Abstract: A method for depositing a powder metal onto a surface of the substrate and a substrate with conductive elements provided on a surface of the substrate are disclosed. The conductive elements are formed by cold spray depositing at least one layer of powder metal onto the surface of the substrate to form at least one conductive element on the surface of the article.

Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 ?m or less and the maximum particle diameter of which is 15 ?m or less.

Abstract: A method for fabricating an acoustic resonator comprises providing a substrate; fabricating a first electrode adjacent the substrate; fabricating a piezoelectric layer adjacent the first electrode; depositing electrode material to form a second electrode up to a first thickness adjacent the piezoelectric layer; depositing a first photo mask over the second electrode; depositing additional electrode material to form the second electrode up to a second thickness; removing the photo mask thereby forming a recessed region in the second electrode; and filling the recessed region with a fill material.

Abstract: The invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising: (a) providing an aqueous suspension of a metal salt; (b) pre-reducing the metal salt suspension by a water soluble polymer capable of metal reduction to form a metal nuclei; and (c) adding a chemical reducer to form metal nanoparticles in dispersion. The invention further relates to aqueous-based dispersions of metal nanoparticles, and to compositions such as ink comprising such dispersions.

Abstract: An LED wiring board includes an insulator layer, a conductor layer (a wiring pattern layer) formed on the insulator layer, and a white reflective film which is formed on the insulator layer and which includes a white colorant and a binder thereof. The conductor layer includes a first wiring pattern and a second wiring pattern, and the white reflective film has a portion which is between the first wiring pattern and the second wiring pattern and which is thinner than both of the first wiring pattern and the second wiring pattern.

Abstract: A patterned substrate for a touch screen sensor assembly that includes a plurality of electrodes that are formed from a first transparent conductive layer that has a first surface resistivity. The substrate also has a plurality of traces that may be used to couple the electrodes controller associated with the touch screen sensor assembly. The traces are formed from a second conductive layer that has a second surface resistivity that is less than the surface resistivity of the first conductive layer. The first and second conductive layers may be formed from indium tin oxide (ITO) having different surface resistivities. A second, similarly configured substrate can be provided and may be spaced apart from the first substrate by a dielectric spacer.

Abstract: A method of aligning nanotubes is described, where a plurality of channels is provided on a substrate (100), a suspension of nanotubes is placed on or adjacent an open surface of the channels (102) and the suspension is allowed to flow into the channels to align the nanotubes substantially parallel to the longitudinal axis of the channels (104).

Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.

Abstract: A mask film, where squeegee cleaning part has been formed at a predetermined position, and another mask film are attached to both sides of a substrate. A through-hole is formed by using a laser, and conductive paste is filled into the through-hole by using a squeezing method. As discussed above, a paste-residue can be prevented on the through-hole, so that a circuit board having high quality of connection can be obtained.

Abstract: The pattern defect repairing apparatus comprises an application head, a waste ejection board, a waste ejection vessel, a waste ejection board moving stage, a head lifting stage, and an application unit base. The application head comprises an ink-jet head and a head holder. An ink jet head has an ejection nozzle, and is attached to the head holder and able to be moved up and down by the head lifting stage. The waste ejection vessel is provided to the waste ejection board and able to be moved between a waste ejection position and a retreated position by the waste ejection board moving stage. Repairing material is ejected for waste onto the waste ejection board set in the vicinity of the nozzle immediately before application to repair the defect. The tip end of the nozzle is prevented from being dried.

Abstract: The present invention relates to a reducing agent for low temperature reducing and sintering of copper nanoparticles and a method for low temperature sintering using the same. The reducing agent includes formic acid or acetic acid and C1 to C3 alcohol or ether which allows reducing and sintering at a low temperature of less than 250° C. The sintered copper nanoparticles provide excellent electrical properties and are suitable for forming fine wirings patterns.

Abstract: A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).

Abstract: To improve the transmission properties of antennae manufactured with known methods, more specifically antennae for application in the UHF range, a method is proposed of producing pattern-forming metal structures on a carrier substrate. The method comprises the following method steps: providing the carrier substrate, forming the pattern on the carrier substrate with a composite material containing dispersed metal, bringing the carrier substrate into contact with halide ions, and thereafter depositing a metal layer onto the pattern formed by the composite material, producing thereby metal structures.

Abstract: Electronic storage devices include one or more substrates, storage circuitry configured to store electronic data and communication circuitry configured to receive the electronic data from a programming device and provide the electronic data to the storage circuitry. The storage circuitry and communication circuitry are embedded in and are in direct physical contact with the one or more substrates. Programming methods include providing an electronic storage device comprising storage circuitry configured to store electronic data and communication circuitry configured to receive the electronic data and provide the electronic data to the storage circuitry, the storage circuitry and communication circuitry being embedded in two or more substrates. The methods also include communicating the electronic data to the communication circuitry and storing the electronic data in the storage circuitry.

Abstract: A fabrication method is capable of creating canonical metamaterial structures arrayed in a three-dimensional geometry. The method uses a membrane suspended over a cavity with predefined pattern as a directional evaporation mask. Metallic and/or dielectric material can be evaporated at high vacuum through the patterned membrane to deposit resonator structures on the interior walls of the cavity, thereby providing a unit cell of micron-scale dimension. The method can produce volumetric metamaterial structures comprising layers of such unit cells of resonator structures.

Abstract: Printable compositions comprising: (a) 5 to 40 parts by weight of silver nanoparticles having a maximum effective diameter of 150 nm, as determined by laser correlation spectroscopy; (b) 50 to 99.5 parts by weight of water; (c) 0.01 to 15 parts by weight of a dispersing agent; (d) 0.5 to 5 parts by weight of a film former; and (g) 30 to 70 parts by weight of metal particles having a maximum effective diameter of 10 ?m, as determined by laser correlation spectroscopy; wherein the printable composition has a viscosity of at least 1 Pa·s; processes for producing electrically conductive coatings using such compositions and electrically conductive coatings prepared thereby.

Abstract: Method of fabricating a circuit board are generally disclosed.

Abstract: Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing.

Abstract: Methods for forming interconnect or interconnections on a substrate for use in a microelectric device are disclosed. In one or more embodiments, the method includes depositing an alloy layer comprising Cu and an alloying element, for, example, Mn, in a dielectric layer and segregating or diffusing the alloying element from the bulk Cu portion of the alloy layer. In one or more embodiments, the method includes annealing the alloy layer in an atomic hydrogen atmosphere. After annealing, the alloy layer exhibits a resistivity that is substantially equivalent to the resistivity of a pure Cu layer.

Abstract: Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment.

Abstract: A surface treatment process for a circuit board is provided. The circuit board includes a substrate, a first circuit layer disposed on an upper surface of the substrate, and a second circuit layer disposed on a lower surface of the substrate. The first circuit layer is electrically connected to the second circuit layer. In the surface treatment process for the circuit board, a first oxidation protection layer and a second oxidation protection layer are respectively formed on a portion of the first circuit layer and a portion of the second circuit layer by immersion. Afterwards, the first circuit layer exposed by the first oxidation protection layer is subjected to black oxidation to form a black oxide layer. The thickness of the first oxidation protection layer is thinner than or equal to the thickness of the black oxide layer.

Abstract: A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature.

Abstract: A cartridge block for screening a multilayer ceramic with a conductive paste includes a threaded paste cartridge attachment located at a top of the cartridge block, the threaded paste cartridge attachment being configured to receive a paste cartridge containing the conductive paste; a paste routing section, the paste routing section located underneath the threaded paste cartridge attachment, the paste routing section comprising a flared section located at a bottom of the cartridge block, the paste routing section being configured to receive the conductive paste from the threaded paste cartridge attachment and route the paste through the flared section.

Abstract: An electroconductive element includes a substrate having a first wavy surface and a second wavy surface, and an electroconductive layer formed on the first wavy surface, wherein the electroconductive layer forms an electroconductive pattern, and the first wavy surface and the second wavy surface satisfy the following relationship: 0?(Am1/?m1)<(Am2/?m2)?1.8. Am1 is a mean amplitude of vibrations of the first wavy surface, Am2 is a mean amplitude of vibrations of the second wavy surface, ?m1 is a mean wavelength of the first wavy surface, and ?m2 is a mean wavelength of the second wavy surface.

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract: A method for partially metallizing a product comprising a first surface, a first polymer material, and a second surface, a second polymer material, wherein the method comprises the sequential steps of exposing the first and second surfaces to conditions which render the first surface hydrophilic, and the second surface hydrophobic; contacting the first and second surfaces with water or aqueous solution; contacting the first and second surfaces with a solution of a film former in a water-immiscible solvent; evaporating the solvent to allow formation of a film by the film former on the second surface; adherence of a film by the film former on the first surface is prevented by the presence of the water or aqueous solution thereupon; performing a conventional metallization process to deposit a metal layer on the first and second surface; and removing the metallized film from the second surface to render the first surface metallized.

Abstract: A conductive ink composition comprising organic-stabilized silver nanoparticles and a solvent, and a polyvinyl alcohol derivative resin of Formula (1) wherein R1 is a chemical bond or a divalent hydrocarbon linkage having from about 1 to about 20 carbons; R2 and R3 are independently an alkyl, an aromatic or substituted aromatic group having from about 1 to about 20 carbon atoms; x, y and z represent the proportion of the corresponding repeat units respectively expressed as a weight percent, wherein each repeat unit is randomly distributed along polymer chain, and the sum of x, y and z is about 100 weight percent, and wherein the polyvinyl alcohol derivative resin is present in an amount of from 0.1 to about 5 weight percent of the ink composition.

Abstract: A conductive circuit containing a polymer composite, which contains at least one polymer and a modified graphite oxide material, containing thermally exfoliated graphite oxide having a surface area of from about 300 m2/g to 2600 m2/g, and a method of making the same.

Abstract: A manufacturing method of conductive circuits of a touch panel includes the following steps: providing a substrate with a conductive area thereon; providing at least one hard coating layer on the conductive area of the substrate; forming a plurality of grooves on the hard coating layer; forming a metal layer on the hard coating layer and in the grooves; and heating the metal layer so as to condense the metallic materials thereof in the grooves due to surface tension, thus forming a plurality of conductive circuits.

Abstract: A wiring material contains copper, nitrogen, and a dopant which is more readily oxidized than copper in an Ellingham diagram, the dopant being added to the wiring material at a rate of not less than 0.5 at. % and not more than 10 at. %.

Abstract: A method of patterning a substrate comprising a plurality of fields, including, inter alia, positioning a first volume of fluid on a first subset of the plurality of fields of the substrate, with the first volume of fluid being subjected to a first evaporation time; positioning a second volume of fluid on a second subset of the plurality of fields of the substrate, differing from the first subset, with the second volume of fluid being subjected to a second evaporation time, differing from the first evaporation time; and patterning the first and second subsets of the plurality of fields, with the first subset of the plurality of fields being patterned prior to the second subset of the plurality of fields being patterned, with a volume associated with the second subset of the plurality of fields being greater than a volume associated with the first subset of the plurality of fields to compensate for the second evaporation time being greater than the first evaporation time.

Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.

Abstract: The invention is directed to a paste composition used for forming an electrode or wiring, wherein it comprises a) a conductive powder; b) a cellulose binder; c) an acrylate monomer; d) a radical polymerization initiator; and e) a solvent, and it is curable at a low temperature when compared to the prior paste compositions and it has excellent hardness, electrical resistivity and stability so that it can be usefully used for forming an electrode or wiring for a solar cell, RFID (Radio Frequency Identification) or PCB (Printed Circuit Board).

Abstract: A method of forming a non-volatile resistive oxide memory array includes forming a plurality of one of conductive word lines or conductive bit lines over a substrate. Metal oxide-comprising material is formed over the plurality of said one of the word lines or bit lines. A series of elongated trenches is provided over the plurality of said one of the word lines or bit lines. A plurality of self-assembled block copolymer lines is formed within individual of the trenches in registered alignment with and between the trench sidewalls. A plurality of the other of conductive word lines or conductive bit lines is provided from said plurality of self-assembled block copolymer lines to form individually programmable junctions comprising said metal oxide-comprising material where the word lines and bit lines cross one another.

Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Abstract: A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 ?m and not more than 1.0 ?m.

Abstract: A method for fabricating a touch sensor panel is disclosed. The method includes providing a substrate for the touch sensor panel, depositing a conductive material layer on a top surface of the substrate, depositing a metal layer on top of the conductive material layer, affixing a resist to a first area of the metal layer, the resist also adapted to serve as a passivation layer during passivation, removing metal from the metal layer outside of the first area; and performing passivation on the substrate while leaving the affixed resist intact.

Abstract: The invention relates generally to a printing process. In particular, the invention relates to a printing process where a first-printed feature or vanishing trace causes a second-printed feature to have a smaller dimension than it would in the absence of the first-printed feature or vanishing trace.

Abstract: A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface of the screen plate, so that the conductive paste is applied onto the conductive pads through the openings. A recess that is inwardly bent is formed in each of the openings of the screen plate.

Abstract: Disclosed herein are a transparent conductive film for a touch panel and a method for manufacturing the same. A transparent conductive film 100 for a touch panel according to the present invention includes a transparent substrate 110: a plurality of silver nanowires 120 formed on the transparent substrate 110 to be parallel with each other in one direction; and a transparent electrode 130 formed on the transparent substrate to apply the silver nanowires 120, whereby the silver nanowires 120 are formed in one direction of the transparent electrode 130 having the relatively higher surface resistance to make the surface resistance constant in all directions of the transparent conductive film 100 for the touch panel, thereby making it possible to increase touch sensitivity when a touch panel is manufactured.

Abstract: Disclosed examples of electrode structures and methods of manufacture thereof may provide one or more advantages relating to enhanced conductivity, for example, while providing optically clear conductors.

Abstract: Methods of forming metal oxide structures and methods of forming metal oxide patterns on a substrate using a block copolymer system formulated for self-assembly. The metal oxide structures and patterns may be used, for example, as a mask for sublithographic patterning during various stages of semiconductor device fabrication. A block copolymer at least within a trench in the substrate and including at least one soluble block and at least one insoluble block may be annealed to form a self-assembled pattern including a plurality of repeating units of the at least one soluble block laterally aligned with the trench and positioned within a matrix of the at least one insoluble block. The self-assembled pattern may be exposed to a metal oxide precursor that impregnates the at least one soluble block. The metal oxide precursor may be oxidized to form a metal oxide. The self-assembled pattern may be removed to form a pattern of metal oxide lines on the substrate surface.

Abstract: A mask, through which a plurality of slender through-holes are formed, has a reinforcing section which is formed to span the through-holes, wherein recesses are provided at portions of the reinforcing section to cover the through-holes. Accordingly, a metal, which is subjected to the sputtering, easily makes the detour around the reinforcing section. Therefore, a metal film is easily formed even on portions shadowed by the reinforcing section. It is possible to accurately form a fine wiring pattern.

Abstract: The present invention provides a metal ink composition, which includes 20 to 80 parts by weight of cupper nano-particle; 10 to 70 parts by weight of non-aqueous organic solvent; and 2 to 20 parts by weight of additive used for adjustment of the dry speed of coated metal ink when metal lines are formed.

Abstract: Provided is a method for manufacturing a metal film, including: coating or printing a metal ink containing an organic metal complex on a substrate; and necessrily parallel-performing a pressure process during a procedure of forming metal particles by firing the metal ink, thereby forming a conductive metal film. The present invention can provide a method for manufacturing a metal film capable of improving film characteristics such as conductivity, reflectance, and uniformity in thickness, and the like, as well as remarkably shortening the time for forming the metal film, thereby efficiently manufacturing a superior-quality metal film.

Abstract: A touch display device includes a display panel, a conductive layer disposed on the display panel, a touch electrode disposed adjacent to the conductive layer and on the display panel, a routing line coupled to the touch electrode, and a polarizer disposed on the touch electrode and the conductive layer, where the conductive layer and the touch electrode are formed of the same material.

Abstract: The present invention provides method for creating point to point metallic contact and bridges between two structures at the nanoscale. Embodiment methods permit for the formation of individual and arrays of silver-gallium nanostructures bridges by mobilizing a gallium microdroplet and bringing in contact with silver coated surface. The invention also describes an example instrument for formation of individual and multiple nanostructure bridges at selective location and orientation. Example structures including multiple nanostructure bridges on the top of each other, suspended nanostructure sensors and actuators, nanowire bonded that provides electrical contacts between nanostructures (e.g. carbon nanotube, Graphene, nanowires) and microelectronic circuits are enabled by this invention.

Abstract: A method for placing material onto a target board by means of a transfer board comprising a plurality of blind holes, the method comprising the steps of immersing the transfer board in a material bath, wherein a first pressure acts on the material bath and a second pressure acts in the blind holes, and wherein the first pressure and the second pressure are substantially equal; generating a pressure difference between the first pressure and the second pressure, so that the blind holes of the transfer board are filled at least partially with the liquid material; extracting the transfer board from the material bath; and positioning the transfer board opposite to the target board, the material being expelled from the blind holes, such that the material touches the target board.

Abstract: A method for printing a conductive trace on a plastic panel comprising: locating a nozzle proximate to a surface of a panel; moving the nozzle relative to the surface of the panel; sensing the surface of the panel relative to the height of the nozzle off of the panel; determining the speed at which the nozzle is being moved across the surface of the panel; adjusting at least one of the height of the nozzle relative to the surface of the panel and a flow rate of conductive ink out of the nozzle; and dispensing a conductive ink from the nozzle onto the surface of the panel to form the conductive trace. The conductive trace is formed with a predetermined width.

Abstract: Stretchable multi-chip modules (SMCMs) are capable of withstanding large mechanical deformations and conforming to curved surfaces. These SMCMs may find their utilities in elastic consumer electronics such as elastic displays, skin-like electronic sensors, etc. In particular, stretchable neural implants provide improved performances as to cause less mechanical stress and thus fewer traumas to surrounding soft tissues. Such SMCMs usually comprise of various electronic components attached to or embedded in a polydimethylsiloxane (PDMS) substrate and wired through stretchable interconnects. However, reliably and compactly connecting the electronic components to PDMS-based stretchable interconnects is very challenging. This invention describes an integrated method for high-density interconnection of electronic components through stretchable interconnects in an SMCM. This invention has applications in high-density SMCMs, as well as high-density stretchable/conformable neural interfaces.