Nickel Coating Patents (Class 427/438)
  • Patent number: 9675992
    Abstract: A substrate processing apparatus includes one or more substrate processing units 11 to 18 each processing a substrate 3 with a processing fluid; processing fluid supply units 19 and 20 supplying the heated processing fluid to the substrate processing units 11 to 18; and a controller 21 controlling the processing fluid supply units 19 and 20. The processing fluid supply units 19 and 20 include a storage tank 35 storing the processing fluid; a heating heat exchanger 51 heating the processing fluid; and a supply path 52 supplying the processing fluid to the substrate processing units 11 to 18. The supply path 52 includes a bypass path 71 bypassing the heating heat exchanger 51 at an upstream of the substrate processing units 11 to 18. The processing fluid heated by the heating heat exchanger 51 and the processing fluid supplied from the bypass path 71 are mixed to be supplied.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: June 13, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshihiro Kawaguchi, Satoshi Kaneko
  • Publication number: 20150015109
    Abstract: A spindle motor is provided in which the scattering of contaminating particles are prevented in a stainless steel part used therein. so that a hard disk drive can be prevented from being damaged due to collision between the particles adhered on a magnetic disk surface and a magnetic head. The spindle motor has a fixed portion and a rotating portion in which at least a part of one of the fixed portion and the rotating portion is made of stainless steel, and a metallic film is directly formed on the surface of the stainless steel by electroless nickel plating.
    Type: Application
    Filed: July 9, 2014
    Publication date: January 15, 2015
    Inventor: Akihiko SUZUKI
  • Patent number: 8858666
    Abstract: A coating for a cutting tool, which includes a plurality of mutually superposed layers, characterized in that the coating has an outer cover layer with a first layer portion of metallic aluminium or an aluminium alloy and a second layer portion arranged thereover of aluminium oxide or a mixed oxide which contains aluminium and at least one further metal.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: October 14, 2014
    Assignee: Walter AG
    Inventor: Veit Schier
  • Patent number: 8859039
    Abstract: In a viscous liquid feed nozzle having a nozzle body provided with a thin and long hole with a front end serving as a feed port, a lubricative plated layer is provided by immersing the liquid feed nozzle in a plating tank containing a lubricative plating solution and forming, by electroless plating, the lubricative plated layer at least on the inside and outside of the feed port.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: October 14, 2014
    Assignee: NHK Spring Co., Ltd.
    Inventors: Shinpei Kakiuchi, Eijiro Furuta, Takashi Ando
  • Patent number: 8828482
    Abstract: A disk for a hard disk drive is provided. The disk comprises a substrate comprising aluminum, and a coating layer disposed over the substrate. The coating layer comprises an alloy of Ni, X1 and X2, wherein X1 comprises one or more elements selected from the group consisting of Ag, Au, B, Cr, Cu, Ga, In, Mn, Mo, Nb, Pb, Sb, Se, Sn, Te, W, Zn and Zr, and wherein X2 comprises either B or P, and wherein X1 and X2 do not comprise the same elements.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: September 9, 2014
    Assignee: WD Media, LLC
    Inventors: Alan J. Ruffini, Lindsey A. Hamilton, Dorothea Buechel-Rimmel, Jean M. Laplante, Ambrose Schaffer, Frederick K. Lowes
  • Patent number: 8728950
    Abstract: Disclosed are a coating method of forming a coating with a stable thickness from a coating solution with a low viscosity employing a slit-type die coater and an organic electroluminescence element prepared employing the coating method. The coating method employing a slit-type die coater comprises the steps of allowing a lip tip of the slit-type die coater to bring close to the substrate to form a coating solution bead between the lip tip and the substrate, and coating on the substrate a coating solution ejected from a slit outlet at the lip tip while relatively moving the slit-type die coater and the substrate, thereby forming at least two coating layers in the stripe shape, featured in that the lip tip has at least one groove in the coating region in the coating width direction, and a pressure at the slit outlet of the coating solution of the bead is negative or zero.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: May 20, 2014
    Assignee: Konica Minolta Holdings, Inc.
    Inventors: Shigetoshi Kawabe, Nobuaki Takahashi
  • Publication number: 20130216721
    Abstract: A plating process using an electroless plating bath formed from a single component solution used to effect nickel or nickel alloy plating on magnesium. The plating solution is provided with a nickel hydrate compound as a source of plating ions, a sodium hydrate compound and ammonium hydroxide. The bath solution is heated to a temperature of 50° C. or more, and the substrate is immersed therein for upto ten minutes to allow for formation of the heating layer.
    Type: Application
    Filed: February 14, 2013
    Publication date: August 22, 2013
    Applicant: UNIVERSITY OF WINDSOR
    Inventor: UNIVERSITY OF WINDSOR
  • Publication number: 20130177777
    Abstract: A coated article includes a metal substrate and an abrasion-resisting layer formed on a surface of the metal substrate. The abrasion-resisting layer consists essentially of amorphous phosphorus-nickel alloy with polytetrafluoroethylene particles and tungsten carbide particles dispersed therein. A method for making the present coated article is also described.
    Type: Application
    Filed: September 5, 2012
    Publication date: July 11, 2013
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventor: DA-HUA CAO
  • Patent number: 8309164
    Abstract: A metallized substrate having, disposed in the order mentioned: a ceramics substrate; a high-melting point metal layer; a base nickel plating layer; a layered nickel-phosphorous plating layer; a diffusion-inhibiting plating layer; and a gold plating layer. The base nickel plating layer being any one of a nickel plating layer, a nickel-boron plating layer, or a nickel-cobalt plating layer. The diffusion-inhibiting plating layer being any one of a columnar nickel-phosphorous plating layer, a palladium-phosphorous plating layer, or a palladium plating layer. According to the above composition, even after heating the semiconductor chips in a mounted state, the metallized substrate can make the connection strength of wire bonding favorable.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: November 13, 2012
    Assignee: Tokuyama Corporation
    Inventors: Tetsuo Imai, Osamu Yatabe, Masakatsu Maeda
  • Patent number: 8293334
    Abstract: The invention relates to a method for a preliminary metallizing treatment of galvanized or zinc alloy-coated steel surfaces or joined metallic parts that at least partly have zinc surfaces, in a surface treatment encompassing several process steps. In the disclosed method, metallic coats of especially a maximum of 100 mg/m2 of molybdenum, tungsten, cobalt, nickel, lead, tin, and/or preferably iron are produced on the treated zinc surfaces. Another embodiment of the invention relates to an uncoated or subsequently coated metallic part which has been subjected to the disclosed preliminary metallizing treatment as well as the use of such a part for making bodies during the production of automobiles, building ships, in the construction industry, and for manufacturing white products.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: October 23, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventors: Karsten Hackbarth, Wolfgang Lorenz, Eva Wilke, Marcel Roth, Reiner Wark, Michael Wolpers, Guadalupe Sanchis Otero, Christian Rosenkranz, Peter Kuhm, Kevin Meagher
  • Patent number: 8202576
    Abstract: A method of forming a metal film, the method including: (a) forming a primer layer on a substrate by applying a first polymer including a unit having a cyano group in a side chain; (b) forming a polymer layer on the surface of the primer layer by applying a second polymer, the second polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof and a polymerizable group; (c) applying the electroless plating catalyst or the precursor thereof to the polymer layer; and (d) forming a metal film on the polymer layer by performing electroless plating.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: June 19, 2012
    Assignee: FUJIFILM Corporation
    Inventors: Masaaki Inoue, Tetsunori Matsumoto
  • Patent number: 8177956
    Abstract: A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: May 15, 2012
    Inventors: Nicole J. Micyus, Carl P. Steinecker, Duncan P. Beckett
  • Patent number: 8021721
    Abstract: A method of modifying a bottomhole assembly that includes metal plating at least a portion of a bottomhole assembly, wherein the metal-plating comprises superabrasive nanoparticles is disclosed.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: September 20, 2011
    Assignee: Smith International, Inc.
    Inventor: Anthony Griffo
  • Patent number: 7964069
    Abstract: A device for galvanic coating of a piston has a pot-shaped interior for accommodating the piston and an electrolyte fluid, a holder device for fixing the piston in place, a cover that is structured like a shutter and leaves only the surfaces of the piston that are to be coated uncovered, a first electrical contact that is connected with an anode and with the plus pole of a direct voltage source, and a second electrical contact that connects the piston with the minus pole of a direct voltage source. The piston can be simply and quickly attached to the holder device, since the holder device is in plate shape, and has an oblong centering device, the length of which corresponds to the radial inside diameter of the piston to be coated so that the piston can be pushed onto the centering device by way of its underside.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: June 21, 2011
    Assignee: MAHLE International GmbH
    Inventors: Rudolf Bergmann, Kurt Nikolei
  • Patent number: 7897198
    Abstract: Electroless plating is performed to deposit conductive materials on work pieces such as partially fabricated integrated circuits. Components of an electroless plating bath are separately applied to a work piece by spin coating to produce a very thin conductive layer (in the range of a few hundred angstroms). The components are typically a reducing agent and a metal source.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: March 1, 2011
    Assignee: Novellus Systems, Inc.
    Inventors: Heung L. Park, Eric G. Webb, Jonathan D. Reid, Timothy Patrick Cleary
  • Publication number: 20110014059
    Abstract: A method to produce a turbomachinery impeller, which includes, at least, the following steps: creation of the impeller using a light alloy, and coating of the impeller with a nickel-plating coating.
    Type: Application
    Filed: July 14, 2010
    Publication date: January 20, 2011
    Inventors: Iacopo GIOVANNETTI, Riccardo PAOLETTI, Massimo GIANNOZZI, Eugenio GIORNI, Andrea AVANZINI
  • Patent number: 7846503
    Abstract: The invention concerns an electrolyte for electroless deposition of metal layers with internal compressive stresses containing a metal base salt, a reducing agent, a complexing agent, an accelerator and a stabilizer. In order to make available an electrolyte of the said kind, from which uniform pore-free and crack-free metal-phosphorus coatings can be deposited with constant layers properties and high phosphorus contents at an elevated deposition rate over a long period of time, it is proposed by means of the invention that the electrolyte contain as metal base salt a metal salt whose anions contain at least one carbon atom and that is present in a starting concentration from 0.01 to 0.3 mol/L. At least one salt consisting of metal acetate, metal formate, metal oxalate, metal propionate, metal citrate and metal ascorbate, especially preferably metal acetate, is used as the metal salt whose anion contains at least one carbon atom.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: December 7, 2010
    Assignee: Enthone Inc.
    Inventors: Franz-Josef Stark, Helmut Horsthemke, Ulrich Treuner
  • Patent number: 7833583
    Abstract: An electroless nickel plating bath is provided that utilizes hypophosphite ions as a reducing agent and is substantially free of sulphate and sodium ions. Spent nickel in the plating bath is removed using an ion exchange resin and the remaining effluent solution is usable for manufacturing fertilizer compositions. The nickel is processed for inclusion back into the plating bath. Thus, the process of the invention allows for the indefinite use of the solutions without discharging hazardous waste.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: November 16, 2010
    Inventors: Trevor Pearson, Paul Bray
  • Patent number: 7810523
    Abstract: A method is provided for reducing seepage through a leak (5) in a duct (1), the leak being defined in terms of its maximum dimension xL and its maximum width in an orthogonal direction yL and the effective size of the leak being given by formula (1): SL=(x2L+y2L)1/2. A plurality of sealing elements (3) are introduced into the duct, the sealing elements having dimensions a, b and c in mutually orthogonal directions and the effective size SE of the sealing element being given by formula (2): SE=(a2+b2+c2)1/2. The sealing elements have an effective size SE, which is less than the effective size of the leak SL, so that sealing elements (3A) are drawn to the leak locality and caused, by reason of a pressure differential at that locality and attributable to the leak, to move over the leak and reduce the seepage.
    Type: Grant
    Filed: April 29, 2003
    Date of Patent: October 12, 2010
    Assignee: Brinker Technology Limited
    Inventors: Ian Kenneth McEwan, Ian Beveridge Chirnside, Nicholas John Ryan
  • Patent number: 7782994
    Abstract: This invention relates to an inhibitor of lead-induced stress corrosion cracking including nickel boride in the secondary side of steam generator tubes in nuclear power plants and an inhibition method using the same, and more particularly, to an inhibitor of lead-induced stress corrosion cracking, in which nickel boride is added to secondary side cooling water of the steam generator in an amount of 0.2˜6 g/l, and to an inhibition method using the same. According to this invention, when the inhibitor of lead-induced stress corrosion cracking is added to the secondary side of the steam generator tube in nuclear power plants, stress corrosion cracking of the tubes, which occurs in the lead-containing neutral or caustic solution, and a crack growth rate are decreased, thus increasing elongation. Further, a stress corrosion cracking ratio is decreased, and therefore the stress corrosion cracking resistance of metal or alloy can be improved.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: August 24, 2010
    Assignees: Korea Atomic Energy Research Institute, Korea Hydro & Nuclear Power Co. Ltd.
    Inventors: Oh-Chul Kwon, Yong-Sun Yi, Hong-Pyo Kim, Joung-Soo Kim
  • Patent number: 7721425
    Abstract: A method of connecting an electronic part, containing: forming an electroless nickel plating coat containing phosphorous on a substrate metal layer which constitutes a connecting terminal of an electronic part; and carrying out connecting to the nickel plating coat through a lead-free solder, wherein a half-width of X-ray diffraction of a (111) plane of Ni crystal in the nickel plating coat is 5 degrees or less.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: May 25, 2010
    Assignee: The Furukawa Electric Co., Ltd.
    Inventor: Junya Hirano
  • Patent number: 7704562
    Abstract: A process is disclosed for the purpose of increasing the adhesion of a polymeric material to a metal surface. The process comprises plating the metal surface with a layer of electroless nickel, electroless cobalt or electroless (or immersion) tin followed by phosphating the plated layer prior to bonding the polymeric material thereto. The process is particularly suited to treating printed circuit board inner-layers and lead frames.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: April 27, 2010
    Inventor: John L. Cordani, Jr.
  • Patent number: 7641781
    Abstract: In a method for coating a substrate, and a coated object, in a first step, in an external current-less or electrolytic manner, nickel and/or cobalt and/or platinum are deposited on a substrate in a deposition bath. In the deposition bath, particles are additionally suspended which contain at least one metal selected from Mg, Al, Ti, Zn and no Cr, the particles becoming occluded in the coating. In a second step, the actual protective layer is produced by heat treatment. The coating of component parts may be used for aircraft turbines or gas turbines or for garbage incineration systems having temperature-resistant protective layers against high temperature corrosion.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: January 5, 2010
    Assignee: MTU Aero Engines GmbH
    Inventors: Andreas Dietz, Gebhard Klumpp, Juergen Olfe
  • Publication number: 20090317556
    Abstract: A process for chrome plating magnesium and its alloys. The process uses a combination of electroless nickel plating, a multi-stage copper coating transition system and multiple layers of electrodeposited nickel to form a corrosion resistant system of substantial impermeability and interlayer adherence suitable for direct chromium electroplating.
    Type: Application
    Filed: June 19, 2008
    Publication date: December 24, 2009
    Applicant: Arlington Plating Company
    Inventor: Richard Lee Macary
  • Publication number: 20090286104
    Abstract: Multiple layers of nickel phosphorous coatings are formed by electroless plating onto a base metal substrate such as a turbine component. In one embodiment, a first nickel layer metallurgical bonded by a heat treatment process to a surface of the base metal substrate, the first nickel layer containing about 4 to about 6 weight percent phosphorous with the balance being essentially nickel; and a second nickel layer deposited onto the first layer, the second nickel layer containing about 8 to about 12 weight percent phosphorous with the balance being essentially nickel, wherein the first and second layers are formed by electroless plating. In this manner, adhesion is maximized without degrading the properties of the second layer such as corrosion resistance and ductility. Also disclosed are processes for forming the multilayered nickel phosphorus coatings.
    Type: Application
    Filed: May 16, 2008
    Publication date: November 19, 2009
    Applicant: General Electric Company
    Inventors: Steven Alfred Tysoe, Eugenio Giorni, Dennis Michael Gray, Lawrence Bernard Kool, Francesco Sorbo
  • Patent number: 7598204
    Abstract: A reagent suitable for use as a catalyst comprises a first metal species substrate having a second reduced metal species coated thereon, the second reduced metal species being less electropositive than the first metal. Methods of manufacture are also provided.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: October 6, 2009
    Assignee: General Motors Corporation
    Inventors: Andrew M. Mance, Tao Xie, Belabbes Merzougui
  • Publication number: 20090232999
    Abstract: A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.
    Type: Application
    Filed: March 12, 2008
    Publication date: September 17, 2009
    Inventors: Nicole J. Micyus, Carl P. Steinecker, Duncan P. Beckett
  • Patent number: 7531246
    Abstract: An exemplary core insert includes a main body having a central protruding portion and a peripheral flange portion surrounding the central protruding portion, and a multilayer film formed on the central protruding portion. The multilayer film includes a nickel-phosphorus layer formed on the central protruding portion, a chromium layer formed on the nickel-phosphorus layer, a chromium nitride layer formed on the chromium layer, and a diamond-like carbon layer formed on the chromium nitride layer. The core insert has excellent hardness, good corrosion resistance, good wear resistance, high adhesion, and a long operational lifetime.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: May 12, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Ga-Lane Chen
  • Publication number: 20080274294
    Abstract: A metal structure (100) for a contact pad of a semiconductor device, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). In the structure, the first copper layer of first thickness and first crystallite size is selectively exposed by a window (110) in the insulating overcoat. A layer of second copper (105) of second thickness covers conformally the exposed first copper layer. The second layer is deposited by an electroless process and consists of a transition zone, adjoining the first layer and having copper crystallites of a second size, and a main zone having crystallites of the first size. The second thickness is selected so that the distance a void from the second layer can migrate during the life expectancy of the structure is smaller than the combined thicknesses of the first and second layers. A layer of nickel (106) is on the second copper layer, and a layer of noble metal (107) is on the nickel layer.
    Type: Application
    Filed: July 18, 2008
    Publication date: November 6, 2008
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Howard R. Test, Donald C. Abbott
  • Publication number: 20080241410
    Abstract: An electroless nickel plating bath is provided that utilizes hypophosphite ions as a reducing agent and is substantially free of sulphate and sodium ions. Spent nickel in the plating bath is removed using an ion exchange resin and the remaining effluent solution is usable for manufacturing fertilizer compositions. The nickel is processed for inclusion back into the plating bath. Thus, the process of the invention allows for the indefinite use of the solutions without discharging hazardous waste.
    Type: Application
    Filed: March 27, 2007
    Publication date: October 2, 2008
    Inventors: Trevor Pearson, Paul Bray
  • Patent number: 7407689
    Abstract: The present invention provides a non-cyanide aqueous acidic immersion plating solution having a pH of from about 3.5 to about 6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions. In one embodiment the immersion plating solutions of the invention also contain at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms. The present invention also relates to methods for depositing zinc alloy protective coatings on aluminum and aluminum alloy substrates comprising immersing the aluminum or aluminum alloy substrate in the non-cyanide acidic immersion plating solutions of the invention. Optionally, the zinc alloy coated aluminum or aluminum alloy substrate is plated using an electroless or electrolytic metal plating solution.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: August 5, 2008
    Assignee: Atotech Deutschland GmbH
    Inventors: Nayan H. Joshi, Maulik D. Mehta
  • Patent number: 7351448
    Abstract: An apparatus and process for coating surfaces of metal or metallic components including providing at least one metal having a patterned outer surface exhibiting an optical reflection greater than about 40%, providing at least one anti-reflective coating material, the anti-reflective coating material(s) including effective amount of electrically conductive light scattering and/or wavelength absorbent properties, and depositing the anti-reflective coating material(s) onto the patterned outer surface(s) of each metal, wherein the anti-reflective coating material(s) conforms to the desired patterned outer surface(s) of each metal. In another embodiment, a coated metal component includes at least one metal having a patterned outer surface(s); and, a coating of at least one antireflective material deposited on the metal patterned outer surface by deposition, wherein the antireflective coating material(s) including effective amount of electrically conductive light scattering and/or wavelength absorbent properties.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: April 1, 2008
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: David J. Irvin, Andrew Guenthner, Nicholas Prokopuk
  • Patent number: 7338686
    Abstract: The present invention provides a low-cost method for producing conductive particles in a short period of time by simplifying pretreatment in electroless plating. The method for producing conductive particles includes the steps of: introducing a solution composed mainly of palladium chloride and hydrochloric acid into an electroless plating bath containing particles of an organic material or an inorganic material while stirring the bath; and simultaneously applying an electroless plating to the surface of the particles and allowing the palladium catalyst to be carried on the surface of the particles to give conductive particles having an electroless plate coating.
    Type: Grant
    Filed: April 13, 2004
    Date of Patent: March 4, 2008
    Assignee: Kiyokawa Plating Industry Co., Ltd.
    Inventors: Hajime Kiyokawa, Kiyoto Fukuoka
  • Patent number: 7314650
    Abstract: Sputter targets comprising a target backing plate and a target deposit, are manufactured using electroless and electrolytic deposition of metal and metal alloys on a surface of the target backing plate. Portions of the target backing plate other than the surface can be protected from the deposition process. In addition, sputter targets comprising a target backing plate and a target deposit with complex combinations of materials are manufactured by simultaneous electroless deposition of a matrix metal and particulate material.
    Type: Grant
    Filed: July 21, 2004
    Date of Patent: January 1, 2008
    Inventor: Leonard Nanis
  • Publication number: 20070298186
    Abstract: A method and apparatus for plating a threaded portion of a high pressure gas cylinder is provided. The method includes: providing a high pressure gas cylinder having a gas containing portion and a threaded portion being formed on a top of the gas containing portion; locating an anode pipe, in which a plating solution passage is formed, inside the threaded portion; forming a closed chamber containing the threaded portion and the anode pipe; forming a flux of the plating solution inside the closed chamber; and forming a voltage difference between the anode pipe and the threaded portion, and plating the threaded portion.
    Type: Application
    Filed: June 12, 2007
    Publication date: December 27, 2007
    Inventor: Kyung Jun Yang
  • Patent number: 7297373
    Abstract: A conductive composite material formed from an organic polymer base, a highly conductive metal interlayer, and an electroless nickel top layer is described. The composite material may be electrically conductive and resistant to corrosion. The highly conductive metal interlayer may be silver or copper. An electroless nickel plating process is described that efficiently deposits the nickel top layer without the use of, surfactants, and stabilizers at low temperatures. The method enables reduction of substantially all of a nickel salt onto the silver surface leaving a spent bath solution free of nickel that can be recycled.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: November 20, 2007
    Assignee: Noble Fiber Technologies, LLC
    Inventor: Vinesh Naik
  • Patent number: 7264848
    Abstract: The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—SH wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: September 4, 2007
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Masaki Sanada, Masao Nakazawa, Kei Imafuji
  • Patent number: 7256115
    Abstract: A method and apparatus are disclosed for forming a tapered contact structure over a contact pad. The tapered contact structure may be used to securely anchor an overlying solder bump or solder ball. Additionally, the tapered contact structure allows the use of either larger contact pads or, alternately, allows a greater density of contact pads to be achieved on an integrated circuit substrate.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: August 14, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Joseph T. Lindgren
  • Patent number: 7160583
    Abstract: A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Articles formed from this method are also disclosed.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: January 9, 2007
    Assignee: 3M Innovative Properties Company
    Inventors: Matthew H. Frey, Khanh P. Nguyen
  • Patent number: 7132124
    Abstract: In a die for molding a honeycomb structure, in which a coating layer is formed on a die base so that slits with a particular width are provided, the slits are provided so as to have a width of 30 to 200 ?m by forming the coating layer by a substrate layer with a thickness of 10 to 100 ?m and a surface layer with a thickness of 1 to 30 ?m. Further, the substrate layer is formed by a metal layer containing no oxide. A thin-wall honeycomb structure with a wall thickness of 30 to 200 ?m can be formed, and moreover a die for molding a honeycomb structure, in which the coating layer is not damaged and thus the durability is high, and a manufacturing method thereof can be provided.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: November 7, 2006
    Assignee: NGK Insulators, Ltd.
    Inventors: Keiji Matsumoto, Haremi Ito, Shinji Murahata
  • Patent number: 6998151
    Abstract: The present invention provides a method to coat an article using a plating process, either electroless or electrolytic, whereby nickel is plated on the article using a solution that includes a suspension of powders or containing one or more of the following elements: Ni, Cr, Al, Zr, Hf, Ti, Ta, Si, Ca, Fe, Y and Ga. Optionally, the coating is then heat treated at a temperature above about 1600° F. for an effective amount of time to allow to homogenize the coating by allowing effective interdiffusion between the species. The level of aluminum may be altered to produce a coating of the predominantly ? phase of the NiAl alloy composition. Optionally, a TBC layer is applied over the predominantly ? phase NiAl alloy composition metallic bond coat.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: February 14, 2006
    Assignee: General Electric Company
    Inventors: Richard Grylls, Theodore Robert Grossman
  • Patent number: 6936302
    Abstract: There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexing agent for nickel ions, a reducing agent for nickel ions, and ammonums (NH4+). The electroless Ni—B plating liquid can lower the boron content of the resulting plated film without increasing the plating rate and form a Ni—B alloy film having an FCC crystalline structure.
    Type: Grant
    Filed: January 28, 2004
    Date of Patent: August 30, 2005
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Hirokazu Ezawa, Masahiro Miyata, Manabu Tsujimura
  • Patent number: 6913791
    Abstract: A method for surface treating a titanium-containing metal, comprising the steps of: (a) treating at least a portion of a surface of the titanium-containing metal with an anodic activation in an electrolyte bath; and (b) strike plating at least a portion of the surface of the treated titanium-containing metal with a metallic coating in the same electrolyte bath as in step (a), wherein the titanium-containing metal remains submerged in the electrolyte bath during steps (a) and (b).
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: July 5, 2005
    Assignee: COM DEV Ltd.
    Inventors: Florin Burca, John Darmon
  • Patent number: 6911269
    Abstract: Lead-free chemically produced nickel alloy containing nickel, phosphorus, bismuth and antimony, process for the production of such a nickel alloy by externally electroless metal deposition in an aqueous electrolyte and articles plated therewith.
    Type: Grant
    Filed: October 25, 2001
    Date of Patent: June 28, 2005
    Assignee: AHC Oberflachentechnik GmbH & Co.
    Inventors: Alfons Hollander, Heinz-Peter Becker
  • Patent number: 6902765
    Abstract: A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: June 7, 2005
    Assignee: Atotech Deutschland GmbH
    Inventors: Mariola Brandes, Herman Middeke, Brigitte Dyrbusch
  • Publication number: 20040258847
    Abstract: A method to determine and monitor concentrations of inert metal plating components in metal plating baths. An inert indictor is included in the bath composition and the concentration of the inert indictor is monitored during plating. The change in the concentration of the inert indicator is used to determine the change in the concentration of inert bath components.
    Type: Application
    Filed: November 26, 2003
    Publication date: December 23, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Martin W. Bayes, Raymund W. M. Kwok
  • Patent number: 6824666
    Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: November 30, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Srinivas Gandikota, Chris R. McGuirk, Deenesh Padhi, Muhammad Atif Malik, Sivakami Ramanathan, Girish A. Dixit, Robin Cheung
  • Patent number: 6800121
    Abstract: This invention relates to aqueous electroless nickel plating solutions, and more particularly, to nickel plating solutions based on nickel salts of alkyl sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous acid or bath soluble salts thereof selected from sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The electroless nickel plating solutions of the invention are free of added nickel hypophosphite, and free of alkali or alkaline earth metal ions capable of forming an insoluble orthophosphite.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: October 5, 2004
    Assignee: Atotech Deutschland GmbH
    Inventor: George E. Shahin
  • Patent number: 6797312
    Abstract: Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetramethylammonium hydroxide. In a further embodiment, a plating solution can be formulated that does not require the use of a catalyst, such as a palladium catalyst prior to depositing the metal alloy on a substrate.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: September 28, 2004
    Assignee: Mattson Technology, Inc.
    Inventors: Bob Kong, Nanhai Li
  • Patent number: 6790481
    Abstract: A corrosion-resistant, copper-finned heat exchanger for a water heater is provided. The heat exchanger includes a conduit through which water runs, heat-transfer fins extending from the conduit and an anti-corrosive coating containing electroless nickel. The heat-transfer fins contain copper, and the coating is deposited directly onto at least one of the copper heat-transfer fins.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: September 14, 2004
    Assignee: AOS Holding Company
    Inventors: Charles J. Bishop, Ming C. Kuo