Abstract: A part painting method and apparatus in which dust, paint residue, and dripping excess paint are prevented from falling on a surface to be painted. A lens, as an example of a part to be painted, is covered with a mask body with a surface to be painted of the lens exposed through the mask body. The lens is positioned and fixed on the rear side of the mask body. The front side of the mask body, which functions as a masking surface with respect to spray paint from the paint gun, is arranged slanted downward with respect to vertical such that painting is performed with the mask body slanted at a predetermined angle so that excess paint dripping from the mask body does not drip onto the lens.

Abstract: A method for fabricating read-only copy protected optical medium comprising a light-sensitive material at positions capable of altering the data read during copying of the optical medium but permitting read of the underlying data in the reading of the optical medium.

Abstract: Extrusion coating of circular and other substrates is taught with a linear extrusion head in a linear motion utilizing a chuck assembly providing a coating bead forming surface. The coating bead forming surface allows for the coating bead to be at a steady state at all points at which the extrusion head interfaces with the substrate during the linear motion. Various configurations of chuck assemblies are taught to allow for improved handling of the substrate, deploying of the chucks in existing machinery, and simplified cleaning of the coating bead forming surface. Additionally, adaptation of the chuck assembly for discouraging undesired migration of the coating material is taught.

Abstract: A process for patterning a non-rigid membrane in a closed gap environment including the optional step of applying a solvent to the non-rigid membrane, applying a layer of an energy-sensitive composition to the non-rigid membrane, spinning the non-rigid membrane, inverting the non-rigid membrane with the layer of an energy-sensitive composition, spinning the inverted non-rigid membrane, re-inverting the non-rigid membrane, and spinning the re-inverted, non-rigid membrane. As a result of the inverting step and the inverted spinning step, the layer of an energy-sensitive composition does not cause the non-rigid membrane to sag and the resulting layer of energy-sensitive composition is substantially uniform in thickness. The energy-sensitive composition may be a photoresist, such as a chemically amplified photoresist.

Abstract: A towel dispensing machine for dispensing wet towels, including a cutting mechanism to cut the towels to the desired length and a liquid dispensing device for wetting the towels to produce individual cut, wet towels. Preferably, the towels are also rolled by a rolling mechanism before being dispensed. Additionally, the liquid can be heated to dispense hot wet towels. A method for producing wet towels is also disclosed.

Abstract: A method for fabricating a structure on a substrate with a low contrast photoresist having a height greater than 15 microns is provided. A uniformly thick film of photoresist is achieved on a substrate by spinning the substrate at two different speeds, then at least partially, but not fully drying the layer of photoresist at ambient temperature. The layer of photoresist is then dried and hardened by applying heat to the bottom surface of the substrate via a hot plate. The substrate is maintained level at all times during the spinning and drying steps in order to prevent wedging of the photoresist which remains in a plastic state until fully hardened by the hot plate. A surface relief pattern is then created in the photoresist via a scanning beam of electromagnetic radiation, which is preferably a laser beam. The resulting exposed surface relief patterns are then developed to produce the desired structure, which has a height of 15 microns or greater.

Abstract: A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.

Abstract: A method for manufacturing a resin thin film of the present invention includes supplying a liquid resin material and a gas to a two-fluid nozzle by pressure; ejecting the resin material in the form of atomized particles toward a heating member by the two-fluid nozzle, thereby adhering the resin material to the heating member; or mixing a liquid resin material with a gas; ejecting the resin material in form of atomized particles toward a heating member that is provided under reduced pressure, thereby adhering the resin material to the heating member; and evaporating the resin material on the heating member to obtain the evaporated resin material. Thus, the present invention can provide a resin thin film having a uniform thickness stably with simple means at a low cost. The resin thin film obtained by the present invention can be used in a wide range, for example a magnetic recording medium such as a magnetic tape, a wrapping material, and an electronic component.

Abstract: A method for regulating a coating process for the application of a layer onto a substrate having a diffracted structure is provided. The intensity of a light bundle falling onto a coated substrate and diffracted thereby is determined after transmission and/or reflection of the light bundle for at least the first order or a higher order, and this intensity is utilized as the actual value for regulating the layer thickness.

Abstract: The present invention provides a method for forming thin films, wherein thin films with a uniform thickness can be formed on substrates as objects such as spheroids, even when the films are formed by conventional film-formation methods using an incident particle beam coming from a specific direction (e.g., evaporation and sputtering). In the method, thin films are formed on substrates such as spheroids with an incident particle beam coming from a particle source located in a specific direction by performing a spin motion together with a swing motion. The spin motion is a rotation of the substrate at a constant angular velocity about the spheroidal axis. The swing motion is a rotational oscillation of the same substrate for rotationally oscillating the axis at a constant cycle in one surface, where the center of the rotational oscillation is in the vicinity of the midpoint between two focal points on the axis of the spheroid.

Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).

Abstract: A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.

Abstract: Disclosed is a method and apparatus for coating liquid films on to the surface of a wafer substrate by rotation the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon and starting at the central region of the wafer surface and moving radially outward therefrom, spraying a fine mist of the liquid to the surface of the wafer.

Abstract: A film forming apparatus comprising: a spin chuck; a cup; a lid; a first circular/tubular nozzle for supplying a resist solution to a first portion corresponding to the rotation center portion of a rectangular substrate; a plurality of second circular/tubular nozzles that supply the resist solution to a plurality of second portions of the rectangular substrate to which supply of the resist solution by centrifugal force is difficult, the distances between the rotation center portion and each of the second portions being greater than a half of a shorter side of the rectangular substrate; a rectangular nozzle holder that holds the first nozzle and the second nozzles; a mechanism that positions the nozzle holder; a controller that controls an amount of the resist solution from the first and second nozzles, attaches the lid to the cup, and rotates the substrate with the spin chuck; a resist solution tank; a supply tube provided between the resist solution tank and the first and second nozzles; a bellows pump for s

Abstract: A coating process comprises the steps of (a) holding a-substrate using a spin chuck surrounded by inner and outer cups, such that the substrate can rotate, (b) rotating the substrate by rotating the spin chuck, and applying a coating liquid onto the substrate, thereby forming a coating on the substrate, (c) discharging, from the inner and outer cups, that part of the coating liquid which is scattered from the substrate while the substrate is rotated, (d) exhausting the inner and outer cups through a plurality of exhaust ports formed in outer peripheral portions of the outer cup, and (e) reducing, from a peripheral region of the substrate, the mist of the coating liquid which has occurred during the step (b), before the substrate stops rotation.

Abstract: The invention relates to a nanostructured BaTiO3 film, plate or array that has from 1,000 to 10,000 times the storage capacity of conventional capacitors. The barium titanates are of the formula BaaTibOc wherein a and b are independently between 0.75 and 1.25 and c is 2.5 to about 5.0. The barium titanates may further be doped with a material, “M”, selected from Au, is Au, Cu, Ni3Al, Ru or InSn. The resulting titanate may be represented by the formula MdBaaTibOc wherein d is about 0.01 to 0.25, a is about 0.75 to about 1.25, b is about 0.75 to about 1.25 and c is about 2.5 to about 5.0. X-ray diffraction results illustrate that the crystal structure of the thin films changed from predominantly cubic to tetragonal phase and crystallite size increased with increasing concentration of “M”.

Abstract: The invention relates to a method of introducing and removing workpieces, particularly vehicle bodies, into and out of a treatment area (20, 70) suitable for the surface treatment of the workpieces (1), wherein the workpieces (1) are detachably secured to mounting frames (7) that each have a rotary axis (13, 41, 61) aligned transverse to the direction of movement of the workpieces (1), the rotary axes (13, 41, 61) are continuously moved translationally and at a constant speed, and the workpieces (1) at the start and end of the treatment area (20, 70) are simultaneously rotated through about 180° around one of these rotary axes (13, 41, 61) in a controlled and always guided manner in the direction of the translational movement. The invention also relates to a device for the surface treatment of workpieces and a system for the surface treatment of vehicle bodies.

Abstract: A method of coating of mass-produced bulk goods (5) including loading the bulk goods (5) into a rotatable drum (1) through an opening (4) formed in a side surface of the drum (1), heating a coating material in coating apparatus (8), having a spray gun (6) and provided outside of the rotatable drum (1); and thereafter, applying the heated coating material to the bulk goods (5) with the spray gun (6) through the drum opening (4).

Abstract: A polymeric printing member for use in a printing machine is provided. The polymeric printing member-includes a substrate and a coating applied to the substrate. The coating is applied to the substrate by rotating the substrate about its longitudinal axis and applying the coating from an applicator to the substrate in a spiral pattern in a controlled amount so that substantially all the coating that exits the applicator adheres to said substrate.

Abstract: Coating solutions having anti-reflective and anti-static properties, a coating derived therefrom, a substrate coated with the coating and methods for their preparation. A coating includes a sol-gel alkoxide polymeric material and a conductive colloidal metal oxide material.

Abstract: A method is described that combines the advantages of the dip-coating method with those of the spin-coating method, whereby at least one liquid coating composition is deposited on a substrate by means of at least one spray nozzle, and wherein said substrate is rotated (spinned) for some time at least after said liquid coating composition has been deposited. This method is particularly suited for the coating of ophthalmic substrates. Furthermore a device suitable for performing such a method is also disclosed.

Abstract: There are provided a spin coating method and an apparatus for forming a thin film having a uniform thickness on a substrate at a low cost in a process for manufacturing semiconductors, optical disks and the like.

Abstract: A drive pulley is disposed to a driving motor. A plurality of follower pulleys are disposed to a rotating shaft of a spin chuck that vacuum sucks a substrate. A belt is passed from one follower pulley to the drive pulley. Belts are passed from the other follower pulleys to the drive shafts of a plurality of air motors. Since the air motors assist the driving of the driving motor, a large substrate can be rotated at a predetermined rotating acceleration. Thus, a film forming apparatus and a film forming method that allow the quantity of process solution supplied to be reduced and a film of process solution to be equally formed on a substrate can be provided.

Abstract: A method for lubricating a thin film magnetic media is disclosed wherein the magnetic media is lubricated only at the head-disc interface zone. The method comprises the steps of vaporizing the lubricant, mixing the lubricant with a carrier gas stream, and depositing a film of the lubricant on at the loading zone on the surface of the magnetic media. The lubricant film can be selectively deposited on the surface of the magnetic disc at any location and at any thickness. In one embodiment of the invention, the lubricant film forms a radial band on the surface of the magnetic disc located near the outside diameter of the magnetic disc.

Abstract: Described is an process for producing uniform coatings on circular substrates that reduces the amount of coating required. The improved process includes the steps of applying the liquid coating material through a single opening of a dispenser having certain characteristics, in a pattern onto the center of a spinning substrate, and then radially moving the dispenser opening near to the edge of the substrate while maintaining the dispenser opening at a predetermined distance from the substrate surface for substantially the entire radius of the substrate providing uniform coverage. Also described are products produced by the process that are substantially free of cosmetic defects and may be photochromic.

Abstract: There is provided an apparatus for spin-coating a semiconductor substrate, including (a) a rotary table rotatable in opposite directions, (b) a nozzle dropping coating material onto a semiconductor substrate lying on the rotary table, (c) an electrode having a ring-shaped cross-section and disposed around the rotary table, and (d) a power source applying a voltage to the electrode, the voltage having an electric polarity opposite to an electric polarity of the coating material. Coating material dropped onto the semiconductor substrate is attracted to an electric field generated by the electrode around the semiconductor substrate. Hence, the coating material is not concentrated around a center of the semiconductor substrate, but is facilitated to uniformly spread over the semiconductor substrate, ensuring formation of a coating layer having a uniform thickness.

Abstract: A method and apparatus for painting parts wherein a plurality of paint coats are applied to a part utilizing a single spray booth for all of the coat applications. The painting apparatus includes a main line track structure extending from a loading station to an unloading station; a closed loop branch track structure having a portion thereof juxtaposed to a portion of the main line track structure between the loading and unloading stations; a paint station located at the juxtaposed portions of the main line and the branch track structure; a plurality of carriers adapted to receive parts to be painted at the paint station and mounted for movement along the main line track structure and the branch track structure; and switch means operative to transfer a carrier between the main line track structure and the branch line track structure.

Abstract: A rotogravure printing medium includes a member coated with a film that is selectively removable to produce ink retaining cells. The film is formed by a series of adjacent strip of bead portions of a self-leveling, curable plastic composition which is engravable after curing. The adjacent strip or bead portions merge and self-level after deposition to produce a uniform continuous coating of the plastic composition.

Abstract: A method for preparing a positive photoresist layer is provided. In this method, a photoresist composition is drop-wise applied on an insulator layer or a conductive metal layer formed on a substrate. The photoresist composition includes a polymer resin, a sensitizer for changing solubility of the photoresist layer when exposed and a solvent. The coated substrate is rotated at the speed of 1,250 to 1,350 rpm for 4.2 to 4.8 seconds. The coated substrate is then dried and the dried substrate is exposed to some form of radiation. Next, the exposed portion is removed by using an alkaline developing solution. The solvent preferably includes 3-methoxybutyl acetate and 4-butyrolactone, or includes 3-methoxybutyl acetate, 2-heptanone, and 4-butyrolactone.

Abstract: A method of coloring silica sand for use in coating a surface. The method includes the steps of selecting silica sand of a desired grain size and color, the preferred color being substantially white and grain size being any combination of thirty, fifty and eighty mesh. A coating having adhesive qualities is then prepared by one of air drying acrylic and vinyl emulsions or thermosetting phenolic, polyester and epoxy emulsions. To coat the silica sand, the silica sand to tumble or fall from an elevated position and is sprayed as it tumbles or falls with the prepared coating. The coated silica sand is then pulverized to break up clumped particles formed during application of the coating. A desired color mixture is obtained by mixing coated silica sand of different colors. The coated silica sand is then applied to a desired surface by one of spraying or using a trowel. Titanium dioxide may now be applied to the mixture after application to alter a gloss of the mixture.

Abstract: The present invention relates to a method of supplying a developing solution to a surface of a substrate to perform developing treatment for the substrate, comprising a first step of supplying the developing solution to the surface of the substrate while a developing solution supply nozzle is moving relative to the substrate and a second step of developing the substrate for a first predetermined period of time, and the second step has the step of stirring the developing solution on the surface of the substrate after a second predetermined period of time from the completion of the first step. Because of stirring, the concentration of the developing solution on the substrate is made uniform, resulting in a rise in the uniformity of developing treatment.

Abstract: A process for drying a polymeric material present on a substrate is provided. Temperatures of the polymeric material is measured and the ambient temperature in the vicinity of the substrate. A temperature of the substrate is also measured. A variation in the measured ambient temperature is detected. The substrate temperature, polymeric temperature, ambient temperature or a substrate drying spin speed is adjusted in response to the detected variation in the measured ambient temperature.

Abstract: The present invention is a mesoporous silica film having a low dielectric constant and method of making having the steps of combining a surfactant in a silica precursor solution, spin-coating a film from this solution mixture, forming a partially hydroxylated mesoporous film, and dehydroxylating the hydroxylated film to obtain the mesoporous film. It is advantageous that the small polyoxyethylene ether surfactants used in spin-coated films as described in the present invention will result in fine pores smaller on average than about 20 nm. The resulting mesoporous film has a dielectric constant less than 3, which is stable in moist air with a specific humidity. The present invention provides a method for superior control of film thickness and thickness uniformity over a coated wafer, and films with low dielectric constant.

Abstract: A method and an apparatus for the realization of printed polychrome decorations on elongated elements (1), which allows to obtain sharper decorations to a lower cost, comprises the projection of a plurality of jets of dyeing substances through respective nozzles (2) towards external surface zones (Z1, Z2, Z3, Z4, Z5) to be decorated of said elongated elements (1) while a distance (D) is kept which is substantially constant between said zones (Z1, Z2, Z3, Z4, Z5) and said nozzles (2), also in correspondence of profile variations of said zones; besides a section bar (1) is provided having decoration zones (Z1, Z2, Z3, Z4, Z5) on its external surface showing sharp outlines and realized with various dyeing substances, such as liquid substances, liquid suspension substances, powders, and also with sublimable inks and dyes.

Abstract: Disclosed is a method for producing a heat mode type optical information-recording medium having, on a substrate, a dye recording layer capable of recording information by being irradiated with a laser beam, the method comprising the step of applying a dye solution for forming the dye recording layer onto the substrate while rotating the substrate, wherein a period of time, which ranges from a point of time at which application of the dye solution is started to a point of time at which a valve is fully open, is not less than 0.1 second. In order to satisfy this condition, the opening degree of a first speed controller is not less than 5% and not more than 50%. Accordingly, the opening speed of the valve of a valve apparatus is not less than 5% and not more than 50% with respect to the maximum speed.

Abstract: After a thin liquid agent film is formed by supplying a liquid agent onto a plate-like developer holder, this liquid agent film and the surface of a substrate are opposed. The liquid agent film and the substrate are brought into contact with each other at a point by declining the substrate and moving it close to the liquid agent film, or by curving the substrate toward the liquid agent film. Then, the substrate is made parallel to the liquid agent film, and the liquid agent is supplied such that the contact area of the liquid agent film spreads over the entire surface by the interfacial tension between the liquid agent film and the substrate. Since a thin liquid agent film can be uniformly formed below the substrate, processing can be performed with a small consumption amount. Additionally, the liquid agent can be supplied to the substrate without holding air.

Abstract: A fragrant thermoplastic snow product for creating winter scenes and pleasing aromatic affects is set forth. The fragrant thermoplastic snow product includes a thermoplastic snow, and a fragrance applied to the thermoplastic snow. A method of manufacturing fragrant thermoplastic snow is also set forth. The method comprises the following steps. First, a batch of thermoplastic snow is provided. Next, a fragrance is mixed with the batch of thermoplastic snow. Finally, the batch of thermoplastic snow is dried.

Abstract: A resist solution applying apparatus and a method of using the resist solution applying apparatus. The apparatus comprises a hold and rotate member that holds and rotates a member to be processed, a resist solution discharge nozzle that discharges a resist solution almost at a center of rotation of the member to be processed, a resist solution supply mechanism that supplies the resist solution to the resist solution discharge nozzle, and a discharge controller connected to the rest solution supply mechanism that controls a predetermined amount of the resist solution discharged from the resist solution discharge nozzle to be reduced gradually or in stages after discharge is started, and increased again before the discharge is stopped.

Abstract: In an apparatus for coating a surface of at least one lens having pair of opposed major surfaces, al least one lens support is coupled to a frame and is rotatable relative thereto. A lens is releasably mounted to the lens support leaving one of the major lens surfaces exposed. A mounting plate is coupled to the frame and is positioned proximate to the lens support. A series of work stations are carried by the mounting plate for sequentially performing work operations on the exposed major surface of the lens. The lens support is indexable relative to the mounting plate to position the exposed lens surface adjacent to each of the work stations in response to commands issued from a controller.

Abstract: A method for forming a generally uniform liquid layer on a surface of an upper surface microelectronic substrate. The apparatus can include a support that engages less than the entire lower surface of the microelectronic substrate and rotates the microelectronic substrate at a selected rate. A barrier can extend over the upper surface of the microelectronic substrate and can rotate at about the same rate as the substrate to separate a rotating air mass adjacent to the upper surface and within the barrier from a stationary air mass external to the barrier. The rotating air mass can reduce the likelihood for liquid/air interface disturbances that create non-uniformities in the liquid layer. Accordingly, the method can increase the range of thicknesses to which the liquid layer can be formed and can reduce the topographical non-uniformities of the liquid layer.

Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).

Abstract: A resist film having a thickness of 5500 Å or less is coated on the wafer having a large diameter of 8 inches or more by the spin coat process. A resist is dripped while allowing the wafer to be rotated at a rotation speed of 500 rpm to 1200 rpm and the dripping of the resist is suspended at the time of spreading the resist on the whole surface of the wafer. The rotation speed is raised to the predetermined rotation speed which regulates the thickness of the resist film and is determined from the correlation of the predetermined rotation speed and the thickness of the resist film. The wafer is rotated for 1 second to 5 seconds at the predetermined rotation speed. Then, the wafer is rotated for 15 seconds or more at the rotation speed which is lower than the predetermined rotation speed.

Abstract: A coater having a controllable pressurized process chamber for applying photoresist to a wafer is provided. The controllable pressurized process chamber reduces the evaporation of solvent in the photoresist during a spin-on process step. Reducing premature curing of the photoresist results in improved uniform planarization of the photoresist layer. Contaminants in the photoresist are also reduced by having an environmentally controllable process chamber. A housing having a upper and lower section forms a process chamber surrounding a wafer chuck. The upper housing section includes a solvent vapor opening for introducing pressurized solvent vapor into the process chamber and the lower housing section includes an exhaust opening. The upper housing section also includes an opening for introducing photoresist onto a wafer. A control device is coupled to the exhaust opening and a vacuum device for controlling the pressure in the process chamber.

Abstract: A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a nozzle adapted to apply a predetermined volume of developer material on a photoresist material layer along a linear path having a length approximately equal to the diameter of the photoresist material layer. A movement system moves the nozzle to a first position offset from a central region of the photoresist material layer for applying a first predetermined volume of developer material to the photoresist material layer while the developer material is spin coated. The movement system also moves the nozzle to a second position offset from the central region for applying a second predetermined volume of developer material to the photoresist material layer while the developer is spin coated. The first position is located on an opposite side of the central region with respect to the second position.

Abstract: A method of forming one or more polymer containing layers on a substrate using ink jet nozzles. The method is particularly suited to forming one or more polymer containing layers of a photoreceptor. The polymer containing layers may be formed by moving a substrate, in particular a cylindrical substrate, past the ink jet nozzles, by moving the ink jet nozzles over the substrate, or both. The ink jet nozzles are capable of being independently controlled in order to permit precise location of the coating on the substrate.

Abstract: Disclosed is method and apparatus for distributing a chemical over the surface of a substrate. The method includes depositing the chemical on a portion of the surface of a substrate near the center of the substrate. The method further includes controlling the temperature of the surface of a substrate so that the viscosity of the chemical is calibrated to cause the chemical to be deposited on the surface of the substrate in a substantially uniform manner.

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

Abstract: A mechanism for effectively dispensing liquid onto a surface of an IC (Integrated Circuit) wafer with minimized back-splash. A nozzle includes a liquid chamber that fills up with the liquid to be dispensed onto the surface of the IC wafer, and the nozzle includes a plurality of nozzle passages. A nozzle passage carries and directs the liquid from the liquid chamber toward the surface of the IC wafer to provide a respective liquid stream from a respective location on the nozzle to a respective spot on the surface of the IC wafer as the IC wafer is spinning. A nozzle passage is disposed within the nozzle at a respective angle with respect to the surface of the IC wafer such that the respective liquid stream from the nozzle passage is directed toward a velocity vector at the respective spot on the surface of the IC wafer where the respective liquid stream hits the surface of the IC wafer. For example, the respective angle of the nozzle passage with respect to the surface of the IC wafer may be 45°.

Abstract: An anode is embedded in an electrolyte layer applied to the surface of a structure such as a pipe section to provide an ionic conductive path between the anode and structure to supply cathodic protection to the structure, where the natural environment may not provide a continuous electrolyte. The anode is comprised of a material normally used as a cathodic protection anode material, such as, an expanded valve metal mesh or ribbon having either an electrochemically active coating or noble metal coating, or a sacrificial anode metal alloy. The anode material is made continuous from one end of the structure to the other and may be connected to a common bus wire from one end to the other. The anode and structure to be protected are connected using wires to a DC power supply that causes cathodic protection current flow to the structure in the case of an impressed current system. No separate power supply is needed in the case of a galvanic or sacrificial anode system.

Abstract: A solvent of a resist solution is dropped from a solvent supply nozzle onto the surface of a semiconductor wafer held by a spin chuck. The semiconductor wafer is rotated by the spin chuck to spread the resist solution over the entire surface of the semiconductor wafer W. Simultaneously, the resist solution is dropped from a resist solution supply nozzle onto the semiconductor wafer and spread following the solvent. During the processing, the processing space is isolated from the outer atmosphere by closing a lid of a processing vessel and a sprayed solvent is supplied into the processing space. The processing space is thus filled with the mist of solvent. In the processing space supplied with the solvent, evaporation of the solvent from the resist solution is suppressed. A film of the resist solution is formed with a uniform film thickness to the edge of the semiconductor wafer W.