Abstract: Disclosed is a method for the xerographic, pattern-wise deposition of a dielectric powder that is sensitized with a metal compound to enable the electroless plating of a pattern formed by said powder.

Abstract: Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths.

Abstract: A heterogenous powder comprising particles of tungsten grains with a diameter of less than 1 .mu.m with a binder sponge-like coating of at least one metal selected from the group consisting of nickel, copper, silver, iron, cobalt, molybdenum and rhenium with a particle diameter of 10 to 50 .mu.m, a process for the preparation thereof, method of forming sintered elements therefrom and the elements produced thereby being useful as penetrating projectiles.

Abstract: The invention relates to a method for the production of a self-supporting spacing mask for a particle radiation-projection system, especially for the selective structuring and/or doping when producing highly integrated circuits.According to the invention, layers of varying compositions are deposited onto a substrate, structured and then partially or completely removed, until the mask structure which is backed by a stable metal grid is produced on the substrate, whereby a special pattern, made like a nuclear filter with statistically distributed pores is used for grid formation.

Abstract: A nickel and/or cobalt chemical plating bath comprises: a salt of the metal(s) to be deposited; one or more complexing agents of said metal(s), a reducing agent based on boron or phosphorous; and a stabilizing agent. To avoid including sources of corrosion and/or toxic substances in the plating, the stabilizing agent comprises a water soluble organic compound which possesses a readily accessible electron pair, and which does not include any metal or metalloid from group IIIa (other than boron or aluminum), IVa (other than carbon), Va (other than nitrogen or phosphorous), VIa (other than oxygen), or VIIa (other than fluorine or chlorine).

Abstract: An improved aqueous electroless nickel plating bath and process for chemically depositing nickel on a substrate comprising an aqueous solution containing nickel ions, hypophosphite ions, a complexing agent, preferably a buffering agent and a wetting agent, and a small but effective amount of a sulfonium betaine compound sufficient to control the rate of nickel deposition and the concentration of phosphorus in the nickel deposit, preferably, in further combination with supplemental organic and/or inorganic rate stabilizers. The invention further contemplates a process for rejuvenating an electroless nickel bath which has been rendered inoperative due to the presence of excessive concentrations of supplemental stabilizing agents by the addition of a controlled effective amount of a sulfonium betaine compound sufficient to restore the bath to an operative plating condition.

Abstract: A low-temperature, electroless process for the plating of nickel metal upon substrate. Nickel, olefin, and trifluorophosphine vapors are condensed and reacted in a vessel. The reaction product is distilled off and condensed onto the surface of a substrate. The surface is warmed and the reaction product allowed to decompose, yielding a coating of nickel metal upon the substrate, gaseous olefin and Ni(PF.sub.3).sub.4.

Abstract: A method for electroless nickel plating of silicon-iron which has been heat treated prior to the plating operation and subjected to thermal shock after the plating operation includes the steps of cleaning the surface of the silicon-iron with a fluoride etch salt, forming a thin deposit of palladium on the clean surface of the silicon-iron, hardening the palladium deposit by treatment with a solution of ammonium hydroxide and nickel plating the silicon-iron using an electroless nickel plating solution, followed by baking at about 250.degree. F. for about six hours.

Abstract: The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the IB and VIIIB Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallizing without current.

Abstract: An electroless nickel plating composition characterized by the addition of a polymer formed from a 2-acrylamido or 2-methacrylamido alkyl sulfonic acid monomer. The polymer additive increases the rate of deposition from solution, and to a minor extent, improves the appearance of a nickel deposited from the solution.

Abstract: A process for the surface treatment of inorganic fibers for reinforcing titanium or nickel, comprising the steps of coating the surface of inorganic fibers with an aqueous or organic solvent solution containing a titanate, borate, tetralkylammonium hydroxide and, if desired, dextrin and then heat treating the coated fibers at a high temperature in an inert or non-oxidizing atmosphere. In one embodiment, the heat treated inorganic fibers is further subjected to ionic or chemical plating with nickel.

Abstract: The boron content of an electroless nickel-boron deposit is enhanced by including a source of zirconyl ions or vanadyl ions within a borane-reduced bath for laying down the nickel-boron deposit, which bath has a moderate temperature and pH. The deposit laid down has a boron content of at least about 2 weight percent, based on the total weight of the deposit.

Abstract: A process for the electrolytic or electroless deposition of a coating of nickel on an aluminum or aluminum alloy substrate which comprises immersing the substrate in a hydroxide solution having a pH of about 12 or above, a nickel or cobalt compound soluble therein and a non-cyanide complexing agent for the nickel or cobalt compound capable of maintaining the nickel or cobalt metal in solution at a pH of about 12 or above, and electrolytically or electrolessly coating a layer of nickel thereon.

Abstract: The electroless deposition of nickel coatings on metals and metal alloy is accomplished with aqueous baths which contain 10-50 g/l of a fluorine-containing nickel compound; 40 to 200 g/l diammonium hydrogen citrate; 20 to 100 g/l ammonium hydrogen difluoride; 5 to 50 g/l 2-hydroxy-4-methyl benzoic acid, (2,4-cresotinic acid); 0.0005-0.05 g/l copper salt; and 10-100 g/l sodium hypophosphite. Nickel fluoride and nickel (II)-hydroxide carbonate dissolved in hydrofluoric acid have been found particularly advantageous. Smooth and uniform, corrosion-resistant coatings are obtained also on complicated formed parts of magnesium and magnesium alloys.

Abstract: A nickel layer is prepared by applying a nickel salt and a reducing agent for reducing said nickel salt, on a substrate and reducing said nickel salt by a chemical reaction. The chemical reduction is carried out in the presence of at least one compound selected from the group consisting of diethylenetriamine, and imidazole.

Abstract: In a spinning or twisting machine, a anti-balloon ring stationarily fixed around the bobbin spindle is first sand-blasted so as to produce a predetermined degree of surface roughness, then provided with a nickel coating in order to reduce undesirable excrescences followed by a copper coating in order to reduce friction and loss of yarn resistance while permitting much higher spindle speeds in respect of an acceptable rate of wear.

Abstract: A positive electrode suitable for the electrolysis of water is produced by immersing a nickel electrode in an aqueous solution containing a nickel salt, a rhodium salt, and an alkyl amine borane.

Abstract: Disclosed are processes and articles for composite electroless coatings comprising at least two distinct layers, the first layer comprising a metal and/or a metal alloy plus particulate matter and the second layer comprising a metal and/or a metal alloy and being substantially free of particulate matter.

Abstract: Disclosed are processes and articles for composite electroless coatings comprising at least two distinct layers, the first layer comprising a metal and/or a metal alloy plus particulate matter and the second layer comprising a metal and/or a metal alloy and being substantially free of particulate matter.

Abstract: Gold-plated electronic components are disclosed, as well as a process for producing the same, wherein an alloy of nickel and cobalt or an alloy containing these elements as essential ingredients is used as an undercoat for the gold-plated layer.

Abstract: An improved tank process for plating aluminum substrates which is especially advantageous for plating porous aluminum castings and, blister-free plated aluminum substrates produced thereby, characterized in that the aluminum piece parts are: (i) emulsion cleaned in a room temperature alkaline cleaner; (ii) immersed in a room temperature dilute acid, inorganic, fluoride salt solution to dissolve heavy oxides and surface silicon while minimizing etching and intergranular attack of the aluminum substrate such, for example, as a porous cast aluminum substrate; (iii) immersed in a room temperature dilute zincate bath for applying a relatively thin zinc protective coating, preferably utilizing a double zincate immersion process with an intermediate prolonged (1-3 min.) nitric acid soak to reduce the zincate deposition rate and to thereby provide improved zincate adhesion; (iv) plated with a non-porous strike applied directly on the zincate protective coating--e.g.

Abstract: A process is described for the reception of composite electroless plating onto a non-catalytic metal or non-catalytic alloy, non-catalytic to composite electroless plating. The process comprises contacting the non-catalytic substrate with a promoter composition containing ions selected from the group of nickel, cobalt, iron, and mixtures thereof and a suitable reducing agent, and thereafter contacting the treated surface with a composite electroless plating bath comprising particulate matter to deposit a metallic layer with finely divided particulate matter dispersed throughout.

Abstract: This invention relates to monitoring the concentration of a component dissolved in solution where the component imparts a perceptible color to the solution and varies in concentration with use of the solution.

Abstract: A method is disclosed for preventing stress corrosion cracking or metal embrittlement of a zirconium or zirconium alloy container that is to be coated on the inside surface with a layer of a metal such as copper, a copper alloy, nickel, or iron and used for holding nuclear fuel material as a nuclear fuel element. The zirconium material is etched in an etchant solution, desmutted mechanically or ultrasonically, oxidized to form an oxide coating on the zirconium, cleaned in an aqueous alkaline cleaning solution, activated for electroless deposition of a metal layer and contacted with an electroless metal plating solution. This method provides a boundary layer of zirconium oxide between the zirconium container and the metal layer.

Abstract: A process for the preparation of non-conductors prior to electroless metal plating with a catalyst composition. The catalyst formulation comprises the product resulting from the admixture of an acid, a nucleophillic reactant, stannous ions, a hydrolyzable stannic compound, and precious metal ions. The stannous ions are in a molar excess relative to either the stannic compound or the precious metal ions.

Abstract: A method is provided for inhibiting the development of friction fatigue stress between the mating surfaces of paired machine parts, and particularly those subject to oscillatory loads. This is achieved by maintaining the mating surfaces separated by placing between them a material either of a different crystal structure than the parts separated, or a material of a greater hardness. The separating material may be in the form of a connecting element, or it may be coated onto one of the mating surfaces.

Abstract: A roller of the type useable as either of the pair of pressure applying rollers used in an instant photographic camera wherein a film unit consisting of a photosensitive element, an image receiving element and a rupturable pod containing a processing fluid is passed between a pair of pressure applying rollers which apply compressive pressure to the film unit so as to rupture the pod and dispenses the processing fluid between and in contact with the photosensitive element and the image receiving element to initiate a diffusion transfer process. The roller has a round roller body having fine surface irregularities and a plated layer of nickel which is reduction separated on the surface of the roller by using the roller material as a catalyst. The plated layer separated on the surface of the roller is of uniform thickness. The roller may be heat hardened after the nickel layer is reduction separated.

Abstract: Method for locally galvanizing a ferrous metal article, preferably a strip or a sheet.The article is coated on the surface to be protected from the galvanization by an aqueous suspension of cement and is thereafter dried, heated to a temperature above the melting point of the zinc and moved through a bath of molten zinc. It undergoes finally a cleaning step to remove the masking cement material and possibly a final rinsing.Articles thus obtained may be one side galvanized steel strips to be used in the automobile industry.

Abstract: A method and apparatus for the electroless nickel plating of long bodies including a deep tank capable of supporting at least one long body in a substantially vertical position and immersed in an electroless nickel plating solution, a fluid distribution system including a plurality of vertically spaced sparger outlets within the tank and means for discharging filtered, heated, plating solution through the sparger outlets generally directed toward or around the long body within the tank to provide directionalized dispersion of the solution throughout substantially the full depth of the tank.

Abstract: Polyalloy catalytic coating formulations are used for preparing a metallic substrate surface to enhance subsequent plating thereover of nickel, cobalt or polyalloys including nickel or cobalt. At the same time, these catalytic formulations can be rinsed subsequent to their application onto the substrate and prior to the electroless deposition thereover. Improved products such as printed wiring boards may be made with these catalytic formulations. Such boards are prepared by depositing metal and forming circuitry patterns by using resists, etching techniques and the like which typically leave copper specks on the non-conductive board.

Abstract: This invention relates to monitoring the concentration of a component dissolved in solution where the component imparts a perceptible color to the solution and varies in concentration with use of the solution.The invention is based upon use of a colorant of a fixed optical density that absorbs light in a different region of the visible spectrum than the monitored component. As the monitored component varies in concentration with use of the solution, the optical density of that component in solution varies as a function of its concentration and consequently, the amount of light, i.e., the intensity of light, passing through the solution will also vary as a function of concentration. Since the optical density of the colorant remains fixed during use, the optical density of the monitored component changes relative to the optical density of the colorant during use of the solution.

Abstract: A process is described for the reception of electrolytic or electroless plating onto a non-platable semiconductor substrate. The process comprises contacting of the semiconductor substrate with a promoter composition containing metal ions, preferably primary type, selected from the group consisting of nickel, cobalt, iron, and copper, and mixtures thereof, and a reducing agent selected from the group consisting of amine boranes, borohydrides, hydrazine, and derivatives thereof, and thereafter immersion of the substrate in conventional electrolytic or electroless plating baths, e.g., nickel or cobalt-hypophosphite type baths or copper-formaldehyde type baths, for the metallic build-up.

Abstract: An improved cathode for the electrolysis of an aqueous solution of an alkali metal salt or water, the cathode having been plated in an electroless plating bath containing a salt of Ni, Co or Fe in the presence of a hypophosphite and as a reducing agent, a sulfur or selenium containing compound.

Abstract: Metal strip, particularly steel strip, is heated above 300.degree. C. and immersed in a coating bath whose temperature is at least 80.degree. C. and which contains at least one metal salt, the strip being coated with a metal layer, e.g. Ni-based or Cr-based, by the coating bath.

Abstract: An electroless nickel plating solution is characterized by the addition of a small but effective amount of a source of gallium for improved stability and deposit properties.

Abstract: A process for the preparation of non-conductors prior to electroless metal plating with a catalyst composition. The catalyst formulation comprises the product resulting from the admixture of an acid, a nucleophilic reactant, stannous ions, an hydrolyzable stannic compound, and precious metal ions. The stannous ions are in a molar excess relative to either the stannic compound or the precious metal ions.

Abstract: A process is described for the reception of electroless plating onto a non-catalytic metal or alloy substrate, non-catalytic to conventional electroless plating. The process comprises contacting the non-catalytic substrate with a promoter composition comprising ions selected from the group consisting of nickel, cobalt, iron and mixtures thereof; and a suitable reducing agent capable of chemically interacting with the non-catalytic metal or alloy and the metal ions in the promoter composition and further wherein the relative concentration of the reducing agent to metal ions is so adjusted as to yield first a reaction of the reducing agent with the non-catalytic metal or alloy and thereafter a heterogeneous reduction of the metal ions; and thereafter contacting the treated substrate with a conventional electroless plating bath, e.g, a nickel or cobalt-hypophosphite type bath or a copper-formaldehyde type bath for the metallic build-up.

Abstract: An adherent bright metallic coating which may be any metal or alloy capable of being deposited electrolessly, is applied to the surface of a plastic or other dielectric part (or to a metal part) by an electroless process comprising suitable pretreatment of said surface, deposition of a primary electroless copper to produce an underlayer, then depositing a bright secondary electroless coating of the desired metal (the overlayer) with complete elimination of any subsequent electroplating process [usually required to achieve this brightness]. The required overlayer may also be limited to selected surface areas of a coated part by mechanically removing portions of the primary electroless copper prior to immersion of the part in the secondary electroless bath to produce the desired overlayer metal.

Abstract: The electroless deposition of nickel base alloys is improved by incorporating in the bath ions of vanadium and of at least one of the metals thallium, vanadium, tin, zinc or tungsten. Three of these metals give even better results, and best results are obtained with four or all five. The effect of the plural added metals is synergetic, to improve corrosion resistance, freedom from porosity, and brightness of the deposited coating.

Abstract: An adherent, bright metallic nickel coating is applied to the surface of a plastic or other dielectric part (or to a metal part) by an electroless process comprising, after suitable pretreatment of said surface, the deposition of a primary electroless nickel possessing special properties followed by a secondary electroless nickel of bright appearance with complete elimination of any subsequent electroplating process usually required to achieve this brightness. The nickel coating may be limited to selected surface areas of a coated part by mechanically removing portions of the primary coat prior to immersion of the part in a secondary electroless nickel bath.

Abstract: This invention relates to electroless metal deposition and more specifically, to a process where a plating solution is brought to equilibrium and thereafter operated with the concentration of plating reactants and by-products maintained substantially constant. The plating solution treated in accordance with the invention is one having evaporative losses of at least one percent per plating cycle. Following the process, a plating solution can be operated indefinitely and yields a metal plate of uniform quality and predictable properties at any time during use of the solution. The invention avoids the known problems of by-product build-up and variable concentration of reactants typically associated with the use of such solutions.

Abstract: According to the proposed method, the upper layer of the working solution is heated and components restoring its concentration are added thereto, while the lower layer of the solution is simultaneously cooled and a reagent restoring the pH of the solution is added thereto. The installation for realizing said method comprises a bath composed of two communicating vessels mounted one atop the other. The lower vessel is provided with an arrangement for cooling the solution therein and with a device for feeding thereinto the reagent restoring the pH of the solution, whereas the upper vessl is provided with an arrangement for heating the solution therein and with a device for feeding thereinto the components restoring the concentration of the solution.

Abstract: A process for producing long-lasting corrosion resistant carbon steel razor blades and the products made thereby. The process comprises first coating the cutting edges of the blades with chromium; and then immersing the blades in an electroless coating bath to provide a coating of a nickel-phosphorous, nickel- copper- phosphorous, cobalt-phosphorous or cobalt-nickel-phosphorous coating material on at least the bodies of the blades, the chromium coating preventing beading up of the coating material on the cutting edges of the blades to an extent that would require resharpening of the cutting edges. The blades may thereafter be overcoated with a carboxy-substituted silicone oil composition preferably comprising therein a long chain aliphatic acid, alcohol, amide and mixtures thereof.

Abstract: This invention is an improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath. The invention solves a problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank.The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.

Abstract: A method for depositing electroless nickel on aluminum or aluminum alloy is described. The method is particularly useful for fabricating bonding pads on aluminum metallized semiconductor devices and for creating beam leads. The described method deposits a thick nickel layer directly on aluminum without the use of intermediate layers or surface activation as required in the prior art. The method basically comprises immersion in a stop-etchant which simultaneously removes aluminum oxide and activates the surface; immersion in a solution which activates the aluminum with nickel ions and deactivates mask material; and immersion in a novel electroless nickel bath. A technique for electrolessly depositing gold is also described.

Abstract: A protective sacrificial coating is provided for metal substrates, e.g. ferrous metal substrates, such as compressor discs or blades for jet engines, the sacrificial coating comprising an intermetallic compound of magnesium with a coating metal, the coating being anodic to the substrate metal, the coating being optionally covered with an adherent non-metallic overcoat of, for example, a conversion coating.

Abstract: A method for depositing electroless nickel on aluminum or aluminum alloy is described. The method is particularly useful for fabricating bonding pads on aluminum metallized semiconductor devices and for creating beam leads. The described method deposits a thick nickel layer directly on aluminum without the use of intermediate layers or surface activation as required in the prior art. The method basically comprises immersion in a stop-etchant which simultaneously removes aluminum oxide and activates the surface; immersion in a solution which activates the aluminum with nickel ions and deactivates mask material; and immersion in a novel electroless nickel bath. A technique for electrolessly depositing gold is also described.

Abstract: Electroless nickel coating of epoxy resin foundry patterns and core boxes can be carried out without a palladium chloride/stannous chloride activation of the surface, if the pattern or core box contains a high density of metal particles which act as "keying" sites, and if the metal-filled resin surface is properly prepared. The preparation steps include a very light abrading with a fine (minus 60 U.S. mesh and preferably even finer) grit and a very brief acid pickling step. The electroless-plated article has a continuous coating of nickel bonded essentially directly to the resin through the metallic "keying" sites.

Abstract: In a wholly additive process for depositing a patterned metal layer on an insulating substrate, the sensitized and activated substrate is coated with photoresist; a desired pattern is formed in the photoresist layer by exposing it to a mask and developing it using conventional techniques; the patterned surface is then contacted with a second developer solution containing the activator; a metal pattern is deposited by electroless metal plating; and the photoresist is removed.

Abstract: A process for the electroless deposition of a metal layer on an article comprised of zirconium or a zirconium alloy is disclosed. The article is activated in an aged aqueous solution comprising from about 10 to about 20 grams per liter ammonium bifluoride and from about 0.75 to about 2 grams per liter of sulfuric acid. The solution is aged by immersion of pickled zirconium in the solution for at least about 10 minutes. The loosely adhering film formed on the article in the activating step is removed and the article is contacted with an electroless plating solution containing the metal to be deposited on the article upon sufficient contact with the article.