Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.

Abstract: The invention provides a phenolic hydroxyl group-containing rubber-modified polyamide resin capable of providing a cured product with excellent heat resistance, adhesion properties, electrically insulating property and flame retardance and having a sufficient flexibility when being shaped into a film, which is characterized by having in its molecule (a) a phenolic hydroxyl group-containing aromatic polyamide segment represented by the following formula (1): (in the formula (1), m and n are average values and satisfy a relationship of 0.005?n/(m+n)?1.00 and m+n is an integer of 2-200, and Ar1 is a bivalent aromatic group, Ar2 is a bivalent aromatic group having a phenolic hydroxyl group and Ar3 is a bivalent aromatic group) and (b) a hydrogenated butadiene polymer segment.

Abstract: Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In farther embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).

Abstract: Coating materials for the coil coating process, comprising (A) as binder at least one aliphatic, araliphatic and/or aromatic polyester having an acid number of <10 mg KOH/g, a hydroxyl number of from 30 to 200 mg KOH/g, and a number-average molecular weight Mn of between 1000 and 5000 daltons, (B) as crosslinking agent at least two amino-containing resins of different reactivity, processes for preparing them, and their use as coil coating materials.

Abstract: An epoxy prepolymer having excellent thermal conductivity is obtained by reacting an epoxy compound having a mesogenic skeleton and a trinuclear bisphenol represented by the following formula: (wherein each of R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11 and R12 represents a hydrogen atom or an alkyl group and each may be the same or different while at least one represents an alkyl group).

Abstract: The present invention provides an epoxy resin composition that is excellent in thermal conductivity and has improved high-temperature resistance and handleability. The epoxy resin composition comprises an epoxy compound having a mesogenic skeleton and a curing agent having a biphenylaralkyl skeleton. The biphenylaralkyl skeleton-containing curing agent preferably has a softening point of 110° C. or lower. The biphenylaralkyl skeleton-containing curing agent is preferably an amorphous curing agent.

Abstract: As a paint composition of cationic electrodeposition and a method preparing thereof, the paint composition of cationic electrodeposition comprises about 42 to about 47 percent by weight of a cationic electrodeposition resin composition, about 6 to about 13 percent by weight of a pigment paste composition, and about 40 to about 48 percent by weight of ion exchange water. An electronic part film coated by utilizing the paint composition of cationic electrodeposition on alloy such as an iron, an aluminum, etc. does not include a lead and a tin. In addition, when assembling electronic parts, an error rate is minimized by inhibiting frictional static electricity through anti-static capacity, and the probability of a fire is dirninished by inhibiting static electricity.

Abstract: A composition includes a cross-linkable epoxy resin, a polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer, and a filler material. The polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer has a concentration ratio of from about 1:1:1 to about 1:1:1.5.

Abstract: A resin composition excellent in heat resistance after moisture absorption, lead-free solder reflow properties, dimensional stability and electrical characteristics for high-multilayer and high-frequency-capable printed wiring boards, which composition comprises a bisphenol A type epoxy resin (a) having at least two epoxy groups per molecule and a secondary hydroxyl group amount of 0.4 meq/g or less, a novolak type epoxy resin (b) at least two epoxy groups per molecule, a cyanate ester resin (c) having at least two cyanate groups per molecule and spherical silica having an average particle diameter of 4 ?m or less, wherein the equivalent ratio of cyanate groups/epoxy groups in the resin composition is in the range of 0.7 to 1.45, and a prepreg and a metal-foil-clad laminate each of which comprises the resin composition.

Abstract: A metallized barrier material comprising a base material, a metallized layer and a protective coating. The base material has a first surface and a second surface. The metallized layer is vapor deposited on the first surface of the base material to a desired optical density. The protective coating is applied to the metallized layer, wherein the protective coating comprises a butyl methacrylate or a combination of an epoxy component and an acrylic component wherein the epoxy component has an EEW of less than 800.

Abstract: One embodiment relates to a coating composition, comprising a novolac epoxy resin comprising silicon carbide powder; an amine curing agent, said agent comprising at least a cycloaliphatic amine; a hydrophobic silica thixotrope agent; and an aluminum oxide powder having the following mesh retention characteristics, based on the weight of the aluminum oxide powder: about 0 wt. % size 10 mesh, ? about 5 wt. % size 16 mesh, ? about 20 wt. % size 18 mesh, ? about 10 wt. % size 20 mesh, and ? about 5 wt. % size 30 mesh. Other embodiments relate to making and using the coating composition, and coatings made from the coating composition.

Abstract: A thermal conductive dielectric coated metal-plate includes a metal carrier, and a partially cured dielectric layer coated to the metal carrier. The dielectric layer includes an epoxy resin, a filler, and a coupling agent.

Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.

Abstract: It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

Abstract: Coated articles are provided comprising: (a) a substrate having two opposing surfaces; (b) a first curable film-forming composition applied to one surface of the substrate, the first curable film-forming composition comprising: (i) a resinous binder comprising a polyepoxide, a polyamideimide, a polyimide, and/or a polysiloxane; (ii) optionally, a curing agent having functional groups reactive with functional groups on the resinous binder in (a); and (iii) a metallic reflective pigment; and (c) a second curable film-forming composition applied to the opposing surface of the substrate, the second curable film-forming composition comprising: (i) a polyepoxide containing at least two epoxide groups per molecule; (ii) a thermoplastic polyester polymer; (iii) a curing agent having functional groups reactive with the epoxide groups in (c)(i); (iv) a mineral filler; and (v) microspheres comprising expandable microspheres and/or hollow microspheres.

Abstract: A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; and (c) a catalytic amount of a catalyst system comprising a combination of: (i) at least a first catalyst compound comprising at least one nitrogen-containing catalyst compound; and (ii) at least a second catalyst compound comprising at least one phosphorus-containing catalyst compound; wherein at least one or more of the above components (a)-(c) is halogenated or contains halogen; or if none of the above components are halogenated wherein the resin composition includes (d) a halogenated or halogen-containing flame retardant compound that does not contain nitrogen. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 170° C.

Abstract: An oligomeric halogenated chain extender composition comprising the reaction product of: (a) an excess of a halogenated phenolic compound; and (b) a halogenated epoxy resin; in the presence of (c) a solvent; and a halogenated epoxy resin composition comprising the reaction product of the oligomeric halogenated chain extender composition with an epoxy resin.

Abstract: Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.

Abstract: A resin coated metal plate having excellent formability comprises, on a metal plate, a resin coating layer containing a conductive filler and a corrosion inhibitor, a matrix resin constituting the resin coating layer is made mainly of a flexible epoxy resin and has a modulus of elasticity of not less than 3 GPa. When secondarily cured, the resin coated metal plate is imparted with excellent weldability and corrosion resistance.

Abstract: The present invention is directed to a compound serving as both a flame retardant and a curing agent (a crosslinking agent) for curable resin, a method for producing the compound, a flame-retardant curable resin composition containing the compound, and a cured product and a laminate sheet having flame retardancy produced through curing the cured resin composition. The compound has a benzoxazine structure and a phosphine oxide structure in a molecule thereof.

Abstract: [Problem] A composite of a metal part and a resin composition part that is improved so that the metal and resin are integrally joined to have strong bonding properties, and a method for manufacturing the composite. [Solution] A magnesium alloy part is inserted into a mold, a resin composition is injected and joined to the part, and a composite is obtained. A part having, formed thereon, a surface layer of a metal oxide, a metal carbonate, or a metal phosphate in use of a usual conversion treatment or a modification method thereof can be used for the magnesium alloy plate 1. The surface that has a larger amount of crystal-like objects of a nanolevel on the surface layer composed of the metal oxide, metal carbonate, or metal phosphate has a higher level of hardness, microscopic roughness, and good injection joining force, and these parameters can be controlled by a conversion treatment method. A resin composition 4, containing PBT or PPS as the main component, is used as the resin composition part.

Abstract: The invention is directed to an integrated lightning strike protection system adapted for automated placement on a composite structure comprising a surfacing layer consisting of an organic polymer resin, a conductive layer of an expanded metal foil, an isolation/tack layer, and a carrier paper layer. In another embodiment of the invention, there is provided an integrated lightning strike protection system comprising an integrated lightning strike protection material consisting of an expanded metal foil encapsulated in organic polymer resin mounted on a carrier paper, and an automated placement machine suitable for placing the material on an aircraft composite part for protection of the composite part from lightning strikes. In another embodiment of the invention, there is provided a method for fabricating a composite structure with lightning strike protection.

Abstract: An intumescent coating in the form of an initially liquid coating which cures to a solid and adheres to a substrate. The coating includes a flexible thermosetting epoxy, such as diglycidyl ether of bisphenol-A (DGEBA), with an aliphatic amine curing agent, expandable graphite flakes with reagent chemicals that react upon heating and decompose into gaseous products, and fumed silica. In the presence of heat or flame, an intumescent layer develops at the coating surface, insulating the substrate. The coating is found to add intumescent characteristics which provide heat resistant and fire retardant qualities.

Abstract: A coating composition comprising an effective corrosion-inhibiting amount of a carbon pigment is provided. In one embodiment, the corrosion-inhibiting carbon pigment is further comprising other components such as extenders, including neutral to slightly acidic generating extenders and acidic generating extenders, are earth compounds, amino acids and amino acid derivatives, gelatin and gelatin derivatives, organic-based exchange resins, and combinations thereof, to enhance the corrosion resistance of the resultant coating film. In one embodiment, the carbon pigment is a surface-modified carbon pigment. The coating compositions have good adhesion to substrates such as metals, including aluminum and aluminum alloys.

Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

Abstract: The invention relates to aqueous coating compositions for producing primer and/or filler layers in a multi-layer coating, in particular in vehicle coating, comprising the following components: A) at least one water-dilutable epoxy resin, B) at least one polyamine curing agent, C) optionally, at least one water-dilutable polyurethane resin, D) water and E) optionally, pigments, fillers, conventional paint additives and/or organic solvents, wherein the polyamine curing agent B) comprises: B1) 5-95% by weight of at least one amino functional compound with at least two secondary and/or primary amino groups and B2) 95-5% by weight of at least one water-dilutable (meth)acrylic copolymer, wherein the percentages by weight of components B1) and B2) are based on the solids and add up to 100% by weight.

Abstract: Disclosed herein is a composition, including a fluorine-based polymer or a perfluoropolyether (PFPE) derivative and a PFPE-miscible polymer, an anti-oxide film and electronic component including the same, and methods of forming an anti-oxide film and an electronic component. Use of the composition may achieve formation of an anti-oxide film through a solution process and electronic components using a metal having increased conductivity and decreased production costs.

Abstract: An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 ?m and a specific surface area of 8 to 30 m2/g. The epoxy resin composition has a higher apparent viscosity than the resins and can hence be inhibited from sagging in a drying oven. This composition retains the intact property of infiltration into reinforcements because the viscosity of the resins themselves has not increased locally. The composition hence produces the effect of improving the appearance of a prepreg.

Abstract: A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; (c) a catalytic amount of a nitrogen-containing catalyst; (d) a non-nitrogen containing catalyst adjuvant compound capable of reducing the concentration of the nitrogen-containing catalyst; wherein at least one of the above components (a)-(d) is halogenated or wherein the resin composition includes (e) a halogenated flame retardant compound. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 1700C; and the resultant cured product formed by curing the curable epoxy resin composition contains well-balanced properties. The composition may be used to obtain a prepreg or a metal-coated foil, or a laminate by laminating the above prepreg and/or the above metal-coated foil.

Abstract: Disclosed are methods of treating a metal to improve the metal's corrosion resistance. In one such method, the method is carried out by applying, to the surface of the metal, a coating which includes magnesium powder and a UV-curable or other radiation-curable binder. In another such method, the method is carried out by applying, to the surface of the metal, a coating which includes magnesium powder and an inorganic binder. In another such method, a coating that includes a magnesium alloy powder and a binder is applied to the surface of the metal. The magnesium alloy powder is selected such that it has a corrosion potential that is from about 0.01 volt to about 1.5 volt more negative than the metal's corrosion potential. Also disclosed are methods of treating a ferrous metals and magnesium alloys to improve the corrosion resistance of these materials.

Abstract: Improved multi-component compositions are provided for treating metallic surfaces subjected to contact with hydrocarbons, such as producing well casings and downhole equipment, and transmission lines. The compositions include an epoxy, a cross-linking or curing agent for the epoxy (e.g., ethoxylated tallow amine), and a scale inhibitor including phosphonic acid or phosphonate moieties (e.g., an organic phosphonate such as DETA phosphonate). The compositions may be added to a well or transmission line as a unitary, three-component mixture, or the epoxy may be initially added, followed by the cross-linking or curing agent, and the scale inhibitor.

Abstract: The invention describes a bearing element (1), comprising a protective layer (2), a bearing metal layer (3) applied over the protective layer (2) and a sliding layer (4) applied by sputtering over the bearing metal layer (3). A sliding paint layer (5) is applied onto the sliding layer (4).

Abstract: A coating composition containing an epoxy resin and a curing agent comprising a trimer fatty triamine and/or higher oligomeric amine. The coating composition is particularly suitable for use as a primer coating layer on concrete and steel.

Abstract: [Object of the Invention] An object of the present invention is to provide a slide member having a protective coat with good sticking resistance and wear resistance. [Disclosure of the Invention] A slide member comprises a base and a protective coat formed on the sliding surface side end surface of the base. The protective coat comprises a resin middle layer made of a mixture of fusible alloy, thermal conductive filler and heat resisting resin for middle layer, and a solid lubricant surface layer formed on the resin middle layer and made of a mixture of solid lubricant and heat resisting resin for surface layer.

Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

Abstract: The present invention provides a polymer membrane enhanced with cured epoxy resin for use as the outer membrane of biosensors. The membrane includes approximately 30-80% epoxy resin adhesives, 10-60% polymer such as poly(vinyl chloride), polycarbonate and polyurethane and 0-30% plasticizers and 5-15% surface modifier reagent such as polyethylene oxide-containing block copolymers. Utilizing the polymer membrane of the present invention, a three-layered sensing element has been developed. This sensing element will be particularly useful for miniaturized biosensors used for in vitro blood measurements or for continuous in vivo monitoring such as implantable biosensors. This element includes an enzyme layer, an interference-eliminating layer and the novel polymer member of the present invention as the outer polymer layer. This novel sensing element shows excellent response characteristics in solutions and has an extremely long lifetime.

Abstract: A transparent conductive film comprising a polymer film and a transparent conductive layer provided thereon, especially a transparent conductive film improved in durability and mechanical and electrical properties, a process for the preparation thereof, and a touch panel provided with the transparent conductive film, as well as transparent conductive plate and the process for the preparation thereof. The transparent conductive film comprising a polymer film, an undercoat layer and a transparent conductive layer which are superposed in this order, and the undercoat layer contains a compound having at least one selected from an amino group and a phosphoric acid group.

Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.1 unit of a structure represented by the following formula (1) per molecular chain: wherein n is an integer of 9 or more, R1 is an organic substituent having an epoxy group, and R2 is a hydrogen atom or an organic substituent having an epoxy group.

Abstract: The present invention provides chip-resistant powder topcoats for corrosion resistant powder coated steel substrates, such as, for example, automotive suspension coil springs, comprising powder coatings formed from one or more wax and a resin component of one or more toughened epoxy resin. The present invention provides dual coatings of toughened epoxy powder basecoats and topcoats, which may be foamed and/or fiber reinforced. The powder used to form the chip resistant topcoat can further comprise up to 200 phr or, preferably, up to 75 phr of one or more extender, or 0.5 or more phr of one or more extender, such as barium sulfate, while fully retaining its chip resistant properties. In addition, the powder used to form the chip resistant topcoat can be a low temperature curing powder comprising one or more low temperature curing agent.

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate.

Abstract: Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal hydrate inorganic flame retardant, and a prepreg and copper-clad laminate using the same. The epoxy resin composition in accordance with the present invention exhibits excellent flame retardancy without use of a halogen flame retardant, and also advantageously provides well-balanced various physical properties which are to be required in copper-clad laminates, such as higher heat resistance and copper peel strength, and lead heat-resistant characteristics after moisture absorption.

Abstract: The surface-treated steel sheet has a zinc-based plated steel sheet, a surface-treatment coating being formed on the surface of the zinc-based steel sheet by applying and drying a surface treatment coating composition thereon, and a top coating being formed by applying and drying a coating composition for top coating on the surface-treatment coating. The surface treatment coating composition contains a water-epoxy resin dispersion, a silane coupling agent, and phosphoric acid and/or a hexafluorometal acid. The coating composition for top coating contains a high molecular weight epoxy group-containing resin having number average molecular weights ranging from 6000 to 20000.

Abstract: A mixture of zirconium hydroxides or zirconium basic carbonate with vanadium oxide (V205) co-reacts in high temperature aqueous slurry to form respectively an amorphous material, believed to be based on a zirconium analog of a zeolite structure, and a solid solution of zirconium oxide with vanadium oxide. The subject compositions, free of hexavalent chromium, are highly effective in providing blister-free corrosion prevention in typical coil and aerospace grade epoxy primer and color coat combinations.

Abstract: A mixture of Zinc Oxides or Hydroxides with Aluminum Hydroxides and Vanadium Oxide (V2O5) co-reacts in high temperature aqueous slurry to form highly crystalline forms of Hydrotalcite, containing the Decavanadate ion as a source of corrosion inhibition. The subject compositions, free of hexavalent chromium, are highly effective in providing blister-free corrosion prevention in typical coil and aerospace grade epoxy primer and color coat combinations.

Abstract: The present invention relates to a phenolic hydroxy group-containing rubber-modified polyamide resin which has, in the molecule, a phenolic hydroxy group-containing aromatic polyamide segment having a structure represented by the following formula (A) (wherein, m and n are average values and Ar represents a divalent aromatic group) and a butadiene (co)polymer segment selected from the following formula (B-1) or (B-2), —(CH2—CH?CH—CH2)X—??(B-1) —(CH2—CH?CH—CH2)Y—(CH2—CH(CN))Z—??(B-2) (wherein, each of x, y and z is an average value and 0.01?z/(y+z)?0.13, x represents a positive number of 5 to 200, and also y+z is a positive number of 10 to 200), and a resin composition containing said resin, in particular an epoxy resin composition; a cured product of said epoxy resin composition is excellent in flexibility, heat resistance and electrical properties especially at high temperature and high humidity.

Abstract: The present invention relates generally to polymer composites having dispersed therein both useful spinel crystal fillers and ferroelectric (and/or paraelectric) fillers wherein the composite is both light activatable and can be used as a planar capacitor material. The light activation is typically employed via a laser beam (or other light emitting device) where the material has a pattern formed thereon. Electrodes are typically formed on the material's surface after patterning is complete via electroless metal plating. These composite polymers can be used as planar capacitors embedded in printed wiring boards or in integrated circuit packages.

Abstract: Multi-component epoxy-amine primer systems are disclosed, which comprise an amine component that comprises a polythioether. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems.

Abstract: Process for the anodic electro-dipcoating of conducting surfaces by dipping in an aqueous anodic electro-dipcoating bath and connecting up as the anode, in which an aqueous anodic electro-dipcoating bath is used that contains 1 to 15 wt. %, referred to the binder solids of the electro-dipcoating bath, of one or more phosphoric acid epoxy esters and/or phosphonic acid epoxy esters that have been produced in the presence of alcohols.