Abstract: A metallic foil, and a process for producing the same, having a metallic micro-layer electrodeposited on a surface of the foil, wherein the micro-layer comprises two co-deposited metals each being a metal other than the metal forming the foil, and does not change the topography of the surface on which it is deposited. The foil may be formed of copper, and the micro-layer may be formed of iron and nickel. When bonded to a polymeric substrate the peel strength of the foil is improved.

Abstract: A flexible metal-film laminate can comprise a layered film structure having a metal layer securely bonded to a film layer. The laminate contains a unique metal-oxide attachment structure between the film and metal layer comprising randomly distributed regions of metal-oxide. After the metal/metal-oxide layer, a chromium metal or chromium alloy layer is formed before subsequent layers of copper, gold, etc. The peel strength of such a laminate is significantly improved over prior laminates and is resistant to peel strength reduction due to environmental stress. The preferred metal-film laminates made with polyester or polyimide can be used in the manufacture of high-quality, low cost, flexible printed circuit boards.

Abstract: A ceramic wiring board has a non-oxide based ceramic substrate which is a sintered body containing aluminum nitride, silicon nitride or the like as main component, and a metallized layer formed on the non-oxide based ceramic substrate; the metallized layer is plasma-etched, irregularities having a difference of elevation of about 0.5 to about 200 nm are formed on the surface of metal particles forming the metallized layer which are positioned on the surface of the metallized surface, and a metal plated layer is further formed on the metallized layer.

Abstract: A thermal barrier coating system and a method for forming the coating system on an article designed for use in a hostile thermal environment, such as superalloy turbine, combustor and augmentor components of a gas turbine engine. The method is particularly directed to a coating system comprising an APS bond coat on which a thermal-insulating APS ceramic layer is deposited, wherein the oxidation resistance of the bond coat and the spallation resistance of the ceramic layer are increased by diffusing platinum, palladium, hafnium, rhenium and/or rhodium into the bond coat. The diffusion process is performed so as not to alter the surface roughness of the bond coat, which is maintained in a range of about 200 to about 500.mu. inch Ra.

Abstract: Treated electrolytic copper foil wherein the shiny side of the raw foil is modified and smoothed by an electrodeposited copper gilding layer, a copper-clad laminate produced with such foil, and an electrical circuit produced from such a laminate. The preferred foil has the surface of the shiny side of the raw foil modified by an electrodeposited copper gilding layer, a copper dendritic layer electrodeposited on the gilding layer, and a second copper gilding layer electrodeposited on the first dendritic layer, while a copper dendritic layer is electrodeposited on the surface of the matte side of the foil, and a copper gilding is electrodeposited on the latter dendritic layer.

Abstract: An electrolytic process for cleaning the surface of a workpiece of an electrically conducting material, which process comprises:i) providing an electrolytic cell with a cathode comprising the surface of the workpiece and an inert anode;ii) introducing an electrolyte into the zone created between the anode and the cathode by causing it to flow under pressure through at least one opening in the anode and thereby impinge on the surface of the cathode, the surface of the cathode not otherwise being immersed in the electrolyte; andiii) applying a voltage between the anode and the cathode and operating in a regime in which the electrical current decreases or remains substantially constant with increase in the voltage applied between the anode and the cathode, and in a regime in which gas bubbles are present on the surface of the workpiece during treatment.

Abstract: A multi-walled steel pipe includes at least two pipe bodies of different diameters. The two pipe bodies are overlapped with one another. Either the inner surface of the outer pipe body or the outer surface of the inner pipe body is a rough surface having a roughness of 10 to 30 .mu.m. The rough surface is made by brasting, etching, or brushing or by the use of rolls. At least one of the overlapping surfaces is plated with copper to provide a brazing layer by which the overlapping surfaces are brazed together. The pipe bodies are double-walled stainless pipes, seamless stainless pipes, or electroseamed pipes.

Abstract: An electrolytic process for metal-coating the pre-cleaned surface of a workpiece of an electrically conducting material, which process comprises:i) providing an electrolytic cell with a cathode comprising the workpiece and an anode comprising the metal for metal-coating of the surface of the workpiece;ii) introducing an electrolyte into the zone created between the anode and the cathode by causing it to flow under pressure through at least one opening in the anode impinge on the cathode; andiii) applying a voltage between the anode and the cathode and operating in a regime in which the electrical current decreases or remains substantially constant with increase in the voltage applied between the anode and the cathode, and in a regime in which discrete gas bubbles are present on the surface of the workpiece during treatment.

Abstract: A metal coating of typically a valve metal, especially a titanium metal coating, is applied by thermal spraying to the surface of concrete, most particularly steel-reinforced concrete. The metal such as titanium may be sprayed by any one of several thermal spraying techniques including flame spray, electric-arc spray, plasma spray, high-velocity oxyfuel spray, or detonation gun spray. The metal coating should be tightly adhered to the concrete and desirably will have a porosity to facilitate extensive coating of the metal itself, as well as facilitate any activation that may be needed for the metal. Such activation can be in the form of an electrochemically active material which allows the coating to function in electrochemically active form. One coating option is to apply a solution onto the spray-applied metal, then polarize the metal anodically to effect deposition of active material on the metal.

Abstract: A improved thermal barrier coating and method for producing and applying such is disclosed herein. The thermal barrier coating includes a high temperature substrate, a first bond coat layer applied to the substrate of MCrAlX, and a second bond coat layer of MCrAlX with particles of a particulate dispersed throughout the MCrAlX and the preferred particulate is Al.sub.2 O.sub.3. The particles of the particulate dispersed throughout the second bond coat layer preferably have a diameter of less then the height of the peaks of the second bond coat layer, or a diameter of less than 5 .mu.m. The method of producing the second bond coat layer may either include the steps of mechanical alloying of particles throughout the second bond coat layer, attrition milling the particles of the particulate throughout the second bond coat layer, or using electrophoresis to disperse the particles throughout the second bond coat layer.

Abstract: The present invention is an electrodeposited copper foil characterised in that roughening treatment is performed on a matte side of an untreated copper foil wherein the surface roughness R.sub.z of the matte side of the untreated copper foil is the same as or less than the surface roughness R.sub.z of the shiny side of this untreated copper foil. The electrodeposited copper foil is made by electrodepositing copper onto a drum from an electrolyte which contains 0.05 to 5 ppm 3-mercapto 1-propanesulfonate; at least one organic compound selected from 0.1 to 15 ppm of a polysaccharide which is a carbohydrate such as starches, celluloses and vegetable rubbers, and 0.3 to 35 ppm of a low molecular weight glue having a weight average molecular weight of 10,000 or less; and 10 to 60 ppm of a chloride ion. The copper foil may be used in making a printed circuit board or as a component of a secondary battery cell.

Abstract: The surface of a lining member 3 is formed with a multiplicity of uneven surfaces 3a. The entire surface of the lining member 3 is coated by an intermediate layer 4 which comprises Ni. The surface of the intermediate layer 4 is additionally coated by an overlay layer 5 which comprises an Sn alloy. The lining member 3 has a surface roughness t.sub.1, as a result of forming the uneven surfaces 3a, which is chosen to be in a range from 2 to 8 .mu.mRz, and a thickness t.sub.2 of the intermediate layer 4 is chosen to be in a range from 0.01 to 0.6 .mu.m. When a sliding bearing 1 is heated, the overlay layer 5 and the intermediate layer 4 chemically react with each other to produce an Sn--Ni compound. As the overlay layer 5 becomes abraded, the Sn--Ni compound 6 will be exposed on the sliding contact surface. However, the described choice prevents the Sn--Ni compound from being exposed across the entire region of the sliding contact surface, thus improving the anti-seizure resistance of the sliding bearing 1.

Abstract: There it is disclosed a chemical treatment for copper foil which imparts a dark brown to black color to the foil and improves the bond strength of the foil to a dielectric substrate without detrimentally changing the etching characteristics of the foil. The treatment includes depositing a nodular copper/nickel alloy layer on a surface of the foil. These nodules are 55% to 95% by weight copper and are electrolytically deposited using a pulse power controller.

Abstract: A magnetic recording medium is disclosed, comprising a non-magnetic support having provided thereon at least a lower non-magnetic layer comprising a binder having dispersed therein a non-magnetic powder and an upper magnetic layer comprising a binder having dispersed therein a ferromagnetic powder which has been coated on said lower non-magnetic layer while the lower non-magnetic layer is wet, wherein the upper magnetic layer has an average dry thickness (d) of not more than 1.0 .mu.m and an average thickness variation (.sup..DELTA. d) at the interface between the upper magnetic layer and lower non-magnetic layer is not more than d/2. The magnetic recording medium exhibits excellent electromagnetic characteristics, running properties, and durability.

Abstract: Method of producing metal sheets or strips by cold reduction rolling of a metal sheet or strip with at least one pair of work rolls, at least one of which being a textured work roll in order to transfer the surface pattern of the textured work roll to the surface of said sheet or strip, characterized in that said pattern of the textured work roll consists in a bidimensional deterministic pattern of spots wherein each spot has the form of a crater with a rim around it.

Abstract: The performance of many macroscopic structures (those whose dimensions are on the order of centimeters, meters, or even larger) can be greatly improved by covering their surfaces with microstuctures. There are several applications in which "large," microstructure-covered sheets are useful. For example, dissimilar sheets of material that otherwise would not bond well to one another (such as a polymer and a metal) can be more strongly bonded with microstructures extending from one of the sheets and embedded into the other sheet. Such products make valuable laminate composites. As another example, the rate of heat transfer between an object and the surrounding medium can be dramatically changed (up or down) by covering the surface of the object with high aspect ratio microstructures, without significantly changing the component's size or weight.

Abstract: A flexible circuit to interconnect two components of an electrical device is formed with a flexible polymeric substrate. A copper alloy is laminated to the flexible substrate. This copper alloy is processed to have relatively high strength, an ultimate tensile strength in excess of about 80 ksi, by either alloying additions, by processing or by a combination of the two. When such an alloy is laminated to the polymeric substrate, the resultant flexible circuit has improved (more cycles to failure) dynamic fatigue performance when compared to both pure copper and dilute copper alloys.

Abstract: For a condensed matter system containing a guest interstitial species such as hydrogen or its isotopes dissolved in the condensed matter host lattice, the invention provides tuning of the molecular orbital degeneracy of the host lattice to enhance the anharmonicity of the dissolved guest sublattice to achieve a large anharmonic displacement amplitude and a correspondingly small distance of closest approach of the guest nuclei. The tuned electron molecular orbital topology of the host lattice creates an energy state giving rise to degenerate sublattice orbitals related to the second nearest neighbors of the guest bonding orbitals. Thus, it is the nuclei of the guest sublattice that are set in anharmonic motion as a result of the orbital topology. This promotion of second nearest neighbor bonding between sublattice nuclei leads to enhanced interaction between nuclei of the sublattice.

Abstract: A steel component is provided on its surface with an electroplated anti-corrosive coating of a metallic material and has a hardness of at least 650 HV, the anti-corrosive coating being thinner than the surface roughness which the hardened component had before the application of the protective coating. Advantageously, the component is a rolling bearing component with a surface roughness R.sub.z of 0.3 to 9.0 .mu.m and a coating thickness of 0.1 to 3.0 .mu.m. Preferably, the anti-corrosive coating comprises a zinc-cobalt alloy, a zinc-iron alloy or a zinc-nickel alloy coating. It is possible to add iron, tin, copper or chromium to the coating composition.

Abstract: The improved sputtered memory disk of the present invention comprises a substrate coated with a nucleating layer, a subsequent magnetic layer, and a protective coating. As a result of texturing in the circumferential direction and epitaxy involving the nucleating layer, an anisotropic orientation of coercivity in the circumferential direction has occurred during the sputtering that provides an improved memory disk having enhanced coercivity, a reduced amplitude modulation, an improved squareness of the hysteresis loop, e.g., lower switching field distribution, and a high production, relatively low cost production system. As a result, a higher recording density due to the higher coercivity and low switching field distribution can be experienced with the magnetic disk of the present invention.

Abstract: A galvanized steel sheet has a coating layer of protective material applied to its surface where the steel sheet has been roughened prior to application of the protective material. The improvement is characterized by the roughened steel surface having a pattern which ensures desired consistent quantity of coating during application of the protective material. The pattern provided on the sheet surface has a multitude of depressions defined by a plurality of ridges. The upper surfaces of the ridges defining a plane for each side of the steel sheet, where the ridges have a surface area less than 1/4 the nominal surface area of the sheet side. Each depression has a depth defined by a continuous side wall extending into the plane of the sheet side. The side wall slopes downwardly of the plane at an angle greater than 45.degree..

Abstract: A surface of a non-magnetic base plate is first coarsened to a required surface roughness and an ultrasonic vibration is then applied to the surface of the non-magnetic base plate while the nonmagnetic base plate is immersed in a liquid. Thereafter, a magnetic recording layer and a protective layer are successively formed on the surface of the non-magnetic base plate thereby to produce a magnetic recording medium. It is preferable that the frequency of a ultrasonic is within a range from 200 kHz to 1600 kHz. Surface fractional properties of the magnetic recording medium can adequately be controlled without variation of floatation height of a magnetic head during its running by varying an ultrasonic oscillation output and an ultrasonic processing time.

Abstract: A thermal barrier coating for superalloy turbine engine vanes and blades that are exposed to high temperature gas is disclosed. The coating includes an Aluminide or MCrAlY layer, an alumina layer, and a ceramic top layer. The ceramic layer has a columnar grain microstructure. A bond inhibitor is disposed in the gaps between the columnar grains. This inhibitor is either unstabilized zirconia, unstabilized hafnia, or a mixture thereof.

Abstract: Disclosed herein is a wire for an Nb.sub.3 X superconducting wire, which is improved in workability and soundness of a diffusion barrier layer without increasing the diffusion barrier layer in thickness. This wire for an Nb.sub.3 X superconducting wire comprises a wire which is prepared by superposing and winding up a first sheet consisting of pure Nb or an Nb alloy and a second sheet consisting of metal atoms X, reacting with Nb for forming a compound exhibiting superconductivity, or an X alloy, a stabilizing material layer which is provided to enclose the wire, and a diffusion barrier layer which is provided between an outer surface of the wire and an inner surface of the stabilizing material layer for preventing the metal atoms X from being diffused in the stabilizing material layer, and the diffusion barrier layer is made of a metal material having larger tensile strength than that of the first sheet. It is possible to obtain a high-performance Nb.sub.

Abstract: A magneto-resistance device comprises a stacked structure, which stacked structure has a non-conducting substrate having a surface on which a multilayer structure is provided. The surface is furnished with a plurality of grooves which are substantially mutually parallel, each groove comprising a first and a second face. All first faces are substantially planar and mutually parallel. The constituent layers of the multilayer structure are provided in a stack upon each first face in such a manner as to be parallel thereto, the thickness of the stacks being such that each stack makes physical contact with each immediately neighbouring stack.

Abstract: A rolling/sliding member for use in conditions of rolling and/or sliding contact with a mating member opposed to the rolling/sliding member under the following conditions;(a) the rolling/sliding member are formed with a large number of fine protrusions and depressions in at least the surface area which comes into contact with the mating member,(b) the total volume per unit area of the fine depressions is in the range of 5.times.10.sup.-8 to 5.times.10.sup.-7 cc/mm.sup.2, and(c) the average volume of the fine depression is 10 to 100 .mu.m.sup.3.

Abstract: A machine part comprises: a base part formed of a titanium alloy or an aluminum alloy and having a roughened surface of Ra 0.5 .mu.m or above and PPI.sub.50 or above; and a Ni--P electrodeposit layer formed over the surface of the base part by an electroplating process using a Ni--P plating bath containing a stress relaxing agent, and having a stress of 20 kgf/mm.sup.2 or below. The machine part has a small specific gravity, excellent seizure resistance, wear resistance and fatigue strength.

Abstract: Thin film media characterized by the utilization of a substantially peritectic seed alloy layer which is sputter deposited so as to provide dispersed, substantially peritectic and homogenous globules underlying subsequently deposited media layers. These media layers may include a metal layer such as chrome and a magnetic layer such as an alloy of cobalt, chromium, and platinum and possibly other ingredients.

Abstract: The object of the present invention is to provide titanium discs to be used as high-density read-while-write magnetic discs. Further object of the present invention is to provide said titanium discs coated with a non-magnetic plated layer.Titanium discs to be used as magnetic discs which satisfy the above object have the following structures: A titanium disc to be used as magnetic disc having the mean height of the peaks from the center line, R.sub.a, of 0.0002 .mu.m to 0.0060 .mu.m and pits on its surface of 25 .mu.m or less in diameter or 5 .mu.m or less in depth. Further, said titanium disc to be used as a magnetic disc is coated with a non-magnetic plated layer with a thickness of 0.09 .mu.m to 5 .mu.m. Moreover, a titanium disc that is most suitable to be used as a magnetic disc is the titanium disc provided with a plated layer of 30/100 or less in a knife-cut peeling test.

Abstract: To improve the sliding characteristics of a magnetic head by reducing a friction coefficient, and realize a magnetic recording medium with a high recording density and a large capacity, capable of reducing the flotation distance of the magnetic head. On the surface of a base, aluminum containing nitrogen aggregates locally to form islands of metal deposits, which are distributed discretely over the entire surface of the base. Meanwhile, on the metal deposits, a metal base layer, a magnetic layer, a protective layer, and a lubrication layer are laminated sequentially to form a magnetic recording disk. On the disk surface, ultrafine irregularities are formed that reflect the shapes of the metal deposits, thereby realizing a reduction in the friction coefficient.

Abstract: A surface of copper foil is protected from oxidation and tarnishing by electrodepositing on the surface a protective layer containing metallic zinc and one or more compound of tri-valent chromium, which protection layer is easily removable by dissolution in a dilute aqueous alkaline solution and which preferably has a zinc to chromium weight ratio of 1:1 or greater. An electrodeposited copper foil especially suited for multilayer printed circuit boards has such a protective layer electrodeposited on the matte side thereof and an electrodeposited copper bonding treatment on the shiny side thereof.

Abstract: An article having a substrate is protected by a thermal barrier coating system. An interfacial layer contacts the upper surface of the substrate. The interfacial layer may comprise a bond coat only, or a bond coat and an overlay coat. The interfacial layer has on its upper surface a preselected, controllable pattern of three-dimensional features, such as grooves in a parallel array or in two angularly offset arrays. The features are formed by an ablation process using an ultraviolet laser such as an excimer laser. A ceramic thermal barrier coating is deposited over the pattern of features on the upper surface of the interfacial layer.

Abstract: A method of etching increases the surface area of a metal foil by creating uniformly distributed etch tunnels. The foil is pretreated by depositing a discontinuous surface layer of metal that is cathodic to the foil, followed by chemically etching the foil to remove a portion of the deposited metal. Finally, the foil is electrochemically etched to create the etch tunnels.

Abstract: A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

Abstract: A laminated steel sheet for a welded can which includes: a steel sheet; a plating layer formed on the steel sheet, the plating layer having a surface roughness represented by a PPI of 5 to 150, the plating layer having a tinning layer and a chemical treatment layer, the tinning layer being formed on the steel sheet and the chemical treatment layer being formed on the tinning layer, the tinning layer having a coating weight of 0.9 to 2.8 g/m.sup.2, the chemical treatment layer containing 5 to 50 mg/m.sup.2 of metallic chromium and hydrated chromium oxide containing 5 to 25 mg/m.sup.2 of chromium; and a resin film thermo-compressed on the plating layer in a band form, the resin film being a biaxially oriented film of a polyethylene terephthalate copolymer, the polyethylene terephthalate copolymer having an acid component of which 0.5 to 10 mol % is isophthalic acid.

Abstract: A copper foil for printed circuits has a roughened layer formed on the side of the foil to be bonded to a base, the roughened layer consisting of a number of protuberant copper electrodeposits containing chromium tungsten or both. It may also have a copper plating layer covering the roughened layer and a treatment layer covering the copper plating layer and formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals. When necessary, the copper foil may contain an anticorrosive layer including various chromate treated layers further formed on the treatment layer. The copper foil is produced by electrolyzing a raw foil as a cathode in an acidic copper electrolytic bath at a current density close to the critical density, thereby forming the roughened layer, the electrolytic bath containing 0.001-5 g/l of chromium ion tungsten ion or both.

Abstract: A flexible metal-film laminate can comprise a layered film structure having a metal layer securely bonded to a film layer. The laminate contains a unique metal-oxide attachment structure between the film and metal layer comprising randomly distributed regions of metal-oxide. The peel strength of such a laminate is significantly improved over prior laminates and is resistant to peel strength reduction due to environmental stress. The preferred metal-film laminates made with polyester or polyimide can be used in the manufacture of high-quality, low cost, flexible printed circuit boards.

Abstract: A slide member includes a surface layer having a slide surface for a mating member. The surface layer is formed of metal crystals belonging to a cubic system with a plane of (h00) by Miller indices directed so as to form the slide surface. The percent area A of the (h00) plane in the slide surface is set in a range of A.gtoreq.50%.

Abstract: A sputtered magnetic recording disk is formed by a series of sequential sputtering processes within an environment of a low pressure inert gas. A disk substrate is abraded to provide a circumferential texturing of hills and valleys. The height of the hills and valleys are of a dimension not to interfere with a fly characteristic of a recording head, while the arithmetic average of the radial roughness is still sufficient to provide a magnetic switching field distribution of less than 0.20. A chromium nucleating layer is deposited on the textured substrate surface by a first sputtering process. A second sputtering process provide a magnetic layer of a cobalt alloy to provide C-axis orientation parallel to the substrate. A third sputtering process provides a protective carbon film. The output of any signal recorded on the magnetic thin film layer will have an amplitude modulation of less than twenty-five percent (25%).

Abstract: Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Abstract: A thin copper foil for a printed wiring board comprising a copper foil supporter having a surface with a roughness; a parting payer consisting of chrome compound; a thin copper foil layer formed on the parting layer which will be attached to a board as printed wiring. A copper-nickel compound metal layer is interposed between the parting layer and the thin copper foil layer, wherein said copper-nickel compound metal layer is formed to be integral with the thin copper foil layer with a peel strength therebetween such that said copper-nickel compound metal layer will be left on the thin copper layer when the parting layer with the copper foil supporter is peeled off.

Abstract: A reflective solar cell substrate comprising a base member composed of a metallic material provided with irregularities at the surface thereof and a buffer layer disposed on said base member so as to cover the entire of said irregularities at the surface of said base member, said buffer layer being composed of a substantially transparent or translucent and conductive material, said buffer layer being provided with irregularities at the surface thereof, and said irregularities at the surface of said buffer layer comprising a plurality of thickened convex portions and a plurality of thinned concave portions, said portions being alternately arranged. The reflective solar cell substrate reflects light reaching the substrate without being absorbed by the optically active layer at an effective angle, whereby the solar cell exhibits improved photovoltaic characteristics.

Abstract: A method treating a surface of rotors in a screw-type rotary fluid machine, with the method comprising the steps of: conducting a non-electrolytic Ni plating on the surface of each rotor so as to form a first layer of non-electrolytic Ni plating layer; heating the rotor having the first layer at a temperature not lower than 500.degree. C.; and forming, at least, a second layer of an organic resin so as to cover the first layer.

Abstract: A roughened surface of a conductive substrate, such as copper, provides uniform Sn-Pb solder coatings and improved solder retention at printed wiring board (PWB) plated through-hole rims (knees) and surface pads during solder dipping or reflow. A high density of copper surface features of moderate average roughness provides the most favorable solder coating thickness distribution. Various chemical or electrochemical etching processes may be used to produce the desired copper surface topography. Reflowed solder thickness distribution in a PWB knee region attained with a ferric chloride copper etching process peaks at 4 .mu.m, which provides a good margin of safety for preventing exposure/oxidation of the underlying Cu-Sn intermetallics. The ferric chloride copper etching process yields only 1% of solder thickness measurements in the undesirable 0-1.5 .mu.m range for plated through-hole rims. Copper surface roughening is expected to greatly reduce solderability loss in mass produced PWBs.

Abstract: A method of forming an isotropic texture having a selected summit density and surface roughness in a selected inner-diameter annular zone of a thin-film medium substrate having a polished metal coating on the substrate. The zone is selectively exposed to a chemical etchant, under etchant strength, temperature, and exposure time, until the selected summit density and roughness are achieved. In a preferred embodiment, the etching conditions are selected to produce a summit density between about 500-20,000/mm.sup.2, and an arithmetic mean roughness value between about 20-70 .ANG. in the inner zone, and a substantially reduced roughness value in an annular, isotropically textured outer-diameter zone of the coating. A thin-film medium formed on the substrate is suitable for near-contact recording.

Abstract: A flexible metal-film laminate can comprise a layered film structure having a metal layer securely bonded to a film layer. The laminate contains a unique metal-oxide attachment structure between the film and metal layer comprising randomly distributed regions of metal-oxide. The peel strength of such a laminate is significantly improved over prior laminates and is resistant to peel strength reduction due to environmental stress. The preferred metal-film laminates made with polyester or polyimide can be used in the manufacture of high-quality, low cost, flexible printed circuit boards.

Abstract: A magnetic storage medium is composed of a non-wettable substrate upon which a transient liquid metal layer is deposited and maintained as a distribution of discontinuous liquid features. A magnetic film layer is deposited on the transient liquid metal layer resulting in a reaction of the liquid metal with the magnetic film. The topology of the magnetic film is controllable by adjusting the thickness of the transient liquid metal layer.

Abstract: A multi-layer material comprises at least two layers of flexible material, including one layer based on electrically conductive, expanded recompressed graphite and another layer based on a metal, wherein the layer of graphite has at least one face thereof covered at every point by a layer of metal and in direct electrical contact with the layer of metal, and wherein the layer of metal is obtained by electrodeposition or by chemical deposit of at least one metal on the layer of graphite in such a way that the layer of metal adheres directly to the layer of graphite and closely matches the micro-relief thereof.

Abstract: A magnetic thin film recording disk includes a substrate of a hard electroless plated nickel surface that has been textured to encourage a circular anisotropic orientation of crystal growth during a pass-by sputtering in a continuous production line. A thin film chromium nucleating layer that is substantially free of any oxidation that would affect the recording properties is subsequently deposited, and then a thin film magnetic layer of a cobalt alloy, having a desired circular anisotropic crystal growth, is deposited through the sputtering process. The resulting magnetic thin film recording disk is then coated with a thin film of a carbon protective material.

Abstract: In a sliding surface bearing for high loads, comprising a sliding layer (2), which has physically been applied in a vacuum directly to a bearing metal layer (1) and consists of a base material with finely divided inclusions (6), which are substantially insoluble in the base material at the operating temperature, substantial freedom from wear and a minimum tendency to mixing by rubbing are to be ensured in that all inclusions (6) have a lower hardness than the base material, which has been crystallized to form columns having a preferred orientation at right angles to the sliding surface (4).