstract: This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a copper compound, bringing the material into contact with an aqueous alkaline solution, and electroplating the material. According to the method of the invention, a desired coating having an excellent decorative appearance can be formed by electroplating without involving electroless plating on even a non-conductive material having a large area such as plastic molded components.

Abstract: A mesh material for a spacecraft antenna reflector is disclosed. The mesh material has a base material made from a dielectric fabric. A conductive material, such as nickel, is applied to the dielectric mesh. The type and thickness of the conductive material is adjusted to regulate the final conductivity of the reflective surface to a predefined range. The present invention utilizes a range that reduces PIM while at the same time maintains a high degree of RF reflectivity. The preferred range is 0.01 to 10 ohms per square.

Abstract: The present invention relates to a thick film formed of a mixture of metal powders and metallo-organic decomposition (MOD) compounds in an organic liquid vehicle and a process for advantageously applying them to a substrate by silk screening or other printing technology. The mixtures preferably contain metal flake with a ratio of the maximum dimension to the minimum dimension of between 5 and 50. The vehicle may include a colloidal metal powder with a diameter of about 10 to about 40 nanometers. The concentration of the colloidal metal in the suspension can range from about 10 to about 50% by weight. The MOD compound begins to decompose at a temperature of approximately about 200.degree. C. to promote consolidation of the metal constituents and bonding to the substrate which is complete at temperatures less than 450.degree. C. in a time less than six minutes.

Abstract: Durable electrolytic cell electrodes having low hydrogen overpotential and performance stability. A highly porous electrocatalytic primary phase and an outer, secondary phase reinforcement coating are provided on an electrically conducting transition metal substrate to make the electrodes. Durability is achieved by the application of the outer secondary phase to protect the primary phase electrocatalytically active coating. A process is also disclosed for catalizing a substrate surface to promote electroless deposition of a metal.

Abstract: A method of making a lightweight, microwave electronic structure includes the steps of forming a rigid, glass structure having a desired density by a sol-gel process and thereafter uniformly coating the formed glass structure with an adherent and uniform conductor. The sol-gel process may be carried out by polymerizing a mixture comprising silicon alkoxide, water and an alcohol. The coating process may be carried out by coating the glass structure with a solution comprising an organic compound of a metal dissolved in an organic solvent and thereafter volatizing the organic solvent.

Abstract: The invention is a process for formation of an electrode on a solid polymer anion exchange membrane to increase rates of reaction at a reaction surface of the membrane. The process includes the steps of soaking a polymer anion exchange membrane in a solution containing an anionic entity wherein a desired metal catalyst is contained within the anionic entity so that anions containing the metal catalyst exchange into the membrane by electrostatic attraction, and exposing the membrane to a reducing agent so the metal catalyst is reduced to a metallic form to become physically secured at a reaction surface of the membrane to thereby form the electrode adjacent the reaction surface. In preparation of an electrode on an anion exchange membrane, the process is concluded by rinsing the membrane in distilled water and then the membrane is cycled through the soaking, exposing and rinsing steps until a desired level of catalyst loading is achieved.

Abstract: An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.

Abstract: A process for forming a layer of gold on a substrate, comprising: preparing a solution of a gold precursor wherein the gold precursor consists ofAu(OH).sub.p (OOCR.sup.1).sub.q (OOCR.sup.2).sub.rwherein R.sup.1 is selected from the group of hydrogen, alkyl, alkenyl, and alkynyl, and R.sup.2 is selected from the group of hydrogen, alkyl from 2 to 10 carbon atoms, alkenyl, or alkynyl, and p+q+r=3. Applying the solution of the gold precursor to the surface of the substrate. Decomposing the gold precursor by subjecting the gold precursor to heat.

Abstract: A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the photoresist is stripped, and copper is deposited without a mask by electroless plating on the unetched seed layer to form well-adhering high density copper lines without exposing the photoresist to the electroless bath.

Abstract: A passenger seat comprising: a frame element, vehicle anchorage means connected to the frame element, a seat body comprising a resilient material fixed with respect to the frame element and trim cover attachment means, the trim cover attachment means comprising a relatively high density, rigid foam member having a groove disposed in a surface thereof, the groove capable of receiving connection means comprised in a trim cover. A process, system and mold for producing a passenger seat are also described.

Abstract: A combustible gas sensor that uses a resistively heated, noble metal-coated, micromachined polycrystalline Si filament to calorimetrically detect the presence and concentration of combustible gases. A thin catalytic Pt film was deposited by CVD from the precursor Pt(acac).sub.2 onto microfilaments resistively heated to approximately 500 .degree. C.; Pt deposits only on the hot filament. The filaments tested to date are 2 .mu.m thick .times.10 .mu.m wide .times.100, 250, 500, or 1000 .mu.m-long polycrystalline Si; some are overcoated with a 0.25 .mu.m-thick protective CVD Si.sub.3 N.sub.4 layer.

Abstract: A nitrogen oxide sensor and a method of manufacturing the sensor are disclosed. The sensor has a gas detecting portion including sensitive material having electric property thereof subject to change in association with presence of nitrogen oxide in gas and a pair of electrodes electrically connected with the gas detecting portion. The gas detecting portion includes, as a main component thereof, metal oxide compound represented by a general formula:Bi.sub.2 Sr.sub.2 (Ca.sub.1-x Y.sub.x)Cu.sub.2 O.sub.8+y(0.8.ltoreq.x.ltoreq.1; 0.ltoreq.y.ltoreq.1)and having the 2212 phase crystal structure and crystalline size greater than 100 .ANG..

Abstract: A method for forming a material in an opening on a substrate, such as a wafer, using an electron cyclotron resonance-assisted high density plasma physical vapor deposition system. The method comprises the steps of: maintaining a pressure in the range of approximately 1 mTorr to approximately 6 mTorr; generating a plasma by providing a microwave power in the range of approximately 3 kilowatts (kW) to approximately 5 kW; applying a direct current (DC) voltage to a target source of the material in the range of approximately (negative) -600 volts to approximately -1000 volts; providing a current of a predetermined amount to a first electromagnet; and providing a current to a second electromagnet that is less than said predetermined amount, wherein said second electromagnet is disposed below said first electromagnet; and forming a layer of the material in the opening.

Abstract: An improved active electrode for use in planar sensors has been discovered, the electrode prepared by a process comprising combining a base component with a metal paste and heating the paste in the presence of air for a time sufficient to oxidize a portion of the electrode to produce the metal/metal oxide electrode. The electrodes may be incorporated into various planar sensor formats, particularly pH and CO.sub.2 sensors.

Abstract: A method of forming electrically conducting silver tracks on glass, by applying a silver composition comprising solids portion in a carrier medium to the glass and then firing the composition to form the tracks, wherein the solids portion contains elemental silver and/or precursor thereof and contains also elemental boron.

Abstract: A method of manufacturing a ceramic electronic component having a dielectric ceramic and a conductor containing Ag as a main component, wherein a dielectric resonator with a high Q value is produced by heat treating at 400.degree. C. or more in an atmosphere containing 10% or less by volume of oxygen after sintering the dielectric ceramic. Using a BaO--TiO.sub.2 --Nd.sub.2 O.sub.3 --Bi.sub.2 O.sub.3 based composition (.epsilon..sub.r =92, Qf=5000 GHz) as a dielectric, a coaxial type dielectric ceramic is produced by granulating calcined powder of the dielectric and then compacting the powder, followed by sintering. A dielectric resonator of .lambda./4 is produced by coating the dielectric ceramic with Ag paste at a position other than either the upper or lower side and then burning the paste. Thereafter, the electrodes(1,4) are formed by burning the paste at 400.degree. C. or more in an atmosphere containing 10% or less by volume of oxygen.

Abstract: Copper lines or molybdenum lines on a substrate are inspected for defects by coating a metallized substrate with an inspection layer followed by imaging the substrate, and removing the inspection layer after the imaging. The inspection layer can be a light reflecting metal or a combination of a light reflecting metal and light-absorbing organic compound.

Abstract: A silver composition is disclosed which contains silver powder or flake, a water soluble binder, an organic water soluble solvent and an inorganic binder. Generally, the composition will also contain water. The water soluble binder is especially chosen such that it has the property after dissolution in water, followed by water removal that it can be again dissolved in water (as opposed to water resistance as in a paint). The silver composition as a film or coating also lacks water resistance (prior to a firing operation) which can aid in pattern formation.

Abstract: A method of manufacturing a multilayer circuit substrate includes a process of forming via holes in an insulating film, a process of applying an electrically conducting paste obtained by having ultra-fine metal particles disperse in a solvent onto an insulating film, and a process of forming vias composed of a sintered product of ultra-fine metal particles in the via holes by removing the solvent and also sintering the ultra-fine metal particles. The sintered products of the ultra-fine metal particles on the insulating layer is removed (or patterned) by peeling off the protective film stuck to the insulating layer.

Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.

Abstract: An electrode for a ferroelectric electronic device is formed on an SiO.sub.2 isolation layer by depositing an adhesion layer, such as titanium, between about 25 .ANG. and 500 .ANG. thick, then a layer of a nobel metal, such as platinum, that is at least 10 times thicker than the adhesion layer. The electrode is then annealed at a temperature higher than the minimum oxide eutectic temperature of the adhesion layer. The electrode is moved into the annealing furnace at a ramp rate such that it reaches its anneal temperature in five minutes or less. The relative thinness of the adhesion layer and the quick ramp up of the anneal causes all the titanium to be tied up in the oxide before it can diffuse through the platinum, and prevents the formation of rutile phases of the titanium and defects such as voids and hillocks in the platinum, which can destabilize the electrode.

Abstract: An oxygen sensor element for detecting an oxygen concentration, the oxygen sensor includes a solid electrolyte; a porous film covering the solid electrolyte at the gas-measuring side; and a reaction electrode provided on the porous film; wherein the porous film includes ceramic particles and metallic particles, and the metallic particles are bonded with the reaction electrode by a metallic bond. In this way, the porous film includes the ceramic particles and the metallic particles to form an irregular surface, and the reaction electrode is adhered to the irregular surface of the porous film in such a manner that the electrode bites into the surface of the porous film. The metallic particles in the irregular surface of the porous film are tightly bonded to the reaction electrode by the metallic bond.

Abstract: A thick-film switch element includes a high-temperature glass frit fused to a non-conductive substrate. A cermet layer having a low-temperature glass matrix is fired in a conventional furnace to sink into the glass frit layer such that the resulting thickness of the switch element layer is approximately equal to the original thickness of the glass frit layer. The wet print thickness of the cermet layer is controlled upon application of the cermet to the glass frit. The glass frit and cermet are fired at a controlled temperature and duration to achieve a fired print thickness of the cermet above the surface of the glass frit having a pre-determined value. In one embodiment, the non-conductive substrate is a metal, such as stainless steel.

Abstract: A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.

Abstract: The present invention is related to a method for manufacturing a photodetector which comprises the steps of: (a) preparing a substrate having a back surface; (b) applying a first conducting layer on the back surface; (c) annealing the substrate coated with the first conducting layer in an inert gas atmosphere; (d) applying a anti-corrosion layer on the first conducting layer; (e) immersing the anti-corrosion layer-applied substrate in a hydrofluoric acid aqueous solution with a concentration of 5%.about.10%; (f) eroding the anti-corrosion layer-applied substrate under a current density of about 12.5.about.25 mA/cm.sup.2 for about 5.about.40 minutes to obtain a porous layer therereon; and (g) applying a thin film layer of a second conducting layer to an upper surface of the porous layer to obtain the photodetector. The present photodetector has a wider frequency band and a higher sensitivity than conventional ones and the present manufacturing method is simple and economical.

Abstract: Coating compositions of silver flake suspended in predominantly aqueous vehicle is disclosed for laying down a coating of electrically conductive metal on resistive or dielectric substrates useful in the electronics industry. The coating compositions provide an ideal combination of high silver loading and low viscosity for spray painting desired thickness coatings at high speed in a single pass. The novel compositions include the three basic components: silver flake, water soluble polymer binder, water. Up to about 10 wt % of a substantially completely water soluble, organic co-solvent can be an optional, additional ingredient. The coating compositions have good green strength after drying and may be used to apply an electrically conductive base to enable electroplating plastic or elastomer parts. Optional sintering adhesives can be added to allow high temperature, permanent bonding of the silver to a ceramic substrate. The compositions can include surfactants, defoamers and antisettling agents.

Abstract: An arbitrary pattern write head assembly for writing timing-based servo patterns on magnetic storage media is provided, comprising: (a) a first pole piece comprising a substrate comprising a magnetic material, said substrate having a major surface; (b) a plurality of electrically conducting windings formed on the major surface; and (c) a second pole piece formed on the substrate, with a portion thereof formed above the plurality of electrically conducting windings and electrically insulated therefrom, the second pole piece having at least one opening therethrough defining a gap above the electrically conducting windings and the substrate, the second pole piece comprising at least two layers, each layer comprising a magnetic material. A method of batch fabricating servo writer heads is also provided for batch fabrication of servo writer heads at a very low cost. The method enables fabrication of heads capable of azimuthal recording commonly practiced in the video recording art.

Abstract: A method for forming platinum silicide plugs suitable for use in very large scale integrated semiconductor devices having large aspect ratios. The method includes the steps of: providing a silicon substrate on which a conductive layer is formed; forming an insulating layer on the silicon substrate and the conductive layer; patterning the insulating layer to form a contact hole on the conductive layer; exposing the conductive layer to air to thereby form a thin native oxide layer on the conductive layer; forming a blanket polysilicon film on the entire resulting structure thick enough to completely fill the contact hole; etching back the blanket polysilicon film to expose the insulating layer, thereby forming a silicon plug in the contact hole; forming a platinum layer on the silicon plug and the insulating layer; performing heat treatment to thereby convert the silicon plug to a platinum silicide plug; and thereafter removing the remaining platinum layer.

Abstract: The invention provides a method of manufacturing a laminated ceramic capacitor, which method includes a step of forming an electrically conductive paste layer on a green sheet composed of lead system composite perovskite oxide. The paste includes a solvent in which are distributed metal powder including at least silver powder, organic titanium compound, organic rhodium compound and organic binder. An amount of titanium in the paste preferably is in the range of 0.02% to 0.09% by weight on the basis of a weight of the metal powder, and an amount of rhodium in the paste preferably is in the range of 0.10% to 0.60% by weight on the basis of a weight of the metal powder.

Abstract: A method of metallizing a diamond substrate without using a refractory metal by firing the diamond substrate at approximately 850.degree. C. for ten minutes in order to de-hydrogenate and oxidize the surface of the diamond substrate; applying any suitable metal such as gold, silver, or copper in any suitable form as an interconnect layer to the diamond substrate using any suitable technique such as thick-film or direct-write; drying the interconnect layer on the diamond substrate at approximately 150.degree. C. for fifteen minutes in order to remove any volatile solvent that may be contained within the interconnect layer; and firing the diamond substrate and the interconnect layer at approximately 850.degree. C. for ten minutes in order to adhere the interconnect layer to the diamond substrate.

Abstract: Disclosed is a method of increasing the adhesion between gold and silica derived from hydrogen silsesquioxane resin. The method comprises joining the gold and silica followed by annealing under an oxidizing atmosphere.

Abstract: A new design for and an improved process of manufacturing a detecting unit for a type I electrolytic cell with thin film electrodes. In the first step of the process, a long, narrow, transparent, hollow glass tube is provided having an inside surface, an outside surface, and an end with a rim. A thin, noble metal film is deposited on the inside surface of the hollow glass tube. Then, a beam from a light source is directed through the hollow glass tube to remove a first portion of the noble metal film from the inside surface of the hollow glass tube and create a first spacer area. The beam also removes a second portion of the noble metal film from the inside surface of the hollow glass tube and creates a second spacer area. Consequently, two, separate electrode wires are created. Finally, an hygroscopic film is deposited on the entire inside surface of the hollow glass tube, covering completely the first and second electrode wires and the spacer areas.

Abstract: A process of growing a film of a metal on a substrate in a selective area thereof by chemical vapor deposition, the process comprising the steps of: preparing a source having a molecule comprising a metal and a radical; providing a substrate having a selective area made of a first substance which is unreactive with the radical and the other area made of copper which is reactive with the radical; and supplying the source onto the substrate held at a film growing temperature to induce a reaction on the substrate, such that, in the selective area, the molecule of the source is bonded to the first substance and decomposed to precipitate the metal on the first substance while, in the other area, the radical of the molecule is combined with the copper to cover the other area of the substrate with a coating which is unreactive with the molecule of the source.

Abstract: The micropin array is comprised of a plurality of micropins having a given diameter and being aligned in parallel to one another at a given pitch, insulating tubular coatings disposed to cover individual micropins, and an adhesive provided to fill spacings among the insulating tubular coatings. This micropin array is produced by the steps of preparing a plurality of coated wire materials composed of a metal core having a given diameter and an insulating tubular coating of a given thickness formed around the metal core, aligning closely and successively the coated wire materials to form a bundle thereof, fixing the bundle of the coated wire materials by means of an adhesive, and cutting the fixed bundle of the coated wire materials by a given length to form a micropin array.

Abstract: Cross-linked polymer microspheres having a sulfonated cation exchange surface are carefully separated into fractions of equal size and density. Each fraction is separately plated preferably with copper, palladium, nickel, titanium or any metal cation which will reduce with hydrazene to form a conductive metal flash coating. The flash coat plated microspheres are again separated into fractions of equal size and density. Each fraction is then given additional metal platings first of nickel, then preferably palladium, then a support plate for the palladium, followed preferably by a stabilizing metal plate such as chromium. The thus plated microspheres have uniformly thick platings and have a maximized surface area for the amount of metal plated making them particularly useful as catalysts or in electrical products or processes. Microspheres having a plating of palladium exhibit a marked improvement in the adsorption of hydrogen both quantitatively and in rapidity.

Abstract: An electrically conductive, thermooxidatively stable poltimide, especially a film thereof, is prepared from an intimate admixture of a particular polyimide and gold (III) ions, in an amount sufficient to provide between 17 and 21 percent by weight of gold (III) ions, based on the weight of electrically conductive, thermooxidatively stable polyimide. The particular polyimide is prepared from a polyamic acid which has been synthesized from a dianhydride/diamine combination selected from the group consisting of 3,3',4,4'-benzophenonetetracarboxylic dianhydride and 2,2-bis[4-(4 -aminophenoxy)phenyl]hexafluoropropane; 3,3',4,4'-benzophenonetetracarboxylic dianhydride and 4,4'-oxydianiline; 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride and 4,4'-oxydianiline; and 3,3'4,4'-benzophenonetetracarboxylic dianhydride and 2,2-bis(3-aminophenyl)hexafluoropropane.

Abstract: A CO gas detecting sensor for detecting the existence or absence of CO gas and a manufacturing process therefor are disclosed. The CO gas detecting sensor includes: a sintered zinc oxide body; a copper oxide coating layer formed on a side of the sintered zinc oxide body; a positive metal electrode layer (a first electrode layer) electrically connected to the copper oxide coating layer; and a negative metal electrode layer (a second electrode layer) formed on the other side of the sintered zinc oxide body. The CO gas detecting sensor according to the present invention is superior in the preference for CO gas, and has an improved measuring repeatability, as well as a superior sensitivity.

Abstract: A method of manufacturing high aspect ratio plated through holes in a circuit carrying substrate. High aspect ratio apertures or holes (16) are formed in a substrate (10). A thin film of copper (20) is sputtered onto the substrate and in the apertures that a macroscopically discontinuous copper film (26) is formed on part of the aperture walls. The macroscopically discontinuous copper film is substantially thinner than the copper film that is deposited on the surface. A catalytic copper coating (30) is plated directly on the vacuum deposited thin film of copper by electroless copper plating in a manner sufficient to form a macroscopically continuous copper layer on the aperture walls.

Abstract: A process for producing a catalytically active gas diffusion electrode, in which process a gas-permeable membrane is first covered by a structuring mask which has recesses in accordance with the planned electrode surfaces. Next, through vapor deposition or cathodic sputtering of a conductive substance in a vacuum, a conductive electrode pattern structured in accordance with the recesses is produced on the membrane. After this, the conductive electrode pattern located on the membrane is galvanically coated with the catalyst by electrolytic deposition and then made hydrophobic.

Abstract: A membrane and electrode structure is formed by surface hydrolyzing an ion exchange membrane and then applying electrode ink of catalytically active particles on the surface of the membrane. The membrane and electrode structure of the present invention is particularly useful in fuel cells and batteries. The inventive process prevents the membrane from swelling or distorting following application of the electrode ink and also improves adhesion between the electrode ink layer and the surface of the membrane.