Abstract: Embodiments described herein may provide for devices comprising a power efficient RGBW display. In some embodiments, a first device may be provided. The first device may include at least one pixel. The pixel may include a first sub-pixel, a second sub-pixel, a third sub-pixel, and a fourth sub-pixel. The first sub-pixel may include a first color filter in optical communication with a first organic light emitting device. The second sub-pixel may include a second color filter in optical communication with a second organic light emitting device. The third sub-pixel may include a third color filter in optical communication with a third organic light emitting device. The fourth sub-pixel may include a fourth organic light emitting device and emits near white light. At least one of the first sub-pixel or the second sub-pixel may include a color conversion layer in optical communication with the first or second organic light emitting device.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window; mounting a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side; attaching a lower internal connector to the base active side and the package substrate bottom side, the lower internal connector through the package substrate window; forming an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side; and forming a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a peripheral connector bottom side directly on the package substrate top side and a peripheral connector top side coplanar with the upper insulation top side.

Abstract: An OLED comprising a substrate with a plurality of pixel regions of first to third colors disposed within a display area, and a functional material layer comprising an organic emissive layer disposed at each of the plurality of pixel regions, wherein first to third partition parts are disposed on the substrate within the display area, first to third frame-like structures are disposed on the substrate outside the display area, the pixel region of the first color is disposed within a first demarcation region demarcated by the first partition part, the pixel region of the second color is disposed within a second demarcation region demarcated by the second partition part, the pixel region of the third color is disposed within a third demarcation region demarcated by the third partition part, and the first to third demarcation regions are connected to the to the interior of the first to third frame-like structures, respectively.

Abstract: A conductive glass substrate includes a glass substrate, a silicon dioxide layer, and a conductive mesh line, the glass substrate defines a meshed groove on a surface thereof; the silicon dioxide layer is attached to the surface of the glass substrate having the groove; the conductive mesh line have a shape adapted to that of the groove, the conductive mesh line is deposited in the groove and attached to the glass substrate via the silicon dioxide layer. In the conductive glass substrate, the conductive mesh line is received in the groove, compared with the conventional conductive glass substrate, a flexible substrate as a supporting body is not needed, the cost is down, and the structure of the conductive glass substrate is simple, further reducing the process, saving manpower and resources. A method of preparing the conductive glass substrate is provided.

Abstract: A vibration damping shaped aluminum extrusion achieves the features of weight reduction and a high damping effect. The vibration damping shaped aluminum extrusion includes a pair of face plates which face each other and a plurality of ribs connecting the face plates, wherein a damping material is provided at least on the central part of the rib in an inner surface of a hollow part formed by the face plate and the rib. A positioning recess or a positioning protrusion may be formed so that a damping material is provided on the central part of the face plate in an inner surface of the hollow part.

Abstract: A printed circuit board has a core substrate, a first conductive pattern on first surface of the substrate, a second conductive pattern on second surface of the substrate, and a through-hole conductor formed of plated material through the substrate such that the conductor is connecting the first and second patterns. The plated material is filling a through hole in the substrate, the substrate includes an insulation layer including inorganic fiber and resin, a first resin layer on one surface of the insulation layer and having the first surface of the substrate, and a second resin layer on the opposite surface of the insulation layer and having the second surface of the substrate, the first and second resin layers do not contain inorganic fiber material, and the sum of thicknesses of the first and second resin layers is set in the range of 20% or less of thickness of the substrate.

Abstract: An anisotropic conductive member is connected to a rigid circuit board having a first electrode and a flexible circuit board having a second electrode as a land. A plurality of conductive paths penetrate an insulating base material of the anisotropic conductive member. Each conductive path has a first protrusion and a second protrusion on respective first and second surfaces of the insulating base. The height of the second protrusion is equal to or less than double the thickness of the land. The first protrusion contacts a part of the first electrode. The second protrusion contacts part of the land. The base of the anisotropic conductive member is pressed such that the insulating material is not in direct contact with the flexible circuit board. When attaching the boards, a pressure of 300 MPa to 1,000 MPa is applied to the surfaces of the lands to reduce circuit board breakage.

Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.

Abstract: A packaged IC having laser vias and methods for making the same. The packaged IC includes a die having bond pads thereon, wire bonds contacting the bond pads, and a substrate configured to electrically connect the wire bonds and external package connectors. The substrate includes mechanical vias through the substrate layers and laser vias in an uppermost substrate layer. Each laser via is closer to the die than the mechanical vias that do not overlap or are not covered by the die. The method includes routing traces on uppermost and lowermost layers, the traces electrically connecting wire bonds and external package connectors, forming mechanical vias through all layers of the substrate, forming laser vias in the uppermost substrate layer, and electrically connecting each wire bond to one trace on the uppermost substrate layer.

Abstract: To provide a multilayer wiring board that ensures sufficient close contact strength between a conformal type conductor and a resin insulating layer. A multilayer wiring board includes a multilayered construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately layered. In each of a plurality of via holes formed in the resin insulating layers, a conformal via conductor is formed to electrically connect between the conductor layers. Filling up parts of the resin insulating layers layered at upper layer side inside of the conformal via conductor forms an anchor portion. The lower end side of the anchor portion bulges larger than the upper end side in the radially outward direction of the via hole.

Abstract: A paste composition containing an inorganic filler, a resin and a solvent, wherein the paste composition is characterized in that it contains one or more solvents of which the boiling point is 160° C. or higher and an inorganic filler of which the mean particle diameter is 5 ?m or smaller, and the total content of the solvent is 25 wt % or less based on the total amount of the paste composition, and a dielectric composition containing an inorganic filler and resin, wherein the inorganic filler includes inorganic fillers of at least two kinds of mean particle diameter, and the greatest mean particle diameter of said mean particle diameters is 0.1-5 ?m and is 3 times or more the minimum mean particle diameter.

Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.

Abstract: An object of the present invention is to provide a resin composition which enables formation of a resin layer having excellent electrical performance including high frequency performance and appropriate solubility with desmear solution required on a material used in manufacturing of a printed wiring board. To achieve the object, the resin composition used for constituting a resin layer on a metal layer surface of a laminate includes a polyphenylene ether compound and 10 parts by mass to 100 parts by mass of a styrene-butadiene block copolymer and 0.1 parts by mass to 100 parts by mass of a component promoting solubility with desmear solution against 100 parts by mass of the polyphenylene ether compound.

Abstract: A conductive pattern is prepared in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation having a ?max of at least 150 nm and up to and including 450 nm, and (c) a crosslinking agent. The polymeric layer is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. The pattern of electroless seed metal ions is then reduced to provide a pattern of corresponding electroless seed metal nuclei. The corresponding electroless seed metal nuclei are then electrolessly plated with a conductive metal.

Abstract: Non-conductive films for constructing lighter than air balloons are provided. A non-conductive film may comprise multiple layers of gas barrier polymers. An outer surface printable layer and an interior heat or ultrasonically sealable layer may also be included. Each gas barrier film may comprise multiple (e.g., from 3 to approximately 75) barrier layers. A gas barrier core has a nano-layer structure. A gas barrier core may also comprise a biodegradable film or a bio-based film. A non-conductive film may comprise a metal layer for enhancing gas barrier properties. The metal layer may be discontinuous. The metal layer may be conductive and coated with an insulating top coat.

Abstract: Non-conductive films for constructing lighter than air balloons are provided. A non-conductive film may comprise multiple layers of gas barrier polymers. An outer surface printable layer and an interior heat or ultrasonically sealable layer may also be included. Each gas barrier film may comprise multiple (e.g., from 3 to approximately 75) barrier layers. A gas barrier core has a nano-layer structure. A gas barrier core may also comprise a biodegradable film or a bio-based film. A non-conductive film may comprise a metal layer for enhancing gas barrier properties. The metal layer may be discontinuous. The metal layer may be conductive and coated with an insulating top coat.

Abstract: A carrier-attached metal foil includes a plate-shaped carrier, a metal foil laminated on at least one of surfaces of the carrier, and a fixing unit configured to fix a periphery of the carrier and a periphery of the metal foil to each other.

Abstract: An insulating glass-ceramic substrate for synthesizing graphene includes discrete, crystalline, nanophase metallic regions capable of catalyzing graphene growth. The nanophase regions may be formed by thermal treatment of a glass-ceramic substrate containing the corresponding metal oxide. Single layer and double layer graphene are prepared on the modified glass-ceramic substrate in a vacuum chemical vapor deposition (CVD) process from hydrocarbon precursors. The graphene-coated glass-ceramic substrate is electrically conductive.

Abstract: In a decorative sheet including a surface layer and an adhesion layer, the surface layer is a polyurethane layer obtained by crosslinking using a curing agent and coating and drying of a straight chain polyurethane resin having a specified molecular weight and acid value, the polyurethane resin being obtained by reaction of a diamine chain extender agent with a polyurethane prepolymer obtained by reaction of a polycarbonate diol having an alicyclic structure, an aliphatic diol having a carboxyl group, and 4,4?-cyclohexylmethandiisocyanate.

Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.

Abstract: The subject of the invention is a process for obtaining a substrate coated on at least part of its surface with at least one film of oxide of a metal M the physical thickness of which is 30 nm or less, said oxide film not being part of a multilayer comprising at least one silver film, said process comprising the following steps: at least one intermediate film of a material chosen from the metal M, a nitride of the metal M, a carbide of the metal M and an oxygen-substoichiometric oxide of the metal M is deposited by sputtering, said intermediate film not being deposited above or beneath a titanium-oxide-based film, the physical thickness of said intermediate film being 30 nm or less; and at least part of the surface of said intermediate film is oxidized using a heat treatment, during which said intermediate film is in direct contact with an oxidizing atmosphere, especially air, the temperature of said substrate during said heat treatment not exceeding 150° C.

Abstract: The invention relates to an enamelled part (3, 11, 21) for a dial comprising a ceramic substrate (31) coated with a first enamel layer (4?, 12, 24, 33) to improve the appearance of said part. According to the invention, the part includes at least one other enamel layer (6?, 8?, 9, 14, 16, 25, 35, 37, 39, 41, 43, 45) partially covering the first enamel layer (4?, 12, 24, 33) so as to form a decoration with a similar improved appearance. The invention concerns the field of timepieces, jewellery and gems.

Abstract: A coated substrate. The coated substrate includes a unitary substrate having a major surface. A first coating is applied to a first surface segment of the major surface. A second coating applied to a second surface segment of the major surface. The first coating is different than the second coating.

Abstract: In a method for forming conductive patterns, a substrate is provided, and a pattern is formed on the substrate using a conductive pattern-forming composition and a printing method. The substrate with the pattern formed is positioned between two microwave-permeable panels and the pattern is fired using microwave. In a method for forming conductive patterns, the substrate is fixed by the microwave-permeable material during the firing of conductive patterns, and accordingly the deformation of substrate can be prevented and the firing process can be facilitated.

Abstract: Fabric has a printed pattern with a base color and at least one design color. The design color has a plurality of irregular, non-repeating spots. The printed pattern is adapted to abate identification of the fabric by a light responsive device. The fabric also includes metal extending throughout. The metal is adapted to abate identification of the fabric by an infrared, heat responsive device.

Abstract: A method of reducing a gaseous carbon oxide includes reacting a carbon oxide with a gaseous reducing agent in the presence of a non-ferrous catalyst. The reaction proceeds under conditions adapted to produce solid carbon of various allotropes and morphologies, the selective formation of which can be controlled by means of controlling reaction gas composition and reaction conditions including temperature and pressure. A method for utilizing a non-ferrous catalyst in a reactor includes placing the catalyst in a suitable reactor and flowing reaction gases comprising a carbon oxide with at least one gaseous reducing agent through the reactor where, in the presence of the catalyst, at least a portion of the carbon in the carbon oxide is converted to solid carbon and a tail gas mixture containing water vapor.

Abstract: Paint film composites comprise sheet metal, a color layer, and an optional transparent protective layer. Methods of making and using the paint film composites, and shaped articles made thereby, are also disclosed.

Abstract: A plunger for fuel injection assembly is provided. The plunger includes a nitrided surface. The nitrided surface includes a damaged area. An electroless material is coated on the damaged area.

Abstract: A method and apparatus comprising a layer of material having a decorative graphic and an electrically conductive material in the layer of material. The layer of material is configured to be attached to a surface of an aircraft. The electrically conductive material is configured to cause a current from an atmospheric electrostatic discharge contacting the layer of material to spread out in a desired amount within the layer of material.

Abstract: A non-catalytic palladium precursor composition is disclosed, including a palladium salt and an organoamine, wherein the composition is substantially free of water. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.

Abstract: Three dimensional printed objects having surface coatings, such as a hydrophobic coating or metalized surface, 3D printed substrates having an outer surface that can be tuned by application of such a coating, and methods for the fabrication of such objects and substrates are described. A surface initiator is incorporated into the 3D substrate during layer-by-layer printing, and the surface coated by surface-initiated atom transfer radical polymerization (SI-ATRP).

Abstract: The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic module or the like. The method involved simultaneously patterning at least one pattern in a conductive layer using a plurality of registration marks. The registration marks serve to align and guide the creation of the plurality of conductive structures. Optical brighteners may also be utilized within the adhesive layer and the registration marks of the present invention in order to detect the location where conductive structures are to be placed.

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 ?g/dm2 of Ni and said Cr layer containing 10-100 ?g/dm2 of Cr is provided.

Abstract: The present invention relates to the field of the protection of security documents, especially banknotes, against illegal actions such as robbery or theft. In particular, the present invention relates to the field of ink-stained documents that are resistant to chemicals. The disclosed security documents are covered on at least one side by from about 70% to about 90% of a protective varnish and comprising from about 10% to about 30% of one or more varnish-free areas comprising one or more varnish-free indentations (I), the percents being based on the total surface of the one side of the security document.

Abstract: An artificial microstructure comprises two “I” shaped metal wire structures. The two “I” shaped metal wire structures are separated to each other. The present invention also discloses an artificial electromagnetic material using the artificial microstructures. The artificial electromagnetic material has high resonance frequency, wide effective frequency band and has a wide application range.

Abstract: A pattern of conductive micro-wires as in a conductive pattern can be prepared using photo-lithography, or imprint technology. A photocurable composition is cured to form a pattern of photocured micro-channels. A conductive composition comprising metal nano-particles is added to the photocured micro-channels and excess conductive composition outside the photocured micro-channels is removed. The conductive composition in the photocured micro-channels is then dried at a temperature of less than 60° C. The dried conductive composition in the photocured micro-channels is treated with hydrogen chloride vapor to form conductive micro-wires in the photocured micro-channels at a temperature of less than 60° C. The outer surface of the conductive micro-wires is then polished in the presence of water, to form a micro-wire pattern.

Abstract: A plastic overmold aluminum extrusion including at least one plastic overmold and aluminum extrusion. The aluminum extrusion is formed with sufficient cross sectional properties and features such as an internal web to help prevent undesirable collapses under injection or compression molding pressures. This improves part geometry and strength while minimizing weight. A plurality of protrusions and/or local deformations on an outer wall of the extrusion can be used to create strong mechanical interface to the plastic. Localized deformations can result from a combination of the applied plastic pressure under injection or compression molding pressures and the proximity of outer gaps of the internal web structure. A process of making the plastic overmold aluminum extrusion includes inserting at least one aluminum extrusion into a mold without mandrels and delivering plastic forming the plastic overmold.

Abstract: A system and a method for selectively coating a substrate includes a removable mask including a magnetic member having a first surface contour shaped to conform to the outside surface of the substrate and a magnetizable member having a second surface contour shaped to conform to the inside surface of the substrate. The method for coating the substrate includes magnetically coupling a removable mask to at least one surface of the substrate; forming a coating of a coating material on the at least one surface of the substrate with the magnetically coupled removable mask using a bath containing the coating material; and selectively decoupling the removable mask from the at least one coated surface to reveal a portion of the coated surface without the coating.

Abstract: A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.

Abstract: A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an inner wall of the through-hole. The base body has a fiber layer including a plurality of glass fibers and a resin that covers the plurality of glass fibers. The glass fibers have a groove-shaped concavity on a surface exposed to the inner wall of the through-hole. The concavity is filled with a part of the through-hole conductor.

Abstract: A printed material includes a first printed layer and a second printed layer. The first printed layer is produced by printing using a first curing ink which is provided in a first processing region for deformation process and contains at least a monofunctional polymerizable compound. The second printed layer is produced by printing using a second curing ink which is provided in a second processing region for shear processing and contains at least a multifunctional polymerizable compound. In the first curing ink, y1/x1 is 0.5 or less, where x1 and y1 are respective masses of the monofunctional polymerizable compound and the multifunctional polymerizable compound in the first curing ink. In the second crying ink, y2/x2 is 1 or greater, where x2 and y2 are respective masses of the monofunctional polymerizable compound and the multifunctional polymerizable compound in the second curing ink.

Abstract: Substantially transparent conductor layers in touch sensing systems may be formed by forming a barrier layer between an organic layer and a substantially transparent conductive layer. For example, a barrier layer can be formed over the organic layer, and the transparent conductor layer can be formed over the barrier layer. The barrier layer can reduce or prevent outgassing of the organic layer, to help increase the quality of the transparent conductor layer. In another example, a combination layer of two different types of a transparent conductor may be formed over the organic layer by forming a barrier layer of the transparent conductor, and forming a second layer of the transparent conductor on the barrier layer. Outgassing that can occur when forming the barrier layer can cause the transparent conductor of the barrier layer to be of lower-quality, but can result in a higher-quality transparent conductor of the second layer.

Abstract: A method of preparing a metal composite material comprises: providing a metal substrate having an anodic oxidation layer on a surface thereof; forming a first dyed layer on the anodic oxidation layer; forming a second dyed layer on the first dyed layer; and removing at least a part of the second dyed layer. A metal composite material is also provided.

Abstract: Coating barrier layer and manufacturing process, for coating a base substrate, comprising said barrier layer a group of, at least, an inorganic layer and a polymeric layer, where a metal rich interface layer is disposed between the inorganic layer and the polymeric layer.

Abstract: Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.

Abstract: A method for forming a textured bond coat surface (48) for a thermal barrier coating system (44) of a gas turbine component (34). The method includes selectively melting portions of a layer of alloy particles (16) with a patterned energy beam (20) to form successive layers of alloy material (16?, 16?) until a desired surface geometric feature (26) is achieved. The energy beam pattern may be indexed between layers to form a protruding undercut (28) in the geometric feature. The patterned energy beam may be formed by directing laser energy from a diode laser (30) through a cartridge filter (32). Particles of a flux material (18) may be melted along with the alloy particles to form a protective layer of slag (22) over the melted and cooling alloy material.

Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.

Abstract: A formed body having a curved surface, a method of producing the formed body, a front cover for a vehicle lighting device, and a method of producing the front cover. A front cover for a vehicle lighting device, mounted to a front opening in a vehicle lighting device having a lamp body and a light source which is provided in the lamp body, wherein a heat generating body is provided in a substantially rectangular region of that surface of the front cover which faces the light source. The heat generating body maintains the relationship of Ra =(2 R0), where R0 is the electric resistance value (initial value) of the heat generating body before the heat generating body is elongated and Ra is the electric resistance value of the heat generating body after the heat generating body is elongated 5%.

Abstract: The invention relates to a reflective insulation material product including a metallized polymeric film laminated to an insulation material with the metallized polymeric film having its exposed metallic surface facing away from the insulation material. The product can meet Class A standard thermal insulation material standards characterized by a flame speed rating of from 0 to 25 and a smoke developed rating value of 0 to 450.

Abstract: A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.