Boride, Carbide Or Nitride Component Patents (Class 428/627)
  • Patent number: 4851299
    Abstract: Molded bodies of SiC ceramic can be firmly bonded to each other or to mol bodies of other ceramic material or to metal workpieces by the establishment of diffusion-welding conditions when a metal alloy layer is interposed between cleaned and polished surfaces that are to be joined. The alloy metal of the layer is MnCu or MnCo or multi-component alloys containing the foregoing as a base and additions of other metals to a total percentage not exceeding 70% with each single other metal being present in the range from 2 to 45% by weight. Such other metals constitute 1 or more of Cr, Ti, Zr, Fe, Ni, V and Ta. The Mn, Cu alloy or alloy base has a Cu content from 10 to 90%, preferably 25 to 82% and the MnCo alloy or alloy base has a cobalt content of 5 to 50% by weight. MnCuFe eutectic compositions containing 5 to 30% by weight Fe and 10 to 90% by weight Cu and MnCoCr eutectic compositions with chromium content from 2 to 45% by weight are preferred, especially 50:40:10 MnCuFe and 60:30:10 MnCoCr.
    Type: Grant
    Filed: July 20, 1988
    Date of Patent: July 25, 1989
    Assignee: Kernforschungsanlage Julich Gesellschaft mit beschrankter Haftung
    Inventor: Jerzy Godziemba-Maliszewski
  • Patent number: 4842957
    Abstract: A pressure sensor element is disclosed which essentially comprises a high-strength electric insulating ceramic substrate and a silver coating tightly deposited on the surface of the substrate. When a region of the element is subjected to a high pressure, the electric resistance in the region concerned changes in proportion to the magnitude of the pressure.
    Type: Grant
    Filed: October 29, 1987
    Date of Patent: June 27, 1989
    Assignees: Agency of Industrial Science & Technology, Ministry of International Trade & Industry
    Inventors: Tetsuo Yamamoto, Hiroshi Hayashi, Tenshiro Muta, Yoshisada Hori, Katsushi Kubo
  • Patent number: 4837089
    Abstract: A composite sintered compact consisting of a sintered body portion, which contains at least one of high density boron nitride and diamond, and a cermet or metal portion bonded to the sintered body portion through an amorphous metal interposed between the sintered body portion and the cermet or metal portion at their bonding area, has high hardness and strength, and further has excellent handleability, heat resistance and toughness during the whole processes ranging from its production to its consumption.
    Type: Grant
    Filed: December 14, 1987
    Date of Patent: June 6, 1989
    Assignee: Nippon Oil and Fats Company, Limited
    Inventors: Masatada Araki, Yutaka Kuroyama
  • Patent number: 4835065
    Abstract: Disclosed is a circuit substrate comprising an alumina plate and an aluminum nitride plate bonded to the alumina plate through metallized layers formed on the respective bonding surfaces of the alumina plate and the aluminum nitride plate and a buffering layer provided between the metallized layers, the buffering layer being of a metallic material(a) which undergoes plastic deformation by recrystallization at a temperature of not higher than 500.degree. C.,(b) which has a tensile strength of not higher than 35 kg.f/mm.sup.2 at a temperature of 500.degree. C., and(c) which has an elongation of not less than 10% at a temperature of 500.degree. C.The circuit substrate of this invention can provide a circuit substrate being excellent in heat dissipating characteristic and free from the generation of crack on an operation.
    Type: Grant
    Filed: July 8, 1987
    Date of Patent: May 30, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideki Sato, Nobuyuki Mizunoya
  • Patent number: 4829020
    Abstract: During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.
    Type: Grant
    Filed: October 23, 1987
    Date of Patent: May 9, 1989
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Timothy J. Drummond, David S. Ginley, Thomas E. Zipperian
  • Patent number: 4828934
    Abstract: Ceramic substrates, e.g. of silicon carbide or silicon nitride are protected against mechanical surface wear at high temperatures by an arc coating with a refractory metal followed by coating with another metal and then with a wear-reducing high density layer, e.g. of a metal oxide, nitride or carbide.
    Type: Grant
    Filed: December 12, 1986
    Date of Patent: May 9, 1989
    Assignee: Vapor Technologies, Inc.
    Inventor: Eduard Pinkhasov
  • Patent number: 4827289
    Abstract: A thermal head for a printer in accordance with the present invention comprises: a substrate (11); a heater layer (12) on the substrate; lead wires (13a and 13b) formed on the heater layer for supplying electric power to the heater layer; and a single protective layer (20) for protecting the heater layer and the lead wires by covering them, the protective layer including an oxide or a nitride.
    Type: Grant
    Filed: June 23, 1988
    Date of Patent: May 2, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shiro Tsuji, Eizo Naya, Takashi Yamanaka, Yoshihiro Usui, Hiroshi Ito, Noriyuki Hasebe
  • Patent number: 4820562
    Abstract: This invention relates to a metallizing composition capable of forming an electroconductive coating of satisfactory adherence properties on the surface of a sintered ceramic article, particularly on a sintered silicon nitride type ceramic article. The metallizing composition contains metal salts of tungstic acid and/or molybdic acid and a metal of Group IVb of the Periodic Table of Elements or a compound thereof. The electroconductive coating of high adherence properties is formed by applying the metallizing composition on a sintered ceramic article and drying the deposited layer of the composition in air, heating the dried layer, and firing the layer in a non-oxidizing atmosphere. The metallizing composition is suitable for the formation of the electroconductive coating on a complexly shaped sintered ceramic article such as, for example, on the inner surface of a hollow ceramic article.
    Type: Grant
    Filed: January 7, 1988
    Date of Patent: April 11, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shunichiro Tanaka, Akio Sayano, Tsuneji Kameda
  • Patent number: 4808487
    Abstract: The protection layer (3,4,5) applied to a support (1) by a vacuum plasma spraying process comprises an adherence layer (3), an intermediate layer (4) and a coating layer (5). In order to enable a universal application of the protection, particularly in the construction of turbines, foundry and nuclear technique, the adherence layer (3) is made of a selected material having a composition and a thermal expansion coefficient close to those of the material of the object to be coated (1). The intermediate layer (4) is comprised of a mixture of the material of the adherence layer (3) and of that of the coating layer (5) and the coating layer is comprised of a thick layer of sprayed material selected in the group of borides, carbides, nitrides and oxides of preferably TiB.sub.2 or Al.sub.2 O.sub.3.
    Type: Grant
    Filed: January 15, 1987
    Date of Patent: February 28, 1989
    Assignee: Plasmainvent AG, Im Oberleh 2
    Inventor: Heiko Gruenr
  • Patent number: 4806394
    Abstract: A method is provided for producing a wear-resistant layer on a metal base. A material, containing about 10 to 50% by weight of TiC in the form of sintered or agglomerated particles in which TiC is dispersed in a matrix alloy selected from the group consisting of iron, nickel and cobalt alloys, is applied to a metal base by thermal spraying. The sprayed-on layer is subjected to heat treatment to provide precipitation hardening by virtue of the precipitation of TiC as uniformly dispersed fine grains. The sintered or agglomerated particles containing TiC have a grain size of -150 to +37 .mu.m. The layer is applied by autogeneous flame spraying to a thickness of at least about 1 mm.
    Type: Grant
    Filed: September 30, 1977
    Date of Patent: February 21, 1989
    Assignee: Castolin S.A.
    Inventor: Hans-Theo Steine
  • Patent number: 4794053
    Abstract: A buried conductive and/or reflective layer is provided in an optical element including at least one chemically vapor deposited material layer. Over a first layer of material is provided an intermediate region. The intermediate region in one embodiment includes at least one layer of a refractory-type material. In an alternate embodiment, the intermediate region is a composite intermediate region including a first passivating layer comprising a layer of a refractory-type of material such as one of the borides, carbides, nitrides, oxides and silicides, or a refractory-type of metal such as tungsten, molybdenum, tantalum, titanium and rhodium or a refractory-type of metal alloy. A conductive layer is then provided over at least a portion of the first passivating layer. Said conductive layer may comprise any of the highly conductive/reflective metals such as copper, gold, silver, palladium, platinum and aluminum, for example.
    Type: Grant
    Filed: July 1, 1985
    Date of Patent: December 27, 1988
    Assignee: Raytheon Company
    Inventor: Randal W. Tustison
  • Patent number: 4786916
    Abstract: A thermal head in which a glazed layer, an improved undercoat layer, a heat generating resistor layer, an electrical power supply conductor layer and a protection layer are successively laminated to the surface of an insulating substrate, in which the undercoat layer is composed of an aluminum nitride (AlN) film. The method of manufacturing the thermal head comprises forming the aluminum nitride (AlN) film by sputtering an Al target in a gas mixture of argon and nitrogen and forming the heat generating resistor layer and the electrical power supply conductor layer, that is, three layers in total successively formed by sputtering. Because of the good heat conductivity of aluminum nitride film, the temperature distribution in the heat generating portion is made uniform and localized heat generation can be avoided, as it also prevents the destruction of the heat generating resistor layer or the protection layer due to the temperature difference upon heat generation.
    Type: Grant
    Filed: December 2, 1986
    Date of Patent: November 22, 1988
    Assignee: Alps Electric Co., Ltd.
    Inventor: Masakazu Kato
  • Patent number: 4785775
    Abstract: A wear layer is provided for each of a piston and cylinder of an internal combustion engine in which ash-producing fuels of solid-liquid mixtures are combusted. Each layer consists of a hard phase and a second phase of lower hardness and greater toughness. Each wear layer has a minimum thickness of one millimeter; the hard phase has a minimum hardness of 1900 HV with a mean chord length in the running direction of from 30 to 200 microns. There is a metallurgical bond between the phases in the wear layer as well as between the wear layer and the substrate. In addition, the hard phases of the respective wear layers have an almost equal hardness value.
    Type: Grant
    Filed: July 31, 1985
    Date of Patent: November 22, 1988
    Assignee: Sulzer Brothers Limited
    Inventors: Roger Dekumbis, Marc-Olivier Borel, Ulrich Ritter, Gerard Barbezat
  • Patent number: 4785470
    Abstract: X-ray dispersive and reflective structures and materials are constructed which exhibit improved characteristics in specific ranges of interest. The structures are formed of metallic and non-metallic layer pairs. The structures are formed of alternating layers of Cr:C, Ni:C or V:C for carbon analysis and Mo:B.sub.4 C for beryllium an boron analysis. The layered structures can be formed from Ni:C for analysis of both carbon and boron.
    Type: Grant
    Filed: April 25, 1986
    Date of Patent: November 15, 1988
    Assignee: Ovonic Synthetic Materials Company, Inc.
    Inventors: James L. Wood, Keith L. Hart
  • Patent number: 4776863
    Abstract: A cutting tool, in particular of hard metal, which is coated with hard layers of titanium carbide, titanium carbonitride and/or titanium nitride and that has an outer thin layer of zirconium nitride. The thickness of this outer layer of zirconium nitride amounts to between 1 and 30%, preferably 1 to 10%, of the thickness of the base coating of titanium carbide, titanium carbonitride and/or titanium nitride.
    Type: Grant
    Filed: July 9, 1987
    Date of Patent: October 11, 1988
    Assignee: Fried. Krupp Gesellschaft mit beschrankter Haftung
    Inventors: Hendrikus van den Berg, Udo Konig, Norbert Reiter
  • Patent number: 4772080
    Abstract: A buried conductive and/or reflective layer is provided in an optical element including at least one chemically vapor deposited material layer. Over a first layer of material is provided an intermediate region. The intermediate region in one embodiment includes at least one layer of a refractory-type material. In an alternate embodiment, the intermediate region is a composite intermediate region including a first passivating layer comprising a layer of a refractory-type of material such as one of the borides, carbides, nitrides, oxides and silicides, or a refractory-type of metal such as tungsten, molybdenum, tantalum, titanium and rhodium or a refractory-type of metal alloy. A conductive layer is then provided over at least a portion of the first passivating layer. Said conductive layer may comprise any one of the highly conductive/reflective metals such as copper, gold, silver, palladium, platinum and aluminum, for example.
    Type: Grant
    Filed: January 20, 1987
    Date of Patent: September 20, 1988
    Assignee: Raytheon Company
    Inventor: Randal W. Tustison
  • Patent number: 4770479
    Abstract: A buried conductive and/or reflective layer is provided in an optical element including at least one chemically vapor deposited material layer. Over a first layer of material is provided an intermediate region. The intermediate region in one embodiment includes at least one layer of a refractory-type material. In an alternate embodiment, the intermediate region is a composite intermediate region including a first passivating layer comprising a layer of a refractory-type of material such as one of the borides, carbides, nitrides, oxides and silicides, or a refractory-type of metal such as tungsten, molybdenum, tantalum, titanium and rhodium or a refractory-type of metal alloy. A conductive layer is then provided over at least a portion of the first passivating layer. Said conductive layer may comprise any one of the highly conductive/reflective metals such as copper, gold, silver, palladium, platinum and aluminum, for example.
    Type: Grant
    Filed: January 20, 1987
    Date of Patent: September 13, 1988
    Assignee: Raytheon Company
    Inventor: Randal W. Tustison
  • Patent number: 4767674
    Abstract: It is disclosed that a metal cored board which comprises an electrically conductive layer whose one surface at least composed of a hardly oxidizable metal, an insulating organic polymer layer baked on the surface of the hardly oxidizable metal, and a metal core adhered on the insulating organic polymer layer, and a method for manufacturing a metal cored board, which comprises a step to coat the surface of a hardly oxidizable metal layer of an electrically conductive metal foil with an insulating varnish, a step to bake a layer of the varnish, and a step to adhere a metal core on the baked varnish layer.
    Type: Grant
    Filed: July 26, 1985
    Date of Patent: August 30, 1988
    Assignee: Dainichi-Nippon Cables, Ltd.
    Inventors: Hideaki Shirai, Kimio Chiba, Koji Okawa, Hiroshi Ishibashi, Akihiro Ishii, Hirotaka Itoh, Hirokazu Kuzushita, Michihiko Yoshioka, Michio Hirose
  • Patent number: 4764435
    Abstract: A metal composition usable as a brazing material for bonding a metal to a non-oxide ceramic. The brazing material contains, at least, one or more metals selected from a first group of transition metals consisting of Pt, Pd, Rh, Ir, Ru and Os, and one or more metals selected from a second group of transition metals consisting of Cr, Mn, Fe, Co, Ni and Cu. The material may further contain one or more elements selected from a third group of elements consisting of B, C, Si and P.
    Type: Grant
    Filed: June 16, 1986
    Date of Patent: August 16, 1988
    Assignee: Nippondenso Co., Ltd.
    Inventors: Hiroki Hosizaki, Hirofumi Suzuki, Terutaka Kageyama
  • Patent number: 4761345
    Abstract: There is disclosed an aluminum nitride substrate which comprises a substrate composed of an aluminum nitride sintered product; an electroconductive metallized layer composed of titanium nitride and at least one selected from the group consisting of molybdenum, tungsten, tantalum, an element in group III of the periodic table, an element in group IVa of the same, a rare earth element, an actinide element and a compound containing these elements; and an electroconductive protective layer laminated in this order on the aluminum nitride sintered product.
    Type: Grant
    Filed: February 20, 1987
    Date of Patent: August 2, 1988
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideki Sato, Nobuyuki Mizunoya, Mitsuhiro Nagata
  • Patent number: 4761346
    Abstract: Erosion resistance is imparted to a metallic substrate without an attendant loss of fatigue life in the substrate in one embodiment by applying to the substrate a first ductile layer comprising a metal from Group VI to Group VIII elements as well as the noble metal group of elements, and a second hard erosion-resistant layer applied on the first layer comprising a boride, carbide, nitride or oxide of a metal selected from Group III to Group VI elements, the first layer capable of retaining substrate integrity and preventing diffusion of material from the second layer into the substrate. Another embodiment defines another layer of a substantially pure metal from Group III to Group VI between the first and second layers. Still another embodiment defines that in the second layer the content of either the carbide, nitride, boride or oxide is graded, i.e.
    Type: Grant
    Filed: May 20, 1986
    Date of Patent: August 2, 1988
    Assignee: AVCO Corporation
    Inventor: Subhash K. Naik
  • Patent number: 4761344
    Abstract: A rocker arm of a valve mechanism of an automotive internal combustion engine is composed of a rocker arm tip secured to a rocker arm main body. The rocker arm tip includes a sheet type sintered alloy adhered to a steel substrate. The sintered alloy includes a joining phase of martensite stainless steel, and a hard phase of boride and/or multiple boride of at least one, including iron, of elements capable of forming boride and/or multiple boride. The hard phase is homogeneously dispersed in the joining phase. The sintered alloy contains boron ranging from 3.0 to 5.0% by weight, and the hard phase ranging from 40 to 62% by weight. Additionally, the sintered alloy has a maximum grain size of the boride and/or multiple boride ranging not larger than 50 .mu.m, a Rockwell A-scale hardness number ranging not less than 80, and a deflective strength ranging not lower than 175 kgf/mm.sup.2.
    Type: Grant
    Filed: April 9, 1987
    Date of Patent: August 2, 1988
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Yoshihiro Maki, Makoto Kano, Akira Fujiki, Ichiro Tanimoto
  • Patent number: 4753851
    Abstract: The inability of conventional adhesion/diffusion barrier Ti-TiN laminates to secure a narrow linewidth electrodeposited gold layer to a silicon structure and prevent unwanted gold diffusion during anneal cycles at temperatures greater than 370.degree. C. for substantial periods of time is overcome by the addition of a medium thickness (.gtoreq.1,500.ANG.) layer of tungsten over the exposed silicon prior to formation of the titanium/titanium nitride laminate structure.
    Type: Grant
    Filed: May 29, 1987
    Date of Patent: June 28, 1988
    Assignee: Harris
    Inventors: Bruce E. Roberts, Charles M. Dalton, Jimmy C. Black
  • Patent number: 4753854
    Abstract: A wear-resistant coating of a cutting tool has at least a single layer of an interstitial phase which comprises alloying components and a non-metallic component the content of which falls within the boundaries of a region wherein a compound of this interstitial phase having the greatest thermodynamic stability is homogeneous. One of the alloying components functions as a catalyst which facilitates the compound with the high thermodynamic stability to form. A method of applying the wear-resistant coating to a cutting tool provides for condensing matter by virtue of ion bombardment and consists in introducing the catalyst into a vacuum by evaporating the material of a cathode and depositing a layer of coating on the base material of the cutting tool at a temperature thereof which permits a catalytic reaction to take place owing whereto the content of the non-metallic component falls within the boundaries of a region wherein the compound with the highest thermodynamic stability is homogeneous.
    Type: Grant
    Filed: May 30, 1986
    Date of Patent: June 28, 1988
    Assignee: Vsesojuzny-Nauchno Issledovatelsky Instrumentalny Institut
    Inventors: Alexei G. Gavrilov, Viktor P. Zhed, Elena I. Kurbatova, Andrei K. Sinelschikov, Evdokia M. Sokolovskaya, Vladimir B. Bozhukov, Albert M. Boyarunas
  • Patent number: 4746563
    Abstract: Multilayer coated cemented carbides excellent in wear resistance and toughness are provided comprising a substrate of cemented carbide, an inner layer contacted with the surface of the substrate, and an outer layer contacted with the inner layer, the inner layer being a single layer and/or laminated layers consisting of at least one member selected from the group consisting of carbides, nitrides, carbonitrides, carboxynitrides, oxynitrides, boronitrides and borocarbonitrides of Ti, and the outer layer being a multilayer with a total thickness of 5 to 20 .mu.m, consisting of a plurality of Al.sub.2 O.sub.3 layer each having a thickness of 0.01 to 2 .mu.m, each consisting of an Al.sub.2 O.sub.3 film in which titanium oxide is dissolved or at most 30 vol % of titanium oxide is coexistent and being respectively divided by interlayers each having a thickness of 0.01 to 2 .mu.
    Type: Grant
    Filed: May 2, 1985
    Date of Patent: May 24, 1988
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Minoru Nakano, Masaaki Tobioka
  • Patent number: 4746582
    Abstract: A ceramic-metal composite body including (a) a ceramic member, (b) a ferrous metal member bonded to the ceramic member, (c) an intermediate metallic member joined to the iron base member, and (d) an aluminum member bonded to the intermediate metallic member. The ceramic member and the aluminum member are integrally joined through the ferrous metal member and the intermediate metallic member.
    Type: Grant
    Filed: January 9, 1987
    Date of Patent: May 24, 1988
    Assignee: NGK Insulators, Ltd.
    Inventor: Nobuo Tsuno
  • Patent number: 4741975
    Abstract: Erosion resistance is imparted to a metallic substrate without an attendant loss of fatigue life in the substrate by applying to the substrate a first layer comprising palladium, platinum or nickel in direct contact with the substrate and then applying a second layer which overcoats the first layer, the second layer being comprised of a tungsten-carbon alloy or a material formed of a tungsten matrix having dispersed tungsten-carbon compound phases therein. In another embodiment erosion resistance is imparted by employing a coating which comprises a first ductile layer on the substrate of palladium, platinum or nickel; a second layer comprising substantially pure tungsten; and a third layer comprising a material formed of a tungsten-carbon alloy or a material formed of a tungsten matrix having dispersed tungsten-carbon compound phases.
    Type: Grant
    Filed: May 20, 1986
    Date of Patent: May 3, 1988
    Assignee: Avco Corporation
    Inventors: Subhash K. Naik, Louis J. Fiedler
  • Patent number: 4740429
    Abstract: Metal-ceramic joined articles having a splendid joint strength can be provided easily, even when the metallic member has a largely different thermal expansion coefficient from that of the ceramic member of the metal-ceramic article.
    Type: Grant
    Filed: July 17, 1986
    Date of Patent: April 26, 1988
    Assignee: NGK Insulators, Ltd.
    Inventor: Nobuo Tsuno
  • Patent number: 4735866
    Abstract: A method of joining ceramics and metals to themselves and to one another at about 800.degree. C. is described using a brazing filler metal consisting essentially of 35 to 50 at. % copper, 40 to 50 at. % silver, 1 to 15 at. % titanium, and 2 to 8 at. % tin. This method produces strong joints that can withstand high service temperatures and oxidizing environments.
    Type: Grant
    Filed: July 28, 1986
    Date of Patent: April 5, 1988
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventor: Arthur J. Moorhead
  • Patent number: 4732801
    Abstract: A structure and method for fabricating the structure, which includes a layer containing a refractory metal and a substrate to which the refractory metal-containing layer does not strongly adhere, there being a thin bonding layer between the substrate and the refractory metal-containing layer for providing good adherence between the refractory metal-containing layer and the substrate. The bonding layer is an oxide, nitride or mixed oxy-nitride layer initially prepared to be Si-rich in a surface region thereof. Inclusions of the refractory metal are produced in the bonding layer by substituting the refractory metal for excess free silicon therein. These inclusions become nucleation and bonding sites for refractory metal deposition, ensuring good adhesion.
    Type: Grant
    Filed: April 30, 1986
    Date of Patent: March 22, 1988
    Assignee: International Business Machines Corporation
    Inventor: Rajiv V. Joshi
  • Patent number: 4731115
    Abstract: A microcomposite material having a matrix of a titanium-base alloy, the material further including about 10-80% by weight TiC substantially uniformly dispersed in the matrix. Several methods of cladding a macrocomposite structure including pressing quantities of a matrix material and a microcomposite material composed of the matrix material and a compatible stiffener material into layers to form a multi-layered compact and sintering the multi-layered compact to form an integral metallurgical bond between the layers of the compact with diffusion but essentially no composition gradient between the layers. A multi-layered macrocomposite article composed of an alloy layer of a matrix material and a layer of a microcomposite material composed of the matrix material and a compatible stiffener material bonded together at the interface region between the layers, the interface region being essentially free of a composition gradient.
    Type: Grant
    Filed: February 22, 1985
    Date of Patent: March 15, 1988
    Assignee: Dynamet Technology Inc.
    Inventors: Stanley Abkowitz, Harold L. Heussi, Harold P. Ludwig
  • Patent number: 4728579
    Abstract: A wear resistant, coated, metal carbide body comprising a metal carbide basic body, a metallic intermediate layer and at least one metal-free hard substance layer; wherein the metallic intermediate layer comprises molybdenum and/or tungsten, has a thickness of 0.1 to 2 .mu.m and is applied to the metal carbide basic body by means of a physical vapor deposition process, preferably by direct cathode sputtering. During the application of the intermediate layer, the metal carbide basic body has a temperature from 200.degree. to 600.degree. C.
    Type: Grant
    Filed: March 4, 1986
    Date of Patent: March 1, 1988
    Assignee: Fried. Krupp Gesellschaft mit beschrankter Haftung
    Inventor: Udo Konig
  • Patent number: 4711386
    Abstract: A pyrolytic boron nitride article is joined to a metal or ceramic member by use of a brazing alloy containing titanium as an active metal.
    Type: Grant
    Filed: September 15, 1986
    Date of Patent: December 8, 1987
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara
  • Patent number: 4707416
    Abstract: A composite material composed of a non-oxide type ceramic and iron or an alloy thereof is disclosed, wherein the non-oxide type ceramic is formed with a copper metallized surface and bonded to the iron or alloy thereof with an intermediate layer of Invar steel, Kovar or copper disposed between the copper metallized surface and the iron or alloy thereof.
    Type: Grant
    Filed: April 15, 1985
    Date of Patent: November 17, 1987
    Assignee: Agency of Industrial Science and Technology
    Inventors: Yoshihiro Ebata, Ryozo Hayami, Nobuyuki Tamari, Yasuo Toibana, Makoto Kinoshita
  • Patent number: 4706061
    Abstract: A gaseous composition sensor which is a microstructure device comprising a heated planar thin film diaphragm sensor member suspended over a shallow flat bottomed etched pit in a single crystal silicon substrate.
    Type: Grant
    Filed: August 28, 1986
    Date of Patent: November 10, 1987
    Assignee: Honeywell Inc.
    Inventor: Robert G. Johnson
  • Patent number: 4704338
    Abstract: A two-stage bonding technique for bonding high density silicon nitride and other ceramic materials to stainless steel and other hard metals, and multilayered ceramic-metal composites prepared by the technique are disclosed. The technique involves initially slurry coating a surface of the ceramic material at about 1500.degree. C. in a vacuum with a refractory material and the stainless steel is then pressure bonded to the metallic coated surface by brazing it with nickel-copper-silver or nickel-copper-manganese alloys at a temperature in the range of about 850.degree. to 950.degree. C. in a vacuum. The two-stage bonding technique minimizes the temperature-expansion mismatch between the dissimilar materials.
    Type: Grant
    Filed: November 20, 1986
    Date of Patent: November 3, 1987
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Richard L. Landingham, Thomas E. Shell
  • Patent number: 4702967
    Abstract: To securely attach a narrow line width electrodeposited layer of gold to an underlying semiconductor structure a thin multiphase adhesion film of nitrogen-modified titanium is formed between a titanium nitride diffusion barrier layer and an overlying gold seed layer. This additional layer nitrogen-modified titanium layer provides a titanium base to ensure adhesion of the gold, yet contains sufficient nitrogen interstitially dispersed in the thin titanium film to prevent formation of unetchable gold-titanium compounds.
    Type: Grant
    Filed: June 16, 1986
    Date of Patent: October 27, 1987
    Assignee: Harris Corporation
    Inventors: Jimmy C. Black, Bruce E. Roberts
  • Patent number: 4699850
    Abstract: The present device relates to an ornamental part utilized in watchcases, watchbands, spectacle frames, accessories and such, wherein the material of the member is heat-resisting material such as metal, ceramics, or plastic, the material being covered by a three-layer structure coating, the successively formed layers being; a layer which has gold colored titanium nitride as its main component; a layer which has gold colored zirconium nitride as its main component; and a gold or gold alloy layer formed on the outer layer.
    Type: Grant
    Filed: March 7, 1986
    Date of Patent: October 13, 1987
    Assignee: Seiko Instruments & Electronics Ltd.
    Inventors: Matsuo Kishi, Kenichi Ogawa, Hiroshige Ikeno
  • Patent number: 4698272
    Abstract: An extra-low iron loss grain oriented silicon steel sheet comprises a base metal of silicon steel and a thin coat of nitride or carbide of Ti, Zr, Hf, V, Nb, Ta, Mn, Cr, Mo, W, Co, Ni, Al, B and Si and strongly adhered to a finished surface of the base metal through a mixed layer of the base metal and the thin coat, and has excellent electrical and magnetic properties as well as good compressive stress dependence of magnetostriction and lamination factor.
    Type: Grant
    Filed: February 21, 1986
    Date of Patent: October 6, 1987
    Assignee: Kawasaki Steel Corporation
    Inventors: Yukio Inokuti, Yo Ito
  • Patent number: 4690793
    Abstract: The nuclear fusion reactor of the present invention presents a new vacuum vessel for enclosing plasma particles where a reactor wall exposed to the above plasma particles has a piled structure. A plurality of heat-resisting ceramic tiles are metallurgically bonded to a metal-base body having a cooling means through a brazing material. The ceramic tiles are preferably composed of sintered silicon carbide of high density and containing a little beryllium oxide between the boundaries of crystal grains.
    Type: Grant
    Filed: February 17, 1984
    Date of Patent: September 1, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Hisanori Okamura, Kunio Miyazaki, Hirosi Akiyama, Shinichi Itoh, Tomio Yasuda, Kousuke Nakamura, Yukio Okoshi, Mutuo Kamoshita, Akio Chiba
  • Patent number: 4690861
    Abstract: A magneto optical recording medium comprising laminating a reflective layer, a dielectric undercoat layer and a hexagonal magnetoplumbite-type metal oxide magnetic layer on a substrate in order, characterized by that said magnetic layer is made an excellently C axis - orientated perpendicular magnetic film by putting the crystal misfit between said reflective layer and said dielectric undercoat layer formed thereon within .+-.30% and the crystal misfit between said dielectric undercoat layer and said hexagonal magnetoplumbite -type metal oxide magnetic layer formed thereon within .+-.30%, and thus various characteristics are widely improved.
    Type: Grant
    Filed: February 24, 1986
    Date of Patent: September 1, 1987
    Assignee: Ricoh Co., Ltd.
    Inventors: Hitoshi Nakamura, Yujiro Kaneko, Yasuo Sawada, Hajime Machida, Fumiya Omi, Atsuyuki Watada
  • Patent number: 4686080
    Abstract: A composite compact component made of a composite compact consisting of a diamond or BN powder bonded to a hard sintered alloy base during a sintering operation, and a substrate composed of steel or a hard sintered alloy bonded to the base of the composite compact through a high strength filler metal or alloy having a melting point of at least the liquidus point of the hard sintered alloy base. A process of making set composite compact component is also disclosed as well as a drill bit containing said composite compact component and variations thereof.
    Type: Grant
    Filed: December 9, 1985
    Date of Patent: August 11, 1987
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Hara, Masaya Miyake, Shuji Yazu
  • Patent number: 4666786
    Abstract: A composite nickel plated sliding surface is obtained by the formation of a composite nickel plating film on a sliding surface of an automobile part such as an engine cylinder or piston by electroless nickel plating. The plating film contains at least one member of wear resistant particles having an average particle size of 0.1 to 1.0.mu. selected from SiC, TiC, WC, BC.sub.4, TiN, Al.sub.2 O.sub.3 or the like, and also at least one member of lubricating particles having an average particle size of 1 to 10.mu. selected from BN, MoS.sub.2, and Teflon. The nickel plating bath is adjusted to have a phosphorus concentration of 0.5 to 12%. When the matrix of the nickel plating film has a phosphorus concentration of 0.5 to 5%, the film hardness is improved.
    Type: Grant
    Filed: February 27, 1985
    Date of Patent: May 19, 1987
    Assignees: Aisin Seiki Kabushiki Kaisha, Toyota Jidosha Kabushiki Kaisha
    Inventors: Hideo Yano, Keiichi Kano, Hitoshi Ozawa, Shinji Kato, Yoshio Takagi
  • Patent number: 4662429
    Abstract: Reinforced composite aluminum-matrix articles containing a non-oxide reinforcing material, such as silicon carbide fibers or particles, are produced by a casting process wherein a small amount of lithium less than about 1%, by weight, is included in a melt of aluminum matrix alloy to facilitate wetting of the reinforcing material and ready dispersal thereof in the aluminum matrix alloy.
    Type: Grant
    Filed: August 13, 1986
    Date of Patent: May 5, 1987
    Assignee: AMAX Inc.
    Inventors: Tsuguyasu Wada, Daniel J. Adenis, Thomas B. Cox
  • Patent number: 4657825
    Abstract: The bond strength between a silicon carbide substrate and a metal layer comprised of a series of metal films is improved without detrimentally affecting other properties of such a device by interposing a layer of silicon, Si.sub.2 Mo or mixtures thereof between the substrate and the first metal film in the layer which is preferably Ti, Zr or Hf.
    Type: Grant
    Filed: December 23, 1985
    Date of Patent: April 14, 1987
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Atsushi Kanda, Shunichi Takagi, Rokuro Kambe
  • Patent number: 4657823
    Abstract: A ring is formed having alternating segments of ferromagnetic and paramagnetic materials. The ring is formed by first providing an annular ring of a high strength magnetic steel. Teeth are formed on the outer surface of the ring by forming troughs of the ferromagnetic material. Low pressure plasma deposition is used to fill in the troughs with a high strength paramagnetic material. The excess steel and excess plasma deposited material is removed to leave the finished ring of alternating segments of ferromagnetic and paramagnetic material.
    Type: Grant
    Filed: September 21, 1984
    Date of Patent: April 14, 1987
    Assignee: General Electric Company
    Inventors: Paul A. Siemers, Robert W. Kopp, Melvin R. Jackson
  • Patent number: 4656101
    Abstract: A electronic device having a structure in which at least one electronic element, including an insulating film or covered with a protecting film, is formed on a substrate, where the insulating or protecting film consist principally of aluminum nitride. Alternatively, the insulating or protecting film can be a laminated member composed of a film consisting principally of aluminum nitride and a film consisting principally of silicon oxide or silicon nitride.
    Type: Grant
    Filed: November 7, 1985
    Date of Patent: April 7, 1987
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Shunpei Yamazaki
  • Patent number: 4650722
    Abstract: A hard faced article comprising an iron or steel substrate having on the surface thereof a weld deposit composed of a solidified iron or steel matrix containing a hard facing material comprising chemically combined vanadium and carbon having tungsten composition wherein said chemically combined vanadium and carbon with tungsten composition consist essentially of a solid solution of vanadium, tungsten and carbon composition and is substantially uniformly distributed throughout said solidified iron or steel matrix, said composition consisting essentially of at least one vanadium carbide with tungsten in solid solution with each vanadium carbide in an amount from about 10% by weight up to solid solubility limit of tungsten in each vanadium carbide.
    Type: Grant
    Filed: December 15, 1983
    Date of Patent: March 17, 1987
    Assignee: Union Carbide Corporation
    Inventors: Harry J. Brown, William D. Forgeng, Charles M. Brown
  • Patent number: H301
    Abstract: A method of joining ceramics and metals to themselves and to one another is escribed using essentially pure trinickel aluminide and trinickel aluminide containing small amounts of carbon. This method produces strong joints that can withstand high service temperatures and oxidizing environments.
    Type: Grant
    Filed: March 11, 1986
    Date of Patent: July 7, 1987
    Assignee: The United States of America as represented by the Department of Energy
    Inventor: Arthur J. Moorhead
  • Patent number: RE32464
    Abstract: A thin film of magnetic recording material is sputter deposited over a base layer of gold and tantalum on a polished substrate. A protective layer of gold and tantalum is deposited overlaying the magnetic recording film. A solid lubricant layer such as carbon, preferably in the form of graphite, gold, silver, tin, molybdenum disulfide, and tungsten disulfide is sputter deposited or ion plated over the protective layer to reduce wear. The recording contacting portion of the recording head is similarly coated with a solid lubricant material. Other suitable protective materials include tantalum, niobium, tungsten and nitrides and carbides of such metals. In a preferred method for making such recording members, the layers are successively sputter deposited in an evacuated sputter chamber, whereby the recording layers and protective coatings are formed in a continuous process requiring only one pump down.
    Type: Grant
    Filed: April 16, 1986
    Date of Patent: July 28, 1987
    Inventor: Harry E. Aine