Abstract: A process for manufacturing a mask having submillimetric openings, in which: for a masking layer, a first solution of colloidal nanoparticles in a first solvent is deposited, the particles having a given glass transition temperature Tg, the drying of the masking layer, known as the first masking layer, is carried out at a temperature below said temperature Tg until a mask having a two-dimensional network of substantially straight-edged submillimetric openings, that defines a mask zone known as a network mask zone is obtained, a solid mask zone is formed by a liquid deposition, on the face, of a second masking zone, the solid mask zone being adjacent to and in contact with the network mask zone, and/or at least one cover zone is formed, the cover zone being in contact with the network mask zone, and/or after the drying of the first masking layer, a filled mask zone is formed by filling, via a liquid route, openings of a portion of the network mask zone.

Abstract: A ceramic compact is provided having a patterned conductor is obtained by coating the patterned conductor with a slurry and then hardening the slurry. The slurry is prepared by mixing a thermosetting resin precursor, a ceramic powder, and a medium. In the ceramic compact, an isocyanate- or isothiocyanate-containing gelling agent and a hydroxyl-containing polymer are reacted and hardened to produce a thermosetting resin. The hydroxyl-containing polymer is preferably a butyral resin, an ethylcellulose-based resin, a polyethyleneglycol-based resin, or a polyether-based resin.

Abstract: A composition that may be an electronic circuit element includes a metal nanoparticle, a silicone modified polyacrylate compound and a solvent. The silicone modified polyacrylate compound may be a silicone modified polyacrylate compound with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, a silicone modified polyacrylate compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100° C. to about 200° C.

Abstract: [Object] A composition of a metal nanoparticle is provided in which reproducibility in a method of producing a metal film with excellent low-temperature sinterable properties is improved. An article using the metal nanoparticle composition is also provided. [Solving Means] A composition of a metal nanoparticle that has a secondary aggregation diameter (median diameter) of 2.0 ?m or less as determined by disk centrifugal-type particle size measurement is used.

Abstract: A liquid material drawing method includes: performing a first discharging step in which at least one of the droplets the liquid material is discharged from at least one of a plurality of nozzles for each of a plurality of pixel regions; observing and capturing an image of the pixel regions on a workpiece in which the droplets are discharged; computing a distance in a first direction and a distance in an orthogonal second direction between barrier parts on the workpiece and a landing position of the at least one of the droplets in the image of the pixel regions; and correcting arrangement information including a relative positioning of the nozzles and the workpiece, which is used to arrange a prescribed number of the droplets as dots for each of the pixel regions, based on the distance in the first direction and the distance in the second direction.

Abstract: An apparatus for processing a substrate includes a gas-atmosphere applying unit for applying gas atmosphere to the substrate, and a light-exposure unit for exposing the substrate to light through a lower surface of the substrate.

Abstract: A method for coating a workpiece by cold gas spraying is carried out using a cold gas spray nozzle which generates a particle jet that is directed onto the surface. Additional energy is introduced into the layer that is being formed by way of an electromagnetic energy source, e.g. a laser, which the energy introduced into the particles by the cold gas spray nozzle also contributes to forming the layer. The cold spraying process can be used flexibly as a result of the additional activation by way of electromagnetic radiation. Moreover, layers having a complicated structure, e.g. strip conductors, can be created with the aid of the laser without further processing. A coating unit includes a generator for electromagnetic radiation in addition to the cold gas spray nozzle and is therefore suitable for carrying out the novel method.

Abstract: Methods and apparatus for drying ceramic green bodies include providing one or more ceramic green bodies in a microwave heating chamber operatively connected to a microwave source and a PLC. The total mass of the ceramic green bodies present in the microwave heating chamber is determined. Microwave energy is generated with the microwave source and transmitted from the microwave source to the microwave heating chamber. A transmitted power of the microwave energy transmitted from the microwave source to the microwave heating chamber is measured with power sensors. The reflected power of reflected microwave energy reflected back from the microwave heating chamber is also measured. The power of the microwave energy transmitted from the microwave source to the microwave heating chamber is adjusted based on the total mass of ceramic green bodies present in the microwave heating chamber, the measured transmitted power and the measured reflected power.

Abstract: An atomic-layer-deposition process for forming a patterned thin film comprising providing a substrate, applying a deposition inhibitor material to the substrate, wherein the deposition inhibitor material is an organosiloxane compound; and patterning the deposition inhibitor material either after or simultaneously with or introducing applying the deposition inhibitor material to provide selected areas of the substrate effectively not having the deposition inhibitor material. The thin film is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.

Abstract: A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation Ra of the profile of the surface of the organic membrane where the metal wire is formed is not less than 60 nm and not more than 5×10?2D, where D is the width of the metal wire. The contact angle with respect to water on the surface of the organic membrane where the metal wire is formed is not less than 110°.

Abstract: A substrate including a die side interconnect pattern having a first solder mask thickness, and a board side interconnect pattern having a second solder mask thickness, where the second thickness is greater than the first thickness. Fabrication process using dry film solder mask can apply a first laminate thickness forming a die side solder mask, and a second laminate thickness forming a board side solder mask; the second thickness being greater than the first thickness. Fabrication process using a liquid solder resist can apply a first number of passes of solder resist forming a die side solder mask, and a second number of passes of solder resist forming a board side solder mask, where the board side thickness is greater than the die side thickness.

Abstract: A processes for manufacturing actuating assembly for tuning a circuit by forming a carrier substrate containing a membrane, a conductive layer, and piezoelectric actuators are disclosed.

Abstract: Liquid compositions contain electrically conductive particles and are printable. Following printing onto substrates, liquid compositions can be solidified to produce polymeric positive temperature coefficient materials. Polymeric thermoplastic positive temperature coefficient materials produced from such compositions. Processes include printing liquid compositions containing electrically conductive particles; and solidifying the liquid compositions to form polymeric positive temperature coefficient materials.

Abstract: A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.

Abstract: An electroconductive composition including a mixture of a copper powder having an averaged particle size between 0.3 and 20 ?m and a copper fine powder having an averaged particle size between 1 and 50 nm; a solvent comprising a multivalent alcohol, such as ethylene glycol or diethylene glycol, having two or more OH groups; and an additive comprising a compound such as malic acid or citric acid having two or more COOH groups and one or more OH groups where the number of COOH groups is equal to or greater than the number of OH groups.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

Abstract: The invention provides a method of patterning flowable material on a surface. The method comprises providing the surface with at least one channel and at least one deposition region connected to the at least one channel, the width of the channel being less than the width of the deposition region, and depositing flowable material in the deposition region such that when the material makes contact with the channel the material is directed into said channel by capillary forces, the receding contact angle of the flowable material in the deposition region being less than 30°.

Abstract: A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet.

Abstract: Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Abstract: The present invention is directed to systems, devices and methods for identifying biopolymers, such as strands of DNA, as they pass through a constriction such as a carbon nanotube nanopore. More particularly, the invention is directed to such systems, devices and methods in which a newly translocated portion of the biopolymer forms a temporary electrical circuit between the nanotube nanopore and a second electrode, which may also be a nanotube. Further, the invention is directed to such systems, devices and methods in which the constriction is provided with a functionalized unit which, together with a newly translocated portion of the biopolymer, forms a temporary electrical circuit that can be used to characterize that portion of the biopolymer.

Abstract: A flex circuit having conductive traces formed on only one side of a base film for attaching to both sides of a DITO touch sensor panel is disclosed. By having conductive traces formed on only one side of the base film, the number of process steps and fabrication cost can be reduced because only a single etching step is needed. Furthermore, because the flex circuit is thinner, the resultant space savings can be utilized for other features in a device without enlarging the overall device package.

Abstract: A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers.

Abstract: A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask (410) such that the first electrically conductive layer has a masked portion and an unmasked portion, forming a second electrically conductive layer (710, 1210), the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer, and removing the mask and the masked portion of the first electrically conductive layer. In an embodiment, the mask covering sections of the first electrically conductive layer is a non-electrically conductive substance (1010) applied with a stamp (1020). In an embodiment, the mask is a black oxide layer.

Abstract: A ceramic wiring board comprises a ceramic substrate and a copper layer formed on the ceramic substrate. The average copper grain radius in the copper layer is approximately equal to or larger than 10 ?m.

Abstract: A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder covered conductors. In one embodiment, the solder may be applied in molten form by immersing the substrate within a bath of the solder while in another the solder may be deposited using a screening procedure.

Abstract: A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that, when the substrate sheet and the underlay substrate are overlapped with each other, overlap with end blank regions of the substrate sheet, of the underlay substrate. In addition, the through holes are formed at equal spacing in portions excluding the end blank corresponding regions in a blank corresponding region, which overlaps with a blank region of the substrate sheet, of the underlay substrate.

Abstract: A method for forming an electrode for a battery includes the step of forming a porous layer on the surface of an electrode hoop formed at its surface with a mixture layer containing an active material. The porous layer is formed in the following manner: A gravure roll is rotated oppositely to the direction of movement of the electrode hoop while being allowed to abut against the surface of the moving electrode hoop, thereby applying a coating fluid serving as a precursor of the porous layer to the surface of the electrode hoop. A plurality of grooves formed in the circumferential surface of the gravure roll extend in parallel in oblique directions against the rotation direction of the gravure roll from the central line of the circumferential surface to the outer edges of the circumferential surface so as to be arranged in a symmetrical manner relative to the central line.

Abstract: Disclosed are conductive polymer inks and methods for forming the inks. The disclosed inks include a dispersion of conductive core/shell nanoparticles. The core/shell nanoparticles include a polymeric core and a shell formed of a conducting polymer. The inks can include a dispersion of the core/shell nanoparticles in a liquid carrier, such as an alcohol. The disclosed inks can be formulated to high viscosities and can be utilized in high-speed printing processes including rotogravure and flexographic printing processes. Products encompassed by the disclosure include polymer devices such as sensors, OFETs, RFID tags, printed circuit board, electrochromic devices, non-volatile memory devices, photovoltaics, and the like.

Abstract: A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.

Abstract: A conductive ink including metal ions, a functional solvent, and a capping agent, a method of preparing a metal wiring using the conductive ink, and a printed circuit board including the metal wiring.

Abstract: In one embodiment, an electronic device comprises a substrate, a plurality of circuit traces on a substrate, wherein at least a subset of the plurality of circuit traces comprise at least one tab trace. A plurality of the tab traces are excised from the substrate, and at least one electronic component is positioned proximate at least one tab trace on the substrate. The electrical component comprises at least one electrical contact on an upper surface of the component. The tab trace is lifted and inverted to establish an electrical connection between an electrically conductive portion of the tab trace and an electrical contact on an upper surface of the at least one electronic component.

Abstract: A method is provided which includes forming a metal layer and converting at least a portion of the metal layer to a hydrated metal oxide layer. Another method is provided which includes selectively depositing a dielectric layer upon another dielectric layer and selectively depositing a metal layer adjacent to the dielectric layer. Consequently, a microelectronic topography is formed which includes a metal feature and an adjacent dielectric portion comprising lower and upper layers of hydrophilic and hydrophobic material, respectively. A topography including a metal feature having a single layer with at least four elements lining a lower surface and sidewalls of the metal feature is also provided herein. The fluid/s used to form such a single layer may be analyzed by test equipment configured to measure the concentration of all four elements. In some cases, the composition of the fluid/s may be adjusted based upon the analysis.

Abstract: A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate.

Abstract: A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and the interfacial metallic layer. A conductive carbon line or plug is formed in the amorphous carbon or carbon-based insulating layer electrically connected with the interfacial metallic layer. An interconnect structure is also described, including a substrate, a patterned interfacial metallic layer on the substrate, an amorphous carbon insulating layer or a carbon-based insulating layer on the substrate, and a conductive carbon line or plug disposed in the amorphous carbon or carbon-based insulating layer and electrically connected with the interfacial metallic layer.

Abstract: Disclosed is a paste pattern formation method comprising the steps of: forming a transfer pattern material on a film base material to prepare a transfer film; sticking the transfer film on a substrate on which a transfer pattern is formed so that the transfer pattern material contacts the substrate; separating the film base material from the transfer pattern material; filling a paste into the transfer pattern depression; solidifying the paste; and removing the transfer pattern material.

Abstract: A “vertical” coffee-stain method for producing self-organized line structures and other very fine features that involves disposing a target structure in a solution made up of a fine particle solute dispersed in a liquid solvent such that a “waterline” is formed by the upper (liquid/air) surface of the solution on a targeted linear surface region of the substrate. The solvent is then caused to evaporate at a predetermined rate such that a portion of the solute forms a self-organized “coffee-stain” line structure on the straight-line portion of the substrate surface contacted by the receding waterline. The substrate and staining solution are selected such that the liquid solvent has a stronger attraction to the substrate surface than to itself to produce the required pinning and upward curving waterline. The target structure is optionally periodically raised to generate parallel lines that are subsequently processed to form, e.g., TFTs for large-area electronic devices.

Abstract: The invention provides a method for applying a material onto a substrate using a droplet printing technique wherein a gas stream is released into the direction of a substrate, which gas stream comprises a carrier gas and droplets of a suspension of the material or droplets of a solution of a precursor of the material or droplets of a precursor of the material as such, whereby the droplets in the gas stream are first maintained in a steady flow and subsequently in a converging flow before the droplets are contacted with the substrate. The invention further provides an apparatus for carrying out said method.

Abstract: The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process forms interconnect wires on a thermal decomposable adhesive, and after positioning the wires at proper bond pad locations, releases the interconnect wires onto the bond pads.

Abstract: A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that, when the substrate sheet and the underlay substrate are overlapped with each other, overlap with end blank regions of the substrate sheet, of the underlay substrate. In addition, the through holes are formed at equal spacing in portions excluding the end blank corresponding regions in a blank corresponding region, which overlaps with a blank region of the substrate sheet, of the underlay substrate.

Abstract: [PROBLEMS] To provide a method for forming a high-definition electroconductive thin line free from blurring at low cost. [MEANS FOR SOLVING PROBLEMS] A resin film having a hardness of 20 to 70, as measured by a type A measuring method specified in JIS K 6253, is formed on a surface of a resin base material. A thin line pattern is formed on the resin film using an electroconductive paste by intaglio printing or stencil printing or using an electroless plating catalyst ink by intaglio printing or stencil printing. Subsequently, a metal film is formed on the thin line pattern by plating to form an electroconductive thin line.

Abstract: A method of controlling both alignment and registration (lateral position) of lamellae formed from self-assembly of block copolymers, the method comprising the steps of obtaining a substrate having an energetically neutral surface layer comprising a first topographic “phase pinning” pattern and a second topographic “guiding” pattern; obtaining a self-assembling di-block copolymer; coating the self-assembling di-block copolymer on the energetically neutral surface to obtain a coated substrate; and annealing the coated substrate to obtain micro-domains of the di-block copolymer.

Abstract: Patterning and direct writing of nanoparticle inks formulated to provide conductive lines upon annealing. Patterning methods include stamp and tip based methods including microcontact printing and DPN printing. Ink viscosity, metal content, and density can be controlled to provide good results. Low temperature of annealing can be used to generate volume resistivities comparable to bulk resistivity. Long lines can be drawn. Addressable patterning can be achieved.

Abstract: The present invention concerns the field of nanoparticle bioconjugates which form an i-motif or an i-motif related structure (compositions) without or with at least one further nucleic acid binding compound. The i-motif base pairs can be charged or non-charged. Their assembly can be controlled by the pH value or temperature. At least one of these nucleic acid binding compounds has to be attached at least to a nanoparticle. The methods provide compositions used for DNA driven programmable nanoparticle assemblies, electronic circuits, diagnostic detection tools, biosensors, memory storage devices, diagnostic devices for biomolecule sequencing and detection, drug delivery, application in tumour diagnostics and treatment, nanomachines, nanofabrication, nanocatalysis, nanoarrays, and nanoscaled enzyme reactors.

Abstract: Provided is a transparent conductive film exhibiting high conductivity together with excellent transparency, and also exhibiting film strength tolerant to a washing treatment and a pattern forming treatment while maintaining conduction to an electronic device layer formed on an transparent conductive layer. Also disclosed is a method of manufacturing a transparent conductive film possessing a transparent substrate and provided thereon, a transparent conductive layer containing a metal nanowire, possessing the steps of forming a layer containing a crosslinking agent on the substrate, coating a coating solution containing a metal nanowire onto the layer containing the crosslinking agent, drying the coating solution, and conducting a treatment by which the crosslinking agent is reacted.

Abstract: There is provided a bump printing apparatus and a method of controlling the same that can increase the printability of solder bumps being printed on a board. The bump printing apparatus may include a printing table onto which a board is mounted; a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation; and air nozzles provided within the printing table and providing air suction to bring the board into close contact with the printing table and spraying air to separate the mask from the board.

Abstract: A dispensing apparatus includes a frame, a support coupled to the frame to receive electronic substrates, a first dispensing unit to dispense viscous material, a second dispensing unit to dispense viscous material, and a gantry coupled to the frame. The gantry includes a first Z drive mechanism to support the first dispensing unit and lower the first dispensing unit toward a first electronic substrate pattern when performing a dispense operation, and a second Z drive mechanism to support the second dispensing unit and lower the second dispensing unit toward a second electronic substrate pattern when performing a dispense operation. The second Z drive mechanism may be adjusted relative to the first Z drive mechanism a predetermined distance. A controller controls a dispense operation of the first dispensing unit on the first electronic substrate pattern and a dispense operation of the second dispensing unit on the second electronic substrate pattern.

Abstract: The apparatus forms an electric circuit on a construction member of a machine based on a set of three-dimensional data. The data defines a position and a profile of the construction member, a position of the electric circuit, and a shape of the electric circuit. The electric circuit is used for electrical connection between electric instruments mounted on the machine. The data is associated with a reference coordinate system provided in the machine, and the data includes coordinates of points for determining arrangement of the electric circuit, a distance between any two of the points adjacent to each other, and a cross-sectional area of the electric circuit associated extended between the two points.

Abstract: A method is provided which includes dispensing a deposition solution at a plurality of locations extending different distances from a center of a microelectronic topography each at different moments in time during an electroless plating process. An electroless plating apparatus used for the method includes a substrate holder, a moveable dispense arm, and a storage medium comprising program instructions executable by a processor for positioning the moveable dispense arm. Another method and accompanying electroless deposition chamber are configured to introduce a gas into an electroless plating chamber above a plate which is suspended above a microelectronic topography and distribute the gas to regions extending above one or more discrete portions of the microelectronic topography.

Abstract: A method is provided which includes dispensing a deposition solution at a plurality of locations extending different distances from a center of a microelectronic topography each at different moments in time during an electroless plating process. An electroless plating apparatus used for the method includes a substrate holder, a movable dispense arm, and a storage medium comprising program instructions executable by a processor for positioning the movable dispense arm. Another method and accompanying electroless deposition chamber are configured to introduce a gas into an electroless plating chamber above a plate which is suspended above a microelectronic topography and distribute the gas to regions extending above one or more discrete portions of the microelectronic topography.

Abstract: The present invention relates to a method to fabricate a flip chip substrate structure, which comprises: providing a carrier; forming a patterned resist layer on the surface of the carrier; forming sequentially a first metal layer, an etching-stop layer, and a second metal layer; removing the resist layer, forming a patterned first solder mask, and then forming at least one first circuit build up structure thereon; forming additionally a patterned second solder mask on the circuit build up structure; respectively removing the carrier, the first metal layer, and the etching-stop layer; and forming solder bumps on both sides of the circuit build up structure. The method increases integration and achieves the purpose of miniaturization. The method solves the problem of circuit layer multiplicity and process complexity.