Abstract: This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).

Abstract: A magnetic device uses laminated ferromagnetic layers containing antiferromagnetically coupled ferromagnetic films coupled together with improved antiferromagnetically coupling (AFC) films. The AFC films are formed of the binary and ternary alloys comprising combinations of Ru, Os and Re. The ferromagnetic film thicknesses, the AFC film thicknesses and the compositions of the films in the laminated layer can be varied to engineer the magnetic properties of the device. The magnetic devices whose properties are improved with the improved laminated layers include spin valve magnetoresistive read heads and magnetic tunnel junction (MTJ) devices for use as magnetic memory cells and magnetoresistive read heads.

Abstract: The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional insert powder composition of loose powder metal is placed in a compact of a surrounding body powder composition and both metal compositions are sintered in a sintering furnace to form a sintered part. The sintered part is infiltrated in part or in whole with a molten metal compound to produce a functionally graded metal substrate having a density of at least 90% of theoretical. A heat-generating component such as a chip can be attached to the metal substrate for use in microelectronic packaging. When the functionally-graded metal substrate has two discrete compositions of copper/tungsten the surrounding body which has a CTE that ranges from about 5.6ppm/.degree. C. to about 7 ppm/.degree. C.

Abstract: For bonding pure beryllium to a copper alloy, a beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy to prevent bonding strength from degrading in the bonding process or during operation of a nuclear fusion reactor, by effectively mitigating formation of brittle intermetallic compounds and generation of thermal stress at the bonding interface.

Abstract: Permanently substituted oxyfluorinated surfaces can be formed on non-fluorinated substrates having a fluorinated surface or fluorocarbon coating applied by gas phase surface fluorination or plasma deposition. The oxyfluorinated surfaces can be refunctionalized by bonding organosilanes, isothiocyanate-containing fluorescent compounds and proteins, such as enzymes, antibodies and peptides directly to such surfaces. Surfaces refunctionalized with such protein based groups are useful in the fabrication of biological sensors, devices for separation of cell lines, filtration applications for selective binding of antigens. Masking techniques can be employed in forming a predetermined pattern of covered and exposed surfaces, for example, prior to oxyfluorination.

Abstract: It is an object of the present invention to provide a bimetal having a same or wider proportional temperature range than a bimetal using a 42 wt % Ni--Fe alloy as a low thermal expansion alloy, and a higher bending characteristic of a large bending coefficient than a bimetal using a 36 wt % Ni--Fe alloy. The bimetal is formed by bonding a Ni--Co--Fe group low thermal expansion alloy, wherein a total amount of Ni and Co restricted to a very narrow containing range is within a specific composition range, a thermal expansion coefficient at 30 to 100.degree.C. is made similar to that of a 31 wt % Ni--5 wt % Co--Fe alloy of a nominal composition, a thermal expansion is very small and 2.times.10.sup.-6 /.degree.C. or less in the temperature range of 30.degree.to 300.degree. C., and further, a transition point is 250.degree. C. or higher and a transformation temperature is 50.degree. C.

Abstract: In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multi-layer is a non-copper metal having a melting point higher than a temperature at which the ceramic multi-layer is fired, typically Ag. Cu and Ag form eutectic crystals when firing the surface conductor layer of Cu. This can be prevented by connecting the surface conductor layer and the inner conductor with Ag--Pd or a metal which is different from the materials of the surface wiring layer and the inner conductor and which does not form eutectic crystals with the material of the surface wiring layer at the temperature at which the surface wiring layer is fired.

Abstract: An electro-deposition coated member comprises a substrate having thereon an electro-deposition coating film. The electro-deposition film contains a powder comprising a ceramic powder having an average particle diameter of from 0.1 to 5 .mu.m, the particle surfaces of which are coated with a metal, in an amount of from 5 to 50 parts by weight based on 100 parts by weight of the electro-deposition coating film. The electro-deposition coated member can be produced by a process comprising the steps of; subjecting a substrate to electro-deposition coating in a coating composition containing a resin feasible for electro-deposition and a powder comprising a ceramic powder having an average particle diameter of from 0.1 to 5 m, the particle surfaces of which are coated with a metal, the powder being contained in an amount of from 0.2 to 30 parts by weight based on from 100 to 150 parts by weight of the resin feasible for electro-deposition; and subsequently carrying out low-temperature curing.

Abstract: In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multilayer is a non-copper metal having a melting point higher than a temperature at which the ceramic multilayer is fired, typically Ag. Cu and Ag form eutectic crystals when firing the surface conductor layer of Cu. This can be prevented by connecting the surface conductor layer and the inner conductor with Ag-Pd or a metal which is different from the materials of the surface wiring layer and the inner conductor and which does not form eutectic crystals with the material of the surface wiring layer at the temperature at which the surface wiring layer is fired.

Abstract: This invention relates to a composition of a region joining two members treated thermodynamically by a process set forth by the present invention. In accordance with one aspect of the present invention, there is provided a region comprising a solidified bead containing generally between 1.6 and 2.0% beryllium, a melt and mix zone containing generally between 0.6 and 1.8% beryllium, a recrystallized zone containing generally between 0.6 and 1.0% beryllium, and an overaged zone containing generally between 0.3 and 0.8% beryllium.

Abstract: A high density, substantially oxide-free metal layer is deposited by spray deposition on a substrate in an atmosphere containing ambient air having an oxygen content above about 0.1% by weight. This is accomplished by directing a supersonic-velocity jet stream of hot gases carrying metal particles at the substrate through an inert gas shroud. The layer is useful as a corrosion barrier and for repairing metal substrates.

Abstract: An electro-deposition coated member has a metal substrate or a non-metal substrate having been subjected to metal plating, a chemically colored film provided on said substrate, and a conductive electro-deposition coating film formed on said chemically colored film.

Abstract: A composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties is produced by joining of at least two parts consisting of a total of at least one shape memory alloy having a two-way effect, whereby each part has a memory effect by itself. In the case of at least two shape memory alloys (1, 2) with different transition temperatures but the same mode of movement, the joining of the individual parts can take place prior to the deformation in the low temperature range necessary to inducing the two-way effect. In the case of differing types and degrees of movement of the individual parts (25, 26), their joining can first be accomplished only after the individual deformations of each part for itself in the low temperature range are accomplished regardless of how many shape memory alloys with different transition temperatures are used in the structure of the composite material.

Abstract: A multilayer ceramic substrate with multilayered circuit patterns, the improvement in which internal conductors for wiring are formed by a Ag base conductive materials capable of being co-fired with multilayered green ceramic substrate sheets in an oxidizing atmosphere and external conductors electrically connected with the internal conductors are formed by a Cu base conductive material, the external Cu conductors being formed in such a manner so that a liquid phase of Cu-Ag is not formed at the interface of the Cu conductor and the Ag conductor. Further high reliable resistors of RuO.sub.2 or Bi.sub.2 Ru.sub.2 O.sub.7 type may be integrally formed onto and/or inside the substrate. In such an arrangement, problems or difficulties caused due to Ag migration, incomplete binder removal, solder leaching, etc., are eliminated and thereby there can be a multilayer substrate with a high reliability and a high pattern precision.

Abstract: An improved electrical discharge machining electrode permitting improved cutting action to be achieved at the same level of electrical power being applied to the wire electrode. Such improvement is attributable to a particular configuration and the material being employed in the wire electrode which has an iron alloy core coated with an intermediate layer including a copper and zinc heat reaction product on which is deposited an adherent carbon surface coating. The improved method and apparatus for employment of this electrode is also described along with one method to form the multilayer coating on the electrode wire core.

Abstract: An article in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties is produced by joining of at least two parts consisting of a total of at least one shape memory alloy having a two-way effect, whereby each part has a memory effect by itself. In the case of at least two shape memory alloys (1, 2) with different transition temperatures but the same mode of movement, the joining of the individual parts can take place prior to the deformation in the low temperature range necessary to inducing the two-way effect. In the case of differing types and degrees of movement of the individual parts (25, 26), their joining can first be accomplished only after the individual deformations of each part for itself in the low temperature range are accomplished regardless of how many shape memory alloys with different transition temperatures are used in the structure of the article.

Abstract: A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.

Abstract: A metallic endless press band with an embossed engraving thereon for use in double band presses for the manufacture of laminates, such as panels, foils, films and the like having textured surfaces wherein a lengthwise and crosswise welding of rolled or electrodeposited surfaces is utilized, consisting essentially of a material which is a metal alloy which may be precipitation hardened or altered in its crystal structure by heat or radiation treatment, the metal structure at the welding seam being identical with the unwelded base material after hardening or after treatment to the extent that no hardness or crystal structure differences which impair the depth of the embossing pattern result when texturing the surface by knurling, etching or mechanical engraving.

Abstract: Material, in the form of bars, tubes, profiles, wires, sheets, or bands, which is, at least partially, composed of a constituent showing a one-way shape memory effect, and a further inactive constituent hindering the one-way effect of the first, and which collectively exhibits a significant two-way effect. The one-way shape memory constituent can be a Cu-Al-Ni, Cu-Al, TiV, Ti-Nb, Ni-Ti, or Ni-Ti-Cu alloy. Production of bi- or multi-constituent components by brazing, welding, roll bonding, extruding, powder metallurgical methods, hot isostatic pressing, or gluing, or by the application of metallic coatings (2) onto a core material (1) and subsequent diffusion treatment to produce an inactive surface layer (3).

Abstract: The invention relates to semiconductor chip mounting substrate for use in semiconductor apparatus, wherein metal material or multi-laminated metal material is coated on its surface and/or lateral faces with thin film of insulated inorganic matter in order to obtain an insulated substrate not only capable of efficiently radiating the heat developed in the semiconductor chip but also having thermal expansion coefficient approximate to that of the semiconductor chip, or further coated with film of Cu or Al so that the substrate is provided with high thermal conductivity and required thermal expansion characteristics thereby enabling to produce semiconductor apparatus highly effective for the acceleration of increase of density, reduction of size and improvement of radiation of IC.

Abstract: A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

Abstract: A composite thermostat metal (bimetal) is disclosed in which a layer of strain hardenable aluminum is bonded to a layer of metal of relatively low coefficient of thermal expansion.

Abstract: The surface of manganese alloys is protected from corrosion by directly exchanging the manganese on the surface of the alloy with a more noble metal, such as nickel, by intrinsic voltaic couple deposition. The invention finds particular utility in protecting manganese alloys from corrosion when used as a thermostat metal.

Abstract: Thermostat metal compositions are disclosed which have a substantially uniform flexivity over a broad range of operating temperatures and which respond rapidly to changes in ambient temperatures. These results are achieved by using, as an intermediate layer, a major portion by volume of a thermostat metal that has a thermal conductivity in excess of 2,400 BTU in/ft.sup.2 hr.degree. F.

Abstract: A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.