Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

Abstract: Methods and structures are provided for implementing strain sensing thermal interface materials (TIMs). An in situ strain sensing thermal interface material (TIM) layer is provided within a packaging assembly structure. The strain sensing TIM is formed by graphene incorporated into the TIM layer. Electrical leads are coupled to the strain sensing TIM layer providing electrical contacts for measuring the electrical property change of the TIM which correlates to mechanical strain.

Abstract: A mechanical device includes a long, narrow element made of a rigid, elastic material. A rigid frame is configured to anchor at least one end of the element, which is attached to the frame, and to define a gap running longitudinally along the element between the beam and the frame, so that the element is free to move within the gap. A solid filler material, different from the rigid, elastic material, fills at least a part of the gap between the element and the frame so as to permit a first mode of movement of the element within the gap while inhibiting a different, second mode of movement.

Abstract: Malfunction or failure of mechanical, electrical and electro-mechanical equipment, for example equipment used in manufacturing operations, is often preceded by an increase in the operating temperature of at least some portion of the equipment. Some pre-determined temperature, greater than the highest normal operating temperature of the equipment, is presumed or known to be indicative of impending equipment failure if no remedial action is taken. A resettable, temperature-sensitive device, containing a shape memory alloy actuator, pre-selected to operate at the pre-determined temperature, is disclosed. The device is placed in thermal contact with the equipment. If the equipment achieves the pre-determined temperature, the shape memory alloy actuator causes the device to display a flag or provide some other passive visual indication. Alternatively, or additionally, the actuator may trigger an electrically-powered alert including visual or audible alerts or a wireless communication.

Abstract: This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near-equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired in a form such as corrugated sheet, discrete tubes or wires, may be joined together using the newly discovered joining technique. Pure niobium when brought into contact with nitinol at elevated temperature, liquefies at temperatures below the melting point and flows readily into capillary spaces between the elements to be joined, thus forming a strong joint.

Abstract: The invention concerns a nanoprinted device comprising point shaped metallic patterns, in which each metallic pattern has a bilayer structure controlled in hardness and in chemical properties comprising a lower layer (30) constituting the base of the point and an upper layer (31) constituting the point itself.

Abstract: The surface of an aluminum alloy shaped product is covered with ultrafine recesses by being dipped in an eroding aqueous solution, or has formed thereon a metal oxide layer covered with the openings of ultrafine pores by anodizing. On the resin side, there is prepared a polyamide resin compounded with an impact resistance modifier, a mixture of an aliphatic polyamide and an aromatic polyamide, or a mixture of aromatic polyamides. The aluminum alloy shaped product is inserted into an injection mold, and a polyamide-type resin composition is injected onto the surface of the aluminum alloy shaped product, to manufacture an integrated composite.

Abstract: A vacuum deposition method for fabricating high-strength nitinol films by sputter depositing nickel and titanium from a heated sputtering target, and controlling the sputter deposition process parameters in order to create high-strength nitinol films that exhibit shape memory and/or superelastic properties without the need for precipitation annealing to attenuate the transition conditions of the deposited material. A vacuum deposited nitinol film having high-strength properties equal to or better than wrought nitinol films and which are characterized by having non-columnar crystal grain structures.

Abstract: One embodiment includes: a copper substrate; a catalyst on top of a single surface of the copper substrate; and a thermal interface material on top of the single surface of the copper substrate. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate. The thermal interface material has: a bulk thermal resistance, a contact resistance between the thermal interface material and the copper substrate, and a contact resistance between the thermal interface material and a solid-state device. The summation of the bulk thermal resistance, the contact resistance between the thermal interface material and the copper substrate, and the contact resistance between the thermal interface material and the solid-state device has a value of 0.06 cm2K/W or less.

Abstract: A vacuum deposition method for fabricating high-strength nitinol films by sputter depositing nickel and titanium from a heated sputtering target, and controlling the sputter deposition process parameters in order to create high-strength nitinol films that exhibit shape memory and/or superelastic properties without the need for precipitation annealing to attenuate the transition conditions of the deposited material. A vacuum deposited nitinol film having high-strength properties equal to or better than wrought nitinol films and which are characterized by having non-columnar crystal grain structures.

Abstract: A two-layer nanotape that includes a nanoribbon substrate and an oxide that is epitaxially deposited on a flat surface of the nanoribbon substrate is described. The oxide is deposited on the substrate using a pulsed laser ablation deposition process. The nanoribbons can be made from materials such as SnO2, ZnO, MgO, Al2O3, Si, GaN, or CdS. Also, the sintered oxide target can be made from materials such as TiO2, transition metal doped TiO2 (e.g., CO0.05Ti0.95O2), BaTiO3, ZnO, transition metal doped ZnO (e.g., Mn0.1Zn0.9O and Ni0.1Zn0.9O), LaMnO3, BaTiO3, PbTiO3, YBa2Cu3Oz, or SrCu2O2 and other p-type oxides. Additionally, temperature sensitive nanoribbon/metal bilayers and their method of fabrication by thermal evaporation are described. Metals such as Cu, Au, Ti, Al, Pt, Ni and others can be deposited on top of the nanoribbon surface. Such devices bend significantly as a function of temperature and are suitable as, for example, thermally activated nanoscale actuators.

Abstract: A material and method for adhering at least two materials that includes the step of interposing at least one intermediate layer between the two materials and associated adhesion material. The materials to be adhered exhibit at least one characteristic dissimilarity and the intermediate material interposed contains at least one shape memory alloy, the shape memory alloy capable of exhibiting superelasticity.

Abstract: The present invention relates to a material for shielding electromagnetic interference (EMI) and radio frequency interference (RFI) between a, electrical conductor or bundle of conductors and the environment. The material comprises a heat-shrinkable woven fabric coated with a conductive material. Specifically, the material can be used as a jacket heat-shrinkable to fit with any sized wire, cable, data or signal line, antenna, or other electrical conductor. A method of making the material is also discussed. In the method, a heat-shrinkable woven fabric is coated with a conductive slurry. When the slurry is dried, a conductive material is deposited on the surface of the heat-shrinkable woven fabric.

Abstract: The present invention is an encapsulated yeast composite comprising a core comprising yeast and a coating containing an emulsifiable lipid. The yeast includes Saccharomyces cerevisiae. The invention also relates to other encapsulated bioactive substance composites. The nature of the coating provides controlled release of the bioactive substance from the encapsulate. The encapsulated composites are useful in the production of food compositions, food products, and animal feed products.

Abstract: A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the filler diffuses into the solder to form a new filler-solder alloy having an increased melting point and added robustness.

Abstract: An atomic force microscope including a cantilever, a transferring device and a displacement detecting device is used for conducting a material test of a test member based on a load amount and a displacement amount. The test member may be fixed to the cantilever or may be entirely replaced with the cantilever. The transferring device, which is normally used for transferring the cantilever or the sample in accordance with a shape of the sample, constitutes a load applying device for applying a load to the test member, and a displacement of the test member is detected by the displacement detecting device. The load applying device can apply slight displacement and load to the test member, so that the material test for the small material can be conducted.

Abstract: A method and structure for reducing chip carrier flexing during thermal cycling. A semiconductor chip is coupled to a stiff chip carrier (i.e., a chip carrier having an elastic modulus of at least about 3×105 psi), and there is no stiffener ring on a periphery of the chip carrier. Without the stiffener ring, the chip carrier is able to undergo natural flexing (in contrast with constrained flexing) in response to a temperature change that induces thermal strains due to a mismatch in coefficient of thermal expansion between the chip and the chip carrier. If the temperature at the chip carrier changes from room temperature to a temperature of about −40° C., a maximum thermally induced displacement of a surface of the chip carrier is at least about 25% less if the stiffener ring is absent than if the stiffener ring is present.

Abstract: The instant invention provides a means and method for producing multi-laminar elements, said elements being suitable for operation in high temperature, atmospheric or vacuum environments such as those which may be required when processing materials such as substrates for semiconductors or for chemical vapor deposition.

Abstract: A reduced CTE composite structure is made by providing a matrix material whose CTE is to be reduced, adding negative CTE bodies to the matrix material and mechanically coupling the matrix material to the negative CTE bodies as by deforming the composite structure. A preferred application is to make an improved composite material for use as a heat sink for semiconductor substrates with a minimum of thermal expansion mismatch.

Abstract: A micromachined element mounted to a substrate, the element including a cantilever having a proximal portion attached to the substrate and a coilable distal portion terminating in a free distal end. The coilable distal portion, upon being heated, is capable of bending away from the substrate and at least partially coiling upon itself to form a coiled portion. At least part of the micromachined element may be electrically conductive. In various embodiments, the micromachined element may function as a mechanical microspring, an electrically conductive link, and/or a magnetic coil. A method of fabricating the microelement may include the steps of selectively depositing various layers upon the substrate.

Abstract: An oil level control valve (10) has a molded base (12) having an oil receiving aperture (12d) formed through a bottom wall (12e) with a circumscribing generally rectangular cover plate seat in which a cover plate (14) is removably received. A thermostatic element (16) in the form of a generally rectangular sheet is fastened to posts (12f) extending upwardly from sidewalls of the base by means of peg portions (12g, 12h) received through holes in the sheet and heat staked to the posts. The thermostatic element allows the cover plate to move away from the seat for optimum oil flow at low temperature conditions and restricts the valve opening as temperature of the oil increases to accommodate an increase in oil volume due to expansion in order to maintain the fluid level in the main sump of a transmission housing by allowing an increase in the fluid level of an auxiliary sump in accordance with target values for different flow rates.

Abstract: It is an object of the present invention to provide a bimetal having a same or wider proportional temperature range than a bimetal using a 42 wt % Ni--Fe alloy as a low thermal expansion alloy, and a higher bending characteristic of a large bending coefficient than a bimetal using a 36 wt % Ni--Fe alloy. The bimetal is formed by bonding a Ni--Co--Fe group low thermal expansion alloy, wherein a total amount of Ni and Co restricted to a very narrow containing range is within a specific composition range, a thermal expansion coefficient at 30 to 100.degree.C. is made similar to that of a 31 wt % Ni--5 wt % Co--Fe alloy of a nominal composition, a thermal expansion is very small and 2.times.10.sup.-6 /.degree.C. or less in the temperature range of 30.degree.to 300.degree. C., and further, a transition point is 250.degree. C. or higher and a transformation temperature is 50.degree. C.

Abstract: A multilayer structure has a selectable, (i) propagating reaction front velocity V, (ii) reaction initiation temperature attained by application of external energy and (iii) amount of energy delivered by a reaction of alternating unreacted layers of the multilayer structure. Because V is selectable and controllable, a variety of different applications for the multilayer structures are possible, including but not limited to their use as ignitors, in joining applications, in fabrication of new materials, as smart materials and in medical applications and devices. The multilayer structure has a period D, and an energy release rate constant K. Two or more alternating unreacted layers are made of different materials and separated by reacted zones. The period D is equal to a sum of the widths of each single alternating reaction layer of a particular material, and also includes a sum of reacted zone widths, t.sub.i, in the period D.

Abstract: A high density, substantially oxide-free metal layer is deposited by spray deposition on a substrate in an atmosphere containing ambient air having an oxygen content above about 0.1% by weight. This is accomplished by directing a supersonic-velocity jet stream of hot gases carrying metal particles at the substrate through an inert gas shroud. The layer is useful as a corrosion barrier and for repairing metal substrates.

Abstract: A test specimen is provided, that is constructed of dual materials, which are preferably metallic materials and which are more preferably an austenitic iron alloy and a ferritic iron alloy. The specimen is generally constructed as a rectangular configuration, with two principal legs, connected together by substantially rigid connections at their ends, with the legs being of the different materials, such that, when the specimen is subjected to heat, one leg will expand linearly an amount greater than the other leg allowing the imposition of bending stress, whereby a given leg will experience both tension and compression. Observation may then be made, by a microscopic examination or otherwise, of those surfaces that are adjacent the portions of the legs that experience most of the tension and compression, such that the effects of temperature on the materials may be observed and recorded.

Abstract: A composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties is produced by joining of at least two parts consisting of a total of at least one shape memory alloy having a two-way effect, whereby each part has a memory effect by itself. In the case of at least two shape memory alloys (1, 2) with different transition temperatures but the same mode of movement, the joining of the individual parts can take place prior to the deformation in the low temperature range necessary to inducing the two-way effect. In the case of differing types and degrees of movement of the individual parts (25, 26), their joining can first be accomplished only after the individual deformations of each part for itself in the low temperature range are accomplished regardless of how many shape memory alloys with different transition temperatures are used in the structure of the composite material.

Abstract: Ferrous bimetals bearing easily read indicia and methods of making them. The bimetals of the present invention have a transparent oxide coating of a controlled thickness in the interference range and are prepared by immersing them in a acid bath, then washing away a film that is formed, followed by tempering them in an oxidizing atmosphere. Bimetals prepared this way have a golden hue an are easily marked with indicia that can be read by a consumer.

Abstract: A thermostatic metal comprises a layer of a low expansion metal bonded to a layer of a high expansion metal, the outer surface of one of the layers comprising a layer of similar composition but containing, in addition, a grain growth limiting additive.

Abstract: An article in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties is produced by joining of at least two parts consisting of a total of at least one shape memory alloy having a two-way effect, whereby each part has a memory effect by itself. In the case of at least two shape memory alloys (1, 2) with different transition temperatures but the same mode of movement, the joining of the individual parts can take place prior to the deformation in the low temperature range necessary to inducing the two-way effect. In the case of differing types and degrees of movement of the individual parts (25, 26), their joining can first be accomplished only after the individual deformations of each part for itself in the low temperature range are accomplished regardless of how many shape memory alloys with different transition temperatures are used in the structure of the article.

Abstract: A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.

Abstract: Material, in the form of bars, tubes, profiles, wires, sheets, or bands, which is, at least partially, composed of a constituent showing a one-way shape memory effect, and a further inactive constituent hindering the one-way effect of the first, and which collectively exhibits a significant two-way effect. The one-way shape memory constituent can be a Cu-Al-Ni, Cu-Al, TiV, Ti-Nb, Ni-Ti, or Ni-Ti-Cu alloy. Production of bi- or multi-constituent components by brazing, welding, roll bonding, extruding, powder metallurgical methods, hot isostatic pressing, or gluing, or by the application of metallic coatings (2) onto a core material (1) and subsequent diffusion treatment to produce an inactive surface layer (3).

Abstract: The invention relates to semiconductor chip mounting substrate for use in semiconductor apparatus, wherein metal material or multi-laminated metal material is coated on its surface and/or lateral faces with thin film of insulated inorganic matter in order to obtain an insulated substrate not only capable of efficiently radiating the heat developed in the semiconductor chip but also having thermal expansion coefficient approximate to that of the semiconductor chip, or further coated with film of Cu or Al so that the substrate is provided with high thermal conductivity and required thermal expansion characteristics thereby enabling to produce semiconductor apparatus highly effective for the acceleration of increase of density, reduction of size and improvement of radiation of IC.

Abstract: A composite thermostat metal having layers of metal of relatively high and relatively low coefficients of thermal expansion metallurgically bonded together has a relatively thin, corrosion-resistant layer of an austenitic stainless steel metallurgically bonded to the low expansion side of the thermostat metal, the stainless steel material being selected from the group consisting of austenitic stainless steels which undergo austenite to martensite transformation and concomitant lowering of coefficient of thermal expansion during work hardening. The stainless steel material is work hardened to a selected extent for lowering its coefficient of thermal expansion so that it cooperates with the other components of the thermostat metal in providing the thermostat metal with suitably high flexivity while also providing improved corrosion-resistance properties on the low expansion side of the thermostat metal.

Abstract: Thermally expansive jewelry as bracelets, rings, wristwatch bands and the like are characterized by formation of the entirety or a component part thereof of an arcuate length of bimetallic strip, thereby to increase and decrease the effective diameter or bounded area of the jewelry to maintain comfort and fit of the jewelry as the body member such as a wrist or finger may swell or recede under varying temperature conditions.

Abstract: There is provided a class of mechanically pre-stressed structures, suitably bi-layer strips comprising a layer of group 5 transition metals in intimate contact with a layer of an intermetallic compound of said transition metals with certain group 3A, 4A or 5A metals or metalloids suitably gallium, indium, silicon, germanium, tin, arsenic or antimony. The changes of Young's modulus of these bi-layered combinations at temperatures in the region of but somewhat above absolute zero provides a useful means of sensing temperature changes. Such bi-metallic strips may be used as control strips in thermostats, in direct dial reading instruments, or the like.

Abstract: The thermal expansion joint for relieving stresses in a pipe line due to thermal expansion consists of a pair of pipe sections wherein each section has one-half of its wall made of a metal having a higher thermal coefficient of expansion than the thermal coefficient of expansion of another metal forming the other half of the pipe section. The two metals are suitably welded along two axially aligned seams disposed on opposite sides of an axis. The section has suitably designed end flanges which can be coupled to each other and also to a flange on, for example, a standard pipe elbow. When the section is coupled to the standard elbow, the metal with the higher thermal coefficient of expansion is disposed on the opposite side from which the free end of the elbow points. Now, the free end of each elbow is coupled within the pipe line so that the fluid path is a modified "Z". To save space, the pair of sections can be formed into a helix.

Abstract: A thermostat metal characterized by low cost has a substantially linear temperature response over a wide temperature range from 0.degree. to 800.degree. F. and is adapted for wide use for temperature control purposes in a whole variety of electrical cooking appliances, particularly when used in combination with integral but thermally-inactive support means for the thermostat metal. The thermostat metal comprises a layer of metal of relatively high coefficient of thermal expansion having a nominal composition by weight of 72 percent manganese, 18 percent copper and 10 percent nickel metallurgically bonded to a layer of metal of relatively lower coefficient of thermal expansion comprising 430 Stainless Steel, whereby the bimetal material displays a sufficiently high and linear flexivity over a wide temperature range to be useful in the various different types of thermostats used in cooking appliances.

Abstract: A composite thermostat metal (bimetal) is disclosed in which a layer of strain hardenable aluminum is bonded to a layer of metal of relatively low coefficient of thermal expansion.

Abstract: A bimetal is disclosed having a high, rapid deflection over a specified temperature range, including a high expansion metal alloy component having a high thermal expansion coefficient that changes rapidly at 50.times.10.sup.-6 /.degree. C. or greater at a temperature of between about 100.degree. C. and 250.degree. C. and containing from 15-30% by weight of manganese, the balance of iron. The second component has a substantially constant thermal expansion coefficient regardless of the temperature change, and is preferably a stainless steel. These bimetals are used in circuit breakers, thermal protectors and the like.

Abstract: Bimetal strip the high-expansion element of which is an alloy which, in weight percent (w/o), consists essentially of up to about 0.50 w/o carbon, about 15-50 w/o manganese, up to about 2 w/o silicon, up to about 12 w/o chromium, about 10-35 w/o nickel, up to about 10 w/o cobalt and the balance iron except for incidental amounts of other elements which may include up to about 0.04 w/o phosphorus, up to about 0.04 w/o sulfur as well as other elements which do not significantly detract from the desired properties or result in the formation of ferrite or otherwise render the desired room temperature austenitic structure of the alloy unstable so as to significantly reduce the coefficient of thermal expansion.

Abstract: A castable nickel-iron base alloy suitable for high temperature service and characterized by low thermal expansion and freedom from notch sensitivity and deleterious microshrinkage in castings. The alloy consists essentially of at least 16% nickel, at least 10% cobalt, up to 5% columbium, up to 3% tantalum, up to 2.5% titanium, up to 2% aluminum, 0.06% to 0.25% boron, up to 0.1% carbon, and the balance iron.

Abstract: The bimetallic material comprises a laminate of two materials, one having a high coefficient of thermal expansion, one with a low coefficient of thermal expansion. The material with the high coefficient of expansion is a corrosion resisting and heat resisting austenitic chromium-nickel steel, while the material with the low coefficient of expansion is a heat hardenable alloy of iron, nickel, cobalt and titanium and/or aluminium. It is found that this combination of materials gives rise to a bimetallic material capable of heavy duty applications without the disadvantages normally associated with such heavy duty materials.

Abstract: A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.