Abstract: A multilayer ceramic substrate that includes a surface layer portion positioned on an internal layer portion, and a surface layer electrode on a surface of the surface layer portion. The surface layer portion includes a first layer next to the internal layer portion, and the internal layer portion includes a second layer next to the first layer. The thermal expansion coefficient of the first layer is lower than the thermal expansion coefficient of the second layer. The first layer and the second layer each contain glass containing 40 weight % to 65 weight % of MO, where MO is at least one selected from CaO, MgO, SrO, and/or BaO); 35 weight % to 60 weight % of alumina, and 1 weight % to 10 weight % of at least one metal oxide selected from CuO and/or Ag2O.

Abstract: A textile fabric containing a first electrically conductive thread and a second electrically conductive thread is disclosed. In one aspect, the first electrically conductive thread and the second electrically conductive thread cross at a first crossover point, wherein the textile fabric further contains an electrical connector establishing an electrical connection between the first electrically conductive thread and the second electrically conductive thread. The electrical connector contains a first contact pad in electrical contact with the first electrically conductive thread, a second contact pad in electrical contact with the second electrically conductive thread, and a first stretchable electrical interconnection connecting the first contact pad with the second contact pad. The first contact pad and the second contact pad are provided at a location different from the location of the first crossover point.

Abstract: A resin composition contains an epoxy resin, and a curing agent including a first acid anhydride and a second acid anhydride. An unsaturated bond concentration in the second acid anhydride is not higher than 0.7%. The unsaturated bond concentration is represented by following formula (1). The ratio of the number of acid anhydride equivalents of the first acid anhydride to the number of epoxy equivalents of the epoxy resin is between 0.05 and 0.5 (inclusive). The ratio of the total number of acid anhydride equivalents of the first acid anhydride and the second acid anhydride to the number of epoxy equivalents is between 0.5 and 1.1 (inclusive).

Abstract: A flexible touch sensing unit may include a substrate including an active touch region and an inactive region surrounding the active touch region, a plurality of first sensing electrodes disposed on the active touch region and extending along a first direction, a plurality of second sensing electrodes disposed on the active touch region and extending along a second direction, and a plurality of sensing lines disposed on the inactive region and electrically connected to the first sensing electrodes and the second sensing electrodes. Each of the sensing lines may include a first metal layer, a first conductive layer disposed on the first metal layer, and a second metal layer disposed on the first conductive layer. Each of the first sensing electrodes may include a third metal layer, and each of the second sensing electrodes may include a fourth metal layer. The first conductive layer may include a self-assembled monolayer.

Abstract: Provided is a conductive film for a touch panel including: an insulating substrate including a pair of surfaces facing each other; a detection electrode pattern portion which is formed of thin metal wires formed on at least one surface of the pair of surfaces of the insulating substrate; a wiring portion which is disposed on the same surface as the surface of the insulating substrate where the detection electrode pattern portion is formed, and includes a plurality of lead-out wirings formed of metal which are connected to the detection electrode pattern portion; and a shielding electrode formed of metal which is disposed on a surface on a side opposite to the surface of the insulating substrate where the wiring portion is disposed and at a position corresponding to the wiring portion, in which the shielding electrode includes a mesh-like pattern portion which is formed of metal wires respectively intersecting with the lead-out wirings of the wiring portion and has an opening ratio equal to or greater than 80%

Abstract: The present disclosure relates to a method for manufacturing a conductivity sensor, including a conductive conductivity sensor, including method steps of producing a thermoplastic sensor body of a plastic, which is doped at least partially with a laser activatable, metal compound as an additive, radiating the sensor body at doped locations by means of a laser, so that conductive metal nuclei form from the metal compound, immersing the sensor body in a metal bath, until at least one conductive trace forms on the region having the metal nuclei, where the at least one conductive trace serves as an electrode of the conductivity sensor.

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.

Abstract: A vertical light-emitting diode device and a method of fabricating the same are provided. The device may include a conductive substrate serving as a p electrode, a p-type GaN layer provided on the conductive substrate, an active layer provided on the p-type GaN layer, an n-type GaN layer provided on the active layer, an n electrode pattern provided on the n-type GaN layer, a metal oxide structure filling a plurality of holes formed in the n-type GaN layer, and a seed layer provided on bottom surfaces of the holes and used to as a seed in a crystal growth process of the metal oxide structure.

Abstract: In a power machine tool which has an electronically commutated drive motor that has a motor shaft and to which a stator core is assigned that s provided at least sectionally with an insulating body at one axial end, with a printed circuit board being disposed in the area of the insulating body and being provided with at least one rotational-direction sensor and at least one temperature sensor as well as a contact element for the electrical contacting of the at least one rotational-direction sensor and the at least one temperature sensor, the printed circuit board is aligned at least sectionally parallel to the motor shaft, and is disposed on the insulating body in such a way that the at least one rotational-direction sensor faces the motor shaft.

Abstract: Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa·s/° C. is 200° C. to 250° C.

Abstract: Methods for fabricating a lateral voltage variable capacitor are disclosed. The voltage variable capacitor utilizes a dielectric material with an electric field dependent dielectric permittivity (dielectric constant). Various process steps are used including planarization to fabricate the lateral device structure.

Abstract: The present disclosure relates to a data storage device housing component (and related data storage devices) that include a polymeric element attached to a surface thereof. The polymeric element includes a polymeric matrix and a plurality of nanofiller elements dispersed within the polymeric matrix to increase the thermal conductivity of the polymeric element as compared to a polymeric element that does not include the plurality of nanofiller elements. Also disclosed are related methods.

Abstract: A hybrid device package comprising a baseplate, a balanced composite structure (BCS) on the baseplate, a first IC on the BCS, and at least one additional IC physically coupled to the first IC. The coefficient of thermal expansion (CTE) for the stack formed from the BCS and the first IC is arranged to be approximately equal to that of the baseplate, thereby reducing the thermal stress to which the at least one additional IC is subjected when cooled to its operating temperature which might otherwise result in physical damage to the IC. The baseplate is preferably an alumina ceramic baseplate. In one embodiment, the first IC is a readout IC (ROIC), the at least one additional IC is a detector array IC which is on the ROIC, and the hybrid device package is a focal plane array (FPA).

Abstract: An electronic device may include a first flexible layer. The first flexible layer may include a first flexible substrate. The first flexible layer may include a first conductive layer. The first conductive layer may be coupled to the first flexible substrate. The electronic device may include a second flexible layer. The second flexible layer may be coupled to the first flexible layer. The second flexible layer may be coupled to the first flexible layer at a first distance. The second flexible layer may include a second flexible substrate. The second flexible layer may include a second conductive layer. The second conductive layer may be coupled to the second flexible substrate. The electronic device may include an elastomer foundation. The first flexible layer may include anchoring sites. The anchoring sites may be coupled to the elastomer foundation at a plurality of anchoring points.

Abstract: Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material containing Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together.

Abstract: A method of assembling a power module includes placing a first plurality of cells adjacent to one another to form a first cell layer. A flexible circuit layer is positioned above the first cell layer, the flexible circuit being electrically conductive. A second plurality of cells is positioned adjacent to one another to form a second cell layer aligned with the first cell layer such that the flexible circuit layer is sandwiched between the first cell layer and the second cell layer. The flexible circuit layer is folded along each of a plurality of axes of rotation such that each one of the first plurality of cells faces another one of the second plurality of cells. Each of the first plurality of cells and the second plurality of cells has respective first and second tabs (extending from their respective short ends) which are welded to the flexible circuit layer.

Abstract: The present invention relates to a multilayer electronic component which includes an element body where a plurality of internal electrode layers and dielectric layers are alternately laminated. Insulating layers are disposed on at least one side surface of the element body. The insulating layers contain a glass composition and a ceramic composition. The internal electrode layers contain a metal M and the ceramic composition contains an oxide of the metal M.

Abstract: A nanowire device includes a first component formed on a substrate and a second component disposed apart from the first component on the substrate. A nanowire is configured to connect the first component to the second component. An anchor pad is formed along a span of the nanowire and configured to support the nanowire along the span to prevent sagging.

Abstract: A flame simulating assembly including a light source, a screen having a translucent region which subjects light from the light source transmitted therethrough to diffusion and a transparent region, and a flicker element for intermittently reflecting the light from the light source toward the screen, to provide images of flames in a predetermined portion thereof. The screen includes a fringe region positioned between the translucent region and the transparent region. The fringe region includes a number of diffusing areas for diffusing the light from the light source and a number of transparent areas positioned between the diffusing areas, to at least partially provide images of flames in the diffusing areas.

Abstract: A multilayer ceramic substrate that includes a laminated structure including a surface layer portion located on a surface of the laminated structure and an inner layer portion located on the inner side of the laminated structure, the surface layer portion including a first layer adjacent to the inner layer portion, the inner layer portion including a second layer adjacent to the first layer. The thermal expansion coefficient of the first layer is lower than the thermal expansion coefficient of the second layer, a first glass contained in the first layer and a second glass contained in the second layer each contain 40% or more by weight MO (where M represents at least one selected from the group consisting of Ca, Mg, Sr, and Ba), and the difference in softening points between the first glass and the second glass is 60° C. or lower.

Abstract: A process for producing a modified polyphenylene ether resin having a purity of more than 99.4%, comprising steps of graft modification, water rinse, and extraction as well as phase splitting, is disclosed that step of separating out powder during purification is no needed, and the solvent for use in performing dissolving of or/and extraction of polyphenylene ether resin can be recycled for future use, so that the manufacturing process is simple and uses less solvent as compared to the prior art, and further helps to conserve resources and is environmentally friendly.

Abstract: A solid state image sensor includes a semiconductor substrate where photoelectric conversion regions for converting light into charges are arranged per pixel planarly arranged; an organic photoelectric conversion film laminated at a light irradiated side of the semiconductor substrate via an insulation film and formed at the regions where the pixels are formed; a lower electrode formed at and in contact with the organic photoelectric conversion film at a semiconductor substrate side; a first upper electrode laminated at a light irradiated side of the organic photoelectric conversion film and formed such that ends of the first upper electrode are substantially conform with ends of the organic photoelectric conversion film when the solid state image sensor is planarly viewed; and a film stress suppressor for suppressing an effect of a film stress on the organic photoelectric conversion film, the film stress being generated on the first upper electrode.

Abstract: The present invention is related to a polymer resin composition capable of providing an insulating material having a low dielectric constant and excellent mechanical properties, a polyimide resin film obtained by using the polymer resin composition, a preparation method of a polyimide resin film, and a circuit board and a metal laminate including the polyimide resin film.

Abstract: Light-emitting devices and displays with improved performance are disclosed. A light-emitting device includes a first electrode including an anode opposite a second electrode including a cathode, a hole injection layer adjacent the first electrode, a hole transporting layer disposed on the hole injection layer, and an emissive layer of inorganic semiconductor nanocrystals disposed between the hole transporting layer and the second electrode. The inorganic semiconductor nanocrystals comprising a plurality of semiconductor nanocrystals capable of emitting light upon excitation.

Abstract: A pixel structure in a pixel for used in a display panel has a plurality of grooves made on a substrate and a plurality of conducting lines formed in the grooves. The conducting line can be made from a silver or copper conductive ink to provide a low-resistance line served as a gate line, common line or source line. In a pixel having a storage capacitor and a TFT with a gate electrode, a source electrode and a drain electrode, the gate electrode is connected to a gate line and a source electrode and one of the capacitor electrodes in the storage capacitor is connected to a common line. At least part of one or more of the gate electrode and the source electrode is disposed on top of and in contact with the surface of one or more conducting lines.

Abstract: An energy-saving glass includes a glass substrate, and a periodic metal layer deposited on the glass substrate and having a honeycomb array of round holes. A method of manufacturing the energy-saving glass includes: providing a template having multiple template spots arranged in a honeycomb array; forming on the template a transfer metal layer having multiple metal spots disposed respectively on the template spots; transferring the metal spots onto a photoresist layer on a glass substrate; etching the photoresist layer exposed from the metal spots to leave photoresist spots underlying the metal spots on the glass substrate; forming a periodic metal layer around the photoresist spots; and removing the photoresist spots.

Abstract: Provided herein is a conductive coating material that can be spray coated to form a shielding layer having desirable shielding performance, and desirable adhesion to a package. A shielded package producing method using the conductive coating material is also provided. The conductive coating material comprises at least (A) 100 parts by mass of a binder component containing 5 to 30 parts by mass of a solid epoxy resin that is solid at ordinary temperature, and 20 to 90 parts by mass of a liquid epoxy resin that is liquid at ordinary temperature, (B) 200 to 1800 parts by mass of metallic particles, and (C) 0.3 to 40 parts by mass of a curing agent. The conductive coating material has a viscosity of 3 to 30 dPa·s.

Abstract: Disclosed herein is a flexible metal laminate including: a first thermosetting polyimide resin layer containing 5 wt % to 75 wt % of a fluorine-based resin; a second thermosetting polyimide resin layer formed on at least one surface of the first thermosetting polyimide resin layer, and containing 1 wt % or less of the fluorine-based resin; and a thermoplastic polyimide resin layer formed on one surface of the second thermosetting polyimide resin layer so as to face the first thermosetting polyimide resin layer, wherein the first thermosetting polyimide resin layer and the second thermosetting polyimide resin layer include the same thermosetting polyimide resin.

Abstract: A laminate having an electroluminescent element disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer comprising an electrically-conductive material, the first electrically-conductive layer being disposed over the first paper layer; a dielectric layer disposed over the first electrically-conductive layer; a light emissive layer comprising an electroluminescent material, the light emissive layer being disposed over the dielectric layer; a second electrically-conductive layer comprising a translucent electrically-conductive material, the second electrically-conductive layer being disposed over the light emissive layer; an insulating layer disposed over the second electrically-conductive layer.

Abstract: An abrasive tool can include a bonded abrasive including a body and a barrier layer bonded to a major surface of the body. The body can include abrasive particles contained within a bond material. The barrier material can include a polymer including a biaxially-oriented material. In an embodiment, the barrier layer may include a polymer-containing film as an exterior surface of the abrasive tool. The abrasive tool may be formed such that the barrier layer is formed in-situ with the formation of the bonded abrasive.

Abstract: A light emitting diode (LED) lamps and methods of providing heat management with fusible metals associated with the heat management components. More particularly, the present disclosure provides LED lamps fusible metal components that are situated between LED components and heat sink components of the LED lamp.

Abstract: An arrangement may include an electrical component and a heat exchanger arranged on the electrical component for controlling a temperature of the component. An electrically insulating isolation layer may be arranged at least partially between the heat exchanger and the component. The isolation layer may be connected to at least one of the component and the heat exchanger via a materially cohesive connection.

Abstract: A conductive paste having a viscosity suitable for filling a hole of a board, long pot life, and excellent conductivity and long-term reliability of a cured product, and a multilayer board using the same are provided. A conductive paste comprising with respect to (A) 100 parts by mass of dimer acid-modified epoxy resin, (B) from 200 to 1900 parts by mass of high melting metal powder containing silver-coated copper alloy powder and having a melting point of 800° C. or higher, (C) from 400 to 2200 parts by mass of silver-coated copper alloy powder having a melting point of 800° C. or higher, (D) from 1.0 to 20.0 parts by mass of curing agent containing a hydroxy group-containing aromatic compound, and (E) from 5.0 to 100.0 parts by mass of a flux containing polycarboxylic acid, is used as the present invention.

Abstract: An interface device comprises a layer of a material thoroughly crossed by metal electrodes intended to electrically connect two electronic circuits. According to the present invention, the layer of material comprises a graphene layer and the electrodes each comprise a central electrically-conductive element formed across the thickness of the graphene layer and an electrically-insulating peripheral layer, interposed between the central element and the graphene layer.

Abstract: A method for forming a conductor layer, including subjecting a surface of a polyimide film where a polyimide layer (a) is formed to polyimide etching treatment, to remove at least part of the polyimide layer (a), the polyimide film having the polyimide layer (a) formed on one surface or both surfaces of a polyimide layer (b); and then forming a conductor layer on the surface, such that the polyimide etching treatment time T (min), which is represented using t (min) defined by the formula as described below, is within the range of 0.2t?T?5t.

Abstract: A printing process for printing an ink pattern on a substrate is provided. The ink pattern to be printed is based on an available pattern layout. The pattern layout defines a desired layout of the ink pattern to be printed. Based on the pattern layout an input image for allocating dot positions of the ink pattern is generated. The printing process includes a step of comparing a scan image with the input image to carry out a quality inspection to detect any print defects in the printed ink pattern. The printing process includes a step of providing a decision on an approval or a rejection of the printed ink pattern. In case of an approval, the substrate can be supplied to a subsequent processing station to finalise the substrate. In case of a rejection, the substrate including print defects can be recycled.

Abstract: An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.

Abstract: A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Abstract: A micromechanical device has a functional layer. One or more layers are provided between the functional layer and the micromechanical device to provide stress relief.

Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.

Abstract: A graphene laminate including a substrate, a binder layer on the substrate, and graphene on the binder layer, wherein the graphene is bound to the substrate by the binder layer.

Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.

Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.

Abstract: A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.

Abstract: A coil component and a method of manufacturing the same are provided. The coil component may include a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a coil disposed on a surface of the support member and having a terminal exposed to at least one outer surface of the body part, and a conductive via connected to the terminal of the coil and penetrating through at least one end portion of the support member to thereby be exposed to the at least one outer surface of the body part.

Abstract: The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1): wherein n represents an integer of 1 or more; and an epoxy resin (B).

Abstract: A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

Abstract: A nanowire device includes a first component formed on a substrate and a second component disposed apart from the first component on the substrate. A nanowire is configured to connect the first component to the second component. An anchor pad is formed along a span of the nanowire and configured to support the nanowire along the span to prevent sagging.

Abstract: A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating.

Abstract: A coil component and a method of manufacturing the same are provided. The coil component may include a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a coil disposed on a surface of the support member and having a terminal exposed to at least one outer surface of the body part, and a conductive via connected to the terminal of the coil and penetrating through at least one end portion of the support member to thereby be exposed to the at least one outer surface of the body part.