Chemical Compound Reducing Agent Utilized (i.e., Electroless Deposition) Patents (Class 427/437)
  • Patent number: 10395853
    Abstract: An electrode, process for preparing the electrode and devices thereof. An electrode comprising at least one metal deposited on a substrate; and at least one electrically conducting polymer. The devices comprising the electrode for energy storage and molecular separation.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: August 27, 2019
    Assignee: Council of Scientific & Industrial Research
    Inventor: Kothandam Krishnamoorthy
  • Patent number: 9245670
    Abstract: A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have different grain sizes. An average grain size of the core material may be several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: January 26, 2016
    Assignee: Tessera, Inc.
    Inventors: Cyprian Uzoh, Craig Mitchell
  • Patent number: 9096924
    Abstract: The present invention is directed to compositions, baths, and methods for composite plating including polytetrafluoroethylene (PTFE), and more particularly, to compositions, baths, and methods of composite plating with PTFE in a metal or alloy matrix where the materials used in the process contain no or essentially no PFOS (perfluorooctane sulfonate) and/or no PFOA (perfluorooctanoic acid).
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: August 4, 2015
    Assignee: SURFACE TECHNOLOGY, INC.
    Inventors: Michael David Feldstein, Thomas S. Lancsek
  • Patent number: 9072203
    Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: June 30, 2015
    Assignee: Enthone Inc.
    Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
  • Patent number: 8962070
    Abstract: The present invention relates to an electrolyte for the electroless deposition of a metal layer on a substrate, wherein the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between ?2 and +5, and in which instead a ?-amino acid is used as stabilizer. In particular, the inventive electrolyte can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. Furthermore, the invention is directed to a method for the electroless deposition of metal layers utilizing an inventive electrolyte as well as the use of ?-amino acids as stabilizer in electrolytes for the electroless deposition of metal layers in general.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: February 24, 2015
    Assignee: Enthone Inc.
    Inventors: Franz-Josef Stark, Christoph Werner
  • Patent number: 8962076
    Abstract: A method of manufacturing a hollow body is disclosed, the body provided with a glass inside surface defining a cavity, said method being characterized in that it includes a step of covering at least a fraction of said inside surface with a lining of composition that is mostly metal, said covering step including sub-steps of activating and of grafting said inside surface respectively with an activation agent and with a grafting agent, and in that said hollow body comprises a single piece of glass inside which said cavity is formed.
    Type: Grant
    Filed: November 27, 2009
    Date of Patent: February 24, 2015
    Assignee: SGD S.A.
    Inventor: Christophe Jean Wagner
  • Patent number: 8961669
    Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: February 24, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Anna Rzeznik
  • Patent number: 8906446
    Abstract: An apparatus is provided having a closable chamber that can be sealed and is capable of withstanding an increased pressure and high temperature. The chamber has several inlet ports for the supply of various process liquids, such as deposition solutions, DI water for rinsing, etc., and a port for the supply of a gas under pressure. The apparatus also includes a solution heater and a control system for controlling temperature and pressure in the chamber. Uniform deposition is achieved by carrying out the deposition process under pressure and under temperature slightly below the boiling point of the solution. The solution can be supplied from above via a shower head formed in the cover, or through the bottom of the chamber. Rinsing or other auxiliary solutions are supplied via a radially moveable chemical dispensing arm that can be arranged above the substrate parallel thereto.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: December 9, 2014
    Assignee: Lam Research Corporation
    Inventors: Igor C. Ivanov, Jonathan Weiguo Zhang, Artur Kolics
  • Patent number: 8871297
    Abstract: A method of applying a nanocrystalline coating to a gas turbine engine component is described. The method comprises the steps of applying an intermediate bond coat to at least a portion of the component, and then applying the nanocrystalline coating to at least the portion of the component overtop of the intermediate bond coat. The component may include, for example, a blade of which a dovetail portion of the blade root is protected by applying the intermediate bond coat and the nanocrystalline coating thereto.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: October 28, 2014
    Inventors: Barry Barnett, Kin-Leung Cheung, Thomas McDonough, Andreas Eleftheriou, Enzo Macchia
  • Patent number: 8834958
    Abstract: A process of electroless plating a tin or tin-alloy active material onto a metal substrate for the negative electrode of a rechargeable lithium battery comprising steps of (1) immersing the metal substrate in an aqueous plating solution containing metal ions to be plated, (2) plating tin or tin-alloy active material onto the metal substrate by contacting the metal substrate with a reducing metal by swiping one on the other, and (3) removing the plated metal substrate from the plating bath and rinsing with deionized water. A rechargeable lithium battery using tin or tin-alloy as the anode active material.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: September 16, 2014
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Shengshui Zhang
  • Patent number: 8822872
    Abstract: Disclosed are an electrode wire for electro-discharge machining and a method for manufacturing the same. The electrode wire includes a core wire including a first metal including copper, a first alloy layer formed at a boundary region between the core wire and a second metal plated on an outer surface of the core wire due to mutual diffusion between the core wire and the second metal, and a second alloy layer formed due to diffusion of the first metal to the second metal. A core wire material is erupted onto a surface of the electrode wire for electro-discharge machining, which includes the core wire, the first alloy layer, and the second alloy layer, along cracks appearing on the second alloy layer, so that a plurality of grains are formed on the surface of the electrode wire.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: September 2, 2014
    Inventors: Ki-Chul Seong, Hyun-Soo Seong, Hyun-Kook Seong
  • Patent number: 8815066
    Abstract: An aqueous electrodeposition coating composition comprising (a) an organometallic compound and (b) a cathodically electrodepositable binder, the binder comprising an amine-functional phosphorylated resin, provides corrosion protection equivalent to that obtained by the conventional phosphate pretreatment-electrodeposition coating process.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: August 26, 2014
    Assignee: BASF Coatings GmbH
    Inventors: Timothy S. December, Abdellatif Chouai
  • Patent number: 8784931
    Abstract: A method of manufacturing ULSI wiring in which wiring layers are separately formed via a diffusion prevention layer and an insulating interlayer portion made of SiO2. The method comprises the steps of treating, with a silane compound, a SiO2 surface of the insulating interlayer portion on which the diffusion layer is to be formed, performing catalyzation with an aqueous solution containing a palladium compound, forming the diffusion prevention layer by electroless plating, and then forming the wiring layer on this diffusion prevention layer. A capping layer may be formed on the wiring layer by electroless plating. Consequently, a diffusion prevention layer having good adhesive properties can be formed through a simple wet process, and, the wiring layer can directly be formed on this diffusion prevention layer by a wet process. The capping layer can also be directly formed on the wiring layer by electroless plating.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: July 22, 2014
    Assignees: Waseda University, Renesas Electronics Corporation
    Inventors: Kazuyoshi Ueno, Tetsuya Osaka, Nao Takano
  • Patent number: 8771790
    Abstract: A method of reducing magnetite formation in the bore of a pipe including the steps of selecting a pipe with a pre-existing oxide layer on its inner bore surface and coating the pre-existing oxide layer with an oxidation resistant metal to thereby reduce magnetite formation in the bore of the pipe.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: July 8, 2014
    Inventor: Michael John de Vink
  • Patent number: 8771805
    Abstract: The present invention provides a process for embedding at least one layer of at least one metal trace in a silicone-containing polymer, comprising: a) applying a polymer layer on a substrate; b) thermally treating the polymer; c) irradiating at least one surface area of the polymer with a light beam emitted by an excimer laser; d) immersing the irradiated polymer in at least one autocatalytic bath containing ions of at least one metal, and metallizing the polymer; e) thermally treating the metallized polymer; f) applying a polymer layer covering the thermally treated metallized polymer; and g) thermally treating the metallized covered polymer. The present invention further provides a polymer layer comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: July 8, 2014
    Assignee: Second Sight Medical Products, Inc.
    Inventors: Lucien D. Laude, Robert J. Greenberg
  • Publication number: 20140170328
    Abstract: An electroless plating Ru bath for the deposition of Ru on the surface of a substrate comprises a Ru stock solution and hydrazine as a reducing reagent. Ru layers may be applied, for example, for use in membranes for the separation of hydrogen gas from mixtures of gases or to protect materials from corrosion. An example Ru stock solution comprises Ru chloride, hydrochloric acid, ammonia, nitrite salt, alkali hydroxide, and deionized water. The electroless plating bath may be applied to deposit ruthenium layers onto palladium layers to prepare Pd—Ru composite or alloy membranes or multilayer Pd—Ru composite or alloy membranes. Such membranes have example application to the separation of hydrogen from mixtures of gases.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 19, 2014
    Applicant: NORAM Engineering and Constructors Ltd.
    Inventors: David Anthony Boyd, Anwu Li
  • Patent number: 8703232
    Abstract: The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed features with recessed surfaces. The structured surface region is substantially free of plateaus. The method includes disposing a fluid composition comprising a functional material and a liquid onto the structured surface region. The method includes evaporating liquid from the fluid composition. The functional material collects on the recessed surfaces such that a remainder of the structured surface region is substantially free of the functional material.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: April 22, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Matthew S. Stay, Mikhail L. Pekurovsky, Cristin E. Moran, Matthew H. Frey
  • Patent number: 8663746
    Abstract: An apparatus and system for stirring liquid inside a flow cell. In one implementation, the apparatus includes a rotatable disc configured to receive liquid at a top side of the disc and distribute the liquid substantially evenly around a periphery of the flow cell. The disc has a triangular cross sectional area. The apparatus may further include a set of fins attached to a bottom side of the disc, wherein the set of fins is configured to draw the liquid from the periphery of the flow cell into the center of the flow cell.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: March 4, 2014
    Assignee: Intermolecular, Inc.
    Inventor: Rajesh Kelekar
  • Patent number: 8622020
    Abstract: An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also includes a fluid delivery system configured to deliver a plating solution to the top surface of the first wafer, wherein in response to delivery of the plating solution, the top surface of the second wafer is brought proximate to the top surface of the first wafer so that the plating solution contacts both top surfaces. A method for applying an electroless plating solution to a substrate is also provided.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: January 7, 2014
    Assignee: Lam Research Corporation
    Inventors: William Thie, John M. Boyd, Yezdi Dordi, Fritz C. Redeker
  • Publication number: 20130295294
    Abstract: Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained.
    Type: Application
    Filed: December 28, 2012
    Publication date: November 7, 2013
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Takahiro ISHIZAKI, Tomoharu NAKAYAMA, Teruyuki HOTTA
  • Patent number: 8568899
    Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: October 29, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Naonori Michishita, Nobuhito Makino
  • Patent number: 8551560
    Abstract: Methods for improving selective deposition of a capping layer on a patterned substrate are presented, the method including: receiving the patterned substrate, the patterned substrate including a conductive region and a dielectric region; forming a molecular masking layer (MML) on the dielectric region; preparing an electroless (ELESS) plating bath, where the ELESS plating bath includes: a cobalt (Co) ion source: a complexing agent: a buffer: a tungsten (W) ion source: and a reducing agent; and reacting the patterned substrate with the ELESS plating bath for an ELESS period at an ELESS temperature and an ELESS pH so that the capping layer is selectively formed on the conductive region. In some embodiments, methods further include a pH adjuster for adjusting the ELESS pH to a range of approximately 9.0 pH to 9.2 pH. In some embodiments, the pH adjuster is tetramethylammonium hydroxide (TMAH). In some embodiments, the MML is hydrophilic.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: October 8, 2013
    Assignee: Intermolecular, Inc.
    Inventors: Jinhong Tong, Zhi-Wen Sun, Chi-I Lang, Nitin Kumar, Bob Kong, Zachary Fresco
  • Patent number: 8519048
    Abstract: Disclosed is a method of forming on the surface of a substrate a first solid layer which is suitable for activating a chemical reaction to form a second layer thereon, the method comprising the steps of: applying to the surface of the substrate a first liquid comprising a curable composition and an activator for the second layer-forming chemical reaction; and curing the curable composition, thereby forming a first solid layer adhered to the surface of the substrate, capable of activating the second layer-forming chemical reaction. A second layer can then be formed on the substrate by bringing into contact with the first solid layer a second fluid comprising components of a second layer-forming chemical reaction, activated by the activator, thereby causing a second layer to be formed on the first solid layer.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: August 27, 2013
    Assignee: Conductive Inkjet Technology Limited
    Inventors: Philip Gareth Bentley, James Edward Fox, Alan Lionel Hudd, Martyn John Robinson
  • Patent number: 8465803
    Abstract: A self-replicating monolayer system employing polymerization of monomers or nanoparticle ensembles on a defined template provides synthesis of two-dimensional single molecule polymers. Systems of self-replicating monolayers are used as templates for growth of inorganic colloids. A preferred embodiment employs SAM-based replication, wherein an initial monolayer is patterned and used as a template for self-assembly of a second monolayer by molecular recognition. The second monolayer is polymerized in place and the monolayers are separated to form a replicate. Both may then function as templates for monolayer assemblies. A generic self-replicating monomer unit comprises a polymerizable moiety attached by methylene repeats to a recognition element and an ending unit that will not interfere with the chosen recognition chemistry. The recognition element is self-complementary, unless two replicating monomers with compatible cross-linking chemistry are employed.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: June 18, 2013
    Assignee: Massachusetts Institute of Technology
    Inventors: Joseph M. Jacobson, David W. Mosley
  • Patent number: 8435603
    Abstract: Disclosed is a method of forming on the surface of a substrate a first solid layer which is suitable for activating a chemical reaction to form a second layer thereon, the method comprising the steps of: applying to the surface of the substrate a first liquid comprising a curable composition and an activator for the second layer-forming chemical reaction; and curing the curable composition, thereby forming a first solid layer adhered to the surface of the substrate, capable of activating the second layer-forming chemical reaction. A second layer can then be formed on the substrate by bringing into contact with the first solid layer a second fluid comprising components of a second layer-forming chemical reaction, activated by the activator, thereby causing a second layer to be formed on the first solid layer.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: May 7, 2013
    Assignee: Conductive Inkjet Technology Limited
    Inventors: Philip Gareth Bentley, James Edward Fox, Alan Lionel Hudd, Martyn John Robinson
  • Patent number: 8404035
    Abstract: An electroless copper plating solution that is favorable to improve the adhesion of a plating film and realizes uniform plating at a low temperature is characterized by containing a water-soluble nitrogen-containing polymer in an electroless copper plating solution, and preferably the above-mentioned electroless copper plating solution contains glyoxylic acid and phosphinic acid as reducing agents. The water-soluble nitrogen-containing polymer is preferably a polyacrylamide or a polyethyleneimine and, preferably, its weight average molecular weight (Mw) is at least 100,000 and Mw/Mn is 10.0 or less.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: March 26, 2013
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori, Yoshihisa Fujihira
  • Publication number: 20130068082
    Abstract: A protective coating is applied to a bell body composed of bronze by simply dip-coating the bell with an outer layer of zinc. The process is carried out by immersing the bell body in a hot aqueous solution containing sodium hydroxide and powdered free zinc. After the bell is removed from the coating solution it is rinsed and then polished. The coating protects the bell from environmental contaminants without changing the frequency or musical quality of the bell and therefore may be used equally with newly manufactured or refurbished bells.
    Type: Application
    Filed: September 20, 2011
    Publication date: March 21, 2013
    Applicant: MALMARK, INC.
    Inventor: Derek Mohr
  • Patent number: 8337609
    Abstract: A pearlescent effect pigment having an opaque, dark or black color is disclosed. The black pearlescent pigment includes a platelet-shaped non-metal substrate, optionally an oxide layer, a template layer, and a metal layer. The pearlescent luster of the disclosed effect pigment is comparable to those of pure pearlescent effects. The disclosed method provides a cost-effective approach for the manufacturing of the disclosed effect pigment.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: December 25, 2012
    Assignee: Silberline Manufacturing Co., Inc.
    Inventors: Shufang Yu, Peter Llyod Redmond, Hai Hui Lin, Chang Xu, Parfait Jean Marie Likibi
  • Patent number: 8318260
    Abstract: The present invention relates to an electroless deposition of metallic silver on various plates. More particularly, in the present invention, by spraying a silver solution including ionic silver to be reduced into metallic silver and a reducing solution a reducing agent for reducing the silver solution at the same time to a predetermined region above a substrate, metallic silver particles having a diameter less than 30 ? are formed, and a silver layer is formed by a deposition of the nano-sized metallic silver. Since the silver layer includes nano-sized silver particles having a diameter less than 3 nm, a reflector having a high density, that is, surface roughness, can be manufactured. The reflector has a considerably excellent reflectance.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: November 27, 2012
    Assignee: Nano CMS Co., Ltd
    Inventors: Si Doo Kim, Seong Uk Lee, Jae Youn Hwang, Shi Surk Kim
  • Patent number: 8298621
    Abstract: An apparatus and system for stirring liquid inside a flow cell. In one implementation, the apparatus includes a rotatable disc configured to receive liquid at a top side of the disc and distribute the liquid substantially evenly around a periphery of the flow cell. The disc has a triangular cross sectional area. The apparatus may further include a set of fins attached to a bottom side of the disc, wherein the set of fins is configured to draw the liquid from the periphery of the flow cell into the center of the flow cell.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: October 30, 2012
    Assignee: Intermolecular, Inc.
    Inventor: Rajesh Kelekar
  • Patent number: 8298620
    Abstract: The present invention provides methods of controlling properties of a thin film applied to a substrate whereby the properties of the thin film may be controlled by the surface morphology of the substrate. Methods of increasing a deposition rate of an electroless plating process applied to a substrate, controlling the grain size distribution and/or grain size of a thin film applied to a substrate and maintaining a uniform overpotential of an electroless plating process on a substrate are also provided.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: October 30, 2012
    Assignee: North Carolina Agricultural and Technical State University
    Inventors: Shamsuddin Ilias, Mohammad A. Islam
  • Patent number: 8293334
    Abstract: The invention relates to a method for a preliminary metallizing treatment of galvanized or zinc alloy-coated steel surfaces or joined metallic parts that at least partly have zinc surfaces, in a surface treatment encompassing several process steps. In the disclosed method, metallic coats of especially a maximum of 100 mg/m2 of molybdenum, tungsten, cobalt, nickel, lead, tin, and/or preferably iron are produced on the treated zinc surfaces. Another embodiment of the invention relates to an uncoated or subsequently coated metallic part which has been subjected to the disclosed preliminary metallizing treatment as well as the use of such a part for making bodies during the production of automobiles, building ships, in the construction industry, and for manufacturing white products.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: October 23, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventors: Karsten Hackbarth, Wolfgang Lorenz, Eva Wilke, Marcel Roth, Reiner Wark, Michael Wolpers, Guadalupe Sanchis Otero, Christian Rosenkranz, Peter Kuhm, Kevin Meagher
  • Patent number: 8225744
    Abstract: An apparatus for depositing a solid film onto a substrate from a reagent solution includes reservoirs of reagent solutions maintained at a sufficiently low temperature to inhibit homogeneous reactions within the reagent solutions. The chilled solutions are dispensed through showerheads, one at a time, onto a substrate. One of the showerheads includes a nebulizer so that the reagent solution is delivered as a fine mist, whereas the other showerhead delivers reagent as a flowing stream. A heater disposed beneath the substrate maintains the substrate at an elevated temperature at which the deposition of a desired solid phase from the reagent solutions may be initiated. Each reagent solution contains at least one metal and either S or Se, or both. At least one of the reagent solutions contains Cu. The apparatus and its associated method of use are particularly suited to forming films of Cu-containing compound semiconductors.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: July 24, 2012
    Assignee: Sisom Thin Films LLC
    Inventor: Isaiah O. Oladeji
  • Publication number: 20120164342
    Abstract: A method of regenerating an electroless tin or tin alloy plating solution containing thiourea or thiourea compounds by reducing impurities by adding organosulfonic acid, organosulfonic acid compound, or salts thereof in certain amounts and then cooling the solution to form precipitates. The precipitates are then removed from the tin or tin alloy solution.
    Type: Application
    Filed: December 28, 2011
    Publication date: June 28, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventor: Yoshiyuki HAKIRI
  • Publication number: 20120164341
    Abstract: Impurities are removed from electroless tin and tin alloy plating solutions by generating precipitates through the addition of sufficient amounts of benzenesulfonic acid, benzenesulfonic acid hydrate or salts thereof to the electroless tin and tin alloy plating solutions. The precipitates may then be removed from the electroless plating solutions using conventional apparatus.
    Type: Application
    Filed: December 28, 2011
    Publication date: June 28, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventor: Yoshiyuki HAKIRI
  • Publication number: 20120156387
    Abstract: The present invention relates to an electrolyte for the electroless deposition of a metal layer on a substrate, wherein the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between ?2 and +5, and in which instead a ?-amino acid is used as stabilizer. In particular, the inventive electrolyte can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. Furthermore, the invention is directed to a method for the electroless deposition of metal layers utilizing an inventive electrolyte as well as the use of ?-amino acids as stabilizer in electrolytes for the electroless deposition of metal layers in general.
    Type: Application
    Filed: July 6, 2010
    Publication date: June 21, 2012
    Applicant: ENTHONE INC.
    Inventors: Franz-Josef Stark, Christoph Werner
  • Patent number: 8202576
    Abstract: A method of forming a metal film, the method including: (a) forming a primer layer on a substrate by applying a first polymer including a unit having a cyano group in a side chain; (b) forming a polymer layer on the surface of the primer layer by applying a second polymer, the second polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof and a polymerizable group; (c) applying the electroless plating catalyst or the precursor thereof to the polymer layer; and (d) forming a metal film on the polymer layer by performing electroless plating.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: June 19, 2012
    Assignee: FUJIFILM Corporation
    Inventors: Masaaki Inoue, Tetsunori Matsumoto
  • Publication number: 20120129005
    Abstract: It is an object of the present invention to provide an electroless gold plating solution capable of directly subjecting a plated coating film made of an underlying metal such as nickel or palladium to gold plate processing, of forming a thick gold plated coating film having a thickness of 0.1 ?m or more, of forming a uniform gold plated coating film, and of safely performing plating work. The present invention relates to an electroless gold plating solution comprising: a water-soluble gold compound; and hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. Preferably, the electroless gold plating solution comprises 0.1 to 100 g/L of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine.
    Type: Application
    Filed: April 15, 2011
    Publication date: May 24, 2012
    Inventors: Takanobu Asakawa, Tomoyuki Fujinami
  • Patent number: 8182594
    Abstract: An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: May 22, 2012
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Eiji Hino, Masashi Kumagai
  • Patent number: 8168258
    Abstract: In a method of producing a temperature sensor including at least one lead wire of a non-noble metal or of an alloy containing a non-noble metal, at first a lead wire is attached to the temperature sensor. An oxide layer is removed from at least one portion of the lead wire, and the at least one portion of the lead wire is chemically gilded immediately after removing the oxide layer.
    Type: Grant
    Filed: July 4, 2007
    Date of Patent: May 1, 2012
    Inventors: Heinrich Zitzmann, Gyoergy Bernitz
  • Patent number: 8128987
    Abstract: A method for electroless deposition from a deposition solution in a working chamber, where the process can include heating the deposition solution to its boiling point and subsequently reducing the temperature of the deposition solution to a working temperature range that is between approximately 1% and approximately 25% below the boiling point of said solution under a predetermined pressure; and the process also can include heating the deposition solution while filling an enclosed area of the chamber such that the deposition solution reaches its boiling point immediately after the enclosed area is filled.
    Type: Grant
    Filed: May 26, 2005
    Date of Patent: March 6, 2012
    Assignee: Lam Research Corp.
    Inventors: Igor C. Ivanov, Jonathan Weiguo Zhang, Artur Kolics
  • Patent number: 8110252
    Abstract: The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: February 7, 2012
    Assignee: OMG Electronic Chemicals, LLC
    Inventor: Roger F. Bernards
  • Patent number: 8104425
    Abstract: A method for electroless plating of a substrate is provided that comprises exposing an electroless plating reagent comprising a metal to be plated and at least one reducing agent to a solid phase Activation Material to form an activated electroless plating reagent prior to application of the electroless plating reagent to the substrate. The activated electroless plating reagent is applied to a substrate in the process chamber under conditions to cause the metal of the electroless plating reagent to deposit on the substrate. Systems and modules are also described.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: January 31, 2012
    Assignee: FSI International, Inc.
    Inventor: Kurt Karl Christenson
  • Patent number: 8101243
    Abstract: The invention provides thin, hydrogen-permeable, sulfur-resistant membranes formed from palladium or palladium-alloy coatings on porous, ceramic or metal supports. Also disclosed are methods of making these membranes via sequential electroless plating techniques, wherein the method of making the membrane includes decomposing any organic ligands present on the substrate, reducing the palladium crystallites on the substrate to reduced palladium crystallites, depositing a film of palladium metal on the substrate and then depositing a second, gold film on the palladium film. These two metal films are then annealed at a temperature between about 200° C. and about 1200° C. to form a sulfur-resistant, composite PdAu alloy membrane.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: January 24, 2012
    Assignee: Colorado School of Mines
    Inventors: J. Douglas Way, Mark Lusk, Paul Thoen
  • Publication number: 20110305919
    Abstract: Formation of an authentication element by deposition of a metal layer with embedded particles on a metal substrate, wherein the embedded particles are configured to convert energy from one wavelength to another. The embedded particles may be upconverters, downconverters, or phosphorescent phosphors, which can be detected and measured with analytical equipment when deposited in the metal layer. A metal substrate may include coinage.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 15, 2011
    Applicant: AUTHENTIX, INC.
    Inventors: Jeffrey L. Conroy, Philip B. Forshee, James A. Shearer
  • Patent number: 8070860
    Abstract: An H2-permeable membrane system (117) comprises an electroless-deposited plating (115) of Pd or Pd alloy on a porous support (110, 110?). The Pd plating comprises face-centered cubic crystals cumulatively having a morphology of hexagonal platelets. The permeability to H2 of the membrane plating (115) on the porous support is significantly enhanced, being at least greater than about 1.3×10?8 mol·m?1·s?·Pa?0.5 at 350° C., and even greater than about 3.4×10?8 mol·m?1·s?1·Pa?0.5. The porous support (110, 110?) may be stainless steel (1100 and include a thin ceramic interlayer (110?) on which the Pd is plated. The method of providing the electroless-deposited plating includes preheating a Pd electroless plating solution to near a plating temperature substantially greater than room temperature, e.g. 60° C., prior to plating.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: December 6, 2011
    Assignee: United Technologies Corporation
    Inventors: Thomas Henry Vanderspurt, Ying She, Zissis Dardas, Craig Walker, James D. MacLeod
  • Patent number: 8058171
    Abstract: An apparatus and system for stirring liquid inside a flow cell. In one implementation, the apparatus includes a rotatable disc configured to receive liquid at a top side of the disc and distribute the liquid substantially evenly around a periphery of the flow cell. The disc has a triangular cross sectional area. The apparatus may further include a set of fins attached to a bottom side of the disc, wherein the set of fins is configured to draw the liquid from the periphery of the flow cell into the center of the flow cell.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: November 15, 2011
    Assignee: Intermolecular, Inc.
    Inventor: Rajesh Kelekar
  • Patent number: 8034746
    Abstract: Disclosed herein is a method of manufacturing round wire using superconducting tape, including the steps of: slitting superconducting tape into superconducting tape strips; silver-coating the slit superconducting tape strips; laminating the silver-coated superconducting tape strips to form a superconducting tape laminate having a square cross-section; holding the superconducting tape laminate; heat-treating the fixed superconducting tape laminate to cause diffusion junction between silver; and copper-plating the heat-treated superconducting tape laminate to have a circular section.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: October 11, 2011
    Assignee: Korea Electrotechnology Research Institute
    Inventors: Hong Soo Ha, Sang Soo Oh, Dong Woo Ha, Rock Kil Ko, Ho Sup Kim
  • Patent number: 8021721
    Abstract: A method of modifying a bottomhole assembly that includes metal plating at least a portion of a bottomhole assembly, wherein the metal-plating comprises superabrasive nanoparticles is disclosed.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: September 20, 2011
    Assignee: Smith International, Inc.
    Inventor: Anthony Griffo
  • Patent number: 7988773
    Abstract: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: August 2, 2011
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Masayuki Kiso, Yoshikazu Saijo, Tohru Kamitamari