Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.

Abstract: A method of applying a coating such as a varnish or a paint on a hollow article. The method includes the operation consisting in depositing a predetermined quantity of coating in the fluid state on the center of a surface of the article, and in spreading it by causing the article to revolve.

Abstract: The invention provides a device for holding a substrate during deposition processes that includes a rotation member rotatable about a first, central axis, and a plurality of substrate holders positioned on the rotation member, the substrate holders being rotatable about second axes. In another aspect, the invention provides a method of applying a substantially uniform coating on a substrate including the steps of providing a device of the invention; mounting a substrate onto the substrate mounts; providing at least one substrate coating station in spaced relation to the substrate mounts; rotating the rotation member about a central axis to position one or more of the substrate mounts at the substrate coating station; supplying the coating through the nozzle; moving the nozzle of the coating station in a direction parallel to the substrate at a predetermined rate to apply a uniform coating on the substrate; and rotating the substrate mounts about the second axes during the coating process.

Abstract: Disclosed is a method and apparatus for coating liquid films on to the surface of a wafer substrate by rotating the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon and starting at the central region of the wafer surface and moving radially outward therefrom, spraying a fine mist of the liquid to the surface of the wafer.

Abstract: A drive pulley is disposed to a driving motor. A plurality of follower pulleys are disposed to a rotating shaft of a spin chuck that vacuum sucks a substrate. A belt is passed from one follower pulley to the drive pulley. Belts are passed from the other follower pulleys to the drive shafts of a plurality of air motors. Since the air motors assist the driving of the driving motor, a large substrate can be rotated at a predetermined rotating acceleration. Thus, a film forming apparatus and a film forming method that allow the quantity of process solution supplied to be reduced and a film of process solution to be equally formed on a substrate can be provided.

Abstract: The present invention relates to a method of supplying a developing solution to a surface of a substrate to perform developing treatment for the substrate, comprising a first step of supplying the developing solution to the surface of the substrate while a developing solution supply nozzle is moving relative to the substrate and a second step of developing the substrate for a first predetermined period of time, and the second step has the step of stirring the developing solution on the surface of the substrate after a second predetermined period of time from the completion of the first step. Because of stirring, the concentration of the developing solution on the substrate is made uniform, resulting in a rise in the uniformity of developing treatment.

Abstract: The automated system includes a fluid dispenser having an applicator tip which is used to apply a fluid to an object. A compliance mechanism is utilized to assist in maintaining the applicator tip of the fluid dispenser in contact with the object during the coating operation. A robot can be utilized to advance the object past the applicator tip during the coating operation. The fluid dispenser is mounted on a movable arm to allow the fluid dispenser to be moved or rotated into and away from the position where fluid is applied to the object. The automated system provides a fluid application system that can apply a precise and repeatable layer of fluid to an object. The use of the robot allows larger objects to be easily handled and for the coating process to be done in a rapid fashion. The automated system is flexible and can readily accommodate changes in the object that is to be coated or the configuration of the coating that is to be applied to the object.

Abstract: A wafer is held on the upper side of a chuck. The chuck is connected to a spin motor, a motor-pedestal seat and an air cylinder shaft. The spin motor functions to rotate the chuck while the air cylinder shaft functions to elevate the chuck. When a resist is dropped on the wafer, the air is supplied to the air cylinder concurrently with the rotation of the spin motor, thus causing the chuck to move upward while rotating. The upward movement causes a downward inertial force to act on the resist, which in turn causes the resist to be pressed against the wafer while being dispersed over the surface of the wafer.

Abstract: An apparatus for and method of rinsing one side of a two-sided substrate and removing unwanted material from the substrate's edge and/or backside. One embodiment of the method is directed toward rinsing and cleaning a substrate having a front side upon which integrated circuits are to be formed and a backside. This embodiment includes dropping the substrate front side down onto a pool of rinsing liquid in a manner such that the front side of the substrate is in contact with the solution while the substrate is held in suspension by the surface tension of the solution liquid thereby preventing the backside of the substrate from sinking under an upper surface of the pool. Next, while the substrate is in suspension in said rinsing liquid, the substrate is secured by its edge with a first set of fingers and in some embodiments the substrate is subsequently spun. In another embodiment, a method of forming a copper layer on a front side of a substrate is disclosed.

Abstract: A method and apparatus is provided for preparing an optical information medium comprising a disk-shaped substrate having a center hole, an information recording layer thereon, and a resin-based light-transmitting layer thereon by which recording/reading laser beam is transmitted. The apparatus includes a rotating table (2) for holding and rotating the substrate (100) having the information recording layer borne thereon, a plug means (3) including a disk member (31) for closing the center hole (101) and an integral support shaft (32), and a nozzle (4) for feeding a coating fluid containing the resin to the outer periphery of the support shaft (32), wherein the coating fluid is flowed from the support shaft to the disk member, then over the substrate, thereby forming the light-transmitting layer having a minimized thickness variation.

Abstract: According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one another. The substrate holder is configured to support a substrate in position so that at least a first face of the substrate is exposed to the plating solution in the tank.

Abstract: A method for dispensing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

Abstract: Disclosed is a method and apparatus for coating liquid films on to the surface of a wafer substrate by rotation the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon and starting at the central region of the wafer surface and moving radially outward therefrom, spraying a fine mist of the liquid to the surface of the wafer.

Abstract: A process for drying a polymeric material present on a substrate is provided. Temperatures of the polymeric material is measured and the ambient temperature in the vicinity of the substrate. A temperature of the substrate is also measured. A variation in the measured ambient temperature is detected. The substrate temperature, polymeric temperature, ambient temperature or a substrate drying spin speed is adjusted in response to the detected variation in the measured ambient temperature.

Abstract: This invention discloses a novel design to obtain a good coating uniformity and to reduce the volume of viscous materials when coating by spraying the viscous material on the wafer during the first time period at a first predetermined pressures; spraying the viscous material on the wafer at a second predetermined pressure in response to the end of the first time period, the second predetermined pressure being lower than the first predetermined pressure; and spraying the viscous material on the wafer during a second time period at a time-varying pressure, the time-varying pressure being increased from the second predetermined pressure to a third predetermined pressure during the second time period.

Abstract: In a photoresist coating apparatus and method, a rotating wafer is scanned with a spray nozzle from which the photoresist issues. The rotational speed of the wafer is varied based on the relative position of the nozzle above the wafer. The varying of the rotational speed is designed to minimize the amount of photoresist necessary for coating the wafer. Specifically, the photoresist is sprayed from the nozzle while the nozzle scans the wafer in a direction from the peripheral edge of the wafer toward its center, and the rotational speed of the wafer is increased during such scanning.

Abstract: The invention relates to a device for the surface treatment of workpieces (12) such as vehicle bodies. One such device has a plurality of successive treatment stations (1-9), a guiding system (16, 17) having a first guiding section (16) extending in the region of the treatment stations (1-9), and a plurality of rotational mounts (13) which can move individually on said guiding system (16, 17). Each rotational mount (13) has a holding device (14) for at least one workpiece (12) and a rotational axis (15) which is arranged in such a way that the workpeice (12) in the holding device (14) can be brought into, or taken out of, one of the treatment stations (1-9) by rotation about the rotational axis (15).

Abstract: The present invention is a method and device, which is suitable for use in an operating theater just prior to implantation, for selectively applying a medical coating to an implantable medical device, for example a stent. Disclosed is a device for use with a stent deployed on a catheter balloon. The device is configured to apply a medical coating of a desired thickness to the surface of a stent only. This is done by use of a drop-on-demand ink-jet printing system in association with an optical scanning device. The device is further configured so as to, if necessary, apply a plurality of layered coats, each layered coat being of a different coating material, and if appropriate, different thickness. The section of the housing in which the stent is held during the coating procedure is detachable from the housing base. The detachable housing section may be easily cleaned and re-sterilized or simply disposed of.

Abstract: An apparatus, system, and method for oscillating the dispersion of a material is provided, which includes a first tube having a plurality of openings through which material passes. One of the openings of the first tube is coupled to a material source. A second tube is provided with an opening positioned at its end for receipt of a portion of the first tube, which assists in guiding the movement of the first tube. The second tube may also have one of more openings positioned along its length that help to form a material ejection stream. A target rotator is provided that positions a target for receipt of dispersed material. Additionally, a moving mechanism positions the first tube so that material is ejected from the first and second tubes on to the target positioned by the target rotator. The target rotator may also be positioned by the moving mechanism.

Abstract: Coating solutions having anti-reflective and anti-static properties, a coating derived therefrom, a substrate coated with the coating and methods for their preparation. A coating includes a sol-gel alkoxide polymeric material and a conductive colloidal metal compound material.

Abstract: The present invention provides a method for forming thin films, wherein thin films with a uniform thickness can be formed on substrates as objects such as spheroids, even when the films are formed by conventional film-formation methods using an incident particle beam coming from a specific direction (e.g., evaporation and sputtering). In the method, thin films are formed on substrates such as spheroids with an incident particle beam coming from a particle source located in a specific direction by performing a spin motion together with a swing motion. The spin motion is a rotation of the substrate at a constant angular velocity about the spheroidal axis. The swing motion is a rotational oscillation of the same substrate for rotationally oscillating the axis at a constant cycle in one surface, where the center of the rotational oscillation is in the vicinity of the midpoint between two focal points on the axis of the spheroid.

Abstract: After a thin liquid agent film is formed by supplying a liquid agent onto a plate-like developer holder, this liquid agent film and the surface of a substrate are opposed. The liquid agent film and the substrate are brought into contact with each other at a point by declining the substrate and moving it close to the liquid agent film, or by curving the substrate toward the liquid agent film. Then, the substrate is made parallel to the liquid agent film, and the liquid agent is supplied such that the contact area of the liquid agent film spreads over the entire surface by the interfacial tension between the liquid agent film and the substrate. Since a thin liquid agent film can be uniformly formed below the substrate, processing can be performed with a small consumption amount. Additionally, the liquid agent can be supplied to the substrate without holding air.

Abstract: A film forming apparatus comprising a substrate holding section for holding a substrate to be processed, a nozzle unit arranged and opposing the substrate holding section, having a discharge hole for continuously applying film-forming solution, in the form of a slender stream, to a surface of a substrate held by the substrate holding section, and a drive mechanism for driving the substrate and the nozzle unit relative to each other, thereby to coat the surface of the substrate with the solution, while the nozzle unit is applying the solution, in the form of a slender stream, to the surface of the substrate.

Abstract: This invention provides a method for producing a CD-R optical recording medium. A first stack at a first stage is created by forming on a substrate a recording layer containing an organic dyestuff and a metal layer. At least after a formation of the metal layer; the first stack is transported from the first stage along a transport path towards a second stage through an atmosphere having a relative humidity. The relative humidity is maintained at 40% or less. To control the relative humidity, a shielding plate may be provided around the transport path. An air conditioner may locally control the relative humidity of an area encircled by this shielding plate.

Abstract: An optical disc and its manufacturing method in which humps may be prohibited from being formed on an outer rim area of the disc to assure optimum surface properties of a light transmitting layer of the disc to contribute to further increase in recording capacity. On a substrate 2 of an optical disc 1 are sequentially formed a recording portion 6 and a light transmitting layer 5. The light falls on the light transmitting layer 5 to record and/or reproduce information signals for a signal recording area 6a of the substrate 2. The radial distance D from the outermost rim of the substrate 2 to the signal recording area 6a is selected to be larger than the radial width L of a hump 5a formed on the outer rim of the light transmitting layer 5. The hump 5a has a height h from the surface of the light transmitting layer 5 not larger than 70 &mgr;m.

Abstract: A process for forming a uniform nanoporous dielectric film on a substrate. The process includes horizontally positioning a flat substrate within a cup; depositing a liquid alkoxysilane composition onto the substrate surface; covering the cup such that the substrate is enclosed therein; spinning the covered cup and spreading the alkoxysilane composition evenly on the substrate surface; exposing the alkoxysilane composition to water vapor and base vapor to thereby form a gel; and then curing the gel. The invention also provides an apparatus for spin depositing a liquid coating onto a substrate. The apparatus has a cylindrical cup with an open top section and removable cover which closes the top. A vapor injection port extends through the center of the cover. Suitable means hold a substrate centered within the cup and spin the cup.

Abstract: A liquid coating device and method for coating a coatable composition on a workpiece to form a coating, wherein a parameter indicative of barometric pressure is measured and at least one thickness-affecting process parameter is adjusted in order to compensate for the effects of variations in barometric pressure on coating thickness uniformity.

Abstract: An apparatus and methods for use in spin coating a coating material onto a wafer. The apparatus includes a rotatable chuck capable of supporting the wafer and a bowl having a bottom and a side defining an interior region, the bottom containing an opening through which said rotatable chuck is movable and separable from the bowl. In a preferred embodiment the bottom has a raised cylindrical portion containing the opening and, the rotatable chuck is positioned within the opening so that the wafer is in close proximity to the raised portion of the bowl so as to prevent solvent vapors form escaping the bowl through the opening.

Abstract: A method of coating of mass-produced bulk goods (5) including loading the bulk goods (5) into a rotatable drum (1) through an opening (4) formed in a side surface of the drum (1), heating a coating material in coating apparatus (8), having a spray gun (6) and provided outside of the rotatable drum (1); and thereafter, applying the heated coating material to the bulk goods (5) with the spray gun (6) through the drum opening (4).

Abstract: A dual cup spin coating system for capturing a discharged flowable coating material in a spin coating process including a first outer cup and a second outer cup said first outer cup concentrically disposed around the second outer cup forming a first capture space arranged for capturing at least a portion of a discharged flowable coating material discharged from a process substrate at a first positive angle with respect to the process substrate in a spin coating process; and, an inner cup disposed concentrically within the second outer cup forming a second capture space arranged for capturing at least a second portion of the discharged flowable coating material discharged from the process substrate at a second positive angle less than about the first positive angle with respect to the process substrate in a spin coating process.

Abstract: There are provided a spin coating method and an apparatus for forming a thin film having a uniform thickness on a substrate at a low cost in a process for manufacturing semiconductors, optical disks and the like. A coating solution is dropped onto the surface of a substrate (2) to be coated, mounted on a horizontal turn table (3) through a discharge nozzle (4) and the substrate is turned to form a thin film. After the coating solution is dropped through the nozzle, a stand-by nozzle tip (4a) is soaked and held in a nozzle soaking solution (10) having a composition near or equivalent to that of the coating solution. The crystal deposition of the solute is suppressed. Inter alia, the present invention is useful when a solution containing a solute having high crystallizability is coated.

Abstract: A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a nozzle adapted to apply a predetermined volume of developer material on a photoresist material layer along a linear path having a length approximately equal to the diameter of the photoresist material layer. A movement system moves the nozzle to a first position offset from a central region of the photoresist material layer for applying a first predetermined volume of developer material to the photoresist material layer while the developer material is spin coated. The movement system also moves the nozzle to a second position offset from the central region for applying a second predetermined volume of developer material to the photoresist material layer while the developer is spin coated. The first position is located on an opposite side of the central region with respect to the second position.

Abstract: An exemplary method of using developer as a solvent to spread photoresist faster and reduce photoresist consumption can include dispensing a developer solution onto an integrated circuit wafer, spinning the integrated circuit wafer to distribute the developer solution over the integrated circuit wafer, and dispensing a photoresist solution onto the integrated circuit covered with the developer solution.

Abstract: The process according to the invention discloses production of a high-quality insulation for conductors or conductor bundles. In this process, internal corona-discharge protection, insulation and external corona-discharge protection are all applied to the conductor or conductor bundle in successive steps by means of thermal spraying. The application thickness per spraying run is up to 0.2 mm, thus ensuring that the layer is free of defects and therefore avoiding partial discharges. Moreover, the ability to withstand thermal loads is considerably improved by the use of high-temperature plastics with fillers comprising inorganic materials as coating powder.

Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.

Abstract: A waste fluid separation and recovery system of the present invention includes a first cup in which the substrate is disposed when the substrate is being coated with the photoresist, a photoresist waste fluid groove connected by a path of fluid communication with the first cup and an exhaust airflow generator for generating an exhaust airflow, which guides photoresist waste fluid from the substrate toward the photoresist waste fluid groove.

Abstract: A system and method is disclosed for applying polyurethane to a roll that is primarily used in the papermaking industry. One advantage of the present system and method is that the polyurethane may be applied to the roll in one pass of a traversing mechanism along the length of the roll while the roll rotates, thus significantly decreasing processing time of the roll.

Abstract: Methods are provided for removing edge beads from spin-on films. A spin-on film is removed from a region of a surface of a spin-coated substrate adjacent to an edge of the surface by spinning the spin-coated substrate, expanding a fluid through a nozzle to form a cryogenic aerosol stream, and directing the cryogenic aerosol stream against the spin-on film in the region as the substrate spins. In another aspect of the invention, a film is formed on a surface of a substrate by dispensing a liquid composition onto the surface, spinning the substrate to distribute the liquid composition to form a substantially uniform film on the surface, expanding a fluid through a nozzle to form a cryogenic aerosol stream, and directing the cryogenic aerosol stream against the film in a region of the surface adjacent to an edge of the surface as the substrate spins. The film may include an alkoxysilane and a low volatility solvent. The fluid may consists essentially of liquid carbon dioxide.

Abstract: A polyimide solution is supplied to a wafer and the wafer is rotated by means of a spin chuck, thereby forming a polyimide film on the wafer. An irradiator for irradiating a laser beam to a peripheral portion of the wafer W is provided. After the polyimide film is formed and side rinse is performed, a laser beam is irradiated to the peripheral portion to solidify the film at the peripheral portion. The solidified polyimide film forms a weir, thus preventing the polyimide solution which has not dried yet from flowing out toward a peripheral edge portion.

Abstract: Methods of coating an implantable device and a system for performing such methods are disclosed. An embodiment of the method includes applying a coating substance to the surface of an implantable device, and rotating the implantable device in a centrifuge. The method can uniformly coat the implantable device with the coating substance and to remove unwanted accumulations of coating substance entrained between struts or crevices in the implantable device body. This system is applicable to methods for coating intraluminal stents, synthetic grafts, and stent coverings with therapeutic compositions comprising therapeutic agents mixed with a polymeric matrix and a solvent.

Abstract: A coating apparatus for forming a film on a surface of a substrate to be coated, comprises a holding table for holding the substrate to be coated, a discharge head, containing a coating solution and formed with a plurality of discharge holes at a portion thereof opposing the substrate to be coated, for discharging the coating solution, a fine-vibration plate for applying fine vibrations to discharge the coating solution and driving motor for driving the holding table and the discharge head relative to each other.

Abstract: Methods of dispensing process liquid to provide a uniform layer of the liquid on a surface are disclosed in accordance with the present invention. The methods include dispensing a process liquid on the surface and rotating the surface at a first speed to distribute an effective amount of the process liquid to substantially wet the surface. The method further includes rotating the surface at a second speed to distribute an effective amount of the process liquid to produce a layer of the process liquid on the surface. In a preferred embodiment for dispensing photoresist onto the surface of a semiconductor wafer, the method includes rotating the wafer at the first speed prior to dispensing the photoresist onto the surface. The preferred method further includes decelerating the wafer from the first to the second speed during the dispensing of the photoresist and terminating the dispensing process after the second speed is reached.

Abstract: A method and apparatus for controlling a temperature of a microelectronic substrate. In one embodiment, the apparatus can include a substrate support configured to engage and support the microelectronic substrate. The apparatus can further include a temperature controller having one or more thermal links coupled directly with the substrate when the substrate is supported by the substrate support. The thermal links can maintain thermal contact with the substrate when the substrate is either stationary or mobile relative to the temperature controller. The temperature controller can heat or cool different portions of the substrate at different rates with one or more of several heat transfer devices, including liquid jets, gas jets, resistive electrical elements and/or thermoelectric elements.

Abstract: A solvent composition comprising (A) 2-(trifluoromethyl)-2,3,3-trifluoropropanol and (B) 2,2,3,4,4,4-hexafluorobutanol, wherein the ratio of (A)/(B) (by mass) is from 0.5/99.5 to 99.5/0.5.

Abstract: The installation for sugarcoating or encasing of products by rotation of a cylindrical rotor includes a distribution and proportioning manifold mounted on support and guide rails external to the rotor permitting its total withdrawal from the rotor for the washing phase and its emplacement with no internal support within said rotor for the operating phase. The rails are formed by two horizontal beams, parallel to the axis of rotation of the rotor which is also the longitudinal axis of the manifold, fixed at one of their ends to the chassis of the rotor and at their other end to a transverse horizontal bar supported by at least one foot. At the level of one of its ends, the manifold is secured to a parallelepipedal frame which also supports closure means for the rotor and which slides along horizontal rails. Washing nozzles are disposed above the manifold at the level of the guide rails.

Abstract: The process for applying a polyurethane derived from VOC-free reactants wherein the reactants are polyol resin and isocyanate. The reactants are separately heated, proportioned and pressurized then the proportioned heated reactants are mixed together. The proportionate volume ratio of polyol resin reactant to isocyanate reactant is 1:1.05 to about 1:4. Combining the reactants initializes the formation of the polyurethane with a stoichiometric excess of the isocyanate reactant. The polyurethane reactants are sprayed onto a heated rotating substrate in an amount sufficient to create a polyurethane elastomer reinforcement layer after curing. The polyurethane reactants are polymerize or gel into an elastomer in the time range of 15 to about 120 seconds.

Abstract: This invention discloses a novel design to obtain a good coating uniformity and to reduce the volume of viscous materials when coating by spraying the viscous material on the wafer during the first time period at a first predetermined pressures; spraying the viscous material on the wafer at a second predetermined pressure in response to the end of the first time period, the second predetermined pressure being lower than the first predetermined pressure; and spraying the viscous material on the wafer during a second time period at a time-varying pressure, the time-varying pressure being increased from the second predetermined pressure to a third predetermined pressure during the second time period.

Abstract: A solution separation ring made of a material with adhesion to a processing solution stronger than that of a rear face of a wafer is provided to surround the periphery of a substrate horizontally held by a spin chuck with a slight clearance therebetween. A supply nozzle is moved from one end side to the other end side of the substrate while supplying the processing solution, and discharge ports of the supply nozzle are allowed to get closer to a summit portion of the solution separation ring near the other end side of the substrate. At this time, the processing solutions on the discharge ports and the front face of the substrate which are contiguous with each other by surface tension are separated caused so as to flow toward the solution separation ring side, thereby preventing an excessive processing solution from returning onto the front face of the substrate.

Abstract: The object of the invention is to provide a method with which smallest possible quantities of a varnish coating a bottom of a can extend beyond a bottom area (30a,30b), into a wall portion (30c) provided with a decoration, in order to reduce the quantity of coating substance used and to prevent said decoration from being changed. The invention proposes a coating with a fluid coating substance, each can (30) having a can axis (102). Said cans (30) are supplied consecutively out of an inlet (4), for being supported on a supporting means (3) for at least a coating interval and for being rotated about at least one axis (100,101,102). A spraying head (15,15a) having a spraying axis (104) sprays a coating onto an outer portion (30a) of said bottom area of at least one of said supplied cans (30), said spraying being effected at a first angle (&agr;) of said spraying axis with respect to said can axis (102).

Abstract: The present invention provides a method for forming thin films, wherein thin films with a uniform thickness can be formed on substrates as objects such as spheroids, even when the films are formed by conventional film-formation methods using an incident particle beam coming from a specific direction (e.g., evaporation and sputtering). In the method, thin films are formed on substrates such as spheroids with an incident particle beam coming from a particle source located in a specific direction by performing a spin motion together with a swing motion. The spin motion is a rotation of the substrate at a constant angular velocity about the spheroidal axis. The swing motion is a rotational oscillation of the same substrate for rotationally oscillating the axis at a constant cycle in one surface, where the center of the rotational oscillation is in the vicinity of the midpoint between two focal points on the axis of the spheroid.