Microscopic Interfacial Wave Or Roughness Patents (Class 428/612)
  • Patent number: 10734130
    Abstract: The invention relates to an elongated electrically conductive copper-aluminum bimetal element, a cable comprising at least one such elongated electrically conductive element, a process for preparing said elongated electrically conductive element and said cable, and a device comprising such an electric cable and at least one metal connector.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: August 4, 2020
    Assignee: NEXANS
    Inventors: Sébastien Dablement, Stéphane Morice
  • Patent number: 10626296
    Abstract: The invention relates to a composition for coatings which includes at least one condensed tannin and water and which has a pH of more than 7. The invention also relates to an anti-adhesive coating composition including said type of composition for coatings.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: April 21, 2020
    Assignee: SEB S.A.
    Inventors: Jérôme Polesel Maris, Isabelle Joutang
  • Patent number: 10518387
    Abstract: A grinding element mounted on a grinding wheel and a grinding wheel containing the same are provided for grinding. The grinding element includes a grinding tooth, and the grinding tooth includes a grinding material having a framework structure and pores distributed in the framework structure. The framework structure includes a bond material and abrasive particles that are bonded by the bond material. A pore size of the pores is larger than 40 microns but smaller than 70 microns. A manufacturing method for semiconductor packages using the same is also provided.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: December 31, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chao Mao, Chin-Chuan Chang, Jing-Cheng Lin, Wen-Hua Chang
  • Patent number: 10230180
    Abstract: A connecting component material used as a material constituting a connecting component, wherein the connecting component material is obtained by using a Ni-plated metal plate in which a Ni plating layer is formed on the surface of a metal plate, and the average depth (R) of a surface roughness motif in at least one direction on the surface of the Ni plating layer is 1.0 ?m or above, and by forming a Sn plating layer having a thickness of 0.3 to 5 ?m on the Ni plating layer of the Ni-plated metal plate; the connection component material makes it possible to reduce friction and minimize abrasion of the material when a connecting component such as an electrical connection terminal is fitted, and to improve the reliability of a stable electrical connection; and the connecting component material can be used in e.g., electrical contact components such as lead frames, harness plugs, and connectors used in electrical and electronic devices and the like.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: March 12, 2019
    Assignee: NISSHIN STEEL CO., LTD.
    Inventors: Yoshikatsu Nishida, Masashi Hiraoka, Masao Nagao, Masayoshi Tatano, Takahiro Fujii
  • Patent number: 10057984
    Abstract: A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminated to a polymer layer to form the printed circuit board, with the step of separating the thin copper foil from the composite copper foil is performed subsequent to said laminating step.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: August 21, 2018
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Tsang-Jin Juo, Kuei-Sen Cheng, Yao-Sheng Lai, Jui-Chang Chou
  • Patent number: 9963774
    Abstract: A thermal barrier coated metallic article includes a platinum-group metal enriched outer layer on the article. The surface of the outer layer has a microstructure including a plurality of projections extending away from the metallic article. A thin adherent layer of oxide is formed on the outer layer of the metallic article. A ceramic coating is provided on the oxide layer on the surface on and around the projections. The ceramic coating includes a plurality of columnar ceramic grains which extend through the full thickness of the ceramic coating. The grains are arranged in clusters separated by gaps. The grains deposited around the projections are generally blocked. The projections reduce the stress in the ceramic coating near the interface with the adherent layer of oxide and also reduce the stress in the adherent layer of oxide and hence increase the working life of the thermal barrier coating system.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: May 8, 2018
    Assignee: ROLLS-ROYCE plc
    Inventors: David Stafford Rickerby, Robert Edward Jones, Christine Chalk
  • Patent number: 9512923
    Abstract: A sliding component is characterized in that, on one sealing face of a pair of sliding parts that slide relative to each other, multiple positive pressure-generating mechanisms that include extremely shallow parallel grooves running roughly in parallel with the sealing face and having submicron-level height differences are provided independently in the circumferential direction, and that extremely shallow thin grooves are formed on the sealing face on the low-pressure fluid side of the extremely shallow parallel grooves, wherein the extremely shallow parallel grooves communicate with the high-pressure fluid side, and the extremely shallow thin grooves communicate with the extremely shallow parallel grooves, but are isolated from the low-pressure fluid side by a seal area, thereby reducing a leakage rate of sealed fluid and significantly improving lubrication characteristics at startup or stop at the same time.
    Type: Grant
    Filed: May 15, 2013
    Date of Patent: December 6, 2016
    Assignee: EAGLE INDUSTRY CO., LTD.
    Inventors: Hideyuki Inoue, Takeshi Hosoe, Yuta Negishi
  • Patent number: 9397343
    Abstract: The present disclosure relates to a copper foil which exhibits surprising anti-deformation properties (e.g., it is resistant to swelling, sagging, and wrinkling). Typically, the copper foil has (a) a shiny side with a surface roughness (Rz) in the range of 0.6 to 1.9 ?m; (b) a matte side with a surface roughness (Rz) in the range of 0.6 to 1.9 ?m; and (c) a lightness L* value of the matte side, based on the L*a*b* color system, in the range of 12 to 35. The disclosure further relates to an anode comprising an anode active material on an anode current collector, wherein the anode current collector includes the above-mentioned copper foil. The anodes are used in, for example, lithium ion secondary batteries.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: July 19, 2016
    Assignee: Chang Chun Petrochemical Co., Ltd.
    Inventors: Kuei-Sen Cheng, Yao-Sheng Lai, Yueh-Min Liu, Jui-Chang Chou
  • Patent number: 9089080
    Abstract: Dielectric composite structures comprising interfaces possessing nanometer scale corrugated interfaces in interconnect stack provide enhances adhesion strength and interfacial fracture toughness. Composite structures further comprising corrugated adhesion promoter layers to further increase intrinsic interfacial adhesion are also described. Methods to form the nanometer scale corrugated interfaces for enabling these structures using self assembling polymer systems and pattern transfer process are also described.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: July 21, 2015
    Assignee: International Business Machines Corporation
    Inventors: Lawrence A. Clevenger, Timothy J. Dalton, Elbert E. Huang, Sampath Purushothaman, Carl J. Radens
  • Patent number: 9028972
    Abstract: A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 ?m to 1.0 ?m, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: May 12, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Terumasa Moriyama
  • Patent number: 9023485
    Abstract: The invention relates to an electro-optical or electromechanical structural component, in particular, an LED, connector or stamped grid, or sliding element, made of a rolled metal substrate of a metal strip, or a sheet produced therefrom, made of Cu or a Cu alloy strip, Al or an Al alloy strip, Fe or a Fe alloy strip, Ti or a Ti alloy strip, Ni or a Ni alloy strip or a stainless steel strip, which has a specially structured surface. The structure of the surface allows joining using optical methods, even in the case of highly reflective surface coatings, and simultaneously improves the functional properties of the components used.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: May 5, 2015
    Assignee: Wieland-Werke AG
    Inventors: Isabell Buresch, Dieter Stock, Thorsten Weireter
  • Publication number: 20150061107
    Abstract: An insulation sheet made from silicon nitride comprising: a sheet-shaped silicon-nitride substrate which contains ?-silicon-nitride crystal grains as a main phase; and a surface layer which is formed on one face or both front and back faces of surfaces of the silicon-nitride substrate and is formed from a resin or a metal which includes at least one element selected from among In, Sn, Al, Ag, Au, Cu, Ni, Pb, Pd, Sr, Ce, Fe, Nb, Ta, V and Ti. A semiconductor module structure using the insulation sheet made from silicon nitride.
    Type: Application
    Filed: November 6, 2014
    Publication date: March 5, 2015
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventor: Takayuki NABA
  • Patent number: 8968881
    Abstract: A precoated metal sheet produced by simultaneous multilayer coating, and a process for producing the same, is provided with improved color shading prevention and adhesion. In the precoated metal plate, the centerline average roughness Ra in the coating film interface is not less than 0.3 ?m, and the maximum height from the waviness center line in the interface is not more than 50% of the layer thickness. Also provided is (i) a top clear coated metal plate, which comprises a clear layer as an upper layer, has an interfacial centerline average roughness Ra of 0.3 to 0.7 ?m and has excellent weathering resistance; and (ii) a precoated metal plate having excellent processability and corrosion resistance, which contains not less than 30% by mass of a rust preventive pigment.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: March 3, 2015
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Hiroyasu Furukawa, Hiroshi Kanai, Kenji Inada, Katsunori Tobisawa, Shigenori Tanaka, Kohei Ueda, Kengo Yoshida, Yoshihiro Suemune
  • Patent number: 8962151
    Abstract: Improved methods of bonding solid materials include a step of fabricating a micro-column array (MCA) on at least one surface to be bonded. The MCA formation process can be modified to cause and/or prevent chemical alteration of the surface being treated or to deposit a coating on the surface. In a preferred embodiment, the MCA is fabricated by laser treating the surface, such as by laser ablation.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: February 24, 2015
    Assignee: Integrated Micro Sensors, Inc.
    Inventors: David Starikov, Abdelhak Bensaoula
  • Publication number: 20150044496
    Abstract: A jointed body that has been solid-phase jointed at normal temperature and that has a non-conventional structure is presented. The jointed body is formed by solid-phase joining a first jointed member to a second jointed member, and has a junction interface between the first member and the second member. This jointed body includes an average crystal grain size in a near interface structure that constitutes a near interface area having a total width of 20 micrometers and extending at both sides of the junction interface as a center is 75-100% of an average crystal grain size in an around interface structure that constitutes around interface areas located at both outer sides of the near interface area. In the jointed body, the near interface structure after the joining is almost the same as the structure before the joining, allowing the jointed body to exert similar characteristics to the jointed members.
    Type: Application
    Filed: March 1, 2013
    Publication date: February 12, 2015
    Inventors: Tadashi Oshima, Hisaaki Takao, Hirofumi Ito
  • Patent number: 8911878
    Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: December 16, 2014
    Assignee: Integran Technologies Inc.
    Inventors: Klaus Tomantschger, Jonathan McCrea, Nandakumar Nagarajan, Francisco Gonzalez, Gino Palumbo, Konstantinos Panagiotopoulos, Herath Katugaha
  • Patent number: 8906515
    Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the coefficient of linear thermal expansion (CLTE) of the metallic layer and the substrate are mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: December 9, 2014
    Assignee: Integran Technologies, Inc.
    Inventors: Klaus Tomantschger, Jonathan McCrea, Nandakumar Nagarajan, Francisco Gonzalez, Gino Palumbo, Konstantinos Panagiotopoulos, Herath Katugaha, Diana Facchini, Jared J. Victor, Uwe Erb
  • Publication number: 20140356644
    Abstract: A component for a turbomachine having at least one region made of an intermetallic material which is formed from an intermetallic compound or comprises an intermetallic phase as the largest constituent. The intermetallic material is compacted and/or modified in microstructure by microplasticization at least partially at a surface or interface in a region close to the surface or interface.
    Type: Application
    Filed: May 27, 2014
    Publication date: December 4, 2014
    Applicant: MTU AERO ENGINES AG
    Inventors: André WERNER, Wilfried SMARSLY
  • Patent number: 8852754
    Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: October 7, 2014
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Satoshi Fujisawa, Takeo Uno, Koichi Hattori
  • Publication number: 20140255717
    Abstract: Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.
    Type: Application
    Filed: March 6, 2013
    Publication date: September 11, 2014
    Applicant: UT-BATTELLE, LLC
    Inventor: Andrew A. Wereszczak
  • Publication number: 20140220375
    Abstract: A method for forming a protective coating on a substrate comprising, applying a bond coating to the substrate, the bond coating having a first surface roughness, ionizing an inert gas which flows into the surface of the bond coating so as to impart a second surface roughness to the bond coating greater than the first surface roughness, wherein the inert gas is ionized and caused to flow into the surface of the bond coating by a reverse polarity current supplied to an electrode which removes at least one electron from the inert gas, and applying a top coating to the bond coating. Additionally, a method for preparing a surface to receive and adhere to a coating comprising roughening the surface to create a micro-roughening network on the surface. In addition, a method of improving strain tolerance and cyclic spallation life of a protective coating.
    Type: Application
    Filed: April 11, 2014
    Publication date: August 7, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: David Bucci, Daniel A. Nowak, Paul S. Dimascio
  • Publication number: 20140191716
    Abstract: A soft magnetic layer for a receiving antenna of a wireless power receiving apparatus includes a first soft magnetic member containing a Mn—Zn ferrite material, and a second soft magnetic member containing a Ni—Zn ferrite material. Accordingly, electromagnetic energy collecting performance of the receiving antenna of the wireless power receiving apparatus is improved, and thereby power transmission efficiency is maximized.
    Type: Application
    Filed: January 3, 2014
    Publication date: July 10, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sang Won LEE, So Yeon KIM, Jin Mi NOH, Seok BAE, Jai Hoon YEOM
  • Publication number: 20140186651
    Abstract: Disclosed herein are a printed circuit board having a copper plated layer with an anchor shaped surface and roughness by forming the copper plated layer having an anisotropic crystalline orientation structure using a plating inhibitor at the time of forming the copper plated layer serving as a circuit wiring and using composite gas plasma and a dilute acid solution, and a method of manufacturing the same.
    Type: Application
    Filed: December 24, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Han, Yoon Su Kim, Doo Sung Jung, Eun Jung Lim, Kyoung Moo Harr, Kyung Suk Shim, Kyung Seob Oh
  • Publication number: 20140147695
    Abstract: An electronic part mounting substrate includes: a metal plate 10 (for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal plate 10 being surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating film 20 of nickel or a nickel alloy formed on the one major surface of the metal plate 10; an electronic part 14 bonded to the plating film 20 by a silver bonding layer 12 (containing a sintered body of silver); a ceramic substrate having a substantially rectangular planar shape, one major surface of the ceramic substrate 16 being bonded to the other major surface of the metal plate 10; and a radiating metal plate (metal base plate) 18 bonded to the other major surface of the ceramic substrate 16.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 29, 2014
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Naoya Sunachi, Hideyo Osanai, Satoru Kurita
  • Patent number: 8734934
    Abstract: A surface metal film material including, in this order, a substrate, a polymer layer that receives a plating catalyst or a precursor thereof, and a metal film formed by plating, wherein, when x ?m represents surface roughness (Ra) at the interface between the substrate and the polymer layer, and y ?m represents surface roughness (Ra) at the interface between the polymer layer and the metal film, x>y and 5 ?m>x>0.1 ?m, and wherein, when T ?m represents a thickness of the polymer layer, T and x satisfy the relationship 2x?T.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: May 27, 2014
    Assignee: FUJIFILM Corporation
    Inventor: Masataka Satou
  • Patent number: 8722197
    Abstract: A thin layer is deposited on a surface having a roughness profile whereof the parameters and mean period are determined for improving the tribological performance, so that the ratio A between the square of the mean period of the profile (PSM) in ?m and the roughness profile (Pa) in ?m, as defined by French standard ISO 4288, is equal to or greater than 5×105 ?m.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: May 13, 2014
    Assignee: H.E.F.
    Inventors: Philippe Maurin-Perrier, Florent Ledrappier, Laurent Houze
  • Patent number: 8722199
    Abstract: It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: May 13, 2014
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Mitsuyoshi Matsuda, Hisao Sakai, Sakiko Tomonaga, Makoto Dobashi
  • Patent number: 8715836
    Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: May 6, 2014
    Assignee: Mitsui Mining & Smelting Co., Ltd
    Inventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka, Jo Nishikawa, Takeo Taguchi
  • Publication number: 20140113453
    Abstract: A tungsten carbide coated chamber component of semiconductor processing equipment includes a metal surface, optional intermediate nickel coating, and outer tungsten carbide coating. The component is manufactured by optionally depositing a nickel coating on a metal surface of the component and depositing a tungsten carbide coating on the metal surface or nickel coating to form an outermost surface.
    Type: Application
    Filed: October 24, 2012
    Publication date: April 24, 2014
    Applicant: Lam Research Corporation
    Inventors: Hong Shih, Lin Xu, John Michael Kerns, Anthony Amadio, Duane Outka, Yan Fang, Allan Ronne, Robert G. O'Neil, Rajinder Dhindsa, Travis Taylor
  • Patent number: 8679642
    Abstract: A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: March 25, 2014
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Stephen W. Smith, John A. Newman, Robert S. Piascik, Edward H. Glaessgen
  • Publication number: 20140023879
    Abstract: A surface-treated steel sheet includes: a steel sheet; and a coated layer which is formed on one surface or both surfaces of the steel sheet and includes zinc and vanadium, wherein the coated layer has a vanadium content of 1% or higher and 20% or less and a coating weight of 3 g/m2 or higher and 40 g/m2 or less, and has a plurality of dendritic arms that are grown in a thickness direction of the steel sheet, and a ratio x/y of a content x of vanadium that is present outside the arms to a content y of vanadium that is present inside the arms is 1.1 or higher and 3.0 or less in terms of vanadium element.
    Type: Application
    Filed: March 29, 2012
    Publication date: January 23, 2014
    Inventors: Fumio Shibao, Taihei Kaneto, Masahiro Fuda, Yoshio Kimata
  • Publication number: 20130302635
    Abstract: An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc, and the either rust-proofing treatment layer is a zinc layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.
    Type: Application
    Filed: November 22, 2011
    Publication date: November 14, 2013
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Shinichi Obata, Shinya Hiraoka, Fumiaki Hosokoshi, Ayumu Tateoka, Hideaki Matsushima, Koichi Miyake, Sakiko Tomonaga, Tomoyuki Maeda
  • Publication number: 20130288070
    Abstract: A first metal such as germanium is prepared for metal-to-metal bonding by depositing the first metal onto a roughened foundation layer so that asperities are present on the first metal layer substantially following the topology of the asperities on the surface of the foundation layer without having to process the surface of the first metal layer. Such asperities can break through barrier layer(s) on the surface of another metal (e.g., an oxide layer, an anti-stiction coating, and/or other barrier layer) during a bonding process so that direct metal-to-metal bonding can be accomplished without having to remove the barrier layer(s) and without having to process the surface of the first metal such as by photolithography or depositing and subsequently removing a material that partially interdiffuses with the first metal.
    Type: Application
    Filed: March 4, 2013
    Publication date: October 31, 2013
    Applicant: ANALOG DEVICES, INC.
    Inventor: Christine H. Tsau
  • Patent number: 8557392
    Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: October 15, 2013
    Assignees: Furukawa Electric Co., Ltd., Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno, Koichi Hattori, Naoya Kuwasaki
  • Publication number: 20130224513
    Abstract: A laminate circuit board with a multi-layer circuit structure which includes a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer and a cover layer is disclosed. The first circuit metal layer is embedded in the substrate or formed on at least one surface of the substrate which is smooth. The first nanometer plating layer with a smooth surface overlaps the first circuit metal layer. The second nanometer plating layer is formed on the other surface of the substrate and fills up the opening in the cover layer to electrically connect the first circuit metal layer. The junction adhesion is improved by the chemical bonding between the nanometer plating layer and the cover layer/the substrate. Therefore, the circuit metal layer does not need to be roughened and the density of the circuit increases.
    Type: Application
    Filed: October 29, 2012
    Publication date: August 29, 2013
    Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventor: KINSUS INTERCONNECT TECHNOLOGY CORP.
  • Patent number: 8518521
    Abstract: Provided is a composite molded article which can increase resistance to peeling at an interface and suppress excessive peeling of a fiber-reinforced polymer material portion even when thermal shock is repeatedly applied. The composite molded article comprises a metal member using metal as a base material and having a surface; and a fiber-reinforced polymer material portion coated on at least part of the surface of the metal member and having a polymer material as a matrix and a plurality of reinforcing fibers for reinforcing the matrix. The surface of the metal member has a plurality of projections juxtaposed regularly or randomly at a pitch distance greater than diameters of the reinforcing fibers. The respective facing projections form enterable spaces which part of the matrix enters and at least part of the reinforcing fibers can enter.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: August 27, 2013
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Toshihiro Aso, Akira Uchimi, Yasuhiro Kume, Toshiyuki Tsuruga
  • Patent number: 8512873
    Abstract: To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: August 20, 2013
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Satoshi Fujisawa, Yuji Suzuki, Takeo Uno
  • Publication number: 20130189538
    Abstract: A method of manufacturing a copper foil for a printed wiring board, characterized in that a roughened layer of roughening copper grains is formed on at least one surface of the copper foil by using an electrolytic bath of sulfuric acid and copper sulfate, and the electrolytic bath contains tungsten ions and/or arsenic ions and further contains an alkyl sulfate-based anionic surfactant. The object of the present invention is to provide a method of manufacturing a copper foil for a printed wiring board, wherein in particular a roughened layer on the copper foil can be improved to enhance the adhesive strength between the copper foil and a resin substrate without deteriorating other properties of the copper foil.
    Type: Application
    Filed: September 8, 2011
    Publication date: July 25, 2013
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventor: Terumasa Moriyama
  • Publication number: 20130183539
    Abstract: A bearing article can include a metal substrate having a bronze layer; a PEEK layer; a PTFE composition layer overlying and penetrating the PEEK layer. A method for preparing a bearing article can include providing a metal substrate with a sintered bronze layer, electrostatic spraying a non-fluorinated polymer onto the metal substrate followed by spraying a fluorinated polymer onto the non-fluorinated polymer and heat rolling to form a laminate.
    Type: Application
    Filed: December 27, 2012
    Publication date: July 18, 2013
    Inventors: Qiang GUO, Guoliang PAN, Lianxiang WANG, Xiaoye LIU
  • Patent number: 8482855
    Abstract: A reflection metal diffraction grating has a high diffraction efficiency for diffracting femtosecond mode laser pulses, and includes a substrate with a set of lines having a pitch A. The substrate is made of metal or covered with a metal layer, and the grating includes a thin film of dielectric material having a thickness, the dielectric film covering the metal surface of the lines of the grating, the grating being suitable for receiving a pulsed electromagnetic lightwave in a femtosecond mode. The thickness of the dielectric thin film is lower than 50 nm, and is suitable for reducing by a third order factor at least the maximum of the square of the electric field of the electromagnetic lightwave on the metal surface and in the metal layer of the substrate as compared to the square of the electric field at the surface of a metal grating not having a dielectric thin film.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: July 9, 2013
    Assignee: Horiba Jobin Yvon SAS
    Inventor: Frederic Desserouer
  • Patent number: 8440322
    Abstract: The copper alloy (lining) prevails in an overwhelmingly large amount in a plain-bearing layer structure. Cu of the plain bearing copper-alloy diffuses into the Sn-based overlay diffuses into the Sn-based overlay and detrimentally impairs the performance of the overlay. The present invention takes a measure against this problem. An Sn-based overlay having a thickness of 3 to 19 ?m is deposited by electro-plating without an intermediate layer for diffusion prevention on a plain-bearing layer, which contains Sn and Ni in a total amount of more than 4 mass % to 20 mass % (the minimum amount of Sn is 4 mass %) and has a hardness of Hv 150 or less.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: May 14, 2013
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Shigeyuki Suga, Hitoshi Wada, Takashi Tomikawa
  • Patent number: 8431254
    Abstract: The invention relates to a composite material element (1), the composite material comprising a microfissured matrix (7) in the form of a three-dimensional interconnected network (4) of microfissures exposed on the surface of the ceramic matrix, an additive material (6) consisting of a flux or glass being dispersed in the matrix, the additive material (6) being a material which, when the composite material is brought to a predetermined temperature, softens and migrates by capillarity in the network (4) of microfissures (4) to said surface of the element. The quantity of additive material dispersed initially in the matrix is in a sufficient proportion compared to the matrix intended to coat a surface (5) of the composite material element left exposed so as to create a gas-tight barrier.
    Type: Grant
    Filed: October 9, 2006
    Date of Patent: April 30, 2013
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Luc Bianchi, Joel Toulc'Hoat, Charles Bories
  • Patent number: 8420224
    Abstract: A zinc or zinc alloy plated steel sheet expressing a performance provided with both corrosion resistance and surface conductivity is provided. The zinc or zinc alloy plated steel sheet of the present invention is a zinc or zinc alloy plated steel sheet having an arithmetic average roughness Ra of a zinc-plated layer surface defined by JIS B 0601, obtained by a stylus-type surface roughness meter defined by JIS B 0651, of 0.3 ?m to 2.0 ?m and a maximum peak height Rp of 4.0 ?m to 20.0 ?m, wherein the arithmetic average roughness Ra (peak) obtained by measuring a range of evaluation length of 20 ?m of peak parts of 80% or more of the Rp by an electron beam 3D roughness analyzer is 70% or more of the arithmetic average roughness Ra (average) obtained by measuring a range of evaluation length of 20 ?m of parts of a height of ±20% about an average line, obtained by a stylus-type surface roughness meter, by an electron beam 3D roughness analyzer.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: April 16, 2013
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Akira Takahashi, Atsushi Morishita
  • Patent number: 8415025
    Abstract: A composite metal ingot having two or more lengthwise alloy layers including adjacent first and second layers respectively formed of an aluminum-manganese alloy and an aluminum alloy of a different composition wherein the interface between the first and second layers is in the form of a substantially continuous metallurgical bond characterized by the presence of particles of one or more intermetallic compositions containing manganese from the first layer dispersed within a region of the second layer adjacent the interface, the first and second layers having been formed by applying the alloy for the second layer to a self-supporting surface of the first layer while the self-supporting surface is at a temperature between the solidus and liquidus temperatures of the first layer alloy.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: April 9, 2013
    Assignee: Novelis Inc.
    Inventors: Mark Douglas Anderson, Kenneth Takeo Kubo, Todd F. Bischoff, Wayne J. Fenton, Eric W. Reeves, Brent Spendlove, Robert Bruce Wagstaff
  • Publication number: 20130084463
    Abstract: Disclosed is a surface-roughened copper foil that can show excellent adhesion to an anisotropic conductive resin (ACF) and a copper-clad laminate using same. Specifically disclosed is a surface-roughened copper foil which is surface-roughened by surface roughening on at least one surface of a base copper foil (untreated copper foil), wherein the roughening treated surface is finished so that a surface roughness (Ra) of 0.28 ?m or more of the adhesion surface of a polyimide film to be adhered to the roughening treated surface.
    Type: Application
    Filed: June 14, 2011
    Publication date: April 4, 2013
    Applicant: Furukawa Electric Co., Ltd.
    Inventor: Satoshi Fujisawa
  • Patent number: 8394507
    Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: March 12, 2013
    Assignee: Integran Technologies, Inc.
    Inventors: Klaus Tomantschger, Jonathan McCrea, Nandakumar Nagarajan, Francisco Gonzalez, Gino Palumbo, Konstantinos Panagiotopoulos, Herath Katugaha
  • Publication number: 20130052476
    Abstract: A housing includes a metal substrate having an outer surface and a color layer formed on the outer surface. The outer surface has a gradient surface roughness across at least one dimension of the outer surface. The color layer has a surface appearance corresponding with the outer surface, thereby the brightness of color of the color layer gradually changing with the location on the outer surface. A method for making the housing is also provided.
    Type: Application
    Filed: March 6, 2012
    Publication date: February 28, 2013
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: YONG-GANG ZHU, GUI-YUN YANG, XIN-WU GUAN, PO-FENG HO
  • Patent number: 8349518
    Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 ?m or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 ?m.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: January 8, 2013
    Assignee: LS Mtron Ltd.
    Inventors: Dae-Young Kim, Byoung-Kwang Lee, Seung-Jun Choi
  • Publication number: 20130004790
    Abstract: In the composite, an aluminum-plated steel sheet and a resin are securely and integrally joined together. Through chemical etching, the aluminum-plated steel sheet is caused to have a surface configuration, in which three-dimensional protrusions having shapes with a minor diameter of at least 0.3 ?m and a major diameter of at least 3 ?m are scattered over a plain part and a portion covered with shallow fine recesses with a diameter of 20 to 50 nm in a state of being distributed adjacent to each other on the plain part accounts for 30 to 50% of the surface area of the plain part. The surface of the three-dimensional protrusions is mainly ceramic containing silicon and the plain part is mainly ceramic containing aluminum. The resin is joined through injection molding with the aluminum-plated steel sheet having been inserted into a metallic mold.
    Type: Application
    Filed: September 10, 2012
    Publication date: January 3, 2013
    Applicant: TAISEI PLAS CO., LTD.
    Inventors: Masanori NARITOMI, Naoki Andoh
  • Publication number: 20120246935
    Abstract: A method and device for reducing sulfidation corrosion and depositional fouling in heat transfer components within a refining or petrochemical facility is disclosed. The heat transfer components are formed from a corrosion and fouling resistant steel composition containing a Cr-enriched layer having a surface roughness of less than 40 micro inches (1.1 ?m) and a protective layer formed thereon.
    Type: Application
    Filed: May 15, 2012
    Publication date: October 4, 2012
    Applicant: EXXONMOBIL RESEARCH AND ENGINEERING COMPANY
    Inventors: Mark A. GREANEY, Thomas BRUNO, Ashley E. COOPER, Ian A. CODY, ChangMin CHUN