Abstract: Disclosed are processes and articles for composite electroless coatings comprising at least two distinct layers, the first layer comprising a metal and/or a metal alloy plus particulate matter and the second layer comprising a metal and/or a metal alloy and being substantially free of particulate matter.

Abstract: A method of manufacturing a film type light receiving element in which the electric current ratio for light and dark input intensities is maximized. Metal electrodes and a photoconductive film are provided in the form of belt-shaped layers on a flat smooth substrate such as a quartz layer. An optically transmissive electrode film of a tin oxide compound is formed thereon in a magnetron type sputtering device. Utilizing the fact that the electric current ratio for light and dark input intensities of the light receiving element varies according to the oxygen partial pressure of the sputtering atmosphere in the sputtering device, the oxygen partial pressure is set close to a value at which the electric current ratio for light and dark input intensities is at a peak value.

Abstract: The invention provides a method of electrodepositing palladium on a substrate e.g. an electrical switch contact, to give a coating having low transverse porosity and good slip wear resistance. The method involves electrodepositing a first layer from an alkaline bath containing a cationic palladium ammine complex and then electrodepositing on the first layer a second layer from an acid bath containing an anionic palladium nitrite complex.

Abstract: A body of sensitized stainless steel is afforded passivity for exposure to a corrosive environment by an integral surface region of normalized stainless shell formed in situ by laser beam scanning.

Abstract: A device and method are disclosed for treating compressible materials, such as hay or other fibrous materials, with a treating substance, preferably anhydrous ammonia, as a preservative for the treated compressible material. The treating substance is preferably introduced into a treating area as a gas, but may be introduced in aqueous or liquid form to establish a fog of treating substance in the treating area.The compressible material to be treated is introduced into the treating area which preferably has air locks, established by a pair of pressure rollers, at both the compressible material inlet and outlet to maintain the treating substance within the treating area.Within the treating area, a path is established for continuous movement of the compressible materials from the inlet to the outlet rollers.

Abstract: A flexible, low porosity airfoil skin is described which includes multilayer flexible, annealed metallic mesh members consisting of two or three such members selected from the class consisting of nickel, Monel alloy, and stainless steel, the members having a mesh size from 60 to 100, the members interlocked mechanically, and the skin having a thickness reduction in the range from 2.5 to 3.0. Such a flexible, low porosity airfoil skin is useful as a covering structure and is particularly useful as a skin or as a substrate for a cooled non-linear airfoil-shaped body, such as a turbine or compressor blade.

Abstract: A magnetic recording media is manufactured by depositing a nonmagnetic cobalt base alloy onto a substrate preferably aluminum as a protective layer for the substrate. The cobalt alloy includes chromium, tungsten, and nickel. The clad protective layer can be deposited in several steps with or without a polishing between the deposition steps to provide better corrosion protection for the substrate and covers surface imperfections of the substrate. The cobalt alloy is preferably sputtered onto the prepared substrate.

Abstract: A large diameter rocket launch tube comprised of a pair of thin sheets wh are rolled and positioned in concentric relation with the seams disposed in spaced (180.degree.) relation. A pair of reinforcing weld strips are positioned inside the tube adjacent the seams, and a second pair of reinforcing strips are positioned inside the tube intermediate the first pair of strips. A bonding agent is spread on the inner tube and the tubes are assembled and spot welded prior to having the adhesive cured.

Abstract: A method of making a composite article having at least a minimum selected impact strength by first obtaining the impact energy absorption/shear strength relationship for the collimated filaments and matrix material comprising the article. Impact strength is improved by the selection of the relative bond strengths between constituents and the orientation of selected matrix materials relative to the impact surface of the article.

Abstract: A nickel-chromium-titanium filler alloy for inert gas shielded-arc welding of 50% Cr, 50% Ni type alloys. The wrought alloy is characterized by a single phase austenitic microstructure and contains, by weight, from about 42 to about 46% chromium, from about 0.1 to about 1.8% titanium, from about 0.01 to about 0.1% carbon, and up to about 0.1% magnesium with the balance, apart from incidental elements, essentially nickel. The alloy provides sound welds having a two phase microstructure that afford elevated temperature strength and corrosion resistance equal to that afforded by base metals of the 50% Cr, 50% Ni type.

Abstract: A metallization scheme for interconnection of elements in thin film and hybrid circuits is described. A thin layer of titanium is first formed, preferably by evaporation or sputtering, on the surface of the insulating substrate. A thin layer of copper is then formed in the same manner over the titanium layer. This is followed by electroplating of copper to a desired thickness onto selected portions of the Ti-Cu multilayer. Successive layers of nickel and gold are then selectively electroplated onto the plated copper regions. An additional layer of palladium may also be included between the titanium and copper layers for improved adhesion. The Ti-Cu-Ni-Au metallization system has been found unusually compatible with the major processing requirements of thin film circuits, for example, thermocompression bonding, soldering, via-hole coverage and resistor stabilization.