Abstract: A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle ?, the normalized intensity being obtained during a ? scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle ? in a range of 40° to 60° to a maximum value B of the normalized intensity with angle ? in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle ? in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.

Abstract: A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of the metal substrate satisfies an equation as follows, ? f + 0.162 × ( 1 - v f ) E f ? ? s ? ? f + 0.889 × ( 1 - v f ) E f Ef representing Young's modulus of the buffer layer, vf representing Poisson's ratio of the buffer layer, ?f representing a coefficient of thermal expansion of the buffer layer, and ?s representing the predetermined coefficient of thermal expansion of the metal substrate.

Abstract: Silver nanowire with a diameter smaller than 100 nm and an aspect ratio from 150 to 300 is disclosed. The preparation method of the silver nanowires is also disclosed.

Abstract: Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications.

Abstract: The present invention provides methods for the manufacturing of metal nanowires using protein fibrils as biotemplates. The methods comprise use of a solvent providing a dual effect by promoting the formation of protein fibrils of suitable size as well as acting as a reducing agent. The invention further provides metal nanowires.

Abstract: The present invention relates to plied silver yarn using silver wire as thread, wherein the silver wire is entirely made of silver (Ag) or a silver alloy, to achieve antimicrobial properties and conductivity, as well as to functional fabric using same and to a method for producing same. The plied silver yarn of the present invention uses, as a core yarn, any one of at least one strand of silver wire and fiber yarn made from natural fiber or synthetic fiber, and uses the other as winding yarn covering the core yarn, wherein said one strand of silver wire is produced by casting a silver alloy containing pure silver or copper into a wire rod through directional solidification, and making the wire rod into a microfiber having a diameter of 0.015 to 0.05 mm through a pulling process.

Abstract: The invention is drawn to novel nanostructures comprising hollow nanospheres and nanotubes for use as chemical sensors, conduits for fluids, and electronic conductors. The nanostructures can be used in microfluidic devices, for transporting fluids between devices and structures in analytical devices, for conducting electrical currents between devices and structure in analytical devices, and for conducting electrical currents between biological molecules and electronic devices, such as bio-microchips.

Abstract: A flexible substrate for a TFT includes a metal substrate having a predetermined coefficient of thermal expansion, and a buffer layer on the metal substrate, the buffer layer including a silicon oxide or a silicon nitride, wherein the predetermined coefficient of thermal expansion of the metal substrate satisfies an equation as follows, ? f + 0.162 × ( 1 - v f ) E f ? ? s ? ? f + 0.889 × ( 1 - v f ) E f Ef representing Young's modulus of the buffer layer, vf representing Poisson's ratio of the buffer layer, ?f representing a coefficient of thermal expansion of the buffer layer, and ?s representing the predetermined coefficient of thermal expansion of the metal substrate.

Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 ?m or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 ?m.

Abstract: Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate and a halide, such as sodium chloride. The anode foil is etched in the electrolyte bath composition by passing a charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

Abstract: A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner.

Abstract: A rolled copper foil consisted of at least either of silicon (Si) and iron (Fe), boron (B), silver (Ag), oxygen (O) of 0.002 mass % or less, and a balance consisted of copper (Cu) and inevitable impurities.

Abstract: A copper alloy wiring film of a flat panel display of the present invention and a sputtering target for forming the same have a composition including Mg: 0.1 to 5 atom %; either one or both of Mn and Al: 0.1 to 11 atom % in total; and Cu and inevitable impurities as the balance, and if necessary, may be further including P: 0.001 to 0.1 atom %.

Abstract: A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Abstract: A fluid dispersion obtained by mixing oxide particles and water is sprayed to a raw aluminum foil from a direction opposite to a travelling direction of the raw aluminum foil while the raw aluminum foil is allowed to travel. In this way, a roll-pressed mark of the raw aluminum foil is eliminated, and thus aluminum foil for aluminum electrolytic capacitor electrode is produced. Pyramidal-shaped recesses each having an acute angle tip are present all over a surface of the aluminum foil.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: A strip-like or sheet-like valve metal or valve metal suboxide structure which has a transverse dimension of from 5 to 100 nm.

Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.

Abstract: An endless fusing thick belt for an electrographic imaging device having a flexible tubular configuration of predetermined diameter, said endless fusing thick belt comprising; an outside surface toner release layer comprised of a coating and a sleeve; a silicone rubber layer positioned inside said outside surface toner release layer; a rigid material layer positioned inside said silicone rubber layer; and a silicone base layer positioned inside and affixed to the internal surface of said polyimide layer using an adhesive.

Abstract: A wire-grid metal sheet includes a grid portion defined by a plurality of spaced strip-shaped longitudinal members extending longitudinally and cross members extending substantially perpendicular to the longitudinal members. A wire grid is made by attaching the wire-grid metal sheet to a frame. The cross members are arranged at intervals at least about five times greater than those of the longitudinal members. The longitudinal members and the cross members may define a lattice pattern. Alternatively, the longitudinal members or the cross members may be arranged in a staggered manner.

Abstract: The present invention relates to an Ag alloy film. Particularly, it is preferably used as a reflective film or semi-transmissive reflective film for an optical information recording medium having high thermal conductivity/high reflectance/high durability in the field of optical information recording media, an electromagnetic-shielding film excellent in Ag aggregation resistance, and an optical reflective film on the back of a reflection type liquid crystal display device, or the like. The Ag alloy film of the present invention comprises an Ag base alloy containing Bi and/or Sb in a total amount of 0.005 to 10% (in terms of at %). Further, the present invention relates to a sputtering target used for the deposition of such an Ag alloy film.

Abstract: A method for producing aluminum strips for lithographic printing plate supports, wherein the aluminum strip is produced from a rolling ingot, which after optional homogenizing is hot-rolled to a thickness of 2 mm to 7 mm and cold-rolled to a final thickness of 0.15 mm to 0.5 mm provides for an aluminum strip having a thickness of 0.15 mm to 0.5 mm and a printing plate support produced from the aluminum strip.

Abstract: An electrodeposited copper foil with carrier foil on which a resin layer for forming an insulating layer is formed, comprising a carrier foil, a bonding interface layer, an electrodeposited copper foil with smooth surfaces on both sides and a resin layer. The resin layer is composed of 20 to 80 parts by weight of an epoxy resin and a curing agent, 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer and optionally a curing accelerator in a suitable amount.

Abstract: The present invention provides an Ag-based alloy reflective film or semi-transmissive reflective film of an optical information recording medium having high reflectivity and excellent in the wet heat resistance and the light fastness. The invention relates to a reflective film or a semi-transmissive reflective film of an optical information recording medium comprising an Ag-based alloy comprising Hf in an amount of 0.05 to 0.8 atomic %.

Abstract: A rolled copper foil includes copper (Cu), an inevitable impurity, a first additive element that forms a solid solution in the copper, and a second additive element that is different from the first additive element, is contained in the copper, and forms a compound with the inevitable impurity.

Abstract: To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.

Abstract: The invention relates to a microperforated metal foil and to a process for the preparation thereof which is characterized in that a self-supporting metal foil is perforated with a needle-punching machine.

Abstract: A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]?3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by ?-scanning at ?=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.

Abstract: An object of the present invention is to provide a production apparatus for electro-deposited metal foil or the like that can reduce thickness fluctuation of electro-deposited metal foil. To achieve the object, a production apparatus for electro-deposited metal foil or the like in which a cathode and an insoluble anode apart from each other, supplying an electrolytic solution through a gap between the cathode and the anode, making the cathode move along to the insoluble anode, electrodepositing a metal component on an electro-deposition surface of the moving cathode is applied.

Abstract: An electrodeposited copper foil with low surface roughness having a surface roughness Rz not higher than 2.5 ?m and an elongation percentage not smaller than 6% at 180° C. in which tensile strength at 25° C. measured within 20 min of the point in time of ending electrodeposition is not higher than 500 MPa and the lowering rate of tensile strength at 25° C. measured within 300 min of the point in time of ending electrodeposition is not higher than 10%. The electrodeposited copper foil with low surface roughness is produced by a process employing aqueous solution of sulfuric acid-copper sulfate as electrolyte and conducting a DC current between an insoluble anode of titanium coated with a platinum metal element or its oxide element and a titanium cathode drum facing the anode, wherein the electrolyte contains hydroxyethylcellulose, polyethyleneimine, a sulfonate of active organic sulfur compound, acetylene glycol and chlorine ions.

Abstract: A foil for producing a metal honeycomb or catalyst carrier body, has an average surface roughness of more than 0.3 ?m (micrometers) on both surfaces in at least one measurement direction. Preferably, the foil is rolled and has an average surface roughness of more than 0.3 or 0.5 ?m, especially approximately 0.6 ?m, in the rolling direction and/or transverse thereto. The foil can have an oxide coating with a thickness between 60 and 80 or between 70 and 75 nm (nanometers) on both surfaces. Despite the roughness, an even thickness of the oxide coating with a tolerance of less than 10% or 5% is advantageous on both surfaces. The foil allows production of durable honeycomb bodies, especially for exhaust systems of internal combustion engines, requiring an exactly defined distribution and quality of compounds in the interior thereof. A honeycomb body and method of production using a foil, are also provided.

Abstract: A method for providing coil shaved metal fibers according to the present invention comprises the steps of -providing a metal composite foil, the metal composite foil comprising oat least two metal layers (Lx) for being converted into metal fibers, each pair of adjacent metal layers are mutually separated by a sacrificial layer (Sy) provided from a sacrificial metal, each sacrificial layer (Sy) having a first and second surface, whereby for each sacrificial layer, the first surface contacts one of the pair of adjacent metal layers, the second surface is contacting the other of the pair of adjacent metal layers; -coiling said metal composite foil on a shaft thereby providing a metal coil having one free end surface; -rotating the metal coil and cutting the free end surface of the metal coil by means of a cutting tool, thereby providing a bundle of composite fibers; -removing the sacrificial metal of the sacrificial layers from the composite fibers thereby providing a bundle of metal fibers, each metal fiber bei

Abstract: The invention relates to a metal foil having (in weight %) Ni 74-90%, W 10-26%, and Al and/or Mg and/or B contents of Al >0-max. 0.02%, Mg >0-max. 0.025%, B>0-max. 0.005%.

Abstract: A bonding or superfine wire is provided made of copper, with a gold enrichment on the surface thereof, in particular in an amount corresponding to a coating of at most 50 nm. The wire may be bonded by the ball/wedge method, has a copper-colored appearance, and the ball thereof after flame-off has a hardness of less than 95 according to HV0.002. In order to produce the bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. The wires are bonded to a semiconductor silicon chip.

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract: An aluminum hard foil is degreased without reducing the hardness to improve the coating performance of coating material. A foil-rolled aluminum foil is subjected to a low-temperature heat treatment for holding the aluminum foil at 80 to 160° C. for 1 hour or more. The low-temperature heat treatment is preferably performed by subjecting the aluminum foil to batch processing with the aluminum foil coiled.

Abstract: Implantable defibrillators are implanted into the chests of patients prone to suffering ventricular fibrillation, a potentially fatal heart condition. A critical component in these devices is an aluminum electrolytic capacitor, which stores and delivers life-saving bursts of electric charge to a fibrillating heart. To reduce capacitor size, manufacturers have developed special aluminum foils, such as core-etched and tunnel-etched aluminum foils. Unfortunately, core-etched foils don't work well in multiple-anode capacitors, and tunnel-etched foils are brittle and tend to break when making some common types of capacitors. Accordingly, the inventors devised a new foil structure having perforations and cavities. In an exemplary embodiment, each perforation and cavity has a cross-sectional area, with the perforations having a larger, for example, 2 to 100 times larger, average cross-sectional area than the cavities.

Abstract: A method for producing a silver nanowire including heating a silver complex in a water solvent at a temperature equal to or below the boiling point of the water solvent, and the silver nanowire produced by the method.

Abstract: The present invention provides metal nanowires including at least silver, and a metal other than silver, wherein the metal other than silver has a standard electrode potential more positive than the standard electrode potential of silver, and the metal nanowires have a long-axis length of 1 ?m or more and a short-axis length of 300 nm or less.

Abstract: The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 ?m.

Abstract: An electroconductive diffuse reflective film is made of an electroconductive metal, wherein the electroconductive diffuse reflective film has a porous structure in which crystal grains having an average grain diameter of 50 nm or more and 1,000 nm or less are separately arranged at intervals of 10 nm or more and 800 nm or less on average.

Abstract: Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern.

Abstract: It is an object of the present invention to provide a biodegradable bag for packing a food capable of storing a food such as a snack food which is required to have an oxygen barrier property and a water vapor barrier property, which can be produced at a high speed by a bag making and packaging machine, which can be degraded by naturally occurring microorganisms in soil or water finally to a non-hazardous degradation product, which can be biorecycled, and which is not accumulated in nature. The present invention is directed to a biodegradable bag for packing a food, which comprises a laminated film obtainable by laminating in the following order; a sealant layer comprising a biodegradable polymer; a barrier layer having an oxygen barrier property and a water vapor barrier property; and a barrier layer-supporting substrate layer comprising a biodegradable polymer, said laminated film being heat-sealed in order for the sealant layer to be inside.

Abstract: To provide bent rod-shaped metal particles having at least one bend point, wherein an average bend angle at the bend point is 5° to 175°.

Abstract: A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle ?, the normalized intensity being obtained during a ? scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle ? in a range of 40° to 60° to a maximum value B of the normalized intensity with angle ? in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle ? in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.

Abstract: The invention discloses a textile article for the usage of a burner cover. The textile article is weaved with a plurality of metal yarns, each of which is blended with a plurality of metal filaments or metal fibers. Particularly, the textile article comprises 100% by weight of the metal filaments.

Abstract: The invention is a laminate made of very thin copper sheet preferably between 0.0005 and 0.01 inches thick, aluminum sheet preferably between 0.004 and 0.04 inches thick, and adhesive between the copper and aluminum sheets. The cost of the aluminum, adhesive, and the manufacturing process combined are much less expensive than solid copper sheet of 0.020 inches in thickness. However, when the copper sheet of the laminate is on the outside, the aesthetic qualities are indistinguishable from heavyweight solid copper sheet.

Abstract: A thin-film composition of nanocrystal molybdenum in an amorphous metallic matrix may be formed by co-sputtering Mo with aluminum or nickel. NEMS cantilevers may be formed from the film. The films exhibit high nanoindentation hardness and a reduction in roughness and intrinsic stress, while maintaining resistivity in the metallic range.

Abstract: To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.

Abstract: A vacuum deposition method for fabricating high-strength nitinol films by sputter depositing nickel and titanium from a heated sputtering target, and controlling the sputter deposition process parameters in order to create high-strength nitinol films that exhibit shape memory and/or superelastic properties without the need for precipitation annealing to attenuate the transition conditions of the deposited material. A vacuum deposited nitinol film having high-strength properties equal to or better than wrought nitinol films and which are characterized by having non-columnar crystal grain structures.