Abstract: Certain embodiments of the present invention include a versatile and scalable process, “patterned regrowth,” that allows for the spatially controlled synthesis of lateral junctions between electrically conductive graphene and insulating h-BN, as well as between intrinsic and substitutionally doped graphene. The resulting films form mechanically continuous sheets across these heterojunctions. These embodiments represent an element of developing atomically thin integrated circuitry and enable the fabrication of electrically isolated active and passive elements embedded in continuous, one atom thick sheets, which may be manipulated and stacked to form complex devices at the ultimate thickness limit.

Abstract: A method for manufacturing a solar cell electrode, comprising the steps of: (a) applying a conductive paste for bus electrode to a wafer in order to form a bus electrode pattern; (b) depositing onto the wafer a photocurable conductive paste for finger electrode from a discharge slot of a dispenser nozzle to thereby form an uncured finger electrode pattern on the wafer, wherein the nozzle moves parallel to the wafer; and (c) curing the uncured finger electrode pattern by exposing the uncured finger electrode pattern to UV light either after forming the uncured finger electrode pattern on the wafer in the step (b), or concurrent with the step (b).

Abstract: Provided are a method of forming copper wiring, a method of manufacturing a wiring board, and a wiring board, which are capable of improving conductivity and suppressing deterioration over a period of time of copper wiring. The method of forming copper wiring includes: a wiring pattern formation step of depositing a suspension onto a substrate to form a wiring pattern of the suspension on the substrate, the suspension including dispersed copper particles having an average particle diameter that is not smaller than 100 nm; a drying step of drying the copper particles at a temperature lower than 150° C.; a pressure application step of applying pressure to the copper particles in the wiring pattern; a heat application step of applying heat to the copper particles in the wiring pattern; and a reducing treatment step of subjecting the copper particles to a reducing treatment.

Abstract: A method for fabricating an acoustic wave device includes the steps of forming an insulating material layer on a piezoelectric substrate, forming a patterned photoresist on the insulating material layer, patterning the insulating material layer, and forming a piezoelectric-substrate exposed depression corresponding to a region where an interdigital transducer electrode is to be formed on a first insulator layer composed of the insulating material layer, depositing a metallic material on the piezoelectric substrate to form the interdigital transducer electrode in the piezoelectric-substrate exposed depression such that the overall interdigital transducer electrode is thinner than the first insulator layer and coating the photoresist with a metallic material, removing the photoresist and the metallic material on the photoresist, and depositing a second insulator layer so as to cover the interdigital transducer electrode and the first insulator layer.

Abstract: The present invention relates to a transparent conductive polymer electrode including a plurality of electrode lines formed of droplets of conductive polymer, each of the electrode lines including first and second regions having different conductive polymer droplet hit densities. The first region has a ratio of b/a within a range of 0.2 to 0.8, where “a” is a distance from a center to an edge of the electrode line in at least one direction of width and length directions thereof, and “b” is a distance from the center to an edge of the first region in the at least one direction. The second region is the remaining region of the electrode line, and the conductive polymer droplet hit density of the second region is lower than that of the first region.

Abstract: A method for manufacturing an electric film body is made by forming a film body to have a shape in accordance with a desired electric characteristic and includes a film forming process for forming an electric film body on a board layer, an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process, an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process, and an electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process.

Abstract: A composition for a coverlay having superior thermal resistance, flexibility, and electrical properties, as well as a method of producing the coverlay and a method of forming the coverlay on a PCB are provided. The composition for a coverlay according to an embodiment of the invention may include 10.0˜45.0 wt % of polyimide, 0.01˜5.0 wt % of a defoaming agent, 0.01˜5.0 wt % of a leveling agent, 0.01˜5.0 wt % of a dispersing agent, 0.1˜15.0 wt % of modified polyimide, and a remainder of a solvent. Also provided is a method for producing a composition for a coverlay for an FPCB that includes: placing amine and an acid anhydride in a reaction solvent and subjecting to first polymerization; placing an acid anhydride in a separate reaction solvent subjecting to second polymerization; forming a polyamic acid by mixing a product of the first polymerization with a product of the second polymerization; and adding a defoaming agent, a leveling agent, a dispersing agent, and modified polyimide to the polyamic acid.

Abstract: A conductive circuit is formed by printing a conductive ink composition to form a pattern and heat curing the pattern, the ink composition comprising an addition type silicone rubber precursor, a curing catalyst, conductive particles having a density of up to 2.75 g/cm3, and a thixotropic agent, typically carbon black and being solvent-free. The ink composition has such thixotropy that the circuit may be formed by screen printing at a high speed and in high throughputs and yields.

Abstract: The described embodiments relate generally to the singulation of circuits and more particularly to a method of cutting of a polymer substrate that is overlaid with a conductive element and a passivation layer. In one embodiment, the passivation layer is applied selectively to the polymer substrate in an area covering the conductive element and extending at least a first distance past an outer edge of the conductive element. Then, a cutting operation is performed along a cutting path located a second distance from an outer edge of the passivation layer. The second distance is a minimum distance between the edge of the passivation layer and the cutting path that prevents a load applied at the second distance from causing a stress crack in the passivation layer.

Abstract: A liquid composition for forming an activator-containing layer on a substrate, for activating a chemical reaction to produce a solid layer on the substrate, comprises activator, surfactant and solvent and/or binder. The liquid composition is deposited on a surface of a substrate, desirably by inkjet printing. The layer is used to activate a chemical reaction to produce a solid layer on the substrate surface, e.g. a layer of conductive metal. The surfactant in the liquid composition has beneficial effects on the behavior of the liquid composition when applied to certain substrates.

Abstract: The present invention can easily provide a method of manufacturing a pattern electrode with excellent electroconductivity and excellent transparency and a pattern electrode manufactured according to the method. The method of manufacturing a pattern electrode is characterized in that it comprises the steps of forming on a substrate an electroconductive layer containing metal nanowires, and carrying out pattern printing on the electroconductive layer employing a metal nanowire removing solution, followed by washing with water.

Abstract: A printed wiring board, in which a pattern is formed by screen printing, includes: a land group including lands each provided corresponding to a through-hole; and a dummy pattern provided in proximity to the land group, and free from electrical connection.

Abstract: A method of forming a non-volatile resistive oxide memory array includes forming a plurality of one of conductive word lines or conductive bit lines over a substrate. Metal oxide-comprising material is formed over the plurality of said one of the word lines or bit lines. A series of elongated trenches is provided over the plurality of said one of the word lines or bit lines. A plurality of self-assembled block copolymer lines is formed within individual of the trenches in registered alignment with and between the trench sidewalls. A plurality of the other of conductive word lines or conductive bit lines is provided from said plurality of self-assembled block copolymer lines to form individually programmable junctions comprising said metal oxide-comprising material where the word lines and bit lines cross one another.

Abstract: A printed circuit board that includes a dielectric polymer layer having a thermally conductive agglomerate filler and an electrically conductive layer bonded to the dielectric polymer layer is provided. Methods of producing the printed circuit board are also provided. The subject printed circuit board and methods find use in a variety of different applications, including electronics applications.

Abstract: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.

Abstract: A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.

Abstract: A method for producing a laminated base material includes applying a liquid composition containing a solvent and a liquid crystal polyester to a substrate; and forming a covering material by removing the solvent. The substrate includes a conductor forming a circuit pattern on an insulating layer. The liquid composition covers the conductor. The polyester includes 30-50 mol % of (1), 25-35 mol % of (2), and 25-35 mol % of (3): -0-Ar1-00-??(1) —CO—Ar2-00-??(2) —X—Ar3—Y—??(3) wherein Ar1 is a phenylene or naphthylene group, Ar2 is a phenylene or naphthylene group, or (4), Ar3 is a phenylene group or (4), and X and Y each independently represent 0 or NH; and hydrogen atoms in Ar1, Ar2, or Ar3 are each substitutable with a halogen atom, or an alkyl or aryl group; —Ar11—Z—Ar12—??(4) wherein Ar11 and Ar12 each independently represent a phenylene or naphthylene group and Z represents 0, CO, or SO2.

Abstract: A layered structure comprising a self-assembled material is formed by a method that includes forming a photochemically, thermally and/or chemically treated patterned photoresist layer disposed on a first surface of a substrate. The treated patterned photoresist layer comprises a non-crosslinked treated photoresist. An orientation control material is cast on the treated patterned photoresist layer, forming a layer containing orientation control material bound to a second surface of the substrate. The treated photoresist and, optionally, any non-bound orientation control material are removed by a development process, resulting in a pre-pattern for self-assembly. A material capable of self-assembly is cast on the pre-pattern. The casted material is allowed to self-assemble with optional heating and/or annealing to produce the layered structure.

Abstract: For a method for producing a flexible circuit configuration in the form of a layer sequence of at least one insulating layer and at least one conductive layer, typically multiple insulating layers (N1, N2, N3, NF) and multiple structured conductive layers (L1, L2), the layer sequence for the flexible circuit configuration is deposited on a rigid substrate so that the adhesion of the layer sequence with respect to the substrate is less in an inner area, in which at least one, preferably multiple flexible circuit configurations are created, than in an edge area (RB) which surrounds the inner area (ZB). An intermediate layer can advantageously be deposited for this purpose in the edge area, which causes a stronger adhesion of the layer sequence over the edge area than the inner area, which is not provided with an intermediate layer.

Abstract: Metal nanowires, such as silver nanowires coated on a substrate were fused together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency. Materials formed form the fused metal nanowire networks described herein can have a transparency to visible light of at least about 85% and a sheet resistance of no more than about 100 Ohms/square or a transparency to visible light of at least about 90% and a sheet resistance of no more than about 250 Ohms/square. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. When formed into a film, materials comprising the metal nanowire network demonstrate low sheet resistance while maintaining desirably high levels of optical transparency, making them suitable for transparent electrode formation.

Abstract: A method of forming a conductive feature on a three-dimensional object may include depositing a composition comprising nanoparticles onto a portion of the three-dimensional object, and annealing the composition to form the conductive feature. In another embodiment, a method of forming a conductive feature on a three-dimensional object may include printing a composition comprising nanoparticles to produce a contiguous line over a non-planar portion of the three-dimensional object, and heating the composition to form a conductive feature that has conductivity throughout.

Abstract: Metal nanowires, such as silver nanowires coated on a substrate were sintered together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency and low haze. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. The resulting sintered network can have a core-shell structure in which metal halide forms the shell. Additionally, effective methods are described for forming patterned structure with areas of sintered metal nanowire network with high conductivity and areas of un-sintered metal nanowires with low conductivity. The corresponding patterned films are also described.

Abstract: A composition includes a boron-containing hydrogen silsesquioxane polymer having a structure that includes: silicon-oxygen-silicon units, and oxygen-boron-oxygen linkages in which the boron is trivalent, wherein two silicon-oxygen-silicon units are covalently bound by an oxygen-boron-oxygen linkage therebetween.

Abstract: This instant disclosure provides a manufacturing method of circuit pattern. The method comprising, forming a substrate; forming a protection layer on the substrate for making the protection layer to be a curved surface along the surface of the substrate; executing a pattern processing for the protection layer to make the protection layer to form a first pattern on the substrate, wherein a slot region is obtained according to the inner side of the first pattern; coating a macromolecule coating to the slot region for forming an activated metal layer on the substrate, wherein the activated metal layer forms a circuit pattern respective to the slot region, the macromolecule coating includes at least a kind of metal material; removing the protection layer for exposing the activated metal layer with the circuit pattern. The manufacturing quality of the circuit pattern can be improved and the associated cost can be saved.

Abstract: An embodiment of an interposer is disclosed. For this embodiment of the interposer, a first circuit portion is created responsive to a first printing region. A second circuit portion is created responsive to a second printing region. The interposer has at least one of: (a) a length dimension greater than a maximum reticle length dimension, and (b) a width dimension greater than a maximum reticle width dimension.

Abstract: Systems and methods disclose reduction of conductive paint overspray while maintaining paint thickness uniformity over the perimeter of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern reduces paint waste and achieves edge uniformity. The reduction in paint overspray reduces paint waste, which in turn, reduces production costs. With the reduced amount of paint needed for coating a panel, the cost per unit can be significantly reduced.

Abstract: Systems and methods disclose maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern achieves paint thickness control. A uniform coating of conductive paint provides a more effective EMI or RFI shield during the operation of the IC modules.

Abstract: A composition for forming an aluminum film, comprising a complex represented by the following formula (1) and a complex represented by the following formula (2), the molar ratio of the complex represented by the following formula (1) and the complex represented by the following formula (2) being 40:60 to 85:15: AlH3.NR1R2R3??(1) AlH3.(NR1R2R3)2??(2) (in the above formulas (1) and (2), R1, R2 and R3 are each independently a hydrogen atom, alkyl group, cycloalkyl group, alkenyl group, alkynyl group, aryl group or aralkyl group.).

Abstract: There is provided a pattern forming apparatus which transfers a paste to a predetermined position of a pattern forming object fixed to a table through a pattern forming mask having opening portions at predetermined positions using a discharge mechanism part. To realize a pattern forming which allows the stable forming of a fine pattern with high accuracy and allows the paste to be surely filled into fine through holes, a corner portion of a distal end of the discharge mechanism part in contact with the pattern forming mask is formed into a concave shape, and a surface of the distal end portion of the discharge mechanism part including the concave shaped portion is covered with a film having liquid repellency so that the rolling of the paste is accelerated in a region formed by the concave shaped portion to form a fine pattern with high accuracy.

Abstract: A method of forming a high resolution feature on a substrate, the method includes, depositing a liquid composition comprising a substance and a solvent onto the substrate to form deposited features, heating the deposited features to a heating temperature during or after the depositing to form an intermediate feature having a central region and an edge region, applying an adhesive substance to at least a portion of a surface of the intermediate feature, and removing the adhesive substance together with at least a portion of the central region of the intermediate feature to form the high resolution feature on the substrate.

Abstract: A method for discharging a liquid body includes: discharging the liquid body to a discharged region from a plurality of nozzles while a plurality of droplet discharge heads having a nozzle line having the plurality of nozzles that discharge the liquid body as droplets and are arranged in a linear manner, and a substrate including a plurality of discharged regions having a nearly rectangular shape are relatively moved in a main scan direction that is nearly orthogonal to an arrangement direction of the droplet discharge heads. In the method, the plurality of discharged regions are composed of a first discharged region and a second discharged region. The first discharged region is disposed on the substrate to set a long side thereof along a certain direction, and the second discharged region has a smaller area than the first discharged region and is disposed to set a long side thereof nearly orthogonal to the long side of the first discharged region.

Abstract: There is provided a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used, but copper particles, which cause little electromigration and are small in the price rate of material itself, are used to form a low-resistance copper wiring pattern while the generation of cracks therein is restrained. The method includes the step of using a dispersion slurry wherein copper based particles having a copper oxide surface are dispersed to form any pattern over a substrate, and the step of reducing the copper oxide surface of the copper based particles in the pattern with atomic form hydrogen to return the oxide to copper, and sintering particles of the copper metal generated by the reduction and bonding the particles to each other.

Abstract: The present invention relates to a substrate for an organic electronic element that enables surface resistance to be reduced and light-extraction efficiency improved, the substrate including: a base substrate; a scattering layer which is formed on the base substrate and includes an conductive pattern for reducing the surface resistance of an electrode, scattering particles for scattering light and a binder, and which forms an uneven structure in the surface opposite the base substrate; and a planarizing layer which is formed on the scattering layer and flattens the surface undulations caused by the uneven structure of the scattering layer, wherein the refractive index (Na) of the scattering particles and the refractive index (Nb) of the planarizing layer satisfy the relationship in formula 1 below. [Formula 1] |Na—Nb|?0.3. In the formula as used herein, Na signifies the refractive index of the scattering particles and Nb signifies the refractive index of the planarizing layer.

Abstract: The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.

Abstract: The present &closure provides a touch screen, wherein the touch screen includes: a protecting cover comprising a touch area and a border area surrounding the touch area; a black mask layer farmed on the border area; and a conductive assembly formed in the touch area, Wherein the conductive assembly is isolated from the black mask layer. By using the touch screen provided in the present disclosure, the problem of easy breaking of the conductive assembly Which leads to functional failure of a touch screen in the conventional technology can be solved. In addition, the present disclosure also provides a manufacturing method of the foregoing touch screen.

Abstract: An exemplary embodiment of the present invention relates to a conductive metal ink composition comprising a conductive metal powder; a non-aqueous solvent; an organo phosphate compound; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition.

Abstract: The invention relates to a method for producing a plastic molded part (9) comprising an integrated conductor path (3), which plastic molded part is used in particular as an intermediate product to be further processed into an electrically heatable mirror (1). The method steps are: a) producing a substrate (7) from a carrier body (2) made of an electrically insulating plastic material having a conductor path (3) made of an electrically conductive material on or in a surface (8) of the carrier body (2), b) flooding the surface (8) of the substrate (7) equipped with the conductor path (3) or the surface (11) of the substrate (7) opposite said surface with a liquid, electrically insulating coating material. The flooding evens out depressions due to uneven shrinkage in the thick and thin areas of the carrier body and a smooth surface can be produced, which can subsequently be covered with a reflective layer.

Abstract: A wiring material contains copper, nitrogen, and a dopant which is more readily oxidized than copper in an Ellingham diagram, the dopant being added to the wiring material at a rate of not less than 0.5 at. % and not more than 10 at. %.

Abstract: A method of forming a wiring pattern is provided. In the method, an adhesive material is coated on a substrate to form an adhesive layer, and then a patterned mask is provided on the adhesive layer, wherein the patterned mask has an opening defining a wiring pattern, and then an electrically conductive paste is filled in the opening, and subsequently the patterned mask is removed so as to form the wiring pattern on the substrate. In the method of the present invention, a wiring pattern is formed by using a screen printing method, but not by using an etching method. As a result, there are no etching contamination issues. Furthermore, the difficulty in etching the finer wiring patterns from the copper foil can be alleviated.

Abstract: Aspects of the disclosure provide a circuit package. The circuit package includes a first signal terminal electrically coupled with a serializer/deserializer (SERDES), a second signal terminal electrically coupled with an external electronic component, and a trace disposed on an insulating layer. The trace is configured to transfer an electrical signal between the first signal terminal and the second signal terminal. The trace is patterned to provide a specific filtering characteristic to filter the electrical signal.

Abstract: A low-temperature sintered conductive metal ink and a method for preparing the same are provided. To be specific, the preparation method includes the following steps of: preparing the conductive film or pattern by printing a conductive metal ink including metal nanocolloids, metal salts, and polymers reacted with the metal salts and preparing the metal nanocolloids (step 1); preparing a mixture by mixing the metal salts and polymers (step 2); preparing the metal ink by stirring the metal nanocolloids and the metal salt/polymer mixture prepared at steps 1 and 2 (step 3); printing the metal ink prepared at step 3 (step 4); and drying and thermally treating a product printed at step 4 (step 5).

Abstract: The present invention relates to a process for manufacturing a copper hydride fine particle dispersion, the process including: reducing a copper(II) salt with a hydrido-based reducing agent in the following solvent (A) in the presence of the following alkylamine (B): solvent (A): a solvent having a solubility parameter (SP value) of from 8 to 12 and being inert to the hydrido-based reducing agent and alkylamine (B): an alkylamine having an alkyl group which has 7 or more carbon atoms and having a boiling point of 250° C. or lower.

Abstract: A method of manufacturing an active retarder includes forming a first substrate, forming a second substrate, and forming a liquid crystal layer between the first substrate and the second substrate. The forming of the first and second substrates is performed by a roll-to-roll process.

Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Abstract: A pattern substrate includes a substrate having a surface on which a first area and a second area are formed, and a pattern layer formed at the first area among the first area and the second area. The pattern layer is a wiring pattern layer or a transparent electrode, the first area has a convex/concave shape where a capillary phenomenon occurs, and the convex/concave shape includes an aggregate of a plurality of structures.

Abstract: Provided is a method for forming a micropattern using a mask template. The method includes: forming a mask template on a substrate, wherein the mask template has an exposure section through which a portion of the substrate is exposed to the exterior and a non-exposure section provided by a polymer material applied on the remaining portion of the substrate; supplying conductive ink to the top of the mask template to deposit the conductive ink on the non-exposure section and on the substrate exposed through the exposure section; and heat treating the conductive ink in order to extract the conductive ink nanoclusters dissolved or dispersed in the conductive ink, wherein the conductive ink nanoclusters disposed on the non-exposure section are bound to the non-exposure section to form an insulating pattern having electrical insulating property, while the conductive ink nanoclusters disposed on the substrate form a conductive pattern having electroconductive property.

Abstract: The microcomponent, for example a microbattery, comprising a stack with at least two superposed layers on a substrate, is made using a single steel mask able to expand under the effect of temperature. The mask comprises at least one off-centered opening. The mask being at a first temperature, a first layer is deposited through the opening of the mask. The mask being at a second temperature, higher than the first temperature, a second layer is deposited through the opening of the mask. Finally, the mask being at a third temperature, higher than the second temperature, a third layer is deposited through the opening of the mask.

Abstract: A method of manufacturing a multilayer printed wiring board includes forming a first interlaminar resin insulating layer, a first conductor circuit on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer, opening portions in the second interlaminar resin insulating layer to expose a face of the first conductor circuit, an electroless plating film on the second interlaminar resin insulating layer and the exposed face, and a plating resist on the electroless plating film. The method further includes substituting the electroless plating film with a thin film conductor layer, having a lower ion tendency than the electroless plating film, and a metal of the exposed face, forming an electroplating film including the metal on a portion of the electroless plating film and the thin film conductor layer, stripping the plating resist, and removing the electroless plating film exposed by the stripping.

Abstract: An encapsulation apparatus capable of securely sealing a gap of a display panel and improving intensity of the display panel, and a method of manufacturing an organic light emitting display device using the encapsulation apparatus are taught. The encapsulation apparatus includes an injection port having tapered projecting edges formed in both sides of one end the injection port, and injecting a reinforcing material into a gap of a display panel in a dual surface contact manner, the first substrate and the second substrate being attached to each other using a sealant; and a supporter coupled to the injection port and supporting the injection port.

Abstract: Methods and apparatus for forming interconnects on the surfaces of three dimensional substrates, including ophthalmic devices incorporating one or more electrical components may be utilized to provide high quality electrical and mechanical connections.