Abstract: Curable compositions, cured compositions, and methods of forming the same, including an epoxy resin, a curing agent, an amphiphilic toughening agent, and an inorganic nanofiller, wherein the toughening agent forms a second phase having at least one dimension being on the nanometer scale.

Abstract: The present invention can provide a heat-curable resin composition which is excellent in insulation property, heat resistance, and preservation stability. The heat-curable resin composition includes (A) cyanate ester compound having at least two cyanate groups in a molecule, (B) phenol curing agent including a resorcinol type phenol resin represented by the formula (1), (In the formula, n represents an integer from 0 to 10, each of R1 and R2 independently represents a monovalent group selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an allyl group, and a vinyl group.), and (C) at least one compound selected from a tetraphenylborate of a tetra-substituted phosphonium compound and a tetraphenylborate represented by the formula (2). (In the formula, R3 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents an integer from 1 to 3).

Abstract: A back side protective sheet for a solar cell, which is capable of enhancing performance of adhesion to an EVA resin as a filler used to seal solar cell elements, maintaining weather resistance for a long period of time, and reducing weight thereof; and a solar cell module including the back side protective sheet for a solar cell. The back side protective sheet is disposed on a back side of the solar cell module and includes: a first film fixedly attached so as to abut a surface of a filler and containing linear low-density polyethylene having a density greater than or equal to 0.91 g/cm3 and less than or equal to 0.93 g/cm3; and a second film laminated to the first film and disposed in an outermost layer of the back side protective sheet, the second film containing polyvinylidene fluoride and polymethyl methacrylate.

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

Abstract: Methods and formulations for distortional thermosets are disclosed that display enhanced composite mechanical performances and robust sorption resistance. The composition includes an epoxy resin of formula (I): and a diamine curing agent. The resultant distortional thermoset compositions possess superior out-life requirements and advantageous reaction kinetics for preparing prepreg compositions and materials.

Abstract: A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: R11—COO—R12??(1) wherein R11 and R12 are CnH2n+1 and n is 1 to 30 and a compound represented by: wherein R1, R2, and R3 are selected from H, —OH, —OR, and —OCOCaHb with the proviso that at least one includes —OCOCaHb; R is CnH2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.

Abstract: A prepreg comprising a structural layer of packed unidirectional conductive fibres comprising thermosetting resin in the interstices, and a first outer layer of resin comprising thermosetting resin, and being essentially free of unidirectional conductive fibres, which when cured under elevated temperature, produces a cured composite material comprising a cured structural layer of packed unidirectional conductive fibres and a first outer layer of cured resin comprising unidirectional conductive fibres dispersed within.

Abstract: The disclosure relates to the field of two-component epoxy resin compositions and to the use thereof as a repair adhesive, in particular in vehicle manufacturing. The two-component epoxy resin compositions according to the disclosure contain a curing component K2, which comprises between 1 and 10 wt. % of an amino group-terminated polyamide B, together with an epoxy resin component K1. The compositions show that the impact resistance is highly increased while an acceptable sheer strength is simultaneously retained.

Abstract: An electronic component module according to the present invention is provided with an electronic component, a sealing resin that seals the electronic component, and a metal film that covers a surface of the sealing resin. The sealing resin contains filler of oxide particles. Part of the filler in the sealing resin is exposed to the surface of the sealing resin. At least the part of the filler exposed to the surface of the sealing resin includes a crack that extends from an exposed surface of the filler into an inner portion. The crack is filled with at least one metal that constitutes the metal film.

Abstract: An aircraft (10) with improved aerodynamic performances is adapted to keep the directional stability and a very good aerodynamic behavior at medium-high incidence. The aircraft (10) includes a fuselage (12) to which shaped wings (18, 20) are associated, and a nose (52). The aircraft (10) also includes a vortex control device (72) of the extension of the leading edge of the wing at the root (LERX), shaped in order to symmetrize the bursting of the vortices generated by such LERX with a medium-high incidence. Said aircraft comprises removable equipment with at least one dissipation device of incident radar waves, on at least one hot portion of the aircraft.

Abstract: A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 ?m and not more than 1.0 ?m.

Abstract: The invention relates to a polyester film comprising, on at least one of the faces thereof, a scratch-resistant crosslinked coating. The objective of the invention is to provide a polyester film coated with an abrasion-resistant layer which adheres perfectly to the polyester substrate, and is simple and economical to manufacture. To achieve this objective, the crosslinked hard coating applied to the polyester film comprises: i. 20% to 99% by weight of at least one ester and/or one amide of (meth)acrylic acid comprising a substituted protic group; ii. 20% to 99% by weight of acrylic resin(s); iii. 1% to 40% of a polyalkylene diacrylate; iv. 0 to 50% of at least one derivative of the benzophenone family; v. 0 to 5% of at least one photoinitiator. The invention also relates to the method for obtaining this polyester film coated with an abrasion-resistant hard layer. Use in the production of polyester/metal sheet (steel) colaminate.

Abstract: The present disclosure relates to a curing agent for a curable resin which is a reaction product obtained from the reaction of a liquid epoxy and a polyamine component. The curing agent may be used as part of a two component curable system for the curing of unmodified epoxy resins.

Abstract: The present invention provides a method for coating an aluminum wheel using a coating composition capable of forming a coating film having a superior cosmetic property as well as an anticorrosive property much enough for preventing corrosion even in the use in an area where the coating film is susceptible to salt damage, and an aluminum wheel obtained by the method. A method for coating an aluminum wheel including applying an anticorrosive coating composition onto the aluminum wheel, and thereafter applying a clear coating composition to form a transparent multilayer coating film, wherein the anticorrosive coating composition contains an acrylic resin (1) having a weight average molecular weight of 50,000 to 140,000, a glass transition point of 20 to 50° C.

Abstract: A cured-film formation composition for forming a cured film having photoreaction efficiency and solvent resistance, and high adhesiveness alignment uniformity, and an orientation material for photo-alignment, and a retardation material formed by use of the orientation material. A cured-film formation composition includes (A) a compound having a photo-aligning group and one substituent selected from a hydroxy group, a carboxy group, and an amino group; (B) a hydrophilic polymer having one or more substituents selected from a hydroxy group, a carboxy group, and an amino group; and (C) a polymer obtained by polymerizing a monomer including an N-hydroxymethyl compound or an N-alkoxymethyl (meth)acrylamide compound, and optionally further a cross-linking catalyst as a component (D). By use of the composition, a cured-film is formed and an orientation material is formed by utilizing photo-alignment technique.

Abstract: The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a case formed of polycyclohexylene dimethylene terephthalate, and a sealant that is charged into the case to seal the LED chip. In the light emitting device, a stabilizer having a melting point that is higher than a junction temperature of the LED chip by 80° C. or more exists at a boundary surface between an inner wall surface of the case and the sealant or within 300 ?m of the boundary surface.

Abstract: A thermosetting resin composition has good storage properties at room temperature and an unreacted epoxy resin etc. are less likely to exude therefrom during heat compression molding. The thermosetting resin composition contains an acrylic copolymer including an epoxy group-containing (meth)acrylate unit, an epoxy resin, and a curing agent for an epoxy resin. In this thermosetting resin composition, epoxy groups in at least the acrylic copolymer are partially cross-linked with an amine compound and a thiol compound having 2 to 4 thiol groups per molecule, and the curing agent for an epoxy resin is an organic acid dihydrazide.

Abstract: The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:

Abstract: An intumescent composition which comprises a polymer selected from a silane-terminated polyurethane or a silane-terminated polyether, a plasticizer that is compatible with the polymer and an intumescent ingredient. Processes of forming a cured intumescent substance, and methods of fire protecting a building are also provided.

Abstract: An aspect of the present invention relates to a method of manufacturing a vinyl polymer, which comprises: mixing a first liquid and a second liquid to conduct an addition reaction, wherein the first liquid has been obtained by reacting a sulfonic acid group-containing compound selected from the group consisting of taurine, N-methyl taurine, and meta-aminobenzenesulfonic acid with an alkali metal hydroxide in methanol, the second liquid comprises a vinyl polymer having an intramolecular epoxy group in a ketone solvent, and the addition reaction incorporates a sulfonic acid alkali metal salt group onto a side chain of the vinyl polymer.

Abstract: A surrogate multilayered material includes a first fiber reinforced layer; the first reinforced layer including a crosslinked polymer and fibers; a second fiber reinforced layer; the second reinforced layer including the crosslinked polymer and the fibers; a foam layer; the foam layer disposed between the first fiber reinforced layer and the second fiber reinforced layer; where opposite faces of the foam layer are in direct contact with the first fiber reinforced layer and the second fiber reinforced layer; the foam layer having a compressive strength of about 3.5 to about 4.5 MPa, when measured as per ASTM-D-1621-73, and a shear strength of 1.50 to about 2.15 MPa, when measured as per ASTM-C-273.

Abstract: The invention relates to a method for producing an anion-exchange polymer material having an IPN or semi-IPN structure, said method consisting in: (A) preparing a homogeneous reaction solution containing, in a suitable organic solvent, (a) at least one organic polymer bearing reactive halogen groups, (b) at least one tertiary diamine, (c) at least one monomer comprising an ethylenic unsaturation polymerizable by free radical polymerization, (d) optionally at least one cross-linking agent including at least two ethylenic unsaturations polymerizable by free radical polymerization, and e) at least one free radical polymerization initiator; and (B) heating the prepared solution to a temperature and for a duration that are sufficient to allow both a nucleophilic substitution reaction between components (a) and (b) and a free radical copolymerization reaction of components (c) and optionally (d) initiated by component (e).

Abstract: The present invention is directed toward recellularizing a devitalized cartilage graft with viable recellularizable cells in vivo, in situ, or in vitro to render the tissue vital. The present invention is also directed toward repairing a cartilage defect and implanting a cartilage graft into a human or animal by crafting a cartilage matrix into individual grafts, disinfecting and cleaning the cartilage graft, applying a pretreatment solution to the cartilage graft, removing cellular debris using an extracting solution to produce a devitalized cartilage graft, recellularizing the devitalized cartilage graft, implanting the cartilage graft into the cartilage defect with or without an insertion device, and sealing the implanted cartilage graft with recipient tissue. The devitalized cartilage graft is optionally stored between the removing cellular debris and the recellularizing steps.

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface containing an inorganic filler in an amount within a range of 70% by weight to 95% by weight based on the whole of the film for flip chip type semiconductor back surface.

Abstract: A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.

Abstract: Methods are disclosed to improved adhesion of polymer coatings over polymer surfaces of stents which include plasma treatment, applying an adhesion promoting layer, surface treatments with solvents, and mechanical roughening techniques.

Abstract: A flame-retardant rubber composition for vulcanization, comprising an epichlorohydrin based rubber (A), red phosphorus (B), and a vulcanizing agent (C), in which the content of the red phosphorus (B) is from 3 to 20 parts by weight for 100 parts by weight of the epichlorohydrin based rubber (A).

Abstract: A coating agent of an ultraviolet ray hardening resin composite type for a water pressure transfer film to restore an adhesion, the ultraviolet ray hardening resin composite having a viscosity of 10-500 CPS (25° C.) and an ink solubility of SP value of 7 or more and including a photo-polymerization oligomer of 25 to 56 weight percent, a photo-polymerization monomer of bi-functional monomer of 33 to 65 weight percent and a photo-polymerization initiator of 5 to 10 weight percent for accomplishing both of membrane strength and adhesion, the photo-polymerization oligomer including a compound of multi-functional oligomer having a blend rate of 12 to 40 weight percent and bi-functional oligomer having a blend rate of 7 to 16 weight percent, the coating agent including a non-reactive resin of 2 to 10 weight percent added to the ultraviolet ray hardening resin composite, and a method of a water pressure transfer method for activating the transfer film by using the coating agent.

Abstract: Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ?120° C.

Abstract: Methods and compositions for treating a substrate are provided. The composition contains a corrosion-inhibiting metal cation and a conjugated compound.

Abstract: According to one or more embodiments, a polymeric article includes a polymeric composition, which in turn includes a polymeric material in a first weight percent, a non-metallic fibrous material in a second weight percent, and a metallic fiber material in a third weight percent and being intermixed with the non-metallic fibrous material. The polymeric material may include at least one of epoxy, vinyl ester, and/or polyester. The fibrous material may include at least one of glass fiber and carbon fiber. The metallic fiber material may include at least one of steel and aluminum.

Abstract: Coating composition comprising the reaction product of a tetra-alkoxyorthosilicate or a partially condensed oligomer thereof and an epoxy resin containing hydroxyl groups, said coating composition having a solids content of at least 70 vol % and/or a volatile organic content (VOC) not exceeding 250 g/l. This coating composition gives fast curing at ambient and sub-ambient temperatures and an extended pot life.

Abstract: Matrix-filled liquid radiation curable resin compositions for additive fabrication are described and claimed. Such resins include a cationically polymerizable component that is an aliphatic epoxide, a multifunctional (meth)acrylate component, a cationic photoinitiator, a free-radical photo initiator, and a matrix of inorganic fillers, wherein the matrix further constitutes prescribed ratios of at least one microparticle constituent and at least one nanoparticle constituent. Also described and claimed is a process for using the matrix-filled liquid radiation curable resins for additive fabrication to create three dimensional parts, and the three-dimensional parts made from the liquid radiation curable resins for additive fabrication.

Abstract: A connecting film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the connecting film including a first layer which is to be located at the first circuit member side, and a second layer which is to be located at the second circuit member side, wherein the first layer contains a cationic curing agent and an epoxy resin, and the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than that of the insulating organic resin layer.

Abstract: The present invention provides a resin composition having a suitable melting temperature for molding, a resin sheet containing the resin composition, a cured resin product excellent in thermal conductivity and heat resistance, and a substrate. They are prepared in the way that in the resin composition containing epoxy compounds and curing agent selected from 1,3,5-tris(4-aminophenyl)benzene and 1,3,5-tris(4-hydroxyphenyl)benzene, the content of 1,3,5-triphenylbenzene that is the main skeleton of the curing agent is 15 mass % or more and 50 mass % or less of the total organic substances in the resin composition.

Abstract: Disclosed is an antifogging film-forming material obtained by reacting, in the presence of a quaternary ammonium salt or quaternary phosphonium salt, a copolymer represented by a certain general formula with a multifunctional epoxy compound having a solubility of 40-100 mass % in 25° C. water. The antifogging film-forming material is characterized by having a weight average molecular weight of 100,000-5,000,000. With this material, it becomes possible to obtain an antifogging article excellent in antifogging property, heat resistance, chemical resistance and abrasion resistance.

Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: The present invention provides a laminated sheet that can prevent the decrease in adhering strength of a resin composition layer and the deterioration in electrical reliability and in which a back grinding tape can be peeled from a plurality of semiconductor elements collectively after dicing. The laminated sheet has a back grinding tape in which a pressure-sensitive adhesive layer is formed on a base, and a resin composition layer that is provided on the pressure-sensitive adhesive layer of the back grinding tape, wherein the tensile modulus of the pressure-sensitive adhesive layer at 23° C. is 0.1 to 5.0 MPa, and the T-peeling strength between the pressure-sensitive adhesive layer and the resin composition layer is 0.1 to 5 N/20 mm at 23° C. and 300 mm/min.

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; and a hardener, which is a stable solution obtainable from the following steps: (a) adding a N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification; (b) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and (c) cooling the polymer solution to obtain the stable solution, wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amounts of the DOPO-based compound and the hardener are as defined in the specification.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: A composition for the manufacture of a gelcoat includes a main component and a curing component. The main component comprises at least one epoxide resin selected from the group consisting of glycidyl ethers of bisphenol A, glycidyl ethers of bisphenol F, trimethylolpropane triglycidyl ethers, and mixtures thereof, and up to 5 wt.-% of at least one of a filler and a pigment based on a total weight of the main component. The curing component comprises at least one cycloaliphatic amine. The main component or the curing component further comprises at least one polytetrahydrofurane polyol.

Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.

Abstract: Composite anti-ballistic systems having multiple nested sub-laminates manufactured from layers of unidirectional monofilaments made from engineering fibers with anti-ballistic properties embedded in polymer matrix materials and interfacial materials engineered for controlled compliance, deformation, energy release and rate sensitive behavior.

Abstract: Provided is e.g., an epoxy resin curing agent, epoxy resin composition and a gas-barrier adhesive containing the epoxy resin composition which can express high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester, and a gas-barrier laminate having high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester. The epoxy resin curing agent of the present invention is a reaction product of the following (A) and (B). Furthermore, the epoxy resin curing agent contains at least an epoxy resin and the epoxy resin curing agent of the present invention. (A) metaxylylenediamine or paraxylylenediamine; (B) an unsaturated carboxylic acid represented by the following formula (1) and/or derivatives thereof: wherein R1 represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group.

Abstract: The use of an aqueous Solution comprising at least one polyanion and at least one high molecular weight polyethyleneimine is described, for providing oxygen barrier properties to a polymer film. The polyanion is a polymer comprising acid groups neutralized with a base selected from the group consisting of inorganic bases and monovalent organic bases and having a weight average molecular weight of at least 10000 g/mol.

Abstract: The invention relates to compositions that can be used as coatings for the inner lining of cargo tanks. The compositions comprise a mixture of epoxy resins, a curing agent, an accelerator or mixture of accelerator(s), and one or more filler(s) or pigment(s), wherein the mixture of epoxy resins comprises 60-80 wt. % of an RDGE epoxy resin and 20-40 wt. % of an epoxy novolac resin, wherein the wt. % is based upon the total weight of the mixture of epoxy resins.

Abstract: The invention relates to a resin curing agent having the formula (I), wherein R1 to R4 are each individually selected from linear or branched C1 to C5 alkyl, a process for its manufacture, blends of the reaction products, and two-component curable resin systems.

Abstract: Epoxy resin compositions that include an epoxy resin component that includes at least one epoxy resin and a solvent blend that includes methyl ethyl ketone and glycol methyl ether acetate are provided. The compositions are well-suited for use in the fabrication of prepregs and composite electrical laminates made therefrom.

Abstract: An epoxy resin curing agent includes at least the following component (I) and component (II) in a mass ratio of 50/50 to 92/8: Component (I): a reaction product obtained by reacting at least (A) metaxylylenediamine or paraxylylenediamine and at least one selected from (B1) acrylic acid and acrylic acid derivatives; Component (II): a reaction product obtained by reacting at least (A) metaxylylenediamine or paraxylylenediamine and at least one selected from (B2) unsaturated carboxylic acids represented by the following formula (1) and derivatives thereof: wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group; so that at least one of R1 and R2 is an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group.

Abstract: Polymer compositions containing a polyoxymethylene polymer are disclosed that are receptive to paints and ink coatings. The polymer composition contains a polyoxymethylene polymer having a relatively high terminal hydroxyl group content in combination with a thermoplastic elastomer. In one embodiment, a coupling agent may be added for coupling the thermoplastic elastomer to the polyoxymethylene polymer. The polymer composition can be molded into various articles and then painted or printed with an ink composition. The polymer composition has been found to dramatically improve adhesion between the molded article and the ink or paint coating.