Abstract: A power storage device includes a plurality of power storage units and a plurality of disconnection units. The plurality of power storage units are electrically connected in parallel between a pair of connection points. The plurality of disconnection units each connect to a corresponding power storage unit in the plurality of power storage units. Each of the plurality of disconnection units is configured to electrically disconnect between the corresponding power storage unit and at least one of the pair of connection points in accordance with flowing of a current at a value more than or equal to a predetermined value in the corresponding power storage unit.

Abstract: The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, the thickness is 10 ?m or less, a problem of a bend is suppressed, the front side and the rear side are flat, the tensile strength is 500 MPa or more, and the elongation percentage is 5.5% or more. The method for producing an electrolytic copper foil includes forming an electrolytic copper foil by using, as an electrolytic solution, a sulfuric acid-copper sulfate aqueous solution not containing a heavy metal other than a copper metal, using an insoluble anode and a cathode drum facing the insoluble anode, and passing a direct current between these electrodes, wherein, in the electrolytic solution, particular additives (A) to (E) are contained each in a particular amount, and the additive (D) and the additive (A) are each added in a ratio such that (D)/(A) is 0.2 to 0.7.

Abstract: A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.

Abstract: The present invention relates to an electrolytic copper foil for a secondary battery, and a method of producing the same. The electrolytic copper foil for a secondary battery exhibits a little change in a physical property caused by a difference in a crosshead speed when tensile strength and an elongation percentage of the electrolytic copper foil are measured, thereby achieving excellent charging and discharging characteristics of a battery and preventing exfoliation of an active material. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC), cobalt, and iron by using a drum, in which a ratio of the TOC to the cobalt and the iron contained in the electrolytic copper foil follows Formula 1 below. TOC/(cobalt+iron)=1.3 to 1.

Abstract: Provided is a titanium copper foil which has required high strength when used as a spring, has an improved etching property, and has decreased settling, and which can be suitably used as a conductive spring material for use in electronic device parts such as autofocus camera modules. The titanium copper foil according to the present invention contains from 1.5 to 5.0% by mass of Ti, the balance being Cu and inevitable impurities, wherein in a Ti concentration curve obtained by analyzing a cross section parallel to a rolling direction along a thickness direction by STEM-EDX, a lower concentration Ti layer having a Ti concentration less than an average value of Ti concentrations in the Ti concentration curve and a higher concentration Ti layer having a Ti concentration equal to or higher than the average value of the Ti concentrations in the Ti concentration curve are alternately present in a thickness direction, and wherein the titanium copper foil satisfies 1.0% by mass?HH?30% by mass, and HH/HL?1.

Abstract: The present invention relates to an electrolytic copper foil for a secondary battery, having excellent flexural resistance, and a method for producing the electrolytic copper foil. The electrolytic copper foil for a secondary battery has excellent flexural resistance even without the use of many additives in a copper electrolyte when producing a copper foil. The electrolytic copper foil for a secondary battery according to the present invention is an electrolytic copper foil for a secondary battery, which is produced from a plating solution, containing total organic carbon (TOC), cobalt and arsenic, by using a drum and is coated with a negative electrode active material, wherein the ratio between the TOC, cobalt and arsenic contained in the electrolytic copper foil follows the following formula 1: TOC/(cobalt+arsenic)=1.30-1.55.

Abstract: An advanced electrodeposited copper foil having island-shaped microstructures and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil includes a micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups which are in a non-uniform distribution and form into island-shaped patterns.

Abstract: Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 ?m3/?m2 to 1.17 ?m3/?m2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 ?m.

Abstract: A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 ?m or more, diameters of 10 ?m or below, and inter-pillar spacing below 20 ?m. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

Abstract: The present invention relates to an electrolytic copper foil for a secondary battery, having excellent flexural resistance, and a method for producing the electrolytic copper foil. The electrolytic copper foil for a secondary battery has excellent flexural resistance even without the use of many additives in a copper electrolyte when producing a copper foil. The electrolytic copper foil for a secondary battery according to the present invention is an electrolytic copper foil for a secondary battery, which is produced from a plating solution, containing total organic carbon (TOC), cobalt and arsenic, by using a drum and is coated with a negative electrode active material, wherein the ratio between the TOC, cobalt and arsenic contained in the electrolytic copper foil follows the following formula 1: TOC/(cobalt+arsenic)=1.30?1.55.

Abstract: An electronic component including a thin-film shield layer includes a wiring substrate, surface mount devices mounted to a first principal surface of the wiring substrate, a metal thin-film shield layer, and a magnetic metal thin-film shield layer. The metal thin-film shield layer includes a nonmagnetic metal material and entirely covers the surface mount devices at the top surface side and lateral surface side thereof. The metal thin-film shield layer includes a top surface portion and a lateral surface portion. The magnetic metal thin-film shield layer includes a magnetic metal material and covers the top surface portion and the lateral surface portion of the metal thin-film shield layer, including an entire edge portion at which the top surface portion and the lateral surface portion are joined to each other.

Abstract: A method of additive manufacturing that deposits material onto a cathode by transmitting current from an anode array through an electrolyte to the cathode; the method uses feedback to control the manufacturing of successive layers of a part. For example, feedback signals may be a map of current across the anode array; this current map may be processed using morphological analysis or Boolean operations to determine the extent of deposition across the layer. Feedback data may be used to determine when a layer is complete, and to adjust process parameters such as currents and voltages during layer construction. Layer descriptions may be preprocessed to generate maps of desired anode current, to manipulate material density, and to manage features such as overhangs. Feedback signals may also trigger execution of maintenance actions during the build, such as replenishment of anodes or removal of films or bubbles.

Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.

Abstract: A metal nanowire according to an embodiment of the invention includes at least one bent portion. An angle (?) between an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion through an n-th bent portion satisfies an inequation of 0°<?<180°.

Abstract: A vertically structured, aluminum nitride-based semiconductor deep ultraviolet light-emitting device is provided that exhibits a high light emission efficiency and an improved yield. The aluminum nitride-based semiconductor deep ultraviolet light-emitting device includes: a conductive support substrate; a porous metal film having a conductive macroporous structure with a pore rate of from 10% to 50% inclusive; and an aluminum nitride-based semiconductor layer structural body with a light-emitting layer, the conductive support substrate and the aluminum nitride-based semiconductor layer structural body being bonded with the porous metal film interposed therebetween for electrical connection, wherein the aluminum nitride-based semiconductor deep ultraviolet light-emitting device has an emission peak wavelength of from 220 nm to 300 nm inclusive.

Abstract: Provided is an electromagnetic wave shielding material including a multilayer structure in which at least one metal foil and at least two resin layers are closely laminated, wherein both surfaces of each metal foil are closely laminated to the resin layers; wherein each metal foil satisfies the following relationship with each of the two resin layers adjacent to the metal foil: 0.02?VM/VM??1.2, in which: VM is a volume fraction of the metal foil relative to a total volume of the metal foil and the resin layer; VM? is (?R??R?)/(?M+?R??R?); ?M is a true stress (MPa) of the metal foil at breakage when a tensile stress is applied to the metal foil; ?R is a true stress (MPa) of the resin layer at breakage when a tensile stress is applied to the resin layer; and ?R? is a true stress (MPa) of the resin layer when a logarithmic strain same as a logarithmic strain at breakage of the metal foil is applied to the resin layer.

Abstract: The invention provides a surface-treated copper foil for a battery cell that is capable of providing good adhesiveness to an active substance and undergoes less detachment of roughening particles. The surface-treated copper foil for a battery cell according to one or more embodiments of the present application contains a copper foil and a surface treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains a primary particle layer and a secondary particle layer, and the surface of the surface treatment layer has a ten-point average roughness Rz of 1.8 ?m or more measured with a laser microscope with a wavelength of 405 nm according to JIS B0601 1994.

Abstract: A vertically structured, aluminum nitride-based semiconductor deep ultraviolet light-emitting device is provided that exhibits a high light emission efficiency and an improved yield. The aluminum nitride-based semiconductor deep ultraviolet light-emitting device includes: a conductive support substrate; a porous metal film having a conductive macroporous structure with a pore rate of from 10% to 50% inclusive; and an aluminum nitride-based semiconductor layer structural body with a light-emitting layer, the conductive support substrate and the aluminum nitride-based semiconductor layer structural body being bonded with the porous metal film interposed therebetween for electrical connection, wherein the aluminum nitride-based semiconductor deep ultraviolet light-emitting device has an emission peak wavelength of from 220 nm to 300 nm inclusive.

Abstract: An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.

Abstract: An electrolytic copper foil for a lithium secondary battery has yield strength of 30 kgf/mm2 to 60 kgf/mm2, a surface area ratio of 1 to 3, and a weight deviation of 3% or below.

Abstract: A nickel particle composition is shown, including: A) a nickel particle having an average particle size in the range of 0.5 ?m to 20 ?m obtained via a laser diffraction/scattering method and containing 50 wt % or more of a nickel element; B) a nickel fine particle having an average primary particle size in the range of 30 nm to 200 nm observed via a scanning electron microscope and containing 50 wt % or more of a nickel element; and C) an organic binder in the range of 0.1 wt % to 2.5 wt % relative to the total metal content; and the weight ratio of a component A to a component B (component A:component B) is in the range of 30:70 to 70:30.

Abstract: A diaphragm for loudspeaker contains resin and single-crystal diamond powder dispersed in the resin.

Abstract: The present disclosure relates to an improved electrodeposited copper foil having uniform thickness and methods for manufacturing the electrodeposited copper foil. The electrodeposited copper foil typically has one to four interfacial lines through the cross-sectional area of the foil and a weight deviation less than 2.0%. The disclosure also relates to a process for making the electrodeposited copper foil that includes the addition of one or more insulative masks to the surface of a dimensionally stable anode. The insulative mask is cut to correspond to areas of variation in electrodeposited copper foil, such that the mask causes interferences with the electrodeposition process to even out the variation.

Abstract: A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.

Abstract: Methods for direct deposition of a metal silicide nanowire for back-end interconnection structures for semiconductor applications are provided. In one embodiment, the method includes positioning a substrate in a processing region of a process chamber, the substrate having a first surface comprising a non-dielectric material; and a dielectric layer formed on the first surface. An opening is formed in the dielectric layer, the opening exposing at least a portion of the first surface, the opening having sidewalls. A metal silicide seed is deposited in the opening using a PVD process, wherein the PVD process is performed with either no bias or a bias which creates deposition on the sidewall which is less than 1% of the deposition on the first surface. A metal silicide layer is then selectively deposited on the metal silicide seed using a metal-silicon organic precursor, creating the metal silicide nanowire.

Abstract: Metal foil provided with an electrically resistive layer, characterized in that an alloy (in particular, a NiCrAlSi alloy) resistive layer containing 1 to 6 mass % of Si is formed on the metal foil controlled to have a ten-point average roughness Rz, which was measured by an optical method, of 4.0 to 6.0 ?m, and the variation in the resistance value of the electrically resistive layer is within ±10%. Provided is a copper foil that allows embedding of a resistive material in a board by further forming an electrically resistive layer on the copper foil, and further allows improving the adhesiveness and suppressing the variation in resistance value within a certain range. As needed, metal foil provided in advance with a copper-zinc alloy layer formed on the surface thereof and a stabilizing layer composed of at least one component selected from zinc oxide, chromium oxide, and nickel oxide formed on the copper-zinc alloy layer is used.

Abstract: A wire includes a ferrous core. The ferrous core can be coated. The coatings can include nickel, molybdenum, zinc and Fe. A process of forming a wire can include placing a metal strip alongside a ferrous wire core, bending the strip around the core, and seam welding the strip to form a metal tube around the core. The process of forming a wire can include applying a metal layer to a ferrous metal rod to form a plated rod, placing a metal strip alongside the rod, bending the strip around the rod, and seam welding the strip to form a metal tube around the rod. The process of forming a wire can include coating a ferrous wire core with a layer of nickel, molybdenum or a nickel alloy that circumferentially surrounds the ferrous wire core.

Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.

Abstract: The zirconium content of the alloy composition of a copper alloy foil of the present invention is 3.0 to 7.0 atomic percent, and the copper alloy foil includes copper matrix phases and composite phases composed of copper-zirconium compound phases and copper phases. As shown in FIG. 1, the copper matrix phases and the composite phases form a matrix phase-composite phase layered structure and are arranged alternately parallel to a rolling direction as viewed in a cross-section perpendicular to the width direction. In addition, the copper-zirconium compound phases and the copper phases in the composite phases form a composite phase inner layered structure and are arranged alternately parallel to the rolling direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double layered structure presumably makes the copper alloy foil densely layered to provide a strengthening mechanism similar to multilayer reinforced composite materials.

Abstract: The zirconium content of the alloy composition of a copper alloy wire is 3.0 to 7.0 atomic percent; and the copper alloy wire includes copper matrix phases and composite phases composed of copper-zirconium compound phases and copper phases. The copper matrix phases and the composite phases form a matrix phase-composite phase fibrous structure and are arranged alternately parallel to an axial direction as viewed in a cross-section parallel to the axial direction and including a central axis. The copper-zirconium compound phases and the copper phases in the composite phases also form a composite phase inner fibrous structure and are arranged alternately parallel to the axial direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double fibrous structure presumably makes the copper alloy wire densely fibrous to provide a strengthening mechanism similar to the rule of mixture for fiber-reinforced composite materials.

Abstract: A battery adapted to operate at low (typically ambient) temperatures for a short initial period and thereafter at higher temperatures. A Li—Mg alloy anode is provided, including up to 25% magnesium, in a liquid thionyl chloride bath which acts as the cathode. A thin, substantially pure lithium layer is applied to a surface of the Li—Mg anode, preferably of a thickness in the range of 0.0019 to 0.0025 inch to allow obtaining of sufficiently high power and voltage output at lower temperatures for a short period where at such lower temperatures the required voltage and power would not otherwise be available from a Li—Mg anode. Thereafter, the battery may be used in, and exposed to, higher temperatures where at such temperatures the necessary voltage and power from the remaining Li—Mg alloy anode is then available.

Abstract: Copper conductor members or other copper-based workpieces are welded using a suitable copper alloy material that is reactive with the joining surfaces of the copper members. The reactive metal material may be applied as a thin metal foil strip between assembled facing joining surfaces. The members are pressed together against the reactive material and electrical resistance heated in forming the weld. Practices are adapted for forming many such welds in the pairs of facing ends of conductor bars or wires assembled, for example, in slots in a stator for a vehicle traction motor. Practices are disclosed for shaping and automated placement of suitably sized and shaped foils of reactive metal. Practices are also disclosed for use of a resistance welding tool in aligning and heating the many pairs of conductors to be welded.

Abstract: At least one foil surface of an aluminum foil is roughened; and in arithmetic mean roughnesses Ra, stipulated in JIS B 0601:2001, of the roughened surface(s), A, which is the arithmetic mean roughness Ra measured in a direction at a right angle to a rolling direction during foil rolling, and B, which is the arithmetic mean roughness Ra measured in a direction parallel to the rolling direction during foil rolling, satisfy the following relationships: 0.15 ?m?A?2.0 ?m; 0.15 ?m?B?2.0 ?m; and 0.5?B/A?1.5. Preferably 50-1000 ?g/m2 of oil is adhered to the roughened foil surface. The oil is preferably rolling oil.

Abstract: A steel fiber for reinforcing concrete or mortar comprises a middle portion and an anchorage end at one or both ends of the middle portion. The middle portion has a main axis. The anchorage end is deflecting from the main axis of the middle portion in a deflection section. The anchorage end has n bent sections, with n equal or larger than 2. The steel fiber is configured so that when the steel fiber is in a stable position on a horizontal surface being vertically projected on this horizontal surface, the vertical projections in this horizontal surface of all of the n bent sections of an anchorage end are located at one side of the vertical projection in this horizontal surface of the main axis of the middle portion.

Abstract: An electrolytic copper foil, which is particularly suitable for the application of a lithium ion secondary battery, has a shiny side and a matte side with a roughness of less than 2 ?m. Based on the total sum of the texture coefficients of a (111) surface, a (200) surface, a (220) surface and a (311) surface of the electrolytic copper foil, the sum of the texture coefficients of the (220) surface and the (311) surface of the electrolytic copper foil is greater than 60%.

Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Abstract: Provided is stainless steel foil that is suitably used for forming a catalyst carrier for an exhaust gas purifying facility, the catalyst carrier being installed in a vehicle that discharges exhaust gas having a temperature lower than the temperature of exhaust gas of a gasoline-powered automobile. The ferritic stainless steel foil contains, by mass %, C: 0.05% or less, Si: 2.0% or less, Mn: 1.0% or less, S: 0.005% or less, P: 0.05% or less, Cr: 11.0% to 25.0%, Ni: 0.05% to 0.30%, Al: 0.01% to 1.5%, Cu: 0.01% to 2.0%, N: 0.10% or less, and the balance being Fe and inevitable impurities.

Abstract: A method of producing a Pepper's Ghost Illusion comprising using a reflective and semi-transparent foil formed from a polymeric composite, the polymeric composite including a flame retardant.

Abstract: A metal sheet at least part of which is embossed with an embossing pattern that includes undulations which are mutually arranged closely adjacent to each other so that in use egress of fluid from the plane of the sheet is omnidirectionally controlled.

Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided.

Abstract: A copper foil for producing graphene including Cu having a purity of 99.95% by mass or more.

Abstract: An artificial marble chip of the present invention comprises curable resin, metal fiber and/or inorganic fiber, and inorganic filler. The metal fiber and/or inorganic fiber preferably have an average length of about 1 to about 6 mm and an average particle diameter of about 10 to about 15 ?m. An artificial marble according to the present invention is produced by using the artificial marble chip, curable resin matrix, and inorganic filler as main components. The curable resin is preferably selected from acrylic resin, unsaturated polyester resin, epoxy resin, or a copolymer thereof. The artificial marble according to the present invention is produced by the steps of: producing an artificial marble composition by mixing the artificial marble chip, the inorganic filler, and other additives into the curable resin matrix; and curing the composition at about 25 to about 180° C. The invention can also include the step of defoaming the composition prior to curing.

Abstract: An Ag alloy film for use in reflective electrodes is provided, which has a low electrical resistivity and a high reflectance that are almost at the same levels as those of an Ag film, and has excellent oxidation resistance. An Ag alloy film for reflective electrodes, which can be used in a reflective electrode and is characterized in that at least one element selected from the group consisting of In and Zn is contained in an amount of 0.1 to 2.0 atomic %.

Abstract: The present invention provides an electrodeposited copper foil for a flexible wiring board, wherein handling in manufacturing and processing lines is easy, good bending and flexing are provided with heating during a film adhesion step, small electric devices can be accommodated, excessive coarsening of a crystal grain structure is minimized, and excellent fine pattern characteristics are provided. The electrodeposited copper foil of the present invention having excellent bending and flexing characteristics is such that a crystal distribution before heating (unprocessed) is such that a number of crystal grains less than 2 ?m in diameter within a range of 300 ?m×300 ?m is 10,000 or greater and 25,000 or less, and a crystal distribution after heating for 1 hr at 300° C. is such that the number of crystal grains less than 2 ?m in diameter within a range of 300 ?m×300 ?m is 5,000 or greater and 15,000 or less.

Abstract: A rolled copper foil composed of crystal particles of copper or a copper alloy, wherein an average particle size of the crystal particles composing the outermost surface is not less than 0.2 ?m and not greater than 6 ?m; a ratio of the average particle size of the crystal particles composing the outermost surface to a thickness of the rolled copper foil is not less than 1% and not greater than 6%; and an intragranular distortion rate found by the following formula (1) when a cross-section perpendicular to a length direction of the rolled copper foil is analyzed by electron backscatter diffraction (EBSD) is not less than 0.5% and not greater than 10%.

Abstract: Method for producing an aluminum foil with integrated security features. An aluminum foil is rolled to a thickness of less than 150 ?m in multiple cold rolling passes, and simultaneously a texture which runs in the rolling direction is produced on both faces of the foil. A loose composite formed from at least two of the aluminum foils, is fed into a pair of working rollers in a final cold rolling pass, wherein the relief-like surface structure which is produced in the rolling direction via a polishing process has been reduced by 10 to 50% with respect to the average roughness height in one region in a contrast- and motif-dependent manner on at least one roller surface in order to form a motif for a security feature. The security feature is transferred onto the aluminum foil face facing the roller surface, and the loose composite of aluminum foils is separated.

Abstract: Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate and a halide, such as sodium chloride. The anode foil is etched in the electrolyte bath composition by passing a charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

Abstract: Roll-to-roll fabrication of predetermined or ordered three-dimensional nanostructure arrays is described. Provided methods can comprise imprinting a substrate with a two-dimensional (2-D) pattern by rolling a cylindrical pattern comprising a 2-D array of structures against a substrate. In addition, control or determination of nanostructure parameters via control of process parameters is provided.

Abstract: Fatigue damage resistant metal or metal alloy wires have a submicron-scale or nanograin microstructure that demonstrates improved fatigue damage resistance properties, and methods for manufacturing such wires. The present method may be used to form a wire having a nanograin microstructure characterized by a mean grain size that is 500 nm or less, in which the wire demonstrates improved fatigue damage resistance. Wire manufactured in accordance with the present process may show improvement in one or more other material properties, such as ultimate strength, unloading plateau strength, permanent set, ductility, and recoverable strain, for example. Wire manufactured in accordance with the present process is suitable for use in a medical device, or other high end application.

Abstract: An electrical steel sheet has a component composition including, by mass %, C: 0.007% or less, Si: 4% to 10%, and Mn: 0.005% to 1.0%, the balance being Fe and incidental impurities, as well as a sheet thickness within a range of 0.01 mm or more to 0.10 mm or less, and a profile roughness. Pa of 1.0 ?m or less. The electrical steel sheet exhibits excellent iron loss properties whereby the magnetic property is free from deterioration, and degradation of the stacking factor can be avoided, even when the steel sheet with a thickness of 0.10 mm or less has been subjected to siliconizing treatment to increase the Si content in the steel.