Abstract: A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.

Abstract: Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.

Abstract: The photosensitive resin composition of the invention is characterized by comprising (A) a binder polymer, (B) a photopolymerizing compound with at least one polymerizable ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a compound represented by the following general formula (1). In formula (1), R1, R2, R3 and R4 are each independently hydrogen or a compound of the following general formula (2). In general formula (2), R5 represents a C4-30 hydrocarbon group.

Abstract: An electronic circuit board is formed by a pattern forming step for forming a conductive pattern of an electronic circuit board by applying a metal colloid solution on a base material by an inkjet method and a coagulant application step for applying a coagulant solution at least on the conductive pattern by a deposition method.

Abstract: A fuel cell has a substrate with a film deposited thereon. The film has nanowires dispersed therein. Catalytic activity and conductivity is substantially enhanced throughout the film.

Abstract: Silicon is selectively oxidized relative to a metal-containing material in a partially-fabricated integrated circuit. In some embodiments, the silicon and metal-containing materials are exposed portions of a partially-fabricated integrated circuit and may form part of, e.g., a transistor. The silicon and metal-containing material are oxidized in an atmosphere containing an oxidant and a reducing agent. In some embodiments, the reducing agent is present at a concentration of about 10 vol % or less.

Abstract: The present invention relates to an electrically conductive composition for filling via-holes formed in an electronic circuit substrate containing an electrically conductive metal and a vehicle, wherein the content of the electrically conductive metal is 57 vol % or more, and the composition is a plastic fluid for which fluidity increases when external pressure is applied to the composition.

Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.

Abstract: A touch screen panel provided in an image display device. The touch screen panel includes a transparent substrate; a plurality of first sensing patterns on the transparent substrate and coupled to each other along a first direction; a first insulating film on the first sensing patterns; and a plurality of second sensing patterns on the first insulating film and coupled to each other along a second direction crossing the first direction, the second sensing patterns being alternately arranged with the first sensing patterns to not overlap with the first sensing patterns.

Abstract: The invention relates to a printable precursor comprising an organometallic zinc complex which contains at least one ligand from the class of the oximates and is free from alkali metals and alkaline-earth metals, for electronic components and to a preparation process. The invention furthermore relates to corresponding printed electronic components, preferably field-effect transistors.

Abstract: Self-metallizing polyimide films are created by doping polyamic acid solutions with metallic ions and solubilizing agents. Upon creating a film, the film is exposed to coherent light for a specific time and then cured. The resulting film has been found to have a metallic surface layer and a metallic subsurface layer (interlayer). The layer separating the metallic layer has a uniform dispersion of small metal particulates within the polymer. The layer below the interlayer has larger metal particulates uniformly distributed within the polymer. By varying the intensity or time of exposure to the coherent light, three-dimensional control of metal formation within the film is provided.

Abstract: The following invention discloses a type of electronic circuits that is realized directly on textile. The circuit has opto-electronic functions that are realized with a number of components integrated into the textile. These components comprise electronically and/or optically active material, that are supported by fabric elements. The components furthermore include an electrolyte. The components have lest two separated structures of an active material, and the electrolyte is in direct contact with the two separated active structures in that component. The separated structures can control their electrical and optical character through the electrolyte. These types of devices are very suitable for implementation in textile, since they are quite insensitive to the spacing between the separated active structures.

Abstract: A photo-resist of a dry film patterned to form opening portions and non-opening portions is provided on a release film. An electrically conductive paste is applied by a doctor blade and thereafter is dried. Then, the release film of the dry film is removed and thereafter the dry film is adhered to a ceramic green sheet. The photo-resist is removed from the ceramic green sheet to form an electrically conductive film on the ceramic green sheet. The ceramic electronic component is manufactured by sintering the ceramic green sheet having the electrically conductive film formed.

Abstract: The invention relates to an electrically conductive ink comprising fine metal particles, an inorganic binder, and a solvent. The inorganic binder comprises a coupling agent containing Ti or Al or a chelate containing Ti or Al. It is preferred that the inorganic binder is present in an amount of 1 to 50 parts by weight per 100 parts by weight of the fine metal particles in the conductive ink. An electrical conductor thin film is produced by the process of printing the conductive ink on a substrate to form a printed pattern by additive processing and firing the printed pattern at 100° C. to 950° C.

Abstract: A method of manufacturing an exhaust temperature sensor is disclosed. It includes forming a green ceramic substrate; and printing an electrical circuit on the green ceramic substrate. The method then contemplates trimming the electrical circuit to a predetermined resistance prior to firing the green ceramic. Finally, the method contemplates firing the green ceramic substrate with the electrical circuit thereon.

Abstract: The present invention generally relates to liquid films containing nanostructured materials, and, optionally, the use of this arrangement to organize nanostructures and to transfer the nanostructures to a surface. Liquid films containing nanostructures, such as nanoscale wires, can be formed in a gas such as air. By choosing an appropriate liquid, a liquid film can be expanded, for example to form a “bubble” having a diameter of at least about 5 cm or 10 cm. The size of the bubble can be controlled, in some cases, by controlling the viscosity of the liquid film. In some embodiments, the viscosity can be controlled to be between about 15 Pa s and about 25 Pa s, or controlled using a mixture of an aqueous liquid and an epoxy. In some cases, the film of liquid may be contacted with a surface, which can be used to transfer at least some of the nanostructures to the surface. In some cases, the nanostructures may be transferred as an orderly or aligned array.

Abstract: To improve the transmission properties of antennae manufactured with known methods, more specifically antennae for application in the UHF range, a method is proposed of producing pattern-forming metal structures on a carrier substrate. The method comprises the following method steps: providing the carrier substrate, forming the pattern on the carrier substrate with a composite material containing dispersed metal, bringing the carrier substrate into contact with halide ions, and thereafter depositing a metal layer onto the pattern formed by the composite material, producing thereby metal structures.

Abstract: Disclosed is a package substrate including a solder resist layer having pattern parts and a method of fabricating the same, in which the pattern parts are formed on the solder resist layer, thus increasing heat dissipation efficiency and minimizing the warpage of the substrate.

Abstract: In a method for producing an electrically conductive path on a plastic component, the plastic material of the plastic component is converted into a conductive substance using an energy application that is guided along the path.

Abstract: A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.

Abstract: Transparent conductors and methods for fabricating transparent conductors are provided. In one exemplary embodiment, a method for fabricating a transparent conductor comprises forming a dispersion comprising a plurality of conductive components and a solvent, applying the dispersion to a substrate in an environment having a predetermined atmospheric humidity that is based on a selected surface resistivity of the transparent conductor, and causing the solvent to at least partially evaporate such that the plurality of conductive components remains overlying the substrate.

Abstract: Some embodiments include methods of utilizing block copolymer to form patterns between weirs. The methods may utilize liners along surfaces of the weirs to compensate for partial-width segments of the patterns in regions adjacent the weirs. Some embodiments include methods in which spaced apart structures are formed over a substrate, and outer surfaces of the structures are coated with a thickness of coating. Diblock copolymer is used to form a pattern across spaces between the structures. The diblock copolymer includes a pair of block constituents that have different affinities for the coating relative to one another. The pattern includes alternating segments, with the segments adjacent to the coating being shorter than the segments that are not adjacent to the coating. The coating thickness is about the amount by which the segments adjacent to the coating are shorter than the segments that are not adjacent to the coating.

Abstract: Methods and devices for selective etching in a semiconductor process are shown. Chemical species generated in a reaction chamber provide both a selective etching function and concurrently form a protective coating on other regions. An electron beam provides activation to selective chemical species. In one example, reactive species are generated from a plasma source to provide an increased reactive species density. Addition of other gasses to the system can provide functions such as controlling a chemistry in a protective layer during a processing operation. In one example an electron beam array such as a carbon nanotube array is used to selectively expose a surface during a processing operation.

Abstract: A method and apparatus for the formation of coplanar electrical interconnectors. Solder material is deposited onto a wafer, substrate, or other component of an electrical package using a complaint mold such that the terminal ends of the solder material being deposited, i.e., the ends opposite to those forming an attachment to the wafer, substrate, or other component of an electrical package are coplanar with one another. A complaint mold is used having one or more conduits for receiving solder material and having a compliant side and a planar side. The compliant side of the mold is positioned adjacent to the wafer, substrate, or other component of an electrical package allowing solder material to be deposited onto the surface thereof such that the planar side of the compliant mold provides coplanar interconnectors. An Injection Molded Solder (IMS) head can be used as the means for filling the conduits of the compliant mold of the present invention.

Abstract: A method for preparing an electroconductive patterned copper layer, comprising mixing copper-based particles with a reducing agent, and then adding a solvent thereto to prepare a reducing agent-containing copper-based particle dispersion solution; printing on or filling in the reducing agent-containing copper-based particle dispersion solution a substrate in a predetermined shape to form a reducing agent-containing copper-based particle patterned layer; and firing the reducing agent-containing copper-based particle patterned layer in the air, which allows forming a patterned copper layer with excellent electric conductivity even in the air, thereby being industrially very useful.

Abstract: Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.

Abstract: Pitch multiplied and non-pitch multiplied features of an integrated circuit, e.g., features in the array, interface and periphery areas of the integrated circuit, are formed by processing a substrate through a mask. The mask is formed by patterning a photoresist layer which simultaneously defines mask elements corresponding to features in the array, interface and periphery areas of the integrated circuit. The pattern is transferred to an amorphous carbon layer. Sidewall spacers are formed on the sidewalls of the patterned amorphous carbon layer. A layer of protective material is deposited and then patterned to expose mask elements in the array region and in selected parts of the interface or periphery areas. Amorphous carbon in the array region or other exposed parts is removed, thereby leaving a pattern including free-standing, pitch multiplied spacers in the array region.

Abstract: The present invention is a method of disposing selectively on a surface of a substrate a first substance having a hydrophilic surface and a second substance having a surface coated with a hydrocarbon group. The substrate has on the surface thereof a hydrophilic first region, a second region coated with a hydrocarbon group, and a third region coated with a fluorocarbon group.

Abstract: A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E), wherein the resin (C) has a glass transition temperature of ?50° C. to 20° C., a sum of amounts of the resin (C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sum of amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10 to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). An electric wiring in which this conductive paste is formed on an insulating substrate.

Abstract: A low cost flexible substrate is described which comprises a thin metal foil and a layer of solder mask. The metal foil layer is patterned to create tracks and lands for solder bonding and/or wirebonding and the layer of solder mask is patterned to create openings for solder bonding, wirebonding and/or for mounting the die. The substrate may be used as a package substrate to create a packaged die or may be used as a replacement for more expensive flexible printed circuit boards.

Abstract: In jet printable compositions that include nano metal powders in a liquid carrier.

Abstract: An LTCC substrate structure with at least one contact element for connecting a wire conductor, which has a first metallization (20) arranged on and/or in the ceramic substrate for electrical connection to the wire conductor, wherein the first metallization (20) preferably contains silver or a silver alloy. To avoid via posting or a plating process, a diffusion barrier layer covering the first metallization or metal layer, which diffusion barrier layer (22) covering the first metallization (20), which diffusion barrier layer is produced with a locally acting application method, and a second metal layer (24) arranged on the diffusion barrier layer (22) are provided, wherein the second metal layer (24) preferably contains gold and/or platinum and/or an alloy that has at least one of these elements. The invention also discloses a production method for an LTCC substrate structure of this type.

Abstract: Methods involve a combination of polyelectrolyte multilayer (PEM) coating or silane self assembly on a substrate; microcontact printing; and conductive graphite particles, especially size controlled highly conductive exfoliated graphite nanoplatelets. The conductive graphite particles are coated with a charged polymer such as sulfonated polystyrene. The graphite particles are patterned using microcontact printing and intact pattern transfer on a substrate that has an oppositely-charged surface. The method allows for conductive organic patterning on both flat and curved surfaces and can be used in microelectronic device fabrication.

Abstract: Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

Abstract: The present invention relates to a reducing agent for low temperature reducing and sintering of copper nanoparticles and a method for low temperature sintering using the same. The reducing agent includes formic acid or acetic acid and C1 to C3 alcohol or ether which allows reducing and sintering at a low temperature of less than 250° C. The sintered copper nanoparticles provide excellent electrical properties and are suitable for forming fine wirings patterns.

Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

Abstract: An electronic component manufacturing method including: a step of mounting a bump formation material on a first wiring substrate 100 to melt the bump formation material to form a bump 200 at the wiring substrate 100; a step of pressing a jig onto the bump 200 to form a recessed portion 220 having a front end portion 202; a step of printing a solder paste 420 onto an electrode 410 of a second wiring substrate 400; a step of performing, on the solder paste 420, positional alignment of the bump 200 on the wiring substrate 100 to allow the front end portion 202 to be in contact with the bump; and a step of heating the wiring substrate 400 on which the wiring substrate 100 is mounted, wherein the recessed portion 220 is formed from the bump front end portion 202 toward an outer periphery 230 in contact with the solder paste 420.

Abstract: A method of making a component for use in a touch sensor includes modifying a substrate having disposed on it a plurality of electrically isolated conductors. Subsets of the conductors are electrically coupled to form composite electrodes. The component can be used as a set of electrodes in a customized touch sensor.

Abstract: A method of printing chipless RFID tags with unique features, includes printing a RFID antenna pattern precursor using a first printing process, wherein the RFID antenna pattern precursor includes a plurality of disconnected wire segments; and printing a conductive ink using a second print process to interconnect at least two of the plurality of disconnected wire segments, to produce a final RFID antenna with a unique antenna geometry.

Abstract: Methods and arrangements are described for forming an array of contacts for use in packaging one or more integrated circuit devices. In particular, various methods are described for forming contacts having thicknesses less than approximately 10 ?m, and in particular embodiments, between 0.5 to 2 ?m.

Abstract: A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.

Abstract: There is provided a method for producing a silver powder having excellent dispersibility and capable of forming a paste which do not form suspended matters by phase separation and which is printed on a substrate to form a film having a uniform thickness. In this method, an alkali or a complexing agent is added to an aqueous silver salt containing solution to form a silver oxide containing slurry or an aqueous silver complex salt containing solution. After or before silver particles are deposited by reduction by adding a reducing agent to the silver oxide containing slurry or aqueous silver complex salt containing solution while stirring it, at least one chelating agent selected from the group consisting of compounds having an azole structure, dicarboxylic acids, hydroxy carboxylic acids and salts thereof is added to a silver power containing slurry solution as a dispersing agent.

Abstract: An aqueous printable electrical conductor (APEC) is defined as a dispersion comprising metal powder (with specific surface properties) dispersed into an aqueous acrylic, styrene/acrylic, urethane/acrylic, natural polymers vehicle (gelatine, soy protein, casein, starch or similar) or in a film forming reactive fatty acids mixture without a binder resin. The aqueous printable dispersion can be applied to substrates through different printing processes such as flexography, gravure, screen, dry offset or others. Exemplary substrates include: (1) coated paper, (2) uncoated paper, and (3) a variety of plastics with treated and untreated surfaces. When printed at a thickness of 1-8 ?m, heating to cure is not required as the dispersion cures at ambient temperatures.

Abstract: A process is disclosed for manufacturing a thick-film circuit such as a hybrid circuit on a titanium or titanium-alloy substrate. The process includes firing a glassy dielectric layer upon at least one surface of the substrate. A thick-film circuit including a titanium or titanium-alloy substrate is also disclosed.

Abstract: A method for forming a wiring pattern in which a plurality of electrical wirings deposited onto a substrate is conductively connected with each other through a plurality of conductive posts, the method including relatively moving a discharge head having a plurality of nozzles and a substrate in a predetermined direction while discharging droplets from predetermined nozzles among the plural nozzles to form the plural conductive posts, wherein, in the orthogonal direction of the above-referenced predetermined direction, the interval among the plural nozzles “a” and the interval among the plural conductive posts “b” satisfy an equation “b=m×a” (“m” may be any positive integer).

Abstract: A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.

Abstract: The invention is directed to a method by exposing at least a portion of a luminescent coating disposed on a surface of an article to ultraviolet light at one or more preselected wavelengths causing said luminescent coating to exhibit a luminescence spectrum, the luminescence spectrum exhibiting a plurality of intensity peaks that have been priorly determined to create a standard; determining the intensity of at least two peaks in the luminescence spectrum of the coating; determining a peak intensity ratio of the at least two peaks; comparing the peak intensity ratio determined with the standard; and, classifying the article according to whether or not the peak intensity ratio does or does not match the standard; wherein the luminescent coating comprises a particulate luminescent composition comprising a rare earth doped fluoride represented by the formula RExA1?xF2+x?2yOy wherein RE represents a three-valent rare-earth element, A is alkaline earth, 0.002?x?0.20, and 0?y?x.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: Disclosed is an electrically conductive feature on a substrate, and methods and compositions for forming the same, wherein the electrically conductive feature includes metallic anisotropic nanostructures and is formed by injetting onto the substrate a coating solution containing the conductive anisotropic nanostructures.

Abstract: A method for moving high aspect ratio molecular structures (HARMS), which method comprises applying a force upon a dispersion comprising one or more bundled and individual HARM-structures, wherein the force moves the bundled and/or the individual HARM-structure based on one or more physical features and/or properties for substantially separating the bundled and individual HARM-structures from each other.