Next To Metal Patents (Class 428/344)
  • Publication number: 20130260064
    Abstract: Tie-layer adhesives having graft compositions for bonding to metal substrates is disclosed. The graft compositions are made up of the reaction product of a live, grafted polyolefin and an olefin elastomer. The grafted polyolefin is first made by heating a polyolefin and an unsaturated monomer. Further reaction of the live, grafted polyolefin with an olefin elastomer provides the graft composition. Grafting efficiency is boosted dramatically by the presence of the olefin elastomer and use of the additional reaction step. The graft composition, when formulated into a tie-layer adhesive provides improved bonding to metal substrates.
    Type: Application
    Filed: September 29, 2011
    Publication date: October 3, 2013
    Applicant: Equistar Chemicals LP
    Inventor: Maged G. Botros
  • Patent number: 8547701
    Abstract: This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating-material layer (1) and which is connected electrically by its contact terminals (7) to the conductor structures contained in the electronic module. According to the invention, a second embedded component (6?), the contact terminals (7?) of which face essentially towards the second surface of the insulating-material layer and which is connected electrically by its contact terminals (7?) to the conductor structures contained in the electronic module, is attached by means of glue or two-sided tape to the first component (6), and the contact terminals (7, 7?) are connected to the conductor structures with the aid of a conductive material, which is arranged in the insulating-material layer in holes (17) at the locations of the contact terminals (7, 7?).
    Type: Grant
    Filed: November 24, 2005
    Date of Patent: October 1, 2013
    Assignee: Imbera Electronics Oy
    Inventors: Risto Tuominen, Antti Iihola
  • Patent number: 8535824
    Abstract: An electrochemical device has one or more electrodes in electrical communication with a tab assembly. The tab assembly includes a tab having one or more clad regions. Each clad region includes a metal clad onto the tab.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: September 17, 2013
    Assignee: Quallion LLC
    Inventors: Hiroshi Nakahara, Sang Young Yoon
  • Patent number: 8535797
    Abstract: In accordance with the teachings of one embodiment of the present disclosure, a method of forming high-density metal interconnects on flexible, thin-film plastic includes laminating a dry photoresist layer to a substrate. The photoresist-laminated substrate is baked. An assembly is formed by laminating a plastic film to the baked, photoresist-laminated substrate. One or more electrically conductive interconnect layers are processed on a first surface of the laminated plastic film. The processing of the one or more electrically conductive interconnects includes photolithography. The assembly is baked and soaked in a liquid. The processed plastic film is then separated from the substrate.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: September 17, 2013
    Assignee: Raytheon Company
    Inventor: Francis J. Morris
  • Patent number: 8530032
    Abstract: There is provided a seal for covering a hole in a disk drive housing. The seal includes a conductive layer, a primary dielectric layer, and a gasket layer. The conductive layer has a covered surface region and an exposed planar surface region. The exposed planar surface region is lacking a dielectric coating disposed thereon. The primary dielectric layer includes an adhesive coating disposed between the primary dielectric layer and the covered surface region. The gasket layer includes first and second adhesive gasket layer sides and a gasket opening disposed through the gasket layer.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: September 10, 2013
    Assignee: Western Digital Technologies, Inc.
    Inventors: Claire-Nechol Sevier, Huynh P. Tan, Julius A. Turangan
  • Publication number: 20130224446
    Abstract: A multi-layer packaging film comprising a bio-based layer and method for making the same. An outer layer comprising a bio-based film is adhered to a product side layer comprising a bio-based film having barrier properties. A non-compostable sealant layer is pattern applied to a portion of the product side layer. Because a portion of the bio-based product side layer is exposed, upon opening of the package the product side layer is susceptible to moisture. This allows for subsequent biodegradation or compostability of the films. In another embodiment the sealant layer comprises a water permeable material. Upon opening of the package moisture can subsequently contact the product side layer and initiate biodegradation.
    Type: Application
    Filed: February 27, 2012
    Publication date: August 29, 2013
    Applicant: FRITO-LAY NORTH AMERICA, INC.
    Inventors: Todd FAYNE, Kenneth Scott LAVERDURE, Brad Dewayne RODGERS, Steven Kenneth TUCKER
  • Patent number: 8507086
    Abstract: A corrosion resistant seaming tape includes a metal layer capable of blocking selected frequencies of electromagnetic radiation arranged on a polymeric substrate and covered with adhesive that protects the metal layer and prevents it from corroding. Also disclosed is a method of sealing a seam between adjacent edges of two adjacent pieces of window film including an internal metal layer by applying a polymeric film to the seam.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: August 13, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Raghunath Padiyath, Josh D. Tibbits
  • Publication number: 20130186566
    Abstract: The invention relates to the use of a hot-melt adhesive having high hardness for adhesive bonding of metal films or foils, paper films or foils, and/or plastic films or foils. The invention further relates to a method for adhesively bonding a metal film or foil, paper film or foil, and/or plastic film or foil onto a substrate.
    Type: Application
    Filed: March 11, 2013
    Publication date: July 25, 2013
    Applicant: Henkel AG & CO. KGAA
    Inventor: Henkel AG & CO. KGAA
  • Publication number: 20130189467
    Abstract: Adhesives with a specific viscose component to provide good thermal conductivity, insulation and flame retardant and high temperature resistant is provided. The adhesive composition form may be single-sided or double-sided with a substrate or not. The substrate may be metal foil, glass fiber, thermal pad or organic polymers. Adhesive composition includes polymerized siloxane, metal hydroxides, and metal oxides. Nitrides, aluminum powder or coupling agent may be added. The coupling agent is specially used in non-silica resin substrate, which enhances the adhesion to substrate surface. Optionally, the adhesive may include a release film.
    Type: Application
    Filed: January 18, 2013
    Publication date: July 25, 2013
    Applicant: PIONEER MATERIAL PRECISION TECH CO., LTD.
    Inventor: PIONEER MATERIAL PRECISION TECH CO., LTD.
  • Publication number: 20130171444
    Abstract: Fluid activatable, multilayer adhesive compositions for use with liner-free labels, and methods of making and using thereof are described herein. The compositions contain a functional layer, such as an adhesive layer, which is applied to the label and a barrier layer which is applied on top of the adhesive layer. The multilayer composition prevents the adhesive layer on the label from interacting with the face of an adjacent label, particularly when the labels are stored as coils or folded stacks.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 4, 2013
    Inventors: Daniel Youngwhan Cho, Benjamin David Lux, Heidi M. Munnelly, Philip So, Kathleen A. Tabis, David A. Sonshine
  • Publication number: 20130143458
    Abstract: The present invention relates to aqueous dispersions containing hydrophilized polycarbodiimides, methods for producing the aqueous dispersions according to the invention, their use as a constituent of binders in adhesives, lacquers, paints, paper coating compounds or in fibre nonwovens and articles made of wood, metal, textile, leather or plastic, which are treated with the aqueous dispersion according to the invention.
    Type: Application
    Filed: March 28, 2011
    Publication date: June 6, 2013
    Inventors: Evgeny Avtomonov, Harald Kraus, Sebastian Dörr, Dirk Achten, Jörg Büchner
  • Patent number: 8455106
    Abstract: An acrylic rubber-metal composite, which comprises a metal, (a) an undercoat adhesive layer comprising phenol resin and epoxy resin, (b) an overcoat adhesive layer comprising phenol resin, halogenated polymer, and a metal oxide, and (c) an acrylic rubber layer, the layers (a), (b) and (c) being successively laid on the surface of the metal, having not only a distinguished initial adhesiveness, but also a good water resistance, where the acrylic rubber is bonded to the metal without surface treatment of the metal such as a chemical treatment, e.g. zinc phosphate treatment, etc., a blast treatment, or a primer treatment.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: June 4, 2013
    Assignee: NOK Corporation
    Inventors: Katsumi Abe, Kiyofumi Fukasawa
  • Publication number: 20130122289
    Abstract: A thermoplastic polymer composition which is excellent in flexibility, mechanical properties, and moldability, capable of adhering to ceramics, metals, and synthetic resins without a treatment with a primer, and exhibits a high adhesion strength even when exposed to a high temperature environment, and a molded product obtained by using the thermoplastic polymer composition. The thermoplastic polymer composition includes 100 parts by mass of a thermoplastic elastomer (A), 1 to 100 parts by mass of a polyvinyl acetal resin (B), and 0.1 to 300 parts by mass a softener (C). The thermoplastic elastomer (A) is a block copolymer including a polymer block constituted by aromatic vinyl compound units and a polymer block constituted by conjugated diene units or a hydrogenated product of the block copolymer. The polyvinyl acetal resin (B) has a glass transition temperature of 80 to 130° C.
    Type: Application
    Filed: July 20, 2011
    Publication date: May 16, 2013
    Applicant: KURARAY CO., LTD.
    Inventors: Asako Minamide, Mikio Masuda
  • Patent number: 8431206
    Abstract: A multipurpose adhesive tape with minimized curling is provided. The adhesive tape includes a base formed as a thin sheet, an adhesive attached to the reverse surface of the base, and a projection projecting along the length of the outer surface of the base within a portion of the width thereof.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: April 30, 2013
    Assignees: Joinset Co., Ltd.
    Inventor: Sun-Ki Kim
  • Patent number: 8424513
    Abstract: A method for the production of an absorber plate for solar collectors from a strip of metal, in particular of aluminum or an aluminum alloy, includes coating the strip using a coil coating process with a highly selective coating, which has very good absorptive properties for sunlight and ensures very little heat emission.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: April 23, 2013
    Assignee: Hydro Aluminium Deutchland GmbH
    Inventors: Wolf Oetting, Willi Schenkel, Volker Denkmann, Andreas Siemen, Merete Hallenstvet, Axel Blecher, Bente Gilbu Tilset, Anica Lacau, Christian Rone Simon
  • Patent number: 8420213
    Abstract: A composite substrate is a piezoelectric substrate that is transparent to light used for photolithography, and a supporting substrate for supporting the piezoelectric substrate are bonded together via an organic adhesive layer. Where at least one of the supporting substrate and the organic adhesive layer of the composite substrate absorbs light used for photolithography.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: April 16, 2013
    Assignee: NGK Insulators, Ltd.
    Inventors: Kenji Suzuki, Yasunori Iwasaki, Takashi Yoshino
  • Publication number: 20130089690
    Abstract: A double-sided self-splitting splicing tape includes: a base layer including a first surface and a second surface, wherein the first surface is opposite to the second surface; a first adhesive layer disposed on the first surface of the base layer; a self-splitting layer disposed on the second surface of the base layer; and a second adhesive layer disposed on the self-splitting layer. Also disclosed are methods of dynamic splicing using the double-sided self-splitting splicing tape.
    Type: Application
    Filed: October 5, 2012
    Publication date: April 11, 2013
    Applicant: BK CHEMICAL CO., LTD
    Inventor: BK Chemical Co., LTD
  • Patent number: 8409704
    Abstract: The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin (A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 ?m or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: April 2, 2013
    Assignee: Panasonic Corporation
    Inventors: Yasuo Fukuhara, Tomoaki Watanabe, Mao Yamaguchi, Yuki Kitai, Hiroaki Fujiwara
  • Patent number: 8405620
    Abstract: An exemplary touch sensitive display (200) includes a display device (220) and a touch panel (210). The touch panel is attached on the display device through two adhesives (231, 232). The two adhesives have different adhesive capabilities.
    Type: Grant
    Filed: May 12, 2008
    Date of Patent: March 26, 2013
    Assignees: Innocom Technology (Shenzhen) Co., Ltd., Chimei Innolux Corporation
    Inventor: Ming-Li Huang
  • Patent number: 8399091
    Abstract: An adhesive sheet is provided in which properties that cause corrosion of a non-contacting metal are inhibited. The adhesive sheet is provided with a pressure-sensitive adhesive layer formed from an aqueous dispersion type adhesive composition. The pressure-sensitive adhesive composition contains an aqueous dispersion type acrylic polymer synthesized using a chain transfer agent that does not have sulfur as a composite element thereof. The amount of sulfur-containing gas (as SO42?) released from the pressure-sensitive adhesive sheet in the case of heating for 1 hour at 85° C. is 0.043 ?g/1 cm2 or less, adhesive strength on an ABS sheet is 10 N/20 mm or more, and holding time as determined in an 80° C. cohesive strength test is 1 hour or more.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: March 19, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Kenichi Yamamoto, Toshihide Suzuki, Shouhei Wada, Mitsuyoshi Shirai, Akiko Takahashi
  • Publication number: 20130048336
    Abstract: A tape is disclosed. The tape includes a metallic foil, an adhesive layer laminated on one surface of the metallic foil and a protective polymeric coating laminated on an opposing second surface of the metallic foil. The protective coating comprises an anti-corrosion agent. The protective coating shields the metallic foil from corrosion and other drawbacks that can occur by environmental exposure. The tape readily can be employed as a busbar tape in photovoltaic cells to provide a cost-effective substitute for the tin-coated copper currently used there.
    Type: Application
    Filed: August 20, 2012
    Publication date: February 28, 2013
    Applicant: ADHESIVES RESEARCH, INC.
    Inventor: Ranjit MALIK
  • Publication number: 20130052386
    Abstract: A sealing web including the following layer structure: a) a film containing polyvinyl chloride; b) a first adhesive; c) a polyethylene terephthalate film; and d) a second adhesive; wherein the layers are disposed in the sequence a), b), c), and d). The sealing web makes it possible to implement adhesion of a PVC web over a large area, without problems arising from the migration of the plasticizer from the PVC film to the adhesive, or in that said problems are at least greatly reduced.
    Type: Application
    Filed: November 26, 2010
    Publication date: February 28, 2013
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Mario Slongo, Carine Kerber, Hagen Aust
  • Patent number: 8382929
    Abstract: An adhesive composition comprising as principal components, a polymerizable component, an ambient temperature radical polymerization catalyst system and a photoinitiator. The adhesive may optionally comprise an adhesion promoter, a toughener, an epoxy, and a filler material. Further, a two-part reactive adhesive comprising, a first part comprising, (i) at least one free radical-polymerizable monomer, (ii) at least one reducing agent, and (iii) a photoinitiator, and a second part comprising an oxidizing agent that is reactive at ambient temperature with the reducing agent to produce free radicals that are capable of initiating and propagating free radical polymerization.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: February 26, 2013
    Assignee: Lord Corporation
    Inventor: Mark W. Pressley
  • Publication number: 20130045376
    Abstract: A curable composition includes components: a) at least one ethylene-propylene-(nonconjugated diene) terpolymer; b) at least one ethylene-propylene copolymer; c) at least one bis(halomethyl)triazine crosslinker; and d) at least one tackifier. A weight ratio of component a) to component b) is in a range of from 15:85 to 85:15. A pressure-sensitive adhesive includes an at least partially crosslinked reaction product of the curable composition. Adhesive articles including the pressure-sensitive adhesive are disclosed.
    Type: Application
    Filed: April 27, 2011
    Publication date: February 21, 2013
    Inventors: Zhong Chen, Jingjing Ma
  • Patent number: 8377540
    Abstract: A transfer film including a protection layer and a substrate is provided. The substrate has a first surface with a first three-dimensional pattern and a second surface. The first three-dimensional pattern has at least one protrusion portion or at least one recess portion. The protection layer is disposed on the substrate and has a third surface and a fourth surface. The third surface contacts the first surface and has a second three-dimensional pattern complementary to the first three-dimensional pattern. The second three-dimensional pattern of the third surface is formed by covering the first three-dimensional pattern of the first surface. The protection layer and the substrate are separated after transfer, so as to expose the second three-dimensional pattern.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: February 19, 2013
    Assignee: Compal Electronics, Inc.
    Inventors: Ju-Chen Chiu, Yin Ta Chen
  • Patent number: 8377553
    Abstract: A constrained layer damper having a multilayer damping material is provided, as are related methods for making and using the damper. The constrained layer damper features a constraining layer, a carrier layer, a release liner, a viscoelastic layer interposed between the constraining layer and a first surface of the carrier layer, and a silicone pressure-sensitive adhesive interposed between the release liner and a second surface of the carrier layer. The silicone pressure-sensitive adhesive has sufficient tackiness at room temperature to adhere the constrained layer damper, with the release liner removed, to a substrate, such as a metallic substrate. The constrained layer damper has a peak damping temperature value in a range of about 50° C. to about 100° C.
    Type: Grant
    Filed: June 11, 2008
    Date of Patent: February 19, 2013
    Assignee: Material Sciences Corporation
    Inventor: Hong Xiao
  • Publication number: 20130040132
    Abstract: A conductive adhesive tape includes a conductive layer; an adhesive layer formed at one side in the thickness direction of the conductive layer and containing an adhesive and a conductive filler; and a metal layer interposed between the conductive layer and the adhesive layer. The maximum resistance value in the first cycle measured in a heat cycle test is 0.1? or less, and the resistance value increase rate is 100% or less.
    Type: Application
    Filed: August 13, 2012
    Publication date: February 14, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kota NAKAO, Noritsugu DAIGAKU, Yasushi BUZOJIMA, Hiroshi YAMAZAKI, Yoshihisa FURUTA
  • Publication number: 20130009846
    Abstract: Apparatuses such as inserts for radomes are described herein. The apparatuses and inserts including a metal layer having a frequency selective surface.
    Type: Application
    Filed: June 27, 2012
    Publication date: January 10, 2013
    Applicant: TRITON SYSTEMS, INC.
    Inventors: Douglas Ward FREITAG, Scott MORRISON, Arthur GAVRIN, Ken MAHMUD
  • Publication number: 20130004767
    Abstract: Provided is an electroconductive pressure-sensitive adhesive tape which can exhibit stable electrical conductivity even when used over a long duration and/or used under severe environmental conditions. The electroconductive pressure-sensitive adhesive tape has a metallic foil and, on one side thereof, a pressure-sensitive adhesive layer, in which the electroconductive pressure-sensitive adhesive tape has a maximum resistance in the first cycle of 1 ? or less and has a maximum resistance in the 200th cycle being 5 times or less the maximum resistance in the first cycle, as measured in a thermo-cycle test.
    Type: Application
    Filed: February 28, 2011
    Publication date: January 3, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Noritsugu Daigaku, Kota Nakao, Ai Murakami, Takahiro Nonaka, Hironori Tamai, Yasushi Buzoujima, Shinya Nakano, Shinatarou Taira, Tetsuya Otsuka
  • Publication number: 20120325518
    Abstract: Disclosed is a conductive adhesive tape which can exhibit extremely stable electroconductivity upon use over a long duration and/or use under severe environmental conditions even when applied in a small area. The conductive thermosetting adhesive tape includes a metallic foil; and a thermosetting adhesive layer on one side of the metallic foil. The thermosetting adhesive layer has a bond strength before curing of 2 N/20 mm or more and a bond strength after curing of 10 N/20 mm or more. The conductive thermosetting adhesive tape is preferably one including the metallic foil; the thermosetting adhesive layer on one side of the metallic foil; and a terminal exposed from the surface of the thermosetting adhesive layer, in which the conductive thermosetting adhesive tape has a total area of the terminal present per 30 mm2 of the surface of the thermosetting adhesive layer of from 0.1 to 5 mm2.
    Type: Application
    Filed: June 22, 2012
    Publication date: December 27, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kota NAKAO, Noritsugu DAIGAKU, Yasushi BUZOJIMA, Yoshihisa FURUTA, Takahiro NONAKA
  • Publication number: 20120301708
    Abstract: Method for installing a thermo-optical patch on an outer satellite wall; the patch consists of a metal sheet that includes a coat of electrically conductive adhesive on one of its sides and a coat of paint with predefined thermo-optical properties on its other side. A satellite that includes a patch applied to an outer side of a wall of the satellite is also described.
    Type: Application
    Filed: May 29, 2012
    Publication date: November 29, 2012
    Applicant: ASTRIUM SAS
    Inventors: Sabine Dagras, Monique Guzzoni, Amandine Rieu
  • Publication number: 20120295052
    Abstract: A conductive single-sided tape includes a conductive, nonwoven adhesive layer and a metal layer positioned adjacent the conductive, nonwoven adhesive layer. The conductive, nonwoven adhesive layer includes a conductive nonwoven substrate having a plurality of passageways, an adhesive material positioned within at least a portion of the passageways and a plurality of metal particles dispersed within the adhesive material.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 22, 2012
    Inventors: Jeong-Wan Choi, Jin-Bae Kim
  • Publication number: 20120295104
    Abstract: Two-part polyurea-urethane adhesive compositions comprising a Part A prepolymer component having an isocyanate component comprising polymeric isocyanate and an oligomer content greater than 15 weight percent, polyol having a molecular weight of about 5,000 to about 12,000 and about 20 weight percent to about 44 percent weight percent filler; and a Part B curative component comprising polyol having molecular weight of about 5,000 to about 12,000, aromatic amine, about 20 weight percent to about 44 percent weight percent filler and catalyst wherein the adhesive has an 85° C. storage modulus greater than about 20 MPa. The two-part polyurea-urethane adhesive composition can be applied to bond various substrates including composite materials and metal, including making parts for the transportation and assembly markets.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 22, 2012
    Inventor: Michael James Barker
  • Patent number: 8309218
    Abstract: Components for the manufacture of polymer electrolyte membrane fuel cells are provided, as well as apparatus and automatable methods for their manufacture by rotary die cutting and by lamination of various layers to form membrane electrode assemblies. A method and apparatus for performing the method are provided comprising die-cutting webs of catalyst decal materials or electrode materials to make first and second workpieces at first and second rotary die stations; holding the die-cut workpieces by action of sub-ambient air pressure to an endless perforated belt of first and second vacuum conveyors, typically before they are fully cut from the first and second webs; transporting first and second workpieces to opposing sides of a membrane in a laminating station; concurrently feeding the first and second workpieces into the laminating nip adjacent to the membrane, and laminating the first and second workpieces to the membrane.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: November 13, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Scott Alan Ripley, Donald Ivan Hirsch, William Frederic Bader
  • Publication number: 20120282444
    Abstract: The invention relates to a one-component, moisture-curing adhesive containing at least one polyoxyalkylene and/or poly(methyl)acrylate prepolymer having at least one hydrolyzable silane group, at least one filler, and auxiliary materials and additives, wherein the prepolymer has a molecular weight of 4,000 to 40,000 g/mol and the adhesive has a viscosity of 200 to 10,000 mPas.
    Type: Application
    Filed: April 30, 2012
    Publication date: November 8, 2012
    Applicant: Henkel AG & Co. KGaA
    Inventors: Lars Zander, Pavel Gentschev, Hans-Georg Kinzelmann, Svenja Struempf, Nicole Ditges, Johann Klein
  • Publication number: 20120276375
    Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.
    Type: Application
    Filed: July 11, 2012
    Publication date: November 1, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Evan George Colgan, Paul W. Coteus, Michael Anthony Gaynes, Kenneth Charles Marston, Steven P. Ostrander
  • Patent number: 8299402
    Abstract: The present invention relates to a disassemblable structure including: a double-coated pressure-sensitive adhesive tape or a double-coated pressure sensitive adhesive sheet including a substrate and pressure-sensitive adhesive layers formed on both surfaces of the substrate, at least one of the pressure-sensitive adhesive layers being a thermal foaming agent-containing pressure-sensitive adhesive layer; a heating element which foams the thermal foaming agent-containing pressure-sensitive adhesive layer by heating; and a pair of adherends joined to each other through the pressure-sensitive adhesive tape or sheet and the heating element.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: October 30, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Eiji Yamanaka, Michirou Kawanishi, Masahiko Ando, Yasuyuki Tokunaga, Tooru Nakashima
  • Patent number: 8263220
    Abstract: A work subject material comprising a metal plate for use in punching and/or bending and, attached thereto, a surface protection sheet, characterized in that the surface protection sheet comprises a support base material and an adhesive layer superimposed on one surface of the support base material and that the surface protection sheet exhibits a coefficient (I) not more than 21.0, a coefficient (II) not less than 4.0 and a coefficient (III) not more than 1.5, which are calculated by the following formulae: (I)=thickness of support base material (mm)×elongation at break of surface protection sheet (%); (II)=thickness of support base material (mm)×strength at break of surface protection sheet (N/20 mm); and (III)=coefficient (I)/coefficient (II).
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: September 11, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Keiji Hayashi, Kazuhito Okumura, Yoshikazu Tanaka, Hideo Hara, Toru Inamasu
  • Patent number: 8257820
    Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: September 4, 2012
    Assignee: World Properties, Inc.
    Inventors: Sankar Paul, Dirk M. Baars
  • Patent number: 8256025
    Abstract: A vapor permeable retroreflective material for use on protective garments. The material may be formed in a non-continuous pattern that provides a high-level of retroreflective brightness, yet also provides adequate permeability to prevent exposure to trapped thermal energy and heated moisture. The non-continuous retroreflective pattern may include retroreflective regions and non-retroreflective regions arranged such that thermal decay through the protective garment is not substantially decreased in the regions corresponding to the retroreflective material. Rather, vapor permeation and thermal decay through the garment may be substantially the same as if the retroreflective material was not present.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: September 4, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Rino A. Feduzi, Robert L. Jensen, Jr., Jeanine M. Shusta
  • Patent number: 8252456
    Abstract: A battery outer label 1 including a heat-shrinkable resin film such as of polyethylene terephthalate as a base material 2, a printing layer 5 and a protective layer 6 formed on a front surface of the base material 2, and a vapor-deposited metal layer 3 and an adhesive layer 4 formed on a back surface of the base material 2, wherein the battery outer label 1 has a water vapor permeability in the range of 14 to 30 g/m2·24 h.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: August 28, 2012
    Assignee: Panasonic Corporation
    Inventors: Takashi Mushiga, Yasuhiko Syoji
  • Publication number: 20120207954
    Abstract: The present invention provides a novel packaging laminate designed particularly for packaging highly hygroscopic, pelleted, flowable materials. It is a multilayer structure which incorporates a layer of heat-sealable polymeric material which has had a thin film of aluminum deposited onto it by vapour coating. This layer combined with a further effective barrier layer provides the low WVTR in the range required by such highly hygroscopic materials. This laminate can be used with additional structural layers of paper or plastic, to form bags that have the features of very low WVTR, excellent puncture resistance, and excellent heat sealability.
    Type: Application
    Filed: February 14, 2011
    Publication date: August 16, 2012
    Applicant: Hood Packaging Corporation
    Inventors: Jean-Francois DALPE, Ian LLOYD-GEORGE
  • Publication number: 20120202057
    Abstract: The present invention provides a laminate in which a formed article as an adherend is adhered without impairing the external designability and touch of the formed article, and a hot-melt adhesive material which is suitable for dielectric heating that does not cause thermal damage directly to a formed article. Having reached the idea that a configuration might be useful, in which an adhesive having satisfactory adhesiveness to both metal and resin materials is laminated on a metal layer for selectively heating a hot-melt adhesive layer by dielectric heating, the present inventor has made extensive studies and found that an adhesive material in which a layer of an adhesive including a modified polyolefin resin is laminated on a metal layer, is capable of adhesion without impairing the designability of an adherend by induction heating.
    Type: Application
    Filed: August 27, 2010
    Publication date: August 9, 2012
    Applicant: KANEKA CORPORATION
    Inventor: Mitsutoshi Moro
  • Publication number: 20120148785
    Abstract: A gas-barrier heat-seal composite film is provided. The gas-barrier heat-seal composite film includes a heat-seal layer including very low density polyethylene (VLDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), high density polyethylene (HDPE), metallocene polyethylene (mPE), metallocene linear low density polyethylene (mLLDPE), ethylene vinyl acetate (EVA) copolymer, ethylene-propylene (EP) copolymer or ethylene-propylene-butene (EPB) terpolymer, and a gas-barrier layer formed on the heat-seal layer, wherein the gas-barrier layer includes a plurality of composite layers, each including a polymer substrate and a single layer or multiple layers of metal or oxide thereof which is formed on one side or both sides of the polymer substrate, and the polymer substrate includes uniaxial-stretched or biaxial-stretched polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyimide (PI), ethylene/vinyl alcohol (EVOH) copolymer or a combination thereof.
    Type: Application
    Filed: March 17, 2011
    Publication date: June 14, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jui-hung Hsu, Dan-Cheng Kong, Chang-Ming Wong
  • Patent number: 8198546
    Abstract: A method of manufacturing a printed wiring board includes preparing a wiring substrate having a conductive circuit, coating a solder-resist layer over the conductive circuit, leveling a surface of the solder-resist layer so as to obtain a maximum surface roughness in a predetermined range, removing the resin film from the surface of the solder-resist layer, and forming multiple openings in the surface of the solder-resist layer to expose multiple portions of the conductive circuit so as to form multiple conductive pads for mounting an electronic components.
    Type: Grant
    Filed: November 23, 2007
    Date of Patent: June 12, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
  • Publication number: 20120126379
    Abstract: A semiconductor device having an electromagnetic wave shielding layer can be manufactured without decreasing productivity. The present invention provides a die bond film including an adhesive layer and an electromagnetic wave shielding layer made of a metal foil or a die bond film including an adhesive layer and an electromagnetic wave shielding layer formed by vapor deposition.
    Type: Application
    Filed: November 17, 2011
    Publication date: May 24, 2012
    Inventors: Daisuke UENDA, Takeshi MATSUMURA, Koichi INOUE, Miki MORITA
  • Publication number: 20120117921
    Abstract: A non-foil packaging laminate for liquid food packaging comprises a layer of paper or other cellulose-based material, outermost liquid tight, heat sealable layers of polyolefin-based polymers and, vapour-deposition coated onto the inner side of the layer of paper or cellulose-based material, an induction heat susceptible metal coating. Also disclosed is a method for manufacturing of the packaging laminate, a packaging container that is made from the packaging laminate and a method of induction heat sealing the packaging laminate into packaging containers.
    Type: Application
    Filed: July 6, 2010
    Publication date: May 17, 2012
    Applicant: TERTA LAVAL HOLDINGS & FINANCE S.A.
    Inventors: Nils Toft, Magnus Wijk, Magnus Rábe, Eva Ehrenberg
  • Patent number: 8173842
    Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1—FUNC1—X—FUNC2—CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming intermolecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.
    Type: Grant
    Filed: February 23, 2006
    Date of Patent: May 8, 2012
    Assignee: Sony Deutschland GmbH
    Inventors: Jurina Wessels, William Ford, Akio Yasuda
  • Patent number: 8172978
    Abstract: The invention concerns a method for manufacturing a radio frequency identification device (RFID), the device featuring an antenna and a chip (12) connected to the antenna, the method including the following steps: printing an antenna (12) having contacts (17 and 19) on a support (20) made of paper or synthetic paper, placing adhesive dielectric material between the contacts of the antenna, positioning an integrated circuit module (10) on the support, the module featuring groups of contacts (17, 18) and the chip (12) connected to groups of contacts inside an encapsulation (14) of the module, so that the groups of contacts of the module are opposite the contacts of the antenna, placing a thermoplastic layer (22) and a paper or synthetic paper layer (24) on the support, the two layers (22 and 24) being provided with a recess (21, 23) at the location of encapsulation (14) of the module (10), laminating together the three layers, the antenna support layer (20), the thermoplastic layer (22) and the paper or synt
    Type: Grant
    Filed: October 13, 2008
    Date of Patent: May 8, 2012
    Assignee: Ask S.A.
    Inventors: Christophe Halope, Olivier Mazabaud
  • Patent number: RE44510
    Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming inter-molecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.
    Type: Grant
    Filed: September 15, 2012
    Date of Patent: September 24, 2013
    Assignee: Sony Deutschland GmbH
    Inventors: Jurina Wessels, William E. Ford, Akio Yasuda