Abstract: Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate and a halide, such as sodium chloride. The anode foil is etched in the electrolyte bath composition by passing a charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

Abstract: Roll-to-roll fabrication of predetermined or ordered three-dimensional nanostructure arrays is described. Provided methods can comprise imprinting a substrate with a two-dimensional (2-D) pattern by rolling a cylindrical pattern comprising a 2-D array of structures against a substrate. In addition, control or determination of nanostructure parameters via control of process parameters is provided.

Abstract: Fatigue damage resistant metal or metal alloy wires have a submicron-scale or nanograin microstructure that demonstrates improved fatigue damage resistance properties, and methods for manufacturing such wires. The present method may be used to form a wire having a nanograin microstructure characterized by a mean grain size that is 500 nm or less, in which the wire demonstrates improved fatigue damage resistance. Wire manufactured in accordance with the present process may show improvement in one or more other material properties, such as ultimate strength, unloading plateau strength, permanent set, ductility, and recoverable strain, for example. Wire manufactured in accordance with the present process is suitable for use in a medical device, or other high end application.

Abstract: Described are ZnxCd1-xSySe1-y/ZnSzSe1-z core/shell nanocrystals, CdTe/CdS/ZnS core/shell/shell nanocrystals, optionally ally doped Zn(S,Se,Te) nano- and quantum wires, and SnS quantum sheets or ribbons, methods for making the same, and their use in biomedical and photonic applications, such as sensors for analytes in cells and preparation of field effect transistors.

Abstract: An electrical steel sheet has a component composition including, by mass %, C: 0.007% or less, Si: 4% to 10%, and Mn: 0.005% to 1.0%, the balance being Fe and incidental impurities, as well as a sheet thickness within a range of 0.01 mm or more to 0.10 mm or less, and a profile roughness. Pa of 1.0 ?m or less. The electrical steel sheet exhibits excellent iron loss properties whereby the magnetic property is free from deterioration, and degradation of the stacking factor can be avoided, even when the steel sheet with a thickness of 0.10 mm or less has been subjected to siliconizing treatment to increase the Si content in the steel.

Abstract: A copper foil for producing graphene having a ratio (Ra1/Ra2) between an arithmetic mean roughness Ra1 in a rolling direction and an arithmetic mean roughness Ra2 in a direction transverse to rolling direction of 0.7 <=(Ra1/Ra2) <=1.3.

Abstract: The present invention provides metal nanowires containing at least metal nanowires having a diameter of 50 nm or less and a major axis length of 5 ?m or more in an amount of 50% by mass or more in terms of metal amount with respect to total metal particles.

Abstract: A ternary magnetic braze alloy and method for applying the braze alloy in areas having limited access. The magnetic braze alloy is a nickel-based braze alloy from the perminvar region of the Ni, Fe, Co phase diagram. The braze alloy includes, by weight percent 8-45% Fe, 0-78% Co, 2.0-4.0% of an element selected from the group consisting of B and Si and combinations thereof, and the balance Ni. The nickel-based braze alloy is characterized by a brazing temperature in the range of 1850-2100° F. The nickel-based braze alloy is magnetic below its Curie temperature.

Abstract: A copper foil for producing graphene, having 60 degree gloss of 500% in a rolling direction and a direction transverse to rolling direction, and an average crystal grain size of 200 ?m or more after heating at 1000° C. for 1 hour in an atmosphere containing 20% by volume or more of hydrogen and balance argon.

Abstract: A composite dual blackened copper foil includes a copper foil and two blackened layers. The copper foil has a shiny side and a matte side. The blackened layers are formed on the shiny and matte sides respectively. The blackened layers are formed alloy by electroplating in a plating bath consisting essentially of copper, cobalt, nickel, manganese, magnesium and sodium ions. A rough layer is selectively formed between the blackened layer and the shiny side as well as the matte side. Both side of the copper foil is spotless, powder free, and good in etching quality. The copper foil is effective at blocking electromagnetic wave, near infrared, undesired light and the like. The copper foil exhibits strong light absorption and is applicable to direct gas laser drilling. A method of manufacturing the composite dual blackened copper foil is also provided.

Abstract: A steel wire having a stainless steel exterior; the steel wire includes a core region that comprises at least 55 wt. % iron which is metallurgically bonded to a stainless steel coating that consists of a stainless steel region and a bonding region. The stainless steel region can have a thickness of about 1 ?m to about 250 ?m, and a stainless steel composition that is approximately consistent across the thickness of the stainless steel region. The stainless steel composition includes an admixture of iron and about 10 wt. % to about 30 wt. % chromium. The bonding region is positioned between the stainless steel region and the core region, has a thickness that is greater than 1 ?m and less than the thickness of the stainless steel region, and has a bonding composition.

Abstract: A copper foil for producing graphene, including oxides and sulfides each having a diameter of 0.5 ?m or more having a total number of 15/mm2 or less measured by using a scanning electronic microscope before heating at 1000° C. for 1 hour.

Abstract: An electrolytic copper foil is provided. The electrolytic copper foil has a shiny side and a matte side opposing to the shiny side, wherein the difference in roughness between the shiny side and the matte side is 0.5 ?m or less. The electrolytic copper foil has a tensile strength of 45 kg/mm2 or above, and is particularly suitable for applications in a lithium ion secondary battery.

Abstract: The metal fiber has fiber outer surfaces (1) oriented substantially at right angles to each other and can also be provided with bent ends in the shape of a clip. The metal fiber is used to stabilize, strengthen, or fasten materials such as concrete, wood and the like. The fiber edges (2) formed by the fiber outer surfaces (1) of the metal fiber and extending in the longitudinal direction of the fiber are designed as edge surfaces (4) oriented at an angle to the fiber outer surfaces (1) in the manner of a chamfer. Said edge surfaces (4) have projections, which form anchoring heads (3) that are anchored in the materials to be stabilized, strengthened, or fastened.

Abstract: A copper foil for producing graphene, including oxides and sulfides each having a diameter of 0.5 ?m or more having a total number of 15/mm2 or less measured by using a scanning electronic microscope before heating at 1000° C. for 1 hour in an atmosphere containing 20% by volume or more of hydrogen and balance argon.

Abstract: An object of the present invention is to provide an aluminum alloy foil for an electrode current collector, the foil having a high strength after the drying step while keeping a high electrical conductivity. Disclosed is a method for manufacturing an aluminum alloy foil for electrode current collector, including: maintaining an aluminum alloy ingot comprising 0.1 to 0.5% of Fe, 0.01 to 0.3% of Si, 0.01 to 0.2% of Cu, 0.01% or less of Mn, with the rest being Al and unavoidable impurities, at 550 to 620° C. for 1 to 20 hours, and subjecting the resulting ingot under a hot rolling with a starting temperature of 500° C. or higher and an end-point temperature of 255 to 300° C.

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated, the copper foil containing at least one selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag at a total of 30 to 500 mass ppm, a tensile strength of the copper foil having of 100 to 180 MPa, a degree of aggregation I200/I0200 of a (100) plane of the copper foil being 30 or more, and an average grain size viewed from a plate surface of the copper foil being 10 to 400 ?m.

Abstract: An object of the present invention is to provide an aluminum alloy foil for an electrode current collector, the foil having a high strength after the drying step while keeping a high electrical conductivity. Disclosed is a method for manufacturing an aluminum alloy foil for electrode current collector, including: maintaining an aluminum alloy ingot comprising 0.03 to 0.1% of Fe, 0.01 to 0.1% of Si, 0.0001 to 0.01% of Cu, 0.005% or less of Mn, with the rest being Al and unavoidable impurities, at 550 to 620° C. for 1 to 20 hours, and subjecting the resulting ingot under a hot rolling with a starting temperature of 500° C. or higher and an end-point temperature of 255 to 300° C.

Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.

Abstract: An apparatus comprises a flexible sheet comprised of antimicrobial copper that is configured to retroactively wrap conformably about at least one predetermined touch surface. The apparatus can further include a securement mechanism that is configured to secure that flexible sheet to the predetermined touch surface.

Abstract: A cast slab containing C: less than 0.02 mass % and made of an Fe-based metal of an ?-? transforming component is subjected to hot rolling at a temperature of an A3 point or higher and is subjected to ?-region rolling at a temperature of 300° C. or higher and lower than the A3 point, and thereby a base metal sheet having a {100} texture in a surface layer portion is fabricated. Then, by performing a heat treatment under predetermined conditions, an Fe-based metal sheet is obtained in which a Z value is not less than 2.0 nor more than 200 when intensity ratios of respective {001}<470>, {116}<6 12 1>, and {223}<692> directions in a sheet plane by X-ray diffraction are set to A, B, and C respectively and Z=(A+0.97B)/0.98C is satisfied.

Abstract: There are provided an electrode foil which has all the functions of a supporting base material, an electrode and a reflective layer and also has a superior thermal conductivity; and an organic device using the same. The electrode foil comprises a metal foil, wherein the electrode foil has at least one outermost surface which is an ultra-smooth surface having an arithmetic average roughness Ra of 10.0 nm or less as measured in accordance with JIS B 0601-2001.

Abstract: The present invention provides an electrolytic copper foil which is excellent in the extension property and can endure the change in the expansion and contraction at the fine units while having high strength, and a method of producing the same. Specifically, the electrolytic copper foil for a negative electrode collector in a secondary battery, wherein in a nominal stress strain curve, a tensile strength is 45 to 70 kg/mm2, and a value of the tensile strength is greater than a value of a breaking stress, and an extension rate is 5% or more.

Abstract: To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250N/mm2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed.

Abstract: A steel foil for a solar cell substrate includes 7% to 40% by mass of Cr and has a tensile strength of 930 MPa or more in a direction perpendicular to the rolling direction.

Abstract: A current collector for an electrochemical element including an aluminum foil showing a peak in the range between 945 cm?1 and 962 cm?1 in measurement of a surface layer of the aluminum foil by Fourier transform infrared spectroscopy. The current collector can be obtained by a manufacturing method which includes the steps of: preparing an aluminum foil material; washing a surface of the aluminum foil material with a chemical solution capable of dissolving aluminum such as hydrochloric acid, aqueous nitric acid, aqueous sulfuric acid, aqueous solutions of alkali metal hydroxides and aqueous solutions of alkaline earth metal hydroxides; and optionally heat treating the aluminum foil at 70 to 200° C. and/or forming a coated layer including an electrically conducive material, on one or both surfaces of the aluminum foil.

Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.

Abstract: Processes for producing a nickel-titanium alloy are disclosed. The processes are characterized by the production of nickel-titanium alloy articles having improved microstructure. A pre-alloyed nickel-titanium alloy is melted and atomized to form molten nickel-titanium alloy particles. The molten nickel-titanium alloy particles are cooled to form nickel-titanium alloy powder. The nickel-titanium alloy powder is consolidated to form a fully-densified nickel-titanium alloy preform that is hot worked to form a nickel-titanium alloy article. Any second phases present in the nickel-titanium alloy article have a mean size of less than 10 micrometers measured according to ASTM E1245-03 (2008) or an equivalent method.

Abstract: Methods are disclosed for preparing copper nanowires that do not rely on highly reactive reagents, highly corrosive solutions, high temperatures, or long reaction times. Nanowires produced from such methods are free of large attached nanoparticles that have accompanied previously disclosed copper nanowires. Such nanowires are useful for electronics applications.

Abstract: A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 ?m to 1.0 ?m, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil.

Abstract: A method for producing an aluminum foil of the present invention is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation), then the film is separated from the substrate to obtain an aluminum foil, and the obtained aluminum foil is subjected to a heat treatment.

Abstract: Provided is a copper foil with a carrier capable of realizing wiring at line/space=15 ?m/15 ?m or less on a printed circuit board on which the copper foil is laminated. Further provided is a printed circuit board or a multilayer printed circuit board capable of realizing fine-pattern wiring at line/space=15 ?m/15 ?m or less using the copper foil. The copper foil is obtained by forming a release layer and a copper foil in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 ?m or more, and peeling off the copper foil from the carrier foil. The copper foil with a carrier is obtained by forming a release layer and a copper foil in this order on a carrier foil that is said copper foil, wherein a spacing between irregularities of ridges on a surface of the carrier foil on which the copper foil is formed is 25 ?m or more in a mean spacing Sm as defined in JIS-B-06012-1994.

Abstract: A reinforced porous metal foil is provided which comprises a porous portion comprising a two-dimensional network structure composed of a metal fiber; and a reinforced portion which is substantially non-porous or less porous than the porous portion, the reinforced portion being composed of the same metal the metal fiber and being continuous and integral with the porous portion. With such features, it possible to obtain a porous metal foil having superior properties at a low cost in a highly productive manner that is also suitable for continuous production.

Abstract: Methods of producing corrosion-inhibiting aluminum foil products suitable for culinary use involve metallurgical sequestration of aluminum radicals by applying a copper-containing barrier metal layer to a substrate aluminum foil, followed by application of a biocompatible, lipid-based sealant layer to seal any gaps in the barrier layer and provide a non-stick coating. The sealant, which has a vegetable cooking oil, or oil mixture, as its primary ingredient, may also function as a natural antimicrobial and/or anti-fungal agent. Various sealant additives may increase the thermal stability of the oil base, enhance the antimicrobial properties thereof, and increase shelf life. Aluminum foil products include a coated aluminum foil with a copper-containing barrier layer applied to an aluminum substrate layer, with a sealant layer applied to the barrier layer. The coated foil may be wound in a coil around a hollow tube which contains a desiccant.

Abstract: A stainless steel foil contains, in percent by mass, 0.05% or less of C, 2.0% or less of Si, 1.0% or less of Mn, 0.003% or less of S, 0.05% or less of P, 25.0% to 35.0% of Cr, 0.05% to 0.30% of Ni, 3.0% to 10.0% of Al, 0.10% or less of N, 0.02% or less of Ti, 0.02% or less of Nb, 0.02% or less of Ta, 0.005% to 0.20% of Zr, 0.02% or less of Ce, 0.03% to 0.20% of REM excluding Ce, 0.5% to 6.0% in total of at least one of Mo and W, and the balance being Fe and incidental impurities.

Abstract: The present invention provides metal silicide nanowires, including metallic, semiconducting, and ferromagnetic semiconducting transition metal silicide nanowires. The nanowires are grown using either chemical vapor deposition (CVD) or chemical vapor transport (CVT) on silicon substrates covered with a thin silicon oxide film, the oxide film desirably having a thickness of no greater than about 5 nm and, desirably, no more than about 2 nm (e.g., about 1-2 nm). The metal silicide nanowires and heterostructures made from the nanowires are well-suited for use in CMOS compatible wire-like electronic, photonic, and spintronic devices.

Abstract: Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern.

Abstract: An Au bonding wire for semiconductor device, comprising a wire-shaped Au alloy material consisting of: 3-15 mass ppm of Be, 3-40 mass ppm of Ca, 3-20 mass ppm of La, 3-20 mass ppm of at least one functional element selected from the group of Ce, Eu, Mg, and Si, and the remainder of Au, wherein the diameter of said Au alloy bonding wire is less than 23 microns, wherein said bonding wire has improved roundness of compressed bonded ball and improved fracture stress.

Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 ?m or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 ?m.

Abstract: Disclosed is a surface-roughened copper foil that can show excellent adhesion to an anisotropic conductive resin (ACF) and a copper-clad laminate using same. Specifically disclosed is a surface-roughened copper foil which is surface-roughened by surface roughening on at least one surface of a base copper foil (untreated copper foil), wherein the roughening treated surface is finished so that a surface roughness (Ra) of 0.28 ?m or more of the adhesion surface of a polyimide film to be adhered to the roughening treated surface.

Abstract: Provided are a method of fabricating a porous thin film structure, by forming a thin film from at least two elements, followed by selectively removing the certain element using a dry etching process, and a porous thin film structure fabricated by the same. Because all processes of the method of fabricating a porous thin film structure are dry processes, process control is simply accomplished, environmental impact is low, and mass production is possible, in contrast to when using a typical wet process such as electrodeposition or dealloying. Also, since a level of porosity is easily controlled and maintained uniform, a mesoporous thin film structure showing a reproducible level of sensitivity when used as a sensor can be fabricated.

Abstract: There are provided an electrode foil which has all the functions of a supporting base material, an electrode and a reflective layer and also has a superior thermal conductivity; and an organic device using the same. The electrode foil comprises a metal foil, wherein the electrode foil has at least one outermost surface which is an ultra-smooth surface having an arithmetic average roughness Ra of 10.0 nm or less as measured in accordance with JIS B 0601-2001.

Abstract: A soft dilute copper alloy wire is composed of a soft dilute copper alloy material containing an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Cu, V, Ni, Mn, and Cr, and balance comprising Cu. An average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 ?m.

Abstract: A casting device for producing semiconductor material foil includes a casting frame and a substrate band. The casting frame is arranged for holding a molten semiconductor material and includes sidewalls of which an exit sidewall is located at an output position for the semiconductor material foil. The exit side wall is provided with an exit slit. The casting device further includes a local force exerting means to exert at the location of the exit slit a locally enlarged external force on the molten semi-conductor material to enlarge an outer pressure on the molten material at the exit slit.

Abstract: The present invention provides metal nanowires including at least silver, and a metal other than silver, wherein the metal other than silver has a standard electrode potential more positive than the standard electrode potential of silver, and the metal nanowires have a long-axis length of 1 ?m or more and a short-axis length of 300 nm or less.

Abstract: A rigid three-dimensional component such as a speaker dome is formed of diamond, preferably fabricated to net shape by CVD diamond synthesis, and includes a coating on one or more major surfaces thereof. The coating is designed to enhance the performance and/or to alter the appearance of the component. In particular, the coating is designed to act as a damping medium and/or provide aesthetic qualities to the component.

Abstract: The present invention relates to an ultra thin copper foil with a very low profile copper foil as a carrier, comprising a carrier foil a release layer and an ultra thin copper foil. The copper foil with the Very Low Profile, smooth on both sides (i.e. VLP copper foil) is used as the carrier foil, the said very low profile copper foil for supporting the ultra thin copper foil can bring advantages of no pinhole, excellent thickness uniformity and low surface roughness. The impact of a release layer on the bond strength between the carrier foil and the ultra thin copper foil is very significant, the release layer is composed of a quaternary metal alloy with peelability.

Abstract: Nanowire preparation methods, compositions, and articles are disclosed. Such methods, which reduce metal ions to metal nanowires in the presence of zero-valent metal atoms, are capable of producing long, narrow, nanowires useful for electronics and optical applications.

Abstract: Methods of preparing nanowires having small diameters and large lengths are disclosed. Such nanowires are useful in electronics applications.

Abstract: Provided herein are nanofibers and processes of preparing nanofibers. In some instances, the nanofibers are metal and/or ceramic nanofibers. In some embodiments, the nanofibers are high quality, high performance nanofibers, highly coherent nanofibers, highly continuous nanofibers, or the like. In some embodiments, the nanofibers have increased coherence, increased length, few voids and/or defects, and/or other advantageous characteristics. In some instances, the nanofibers are produced by electrospinning a fluid stock having a high loading of nanofiber precursor in the fluid stock. In some instances, the fluid stock comprises well mixed and/or uniformly distributed precursor in the fluid stock. In some instances, the fluid stock is converted into a nanofiber comprising few voids, few defects, long or tunable length, and the like.