Abstract: A thermal transfer ink ribbon includes a backcoat layer, a ribbon base layer formed on the backcoat layer, a release layer formed on the ribbon base layer and containing resin and wax, an ink layer formed on the release layer and containing a first resin and a second resin, an aluminum layer formed on the ink layer, and an adhesive layer formed on the aluminum layer and containing resin and wax. The first resin is transparent or translucent and contains at least one of polyester resin, styrene-acrylic resin, and polyethylene resin. The second resin is transparent or translucent and contains at least one of polyurethane resin, polypropylene resin, acrylic resin, and methacrylic resin.

Abstract: Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain polyamines and the top coat contains hydrophobic alky organic compounds.

Abstract: A stamp that is configured to be employed in a printed circuit process, a method of fabricating the stamp, and a printed circuit process are provided, and the stamp includes a main structure, a micro-protrusion structure, and a plurality of nano-conical structures. The micro-protrusion structure is located on the main structure. The nano-conical structures are located on the main structure and surround the micro-protrusion structure.

Abstract: Disclosed herein is a semiconductor device that includes a semiconductor die and a substrate having a first surface and a second surface. The semiconductor die is attached to the second surface. The substrate includes a layer of insulative material and at least a portion of an embedded conductive circuit in the layer of insulative material. The substrate includes an etched layer of a conductive material attached to the portion of the conductive circuit, the etched layer of the conductive material located on the first surface of the substrate.

Abstract: A flexible touch panel includes a flexible substrate bent in a first direction, and a touch sensor unit disposed on the flexible substrate, the touch sensor unit including a bridge extending in a second direction intersecting the first direction.

Abstract: In a linear conductor forming step, a wide portion having a relatively large line width and a narrow portion having a relatively small line width are formed in each of a plurality of linear conductors. In addition, in a multilayer board, in base material layers adjacent to each other in a stacking direction, the wide portion overlaps the narrow portion on the adjacent base material layer, and end portions of the wide portions at both sides of the narrow portion in a line width direction, in a planar view. The wide portions are disposed such that the end portions thereof overlap each other in the stacking direction and resistance of a fluid thermoplastic resin increases. The narrow portion is located between the wide portions in the stacking direction.

Abstract: A touch sensor device including a first conductive pattern disposed on a substrate and a first polymer layer disposed on the first conductive pattern. The first polymer layer includes a first conductive region and a first non-conductive region. The touch sensor device also includes a second polymer layer disposed on the first polymer layer. The second polymer layer includes a second conductive region and a second non-conductive region.

Abstract: In a method of controlled laser deformation, a substrate is provided that is transparent to the laser energy. At least a portion of the substrate is coated with a release layer that absorbs the laser energy. A component to be deformed is attached to the release layer opposed to the substrate. A source of laser energy is directed through the substrate and into a portion of the release layer, which vaporizes the portion of the release layer by absorption of the laser energy, and releases a portion of the component from the substrate. This deforms the portion of the component away from the substrate by the vaporization of the release layer such that at least one edge of the component is no longer in contact with the release layer or substrate, and leaving a second portion of the component still attached to non-vaporized release layer.

Abstract: An electronic device such as a cover for a portable device may be provided with a body having hinge portions. The hinge portions may allow the body to bend about one or more bend axes. The cover may have electrical components such as a keyboard. A keyboard may be mounted at one end of the cover and a connector may be mounted at an opposing end of the cover. A flexible fabric signal path structure may be formed from metal traces on a flexible fabric substrate. At one end of the cover, the flexible fabric signal path structure may be coupled to a printed circuit in the keyboard using conductive adhesive. At the opposing end of the cover, the metal traces on the flexible fabric substrate may be coupled to the connector.

Abstract: An aircraft fuselage includes at least one space arranged in the aircraft fuselage and at least one wall. The wall resists burnthrough for a period of at least four minutes from outside the aircraft fuselage towards the space, wherein the region of the aircraft fuselage underneath the space does not include burnthrough-resistant insulation. The space may be a cargo compartment of the aircraft or a passenger cabin, while the wall may be designed as a cargo compartment floor, passenger cabin floor or wing/fuselage fairing (belly fairing). The design of the aircraft fuselage results in burnthrough resistance that meets the requirements of FAR §25.856 (b) without any additional burnthrough-resistant insulation in the aircraft fuselage.

Abstract: Light-emitting devices and displays with improved performance are disclosed. A light-emitting device includes an emissive material disposed between a first electrode, and a second electrode. Various embodiments include a device having a peak external quantum efficiency of at least about 2.2%; a device that emits light having a CIE color coordinate of x greater than 0.63; a device having an external quantum efficiency of at least about 2.2 percent when measured at a current density of 5 mA/cm2. Also disclosed is a light-emitting device comprising a plurality of semiconductor nanocrystals capable of emitting red light upon excitation, wherein the device has a peak luminescent efficiency of at least about 1.5 lumens per watt. Also disclosed is a light-emitting device comprising a plurality of semiconductor nanocrystals capable of emitting red light upon excitation, wherein the device has a luminescent efficiency of at least about 1.

Abstract: Provided herein is a method for forming a transparent electrode film for display and the transparent electrode film for display, the method comprising forming an electrode pattern by printing a fine electrode pattern on a release film using a conductive ink composition; forming an insulating layer by applying an insulating resin on the release film on which the electrode pattern has been formed; forming a substrate layer by laminating a substrate on the insulating layer; and removing the release film.

Abstract: In the present invention, there is provided a plasma processing apparatus including a vacuum processing chamber for applying a plasma processing to a sample, a sample stage deployed inside the vacuum processing chamber for mounting the sample thereon, induction antennas provided outside the vacuum processing chamber, a radio-frequency power supply for supplying a radio-frequency power to the induction antennas, and a Faraday shield which is capacitively coupled with the plasma, a radio-frequency voltage being applied to the Faraday shield from the radio-frequency power supply via a matching box, wherein the matching box includes a series LC circuit including a variable capacitor and an inductor, a motor control unit for controlling a motor for the variable capacitor, and a radio-frequency voltage detection unit for detecting the radio-frequency voltage applied to the Faraday shield, the matching box executing a feedback control over the radio-frequency voltage applied to the Faraday shield.

Abstract: Using a broadband light source and a photomask, surface energy gradients can be directly transferred into polymer films. The Marangoni effect causes high surface energy regions to rise upon heating the film. This leads to the formation of three-dimensional topography that can be locked in by quenching the polymer by cooling.

Abstract: Improved stretchable printed circuit boards, and fabrication methods thereof, are described. The improved stretchable printed circuit boards include a serpentine conductive trace enclosed by stretchable dielectric material. The stretchable dielectric material has a serpentine shape itself, realized by crenulated edges. The crenulated edges reduce torsional strain on the conductive trace and are formed, for example, by cutting away sections of the stretchable dielectric material proximate segments of the serpentine conductive trace where the serpentine conductive trace changes direction.

Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.

Abstract: To be provided is a metal paste from which an electrode having high electrode activity as a sensor electrode of various gas sensors can be produced. The present invention is a metal paste for forming a gas sensor electrode obtained by dispersing a conductive particle including Pt or a Pt alloy and a ceramic powder including zirconia or stabilized zirconia, or any of zirconia and stabilized zirconia and one or more oxides of La, Ce, Pr, Nd, Sm, and Hf in a solvent, the metal paste further including an inorganic oxide particle containing alumina and an insoluble particle that is insoluble in the solvent, in which 0.5 or more to 3.0 mass % or less of the inorganic oxide particle and 1.0 to 5.0 mass % of the insoluble particle are dispersed based on the mass of the solid content of the conductive particle, the ceramic powder, the inorganic oxide particle, and the insoluble particle.

Abstract: The present invention relates to a test socket that is disposed between a blood test device and a test apparatus to electrically connect a terminal of the blood test device and a pad of the test apparatus with each other. Conduction units that are arranged at positions corresponding to the terminal of the blood test device and show conductivity in a thickness direction have: conduction units that are arranged in such a manner that multiple conductive particles are arranged in the thickness direction in an elastic insulating material; and an insulating support unit that supports and insulates each of the conduction units. The conductive particles are provided with through-holes bored through one surface and another surface other than the one surface, and the through-holes are filled with the elastic insulating material.

Abstract: A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.

Abstract: When decoating a glass panel (3), a decoating tool (6) with a circular-cylindrical grinding element (8) is used, which element is set to rotate around its axis. In the end face of the grinding element (8) that is used when the active face (9) is decoated, a hole (10) and at least one radial groove (11) are provided. The decoating tool (6) is placed at a spot (A) on the glass panel (3) in a movement (arrow 13) that is oriented at an acute angle to the plane of the glass panel (3), which lies between the ends (B) and (C) of the strip-shaped decoating area (14) and moves first to the one end (B) (arrow 15) and then to the other end (C) (arrow 16) in order to strip coating from the glass panel (3) in the decoating area (14).

Abstract: A case for an electronic device includes an injection preform having a recess on at least one portion of a surface thereof, a deposition layer deposited on a surface of the injection preform, and a paint layer formed on the deposition layer. The deposition layer may directly contact a surface of the injection preform. A method of manufacturing a case includes injection-molding an injection preform having a recess on a surface thereof, forming a deposition layer directly contacting a surface of the injection preform, and forming a paint layer on the deposition layer.

Abstract: The present application discloses a conductive layer in a semiconductor apparatus, comprising a metal sub-layer and an anti-reflective coating over the metal sub-layer for reducing light reflection on the metal sub-layer; wherein the anti-reflective coating comprises a light absorption sub-layer on the metal sub-layer for reducing light reflection by absorption and a light destructive interference sub-layer on a side of the light absorption layer distal to the metal sub-layer for reducing light reflection by destructive interference; and the metal sub-layer is made of a material comprising M1, wherein M1 is a single metal or a combination of metals; the light absorption sub-layer is made of a material comprising M2OaNb, wherein M2 is a single metal or a combination of metals, a>0, and b?0; the light destructive interference sub-layer is made of a material comprising M3Oc, wherein M3 is a single metal or a combination of metals, and c>0; the light absorption sub-layer has a refractive index larger than t

Abstract: A method for using a carbon nanotube film supporting structure includes: providing a carbon nanotube film structure and a carbon nanotube film supporting structure, the carbon nanotube film supporting structure comprises a substrate and a plurality of protruding structures, the substrate having a surface defining a support region, the plurality of protruding structures distributed on support region, a ratio of a sum of a plurality of surface areas, defined by the top of the plurality of protruding structures, to an area of the support region, is less than or equal to 20%; and placing the carbon nanotube film structure on the support region of the carbon nanotube film supporting structure.

Abstract: A resonant tunneling diode, and other one dimensional electronic, photonic structures, and electromechanical MEMS devices, are formed as a heterostructure in a nanowhisker by forming length segments of the whisker with different materials having different band gaps.

Abstract: The invention relates to the technical field of smart cards with displays. Such a card comprises, embedded in a transparent core, a multi-component module supporting the display. The card comprises: at least one layer of ink printed on the surface of the transparent core, except in a zone facing the display, said at least one layer being opaque in at least one region; and a transparent film covering the at least one ink layer. The card is characterized in that the at least one layer is formed by a first opaque ink layer printed on the surface of the transparent core, except in a zone facing the display and a second ink layer forming a graphic design allowing customization printed on the first ink layer.

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

Abstract: A method for manufacturing a semiconductor device is disclosed. The method includes generating a thermo-mechanical stress within a plurality of layers of a wafer, and after generating the thermo-mechanical stress, testing an interfacial strength level associated with one or more of the plurality of layers.

Abstract: A carbon nanotube film supporting structure is provided. The carbon nanotube film supporting structure is used for supporting a carbon nanotube film structure. The carbon nanotube film supporting structure includes a substrate and a number of protruding structures. The substrate has a surface defining a support region. The protruding structures are distributed on the support region. The carbon nanotube film structure can be peeled off completely after being in contact with the carbon nanotube film supporting structure.

Abstract: A carbon nanotube sheet includes a plurality of carbon nanotubes including a first constriction portion in one end side, and a resin portion filled between the plurality of carbon nanotubes. Each of the plurality of carbon nanotubes is bent at the first constriction portion to a lateral direction in the resin portion.

Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from any one of the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.

Abstract: The disclosure provides an ultrahigh-voltage (UHV) semiconductor structure including a first electrical portion, a second electrical portion and a bridged conductive layer. In which, the first electrical portion and the second electrical portion are isolated, and directly connected to each other through the bridged conductive layer. Thus, there is no current leakage occurring in the UHV semiconductor structure disclosed in this disclosure. And a method for manufacturing the UHV semiconductor structure also provides herein.

Abstract: The invention relates to two-component polyurethane compositions that are especially suitable for use as structural adhesives. Said compositions are constituted of a polyol component K1 and a polyisocyanate component K2, the polyol component K1 comprising at least one alkoxylated aromatic diol A1 and at least one aliphatic triol A2 and the polyisocyanate component K2 comprising at least one polyisocyanate B1.

Abstract: An epoxy resin composition [composition (C)] comprising: (i) from 30 to 90% by weight of at least one epoxy compound [compound E], based on the total weight of the composition (C); (ii) from 0 to 60% by weight of at least one curing agent [agent C], based on the total weight of the composition (C); (iii) from 0 to 15% by weight of at least one accelerator, based on the total weight of the composition (C); (iv) from 1 to 60% by weight of at least one poly(aryl ether sulfone) (I) [PAES (I-1)], based on the total weight of the composition (C) and wherein said PAES (I-1) polymer comprises amine functional groups in an amount equal to or more than 200 ?eq/g; (v) from 1 to 60% by weight of at least one poly(aryl ether sulfone) (I) [PAES (I-2)], based on the total weight of the composition (C), and wherein said PAES (I-2) polymer is different from the PAES (I-1) polymer.

Abstract: A method of manufacturing a semiconductor device that includes: preparing a pair of substrates that respectively include a device structure on one primary surface or another primary surface thereof; stacking the substrates so that said one primary surfaces face each other, exposing said another surfaces to the outside, and fixing entire peripheral outer edges of the substrates that have been stacked to each other; and thereafter, plating said exposed another primary surfaces of the stacked and fixed substrates.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

Abstract: A method for decorating a given part is designed to print designs onto a coat layer deteriorating the coat layer on the surface of the given part. In the coat layer-forming process, in spreading the metallic-coating material containing aluminum flake onto the surface of the resin compact, the coat layer is formed on the surface of it. In a laser-printing process, a laser is irradiated on the condition of being able to maintain the same state of the coat layer before and after irradiating the laser, so as to reduce the aspect ratio of the micronized-metallic powder, which is the average value of the ratio of the maximum dimension of the micronized-metallic powder to the average value of the minimum dimension of the micronized-metallic powder, which laser irradiation eventually thermally deforms the first scale-shaped micronized-metallic powder into a spherical shape in the coat layer to print designs on the film.

Abstract: It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 ?m, and a diameter of the through hole is 20 to 100 ?m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 ?m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 ?m.

Abstract: In a Surface-Enhanced Raman Scattering (SERS) substrate and the manufacturing method thereof, the SERS substrate includes a low thermal conductivity base and a plurality of metal nanoparticles (NPs). The surface of the low thermal conductivity substrate has a first surface, and the first surface has a plurality of ripple micro/nano structures. The plurality of metal NPs are non-continuously densely arranged on the ripple micro/nano structures of the first surface. The metal NPs have a height difference along the ripple micro/nano structures, and form a 3D electric field enhanced region. The manufacturing methods includes sputtering a metal nano-thin film on a surface of a low thermal conductivity base, and the surface of the low thermal conductivity base has a plurality of ripple micro/nano structures; using laser to ablate the metal nano-thin film; and forming a plurality of metal NPs, which are non-continuously densely arranged.

Abstract: A method for producing a printed wiring board which is capable of forming an insulating layer having a surface with low roughness and high adhesion strength to a conductive layer and of achieving an excellent performance in removal of smear, involves the following steps (A) to (F) in this order: (A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which includes a support and a resin composition layer in contact with the support so that the resin composition layer is in contact with the internal layer circuit substrate; (B) thermally curing the resin composition layer of the resin sheet with a support to form an insulating layer; (C) perforating the insulating layer to form a via hole; (D) performing a desmear treatment; (E) peeling the support; and (F) forming a conductive layer on a surface of the insulating layer.

Abstract: The present invention relates to an acoustic lysis system including a disposable cartridge that can be reversibly coupled to a platform having a small, high-frequency piezoelectric transducer array. In particular, the system releases viable DNA, RNA, and proteins from human or bacterial cells, without chemicals or additional processing, to enable high-speed sample preparation for clinical point-of-care medical diagnostics and use with nano/microfluidic cartridges. Also described herein are methods of making and using the system of the invention.

Abstract: A method and system for increasing the performance of an automotive plate antenna system are provided. A carbon loaded material is used to enhance performance of the plate antenna. The method and resulting systems have a first metallic plate of the antenna arranged and secured on a planar surface of the carbon loaded material. The method realizes an antenna system with reduced size and weight without a reduction in performance.

Abstract: A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner conductive layer and has multiple conductive pillars, wherein each of the first conductive pillar is located on the corresponding first pad. The first dielectric layer covers the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer, and has multiple first concaves, wherein the first concave exposes the top and side of the corresponding first conductive pillar. A semiconductor package structure applied the above circuit substrate and a process for fabricating the same are also provided here.

Abstract: Methods of forming a curable pre-impregnated composite precursor material with radiation (e.g., actinic or electron-beam) curable resin composition systems are provided, as are the curable pre-impregnated composite precursor materials themselves. The resin systems have reversible temperature-viscosity control, which are advantageously used to form curable pre-impregnated composite precursor materials (pre-preg) that can be cured to form a composite article. The uncured resin composition comprises: (a) an acrylate or a methacrylate monomer; (b) an oligomer species selected from the group consisting of: polyethers, polyesters, epoxies, and combinations thereof; and (c) a photoinitiator. The uncured resin has a first viscosity at 21° C. (70° F.) of ?about 200,000 centipoise (cP) and a second viscosity of ?about 5,000 cP at 65° C. (149° F.) or above.

Abstract: An interior rearview mirror system and assembly includes a variable reflectivity reflective element and a video display screen disposed behind the reflective element and operable to display images viewable through the reflective element by a person viewing the interior rearview mirror assembly when it is normally mounted in a vehicle. The video display screen may be operable to brighten or enhance the intensity of images displayed by the video display screen responsive to a dimming condition of the variable reflectivity reflective element. The mirror system may include an image sensor and a decoder that decodes an output signal of the image sensor. The decoder has a microprocessor operable to control the video display screen, such that the captured image data are processed and images are displayed via operation of a common microprocessor. A compass chip may connect to a vehicle wire harness that extends from a vehicle headliner.

Abstract: A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.

Abstract: A multilayer inductor device in which parasitic inductance is made smaller while preventing increase in a mounting area of the device and complexity of a wiring pattern, and a manufacturing method of the stated multilayer inductor device. An outer electrode and a terminal electrode are connected to each other through a via hole. A side surface of a non-magnetic member forms a part of an end surface of the device, while the other side surface thereof being in contact with the via hole. A side surface of the via hole that makes contact with the non-magnetic member is opened, which prevents the parasitic inductance from being increased. The via hole being provided in an arbitrary position makes it possible to prevent the wiring pattern from being complicated and a mounting area of the device from being increased.

Abstract: A manufacturing method of multilayer wiring is provided, wherein a multilayer wiring structure including a wiring layer and a conductive via is formed on a substrate. The wiring layer is formed by forming a patterned colloidal layer having a first catalyzer on the substrate, activating the first catalyzer, and forming a conductive layer on a surface of the patterned colloidal layer. The conductive via is formed by forming an insulation colloidal layer containing a second catalyzer on the substrate and the conductive layer and forming at least one opening in the colloidal insulation layer by laser to expose the conductive layer and activate a portion of the second catalyzer. Electroless plating is performed on the activated second catalyzer to form the conductive via in the opening. An interface is between the patterned colloidal layer and the conductive layer in the multilayer wiring structure.

Abstract: An article of manufacture includes a substrate and a stretchable, conductive film. The stretchable, conductive film includes a plurality of annealed silver nanoparticles disposed on the substrate. The conductive film can be formed from a liquid composition comprising silver nanoparticles in a decalin solvent. The conductive film can further include a first conductivity associated with an as-annealed shape of the conductive film, and the film can include a second conductivity upon being stretched in at least one direction beyond the as-annealed shape.

Abstract: A test probe is provided for probing signal information on a back-drilled plated through hole connector formed in a printed circuit board, where the test probe includes a conductive probe body with a distal tip region extending a predetermined minimum coverage length (LTIP) that is longer than a recess depth dimension (DPL) for a recessed plating layer formed in the back-drilled plated through hole connector with an elastomer test probe tip formed around the distal tip region and having a total tip width (WTIP) which is compressed when inserted into the recessed plating layer formed in a back-drilled plated through hole connector, thereby establishing a conductive path between the conductive probe body and the recessed plating layer.

Abstract: A mounting-completed core parent substrate in which surface mount devices are mounted on both principal surfaces of the core parent substrate including a plurality of the core individual substrates and having a through hole formed in each core individual substrate so as to extend therethrough is formed. Then, resin layers in a partially cured state are formed on both the principal surfaces of the core parent substrate and the resin layers on both the principal surfaces are joined through the through holes so that the resin layers on both principal surfaces of each core individual substrate are joined and integrated to each other at a predetermined region, each core individual substrate being obtained by dividing the core parent substrate. After that, the resin layers are subjected to main curing. Thereafter, the core parent substrate is divided at a predetermined position and separated into the core individual substrates.