Abstract: The application discloses a heat weldable film comprising the flowing layers: (i) a first plastic polymer layer consisting of a material weldable to a plastic polymer reaction tube; (ii) an opaque second layer comprising pigments; (iii) a third layer consisting of a clear transparent material; wherein the material of the first and third layer differ. Furthermore, a reaction tube comprising a heat weldable film according to the invention is disclosed as well as a method for labelling of reaction tubes.

Abstract: In one embodiment, a selectively-releasable adhesive includes a base adhesive compound and a releasing compound that is blended with the base adhesive compound, the releasing compound being capable of decreasing the adhesive strength of the base adhesive compound when a releasing agent is applied to the selectively-releasable adhesive.

Abstract: A laminate donor element can be used to transfer a composite of a metal grid and an electronically conductive polymer to a receiver sheet for use in various devices. The laminate donor element has a donor substrate, a metal grid that is disposed over only portions of the donor substrate, leaving portions of the substrate uncovered by the metal grid, and an electronically conductive polymer that covers the portions of the donor substrate that are uncovered by the metal grid. The composite of metal grid and electronically conductive polymer exhibits a peel force of less than or equal to 40 g/cm for separation from the donor substrate at room temperature.

Abstract: A plastics film with improved energy-shielding properties, suitable for application on a transparent or translucent surface, such as glass, and which is at least 50% transparent for visible light, further characterized in that it includes at least one plastic carrier layer with on top thereof as a functional layer a metallic layer consisting of antimony and/or arsenic together with indium and/or gallium, wherein the plastics film contains a total of indium (In), gallium (Ga), antimony (Sb) and arsenic (As) together, which are present as an alloy, such as indium andmonide, gallium andmonide, indium arsenide, indium gallium arsenide and/or gallium arsenide, of at least 4.0 ppm by weight and at most 25.0 ppm by weight. A glass plate to which the film is attached, is described as are objects provided with the glass plate. Methods are described for the production of the film, the glass plate and the objects.

Abstract: A resin composition for a flexible printed circuit board that can attain high adhesiveness and solder reflow resistance even if a base film having low dielectric properties is used, and that attains excellent electrical properties. The resin comprises a fluororesin and an isocyanate compound, wherein the fluororesin has a content of 1 to 50% by mass, and a hydroxyl equivalent of 300 to 5500 g/equivalent.

Abstract: The present invention provides a conductive adhesive composition having excellent adhesiveness and low surface resistance and capable of being used as a buffer layer of an electronic device. The conductive adhesive composition according to the present invention includes (A) a water-soluble polyvinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound, wherein the organic additive (B) is at least one member selected from water-soluble polyhydric alcohols, water-soluble pyrrolidones, and hydrophilic aprotic solvents, and the conductive organic polymer compound (C) is at least one member selected from polyanilines, polypyrroles, polythiophenes, and derivatives thereof.

Abstract: A method for manufacturing a resin coating on copper foil includes following steps. Firstly, two diamines of 2,2-bis[4-(4-aminophenoxy)phenyl]propane and 4,4?-oxydianiline, and two acid anhydrides of pyromellitic diandydride and oxydiphthalic anhydride are added into a polar aprotic solvent and the solvent is stirred to form a mixed solution. Secondly, the mixed solution is heated to a temperature of about 170° C.-190° C. to allow a cross-linking reaction to be completed between the two diamines and the two acid anhydrides, thereby forming a thermoplastic polyimide adhesive fluid. The thermoplastic polyimide adhesive fluid is coated on a copper foil and cured to form a thermoplastic polyimide adhesive layer on the copper foil, thereby obtaining a resin coated copper foil. This disclosure also relates to resin coated copper foil and a method for manufacturing a multi-layer circuit board.

Abstract: To provide a resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viscoelasticity and flexibility at high temperatures. To attain this, a polyimide resin composition is provided that includes a polyimide having a polycondensation unit of a tetracarboxylic acid dianhydride and a diamine, wherein the tetracarboxylic acid dianhydride includes an (?1) tetracarboxylic acid dianhydride represented by general formula (1), or the diamine includes an (?1) aromatic diamine represented by general formula (2), the diamine includes an (?2) aliphatic diamine represented by general formula (3) or (4), a total amour of the (?1) tetracarboxylic acid dianhydride and the (?1) aromatic diamine is 5 to 49 mol % with respect to a total amount of the tetracarboxylic acid dianhydride and the diamine, and an amine equivalent of the polyimide is 4,000 to 20,000.

Abstract: The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react with active hydrogen is used for increasing the reaction rate of an adhesive resin which is required for the preparation of a decorative film having a metallic effect, thereby ensuring coating stability and increasing the reaction rate. Thus, according to the present invention, an adhesive resin which has little deviation in quality (boil resistance) between and within rolls can be provided in a short time.

Abstract: A laminated product having a thickness that can be adjusted by chipping, and including alternating sheets and layers of an adhesive material in a stack, each sheet possessing an intrinsic resistance to tearing and each layer of adhesive material connecting adjacent sheets in the stack with a linking force which is weaker than the resistance of the sheets to tearing, enabling each sheet to be detached from the stack without tearing. The product includes a housing which is disposed inside the thickness of the stack, and an electronic identification element which is disposed in the housing.

Abstract: Tie-layer adhesives having graft compositions for bonding to metal substrates is disclosed. The graft compositions are made up of the reaction product of a live, grafted polyolefin and an olefin elastomer. The grafted polyolefin is first made by heating a polyolefin and an unsaturated monomer. Further reaction of the live, grafted polyolefin with an olefin elastomer provides the graft composition. Grafting efficiency is boosted dramatically by the presence of the olefin elastomer and use of the additional reaction step. The graft composition, when formulated into a tie-layer adhesive provides improved bonding to metal substrates.

Abstract: This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating-material layer (1) and which is connected electrically by its contact terminals (7) to the conductor structures contained in the electronic module. According to the invention, a second embedded component (6?), the contact terminals (7?) of which face essentially towards the second surface of the insulating-material layer and which is connected electrically by its contact terminals (7?) to the conductor structures contained in the electronic module, is attached by means of glue or two-sided tape to the first component (6), and the contact terminals (7, 7?) are connected to the conductor structures with the aid of a conductive material, which is arranged in the insulating-material layer in holes (17) at the locations of the contact terminals (7, 7?).

Abstract: An electrochemical device has one or more electrodes in electrical communication with a tab assembly. The tab assembly includes a tab having one or more clad regions. Each clad region includes a metal clad onto the tab.

Abstract: In accordance with the teachings of one embodiment of the present disclosure, a method of forming high-density metal interconnects on flexible, thin-film plastic includes laminating a dry photoresist layer to a substrate. The photoresist-laminated substrate is baked. An assembly is formed by laminating a plastic film to the baked, photoresist-laminated substrate. One or more electrically conductive interconnect layers are processed on a first surface of the laminated plastic film. The processing of the one or more electrically conductive interconnects includes photolithography. The assembly is baked and soaked in a liquid. The processed plastic film is then separated from the substrate.

Abstract: There is provided a seal for covering a hole in a disk drive housing. The seal includes a conductive layer, a primary dielectric layer, and a gasket layer. The conductive layer has a covered surface region and an exposed planar surface region. The exposed planar surface region is lacking a dielectric coating disposed thereon. The primary dielectric layer includes an adhesive coating disposed between the primary dielectric layer and the covered surface region. The gasket layer includes first and second adhesive gasket layer sides and a gasket opening disposed through the gasket layer.

Abstract: A multi-layer packaging film comprising a bio-based layer and method for making the same. An outer layer comprising a bio-based film is adhered to a product side layer comprising a bio-based film having barrier properties. A non-compostable sealant layer is pattern applied to a portion of the product side layer. Because a portion of the bio-based product side layer is exposed, upon opening of the package the product side layer is susceptible to moisture. This allows for subsequent biodegradation or compostability of the films. In another embodiment the sealant layer comprises a water permeable material. Upon opening of the package moisture can subsequently contact the product side layer and initiate biodegradation.

Abstract: A corrosion resistant seaming tape includes a metal layer capable of blocking selected frequencies of electromagnetic radiation arranged on a polymeric substrate and covered with adhesive that protects the metal layer and prevents it from corroding. Also disclosed is a method of sealing a seam between adjacent edges of two adjacent pieces of window film including an internal metal layer by applying a polymeric film to the seam.

Abstract: Adhesives with a specific viscose component to provide good thermal conductivity, insulation and flame retardant and high temperature resistant is provided. The adhesive composition form may be single-sided or double-sided with a substrate or not. The substrate may be metal foil, glass fiber, thermal pad or organic polymers. Adhesive composition includes polymerized siloxane, metal hydroxides, and metal oxides. Nitrides, aluminum powder or coupling agent may be added. The coupling agent is specially used in non-silica resin substrate, which enhances the adhesion to substrate surface. Optionally, the adhesive may include a release film.

Abstract: The invention relates to the use of a hot-melt adhesive having high hardness for adhesive bonding of metal films or foils, paper films or foils, and/or plastic films or foils. The invention further relates to a method for adhesively bonding a metal film or foil, paper film or foil, and/or plastic film or foil onto a substrate.

Abstract: Fluid activatable, multilayer adhesive compositions for use with liner-free labels, and methods of making and using thereof are described herein. The compositions contain a functional layer, such as an adhesive layer, which is applied to the label and a barrier layer which is applied on top of the adhesive layer. The multilayer composition prevents the adhesive layer on the label from interacting with the face of an adjacent label, particularly when the labels are stored as coils or folded stacks.

Abstract: The present invention relates to aqueous dispersions containing hydrophilized polycarbodiimides, methods for producing the aqueous dispersions according to the invention, their use as a constituent of binders in adhesives, lacquers, paints, paper coating compounds or in fibre nonwovens and articles made of wood, metal, textile, leather or plastic, which are treated with the aqueous dispersion according to the invention.

Abstract: An acrylic rubber-metal composite, which comprises a metal, (a) an undercoat adhesive layer comprising phenol resin and epoxy resin, (b) an overcoat adhesive layer comprising phenol resin, halogenated polymer, and a metal oxide, and (c) an acrylic rubber layer, the layers (a), (b) and (c) being successively laid on the surface of the metal, having not only a distinguished initial adhesiveness, but also a good water resistance, where the acrylic rubber is bonded to the metal without surface treatment of the metal such as a chemical treatment, e.g. zinc phosphate treatment, etc., a blast treatment, or a primer treatment.

Abstract: A thermoplastic polymer composition which is excellent in flexibility, mechanical properties, and moldability, capable of adhering to ceramics, metals, and synthetic resins without a treatment with a primer, and exhibits a high adhesion strength even when exposed to a high temperature environment, and a molded product obtained by using the thermoplastic polymer composition. The thermoplastic polymer composition includes 100 parts by mass of a thermoplastic elastomer (A), 1 to 100 parts by mass of a polyvinyl acetal resin (B), and 0.1 to 300 parts by mass a softener (C). The thermoplastic elastomer (A) is a block copolymer including a polymer block constituted by aromatic vinyl compound units and a polymer block constituted by conjugated diene units or a hydrogenated product of the block copolymer. The polyvinyl acetal resin (B) has a glass transition temperature of 80 to 130° C.

Abstract: A multipurpose adhesive tape with minimized curling is provided. The adhesive tape includes a base formed as a thin sheet, an adhesive attached to the reverse surface of the base, and a projection projecting along the length of the outer surface of the base within a portion of the width thereof.

Abstract: A method for the production of an absorber plate for solar collectors from a strip of metal, in particular of aluminum or an aluminum alloy, includes coating the strip using a coil coating process with a highly selective coating, which has very good absorptive properties for sunlight and ensures very little heat emission.

Abstract: A composite substrate is a piezoelectric substrate that is transparent to light used for photolithography, and a supporting substrate for supporting the piezoelectric substrate are bonded together via an organic adhesive layer. Where at least one of the supporting substrate and the organic adhesive layer of the composite substrate absorbs light used for photolithography.

Abstract: A double-sided self-splitting splicing tape includes: a base layer including a first surface and a second surface, wherein the first surface is opposite to the second surface; a first adhesive layer disposed on the first surface of the base layer; a self-splitting layer disposed on the second surface of the base layer; and a second adhesive layer disposed on the self-splitting layer. Also disclosed are methods of dynamic splicing using the double-sided self-splitting splicing tape.

Abstract: The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin (A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 ?m or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.

Abstract: An exemplary touch sensitive display (200) includes a display device (220) and a touch panel (210). The touch panel is attached on the display device through two adhesives (231, 232). The two adhesives have different adhesive capabilities.

Abstract: An adhesive sheet is provided in which properties that cause corrosion of a non-contacting metal are inhibited. The adhesive sheet is provided with a pressure-sensitive adhesive layer formed from an aqueous dispersion type adhesive composition. The pressure-sensitive adhesive composition contains an aqueous dispersion type acrylic polymer synthesized using a chain transfer agent that does not have sulfur as a composite element thereof. The amount of sulfur-containing gas (as SO42?) released from the pressure-sensitive adhesive sheet in the case of heating for 1 hour at 85° C. is 0.043 ?g/1 cm2 or less, adhesive strength on an ABS sheet is 10 N/20 mm or more, and holding time as determined in an 80° C. cohesive strength test is 1 hour or more.

Abstract: A tape is disclosed. The tape includes a metallic foil, an adhesive layer laminated on one surface of the metallic foil and a protective polymeric coating laminated on an opposing second surface of the metallic foil. The protective coating comprises an anti-corrosion agent. The protective coating shields the metallic foil from corrosion and other drawbacks that can occur by environmental exposure. The tape readily can be employed as a busbar tape in photovoltaic cells to provide a cost-effective substitute for the tin-coated copper currently used there.

Abstract: A sealing web including the following layer structure: a) a film containing polyvinyl chloride; b) a first adhesive; c) a polyethylene terephthalate film; and d) a second adhesive; wherein the layers are disposed in the sequence a), b), c), and d). The sealing web makes it possible to implement adhesion of a PVC web over a large area, without problems arising from the migration of the plasticizer from the PVC film to the adhesive, or in that said problems are at least greatly reduced.

Abstract: An adhesive composition comprising as principal components, a polymerizable component, an ambient temperature radical polymerization catalyst system and a photoinitiator. The adhesive may optionally comprise an adhesion promoter, a toughener, an epoxy, and a filler material. Further, a two-part reactive adhesive comprising, a first part comprising, (i) at least one free radical-polymerizable monomer, (ii) at least one reducing agent, and (iii) a photoinitiator, and a second part comprising an oxidizing agent that is reactive at ambient temperature with the reducing agent to produce free radicals that are capable of initiating and propagating free radical polymerization.

Abstract: A curable composition includes components: a) at least one ethylene-propylene-(nonconjugated diene) terpolymer; b) at least one ethylene-propylene copolymer; c) at least one bis(halomethyl)triazine crosslinker; and d) at least one tackifier. A weight ratio of component a) to component b) is in a range of from 15:85 to 85:15. A pressure-sensitive adhesive includes an at least partially crosslinked reaction product of the curable composition. Adhesive articles including the pressure-sensitive adhesive are disclosed.

Abstract: A transfer film including a protection layer and a substrate is provided. The substrate has a first surface with a first three-dimensional pattern and a second surface. The first three-dimensional pattern has at least one protrusion portion or at least one recess portion. The protection layer is disposed on the substrate and has a third surface and a fourth surface. The third surface contacts the first surface and has a second three-dimensional pattern complementary to the first three-dimensional pattern. The second three-dimensional pattern of the third surface is formed by covering the first three-dimensional pattern of the first surface. The protection layer and the substrate are separated after transfer, so as to expose the second three-dimensional pattern.

Abstract: A constrained layer damper having a multilayer damping material is provided, as are related methods for making and using the damper. The constrained layer damper features a constraining layer, a carrier layer, a release liner, a viscoelastic layer interposed between the constraining layer and a first surface of the carrier layer, and a silicone pressure-sensitive adhesive interposed between the release liner and a second surface of the carrier layer. The silicone pressure-sensitive adhesive has sufficient tackiness at room temperature to adhere the constrained layer damper, with the release liner removed, to a substrate, such as a metallic substrate. The constrained layer damper has a peak damping temperature value in a range of about 50° C. to about 100° C.

Abstract: A conductive adhesive tape includes a conductive layer; an adhesive layer formed at one side in the thickness direction of the conductive layer and containing an adhesive and a conductive filler; and a metal layer interposed between the conductive layer and the adhesive layer. The maximum resistance value in the first cycle measured in a heat cycle test is 0.1? or less, and the resistance value increase rate is 100% or less.

Abstract: Apparatuses such as inserts for radomes are described herein. The apparatuses and inserts including a metal layer having a frequency selective surface.

Abstract: Provided is an electroconductive pressure-sensitive adhesive tape which can exhibit stable electrical conductivity even when used over a long duration and/or used under severe environmental conditions. The electroconductive pressure-sensitive adhesive tape has a metallic foil and, on one side thereof, a pressure-sensitive adhesive layer, in which the electroconductive pressure-sensitive adhesive tape has a maximum resistance in the first cycle of 1 ? or less and has a maximum resistance in the 200th cycle being 5 times or less the maximum resistance in the first cycle, as measured in a thermo-cycle test.

Abstract: Disclosed is a conductive adhesive tape which can exhibit extremely stable electroconductivity upon use over a long duration and/or use under severe environmental conditions even when applied in a small area. The conductive thermosetting adhesive tape includes a metallic foil; and a thermosetting adhesive layer on one side of the metallic foil. The thermosetting adhesive layer has a bond strength before curing of 2 N/20 mm or more and a bond strength after curing of 10 N/20 mm or more. The conductive thermosetting adhesive tape is preferably one including the metallic foil; the thermosetting adhesive layer on one side of the metallic foil; and a terminal exposed from the surface of the thermosetting adhesive layer, in which the conductive thermosetting adhesive tape has a total area of the terminal present per 30 mm2 of the surface of the thermosetting adhesive layer of from 0.1 to 5 mm2.

Abstract: Method for installing a thermo-optical patch on an outer satellite wall; the patch consists of a metal sheet that includes a coat of electrically conductive adhesive on one of its sides and a coat of paint with predefined thermo-optical properties on its other side. A satellite that includes a patch applied to an outer side of a wall of the satellite is also described.

Abstract: A conductive single-sided tape includes a conductive, nonwoven adhesive layer and a metal layer positioned adjacent the conductive, nonwoven adhesive layer. The conductive, nonwoven adhesive layer includes a conductive nonwoven substrate having a plurality of passageways, an adhesive material positioned within at least a portion of the passageways and a plurality of metal particles dispersed within the adhesive material.

Abstract: Two-part polyurea-urethane adhesive compositions comprising a Part A prepolymer component having an isocyanate component comprising polymeric isocyanate and an oligomer content greater than 15 weight percent, polyol having a molecular weight of about 5,000 to about 12,000 and about 20 weight percent to about 44 percent weight percent filler; and a Part B curative component comprising polyol having molecular weight of about 5,000 to about 12,000, aromatic amine, about 20 weight percent to about 44 percent weight percent filler and catalyst wherein the adhesive has an 85° C. storage modulus greater than about 20 MPa. The two-part polyurea-urethane adhesive composition can be applied to bond various substrates including composite materials and metal, including making parts for the transportation and assembly markets.

Abstract: Components for the manufacture of polymer electrolyte membrane fuel cells are provided, as well as apparatus and automatable methods for their manufacture by rotary die cutting and by lamination of various layers to form membrane electrode assemblies. A method and apparatus for performing the method are provided comprising die-cutting webs of catalyst decal materials or electrode materials to make first and second workpieces at first and second rotary die stations; holding the die-cut workpieces by action of sub-ambient air pressure to an endless perforated belt of first and second vacuum conveyors, typically before they are fully cut from the first and second webs; transporting first and second workpieces to opposing sides of a membrane in a laminating station; concurrently feeding the first and second workpieces into the laminating nip adjacent to the membrane, and laminating the first and second workpieces to the membrane.

Abstract: The invention relates to a one-component, moisture-curing adhesive containing at least one polyoxyalkylene and/or poly(methyl)acrylate prepolymer having at least one hydrolyzable silane group, at least one filler, and auxiliary materials and additives, wherein the prepolymer has a molecular weight of 4,000 to 40,000 g/mol and the adhesive has a viscosity of 200 to 10,000 mPas.

Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.

Abstract: The present invention relates to a disassemblable structure including: a double-coated pressure-sensitive adhesive tape or a double-coated pressure sensitive adhesive sheet including a substrate and pressure-sensitive adhesive layers formed on both surfaces of the substrate, at least one of the pressure-sensitive adhesive layers being a thermal foaming agent-containing pressure-sensitive adhesive layer; a heating element which foams the thermal foaming agent-containing pressure-sensitive adhesive layer by heating; and a pair of adherends joined to each other through the pressure-sensitive adhesive tape or sheet and the heating element.

Abstract: A work subject material comprising a metal plate for use in punching and/or bending and, attached thereto, a surface protection sheet, characterized in that the surface protection sheet comprises a support base material and an adhesive layer superimposed on one surface of the support base material and that the surface protection sheet exhibits a coefficient (I) not more than 21.0, a coefficient (II) not less than 4.0 and a coefficient (III) not more than 1.5, which are calculated by the following formulae: (I)=thickness of support base material (mm)×elongation at break of surface protection sheet (%); (II)=thickness of support base material (mm)×strength at break of surface protection sheet (N/20 mm); and (III)=coefficient (I)/coefficient (II).

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming inter-molecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.