Next To Group Viii Metal-base Component Patents (Class 428/648)
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Patent number: 11939692Abstract: A steel sheet for can making and methods for manufacturing the same. The steel sheet includes, in order from a steel sheet side, an iron-nickel diffusion layer, a metallic chromium layer, and a chromium oxide layer. The iron-nickel diffusion layer has a nickel coating weight of 50 mg/m2 to 500 mg/m2 per surface of the steel sheet and a thickness of 0.060 ?m to 0.500 ?m per surface of the steel sheet. The metallic chromium layer includes a flat-like metallic chromium sublayer and a granular metallic chromium sublayer placed on a surface of the flat-like metallic chromium sublayer. The total chromium coating weight of both sublayers per surface of the steel sheet is 60 mg/m2 to 200 mg/m2. The chromium oxide layer has a chromium coating weight 3 mg/m2 to 10 mg/m2 per surface of the steel sheet in terms of metallic chromium.Type: GrantFiled: June 7, 2019Date of Patent: March 26, 2024Assignee: JFE STEEL CORPORATIONInventors: Yusuke Nakagawa, Hanyou Sou, Yoichiro Yamanaka
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Patent number: 11371130Abstract: A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m2 per one surface.Type: GrantFiled: April 26, 2019Date of Patent: June 28, 2022Assignee: NIPPON STEEL CORPORATIONInventors: Masahiro Fuda, Toshinori Mizuguchi, Junji Nakano, Yoshiharu Inoue, Kazuhisa Kusumi, Yasuaki Naito
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Patent number: 10294558Abstract: A method for producing a metal sheet is provided. The method includes providing a steel substrate having two faces, depositing a metal coating on each face by dipping the substrate in a bath, cooling the metal coatings, altering layers of magnesium oxide or magnesium hydroxide formed on the outer surfaces of the metal coatings, and depositing a layer of oil on the outer surfaces of the metal coatings.Type: GrantFiled: April 25, 2013Date of Patent: May 21, 2019Assignee: ARCELORMITTAL INVESTIGACION Y DESARROLLO, S.L.Inventors: Tiago Machado Amorim, Joëlle Richard, Eric Jacqueson, Audrey Lhermeroult, Pascale Feltin, Jean-Michel Lemaire, Luc Diez, Jean-Michel Mataigne
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Patent number: 10287647Abstract: A steel component formed from a flat steel having a yield point of 150-1100 MPa and a tensile strength of 300-1200 MPa and coated with an anticorrosion coating of an alloy that includes 35-70% by weight aluminum, 35-60% by weight zinc, 0.1-10% by weight magnesium, up to 10% by weight Si, and up to 5% by weight Fe. A blank obtained from the flat steel product is heated to at least 800° C. and formed into the steel component. Alternatively, the steel component may be formed into the steel component first and then heated to at least 800° C. Regardless, the steel component may then be hardened by sufficiently rapid cooling the steel component from a sufficiently high temperature.Type: GrantFiled: July 15, 2014Date of Patent: May 14, 2019Assignee: THYSSENKRUPP STEEL EUROPE AGInventors: Maria Köyer, Sascha Sikora, Janko Banik, Manuela Ruthenberg, Jennifer Schulz
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Patent number: 10218102Abstract: A terminal fitting that can reduce the terminal insertion force and can suppress surface oxidation of a plating film, even if the terminal fitting is exposed to a hot and humid environment, and a connector that uses the terminal fitting. The terminal fitting includes a metal base material, and the plating film. The plating film includes a Ni foundation layer, an outermost layer exposed at the outermost surface, and a Ni3Sn4 layer formed between the Ni foundation layer and the outermost layer. The outermost layer includes a Sn parent phase, and intermetallic compound that is dispersed in the Sn parent phase, and is made of (Ni0.4Pd0.6)Sn4. The intermetallic compound protrudes from the lower side of the outermost layer to the Ni3Sn4 layer side, and is partially buried in the Ni3Sn4 layer. A connector includes the terminal fitting, and a housing that holds the terminal fitting.Type: GrantFiled: October 18, 2016Date of Patent: February 26, 2019Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hajime Watanabe, Yoshifumi Saka
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Patent number: 9914584Abstract: A three-piece resealable can for acidic liquid includes, a cylindrical can body member that includes a screw portion at one end; and a can bottom member that contacts the can body member so as to close an opening portion of the other end of the can body member. The can body member includes a cylindrical first steel sheet, Ni plating that is formed on an inner circumferential surface of the first steel sheet, a polyester film that is formed so as to be disposed on the outermost surface of the inner circumference of the can body member, and a Zr-containing film that is formed between the first steel sheet and the polyester film. The can bottom member includes a second steel sheet, and Sn plating that is formed on the can body member side of the can bottom member. The Zr-containing film contains Zr compounds.Type: GrantFiled: May 27, 2013Date of Patent: March 13, 2018Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATIONInventors: Shigeru Hirano, Yoshiaki Tani, Hirokazu Yokoya
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Patent number: 9758853Abstract: Disclosed is a hot-dip Al—Zn alloy coated steel sheet having excellent anti-corrosion property after coating, and a method for producing the same. In the disclosure, the hot-dip Al—Zn alloy coated steel sheet has a hot-dip coating layer containing by mass %, Al: 25% to 90%, and at least one of Sn: 0.01% to 2.0%, In: 0.01% to 10%, and Bi: 0.01% to 2.0%.Type: GrantFiled: February 17, 2014Date of Patent: September 12, 2017Assignee: JFE STEEL CORPORATIONInventors: Masahiro Yoshida, Akira Matsuzaki, Satoru Ando
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Patent number: 9689052Abstract: The present invention provides a very thin steel sheet and production method thereof that, in a very thin steel sheet of 0.4 mm or less thickness, enable production at low addition of special elements, simultaneous achievement of both good workability and anti-aging property, and stable passing of even wide coil in a continuous annealing process, which very thin steel sheet and production method.Type: GrantFiled: May 17, 2010Date of Patent: June 27, 2017Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATIONInventors: Hidekuni Murakami, Seiichi Tanaka, Keiichiroh Torisu, Akihiro Jinno
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Patent number: 9428824Abstract: A metallic coated steel strip includes a steel strip and a metallic coating on at least one side of the strip. The metallic coating includes an Al—Zn—Mg—Si overlay alloy layer and an intermediate alloy layer between the steel strip and the overlay alloy layer. The intermediate alloy layer has a composition of, by weight, 4.0-12.0% Zn, 6.0-17.0% Si, 20.0-40.0% Fe, 0.02-0.50% Mg, and balance Al and unavoidable impurities.Type: GrantFiled: July 31, 2013Date of Patent: August 30, 2016Assignee: Bluescope Steel LimitedInventor: Qiyang Liu
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Patent number: 9308545Abstract: A system and a method for pretreating an aluminum assembly includes selecting a blank having a thin film pretreatment layer and a lubricant coating applied to a surface. The blank is formed to a desired shape and an adhesive is applied to a selected portion of the surface. A cleaner is applied to the assembly to remove the thin film pretreatment layer and the lubricant coating from the surface except at the selected portion and a zirconium oxide conversion coating is applied to the assembly before painting.Type: GrantFiled: June 26, 2014Date of Patent: April 12, 2016Assignee: Ford Global Technologies, LLCInventors: Mark Edward Nichols, Janice Lisa Tardiff, Brian Schneider, Steven J. Simko
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Publication number: 20150118514Abstract: A method of thermal interface material (TIM) assembly includes plating a seed layer on each of a plurality of graphite film layers, each of the graphite film layers comprising parallel-oriented graphite nanoplates, stacking the plurality of graphite film layers, each of the plurality of graphite film layers separated by at least one solder layer, pressing together the stacked graphite film layers, and applying heat to the plurality of graphite film layers and respective at least one solder layer in a vacuumed furnace to form a graphite laminate.Type: ApplicationFiled: October 30, 2013Publication date: April 30, 2015Inventors: Yuan Zhao, Dennis R. Strauss, Ten-Luen T. Liao, Vivek Mehrotra, Chung-Lung Chen
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Publication number: 20150079419Abstract: This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.Type: ApplicationFiled: March 28, 2013Publication date: March 19, 2015Inventors: Jean Joseph Campaniello, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
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Publication number: 20150047879Abstract: The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 ?m or more; the thickness of the upper layer is 0.005 ?m or more and 0.Type: ApplicationFiled: January 25, 2013Publication date: February 19, 2015Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
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Patent number: 8956735Abstract: A mating-type connecting part can be obtained by stamping and surface-roughening a copper sheet into a predetermined shape with depressions as a plurality of parallel lines. The copper sheet then has a roughness of from 0.5 ?m to 4.0 ?m parallel to a sliding direction upon connection, a mean projection-depression interval of from 0.01 mm to 0.3 mm in that direction, a skewness less than 0, and a protrusion peak portion height of 1 ?m or less. The copper sheet is then plated with Cu and Sn, followed by reflowing. The result is a connecting part having a Sn surface coating layer group as a plurality of parallel lines, and a Cu-Sn alloy coating layer adjacent to each side of each Sn surface coating layer.Type: GrantFiled: March 22, 2011Date of Patent: February 17, 2015Assignees: Kabushiki Kaisha Kobe Seiko Sho, Shinko Leadmikk Co., Ltd.Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
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Publication number: 20150044500Abstract: This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.Type: ApplicationFiled: March 28, 2013Publication date: February 12, 2015Inventors: Jean Joseph Campaniello, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
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Patent number: 8940405Abstract: A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 ?m to 4.0 ?m in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 ?m or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 ?m or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing.Type: GrantFiled: August 9, 2013Date of Patent: January 27, 2015Assignees: Kobe Steel, Ltd., Shinko Leadmikk Co., Ltd.Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
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Publication number: 20150017469Abstract: The invention relates to sheet steel for use as packaging steel, made of a non-alloy or low-alloy and cold-rolled steel having a carbon content of less than 0.1%. According to the invention, in order to use such sheet steel for packaging steel that has good formability and can be produced in a cost-effective way, the sheet steel contains less than 0.4 wt % of manganese, less than 0.04 wt % of silicium, less than 0.1 wt % of aluminum, and less than 0.1 wt % of chromium and is provided with a multi-phase structure, comprising ferrite and at least one of the structure constituents martensite, bainite, and/or residual austenite. The invention further relates to a method for producing such packaging steel from cold-rolled sheet steel.Type: ApplicationFiled: October 2, 2012Publication date: January 15, 2015Inventors: Reiner Sauer, Burkhard Kaup, Dirk Matusch, Dimitrios Nouskalis
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Patent number: 8915761Abstract: A connector terminal which can achieve high mechanical connection strength and stabilized low electrical connection resistance when it is crimped to an aluminum electric wire, and in addition, can suppress electrical contact resistance low when it is fitted to a mating connector terminal is provided. In a connector terminal (1A) having an electrical contact section (10) which is brought into contact and conducted with a mating connector terminal by fitting to the mating connector terminal, and a conductor crimping section (12) which is crimped to the conductor of an electric wire, a metal material which constitutes the terminal uses aluminum or an aluminum alloy as a base material (100), a Zn layer (101) having a thickness in the range from 0.1 ?m to 2.0 ?m by electroless plating and a Cu layer (102) having a thickness in the range from 0.5 ?m to 1.0 ?m by electrolytic plating are formed in sequence on the surface of the base material (100), and an Sn layer (105) having a thickness in the range from 0.Type: GrantFiled: March 24, 2010Date of Patent: December 23, 2014Assignee: Yazaki CorporationInventor: Naoki Kakuta
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Publication number: 20140370328Abstract: The present invention relates to a tin whisker mitigation material using thin film metallic glass underlayer, which is a thin film metallic glass (TFMG) formed between a metal substrate and a tin layer. Particularly, the TFMG can be a Zr46Ti26Ni28 underlayer or a Zr51.7Cu32.3Al9Ni underlayer, capable of blocking off the interaction occurring in the interface of a copper layer (the metal substrate) and the tin layer, so as to carry out the inhibition of tin whisker growth. Moreover, a variety of experiment data are proposed for proving that the TFMG of the Zr46Ti26Ni28 or the Zr51.7Cu32.3Al9Ni can indeed be used to replace the conventionally used thick tin layer for being the underlayer between the copper layer (the metal substrate) and the tin layer, and then effectively inhibit the interaction occurring in the Cu/Sn interface and the growth of tin whisker by low manufacturing cost way.Type: ApplicationFiled: August 28, 2013Publication date: December 18, 2014Applicant: National Taiwan University of Science and TechnologyInventors: Jinn Chu, I Made Wahyu Diyatmika, Yee-Wen Yen, Wen-Zhi Chang
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Hot dip plated high strength steel sheet for press forming use superior in low temperature toughness
Patent number: 8889264Abstract: The present invention provides a hot dip plated high strength steel sheet comprising a cold rolled steel sheet and a hot dip plated layer formed on the surface thereof, characterized in that the cold rolled steel sheet contains, by mass %, C: 0.0005 to 0.0050%, Si: over 0.3 to 1.0%, Mn: 0.70 to 2.0%, P: 0.05% or less, Ti: 0.010 to 0.050%, Nb: 0.010 to 0.040%, B: 0.0005 to 0.0030%, S: 0.010% or less, Al: 0.01 to 0.30%, and N: 0.0010 to 0.01%, and a balance of Fe and unavoidable impurities, and the cold rolled steel sheet has a value of TB* defined by the equation TB*=(0.11?[Ti])/(ln ([B]×10000)) of 0.03 to 0.06, and P is present in an amount of [P]?10×[B]+0.03, where [Ti] is the Ti content in mass percent, [B] is the B content in mass percent, and [P] is the P content in mass percent.Type: GrantFiled: April 11, 2008Date of Patent: November 18, 2014Assignee: Nippon Steel & Sumitomo Metal CorporationInventors: Hironori Satoh, Masayuki Abe, Yasuto Goto, Shinichi Yamaguchi -
Publication number: 20140329107Abstract: There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 ?m, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 ?m.Type: ApplicationFiled: September 10, 2012Publication date: November 6, 2014Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
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Patent number: 8877348Abstract: It is an object to provide a surface-treated steel sheet which contains no Cr, which is excellent in wet resin adhesion, and which can be used as an alternative to a conventional tin-free steel sheet and to provide a resin-coated steel sheet produced by coating the surface-treated steel sheet with resin. A surface-treated steel sheet including an adhesive layer which is disposed on at least one surface of the steel sheet and which contains Ti and at least one selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, the ratio of the total amount of Co, Fe, Ni, V, Cu, Mn, and Zn to the amount of Ti contained therein being 0.01 to ten on a mass basis, and a method for producing the surface-treated steel sheet.Type: GrantFiled: October 30, 2008Date of Patent: November 4, 2014Assignee: JFE Steel CorporationInventors: Yuka Nishihara, Takeshi Suzuki, Noriko Makiishi, Takumi Tanaka, Hiroki Iwasa, Norihiko Nakamura, Kaoru Sato, Takashi Kawano
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Patent number: 8865319Abstract: A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.Type: GrantFiled: October 26, 2010Date of Patent: October 21, 2014Assignee: JX Nippon Mining & Metals CorporationInventor: Naofumi Maeda
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Publication number: 20140308540Abstract: Plated contacts and processes of manufacturing plated contacts are disclosed. The processes include providing a metallic substrate, applying tin-containing plating over the metallic substrate, applying corrosion-prevention plating over the first tin-containing plating, applying a second tin-containing plating over the first corrosion-prevention plating, applying a second corrosion-prevention plating over the second tin-containing plating, and applying a gold plating over the second corrosion-prevention plating to form the plated contact. One or both of the first corrosion-prevention plating and the second corrosion-prevention plating includes nickel, a nickel-based alloy, copper, a copper containing alloy, or a combination thereof.Type: ApplicationFiled: April 12, 2013Publication date: October 16, 2014Applicant: TYCO ELECTRONICS CORPORATIONInventor: George Jyh-Shann CHOU
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Patent number: 8822037Abstract: A surface-treated steel plate obtained by forming, on at least one surface of the steel plate by cathodic electrolysis, a surface-treating film which contains a mixed oxide of an oxide of Fe and at least one of an oxide of Zr or an oxide of Ti, and a polycarboxylic acid, the amount of Zr or Ti, or the total amount of Zr and Ti if both of them are present, being from 3 to 300 mg/m2 and the amount of C being from 0.1 to 5.0 mg/m2.Type: GrantFiled: May 27, 2011Date of Patent: September 2, 2014Assignees: Toyo Seikan Group Holdings, Ltd., Toyo Kohan Co., Ltd.Inventors: Wataru Kurokawa, Seitaro Kanazawa, Shinichi Taya, Kunihiro Yoshimura, Naomi Iida, Miwa Iida, Masahiko Matsukawa
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Publication number: 20140178711Abstract: A copper substrate for use as a contact having Sn plating, nickel plating and Au plating overlying the substrate. A combination of Sn plating is applied over a copper substrate; nickel plating is applied over the Sn plating; and Au plating is applied over the nickel plating to form a stack. The stack is then processed by a vapor phase Sn reflow step that results in the formation of intermetallics and eliminates stannous oxide layers that may otherwise form on the tin layer. The intermetallic layers provide excellent corrosion resistance, and serve as diffusion barriers to prevent the further migration of either Ni atoms or Cu atoms into the Sn, and Sn atoms outwardly into either the Ni or the Cu. Regardless of the thickness, the interfaces are substantially free of oxides, in particular tin oxide, and not prone to delamination.Type: ApplicationFiled: December 26, 2012Publication date: June 26, 2014Applicant: TYCO ELECTRONICS CORPORATIONInventor: George Jyh-Shann CHOU
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Publication number: 20140162087Abstract: The invention relates to a method for enhancing a metallic coating on a steel strip or steel plate, the coating being melted by heating to a temperature above the melting temperature of the material of the coating, the heating taking place by irradiation of the surface of the coating with electromagnetic radiation having a high power density over a limited irradiation time of not more than 10 ?s, and the mandated irradiation time and the energy density introduced into the coating by the electromagnetic radiation being selected such that the coating melts completely over its entire thickness down to the boundary layer with the steel strip, thereby forming a thin alloy layer at the boundary layer between the coating and the steel strip.Type: ApplicationFiled: January 2, 2012Publication date: June 12, 2014Applicant: THYSSENKRUPP RASSELSTEIN GMBHInventors: Winfried Hoehn, Helmut Oberhoffer, Benjamin Johannes Liebscher, Reiner Sauer
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Patent number: 8734619Abstract: A method including directing a first radiation at a first copper-indium-gallium (CIG) sputtering target in a reactive copper indium gallium selenide (CIGS) sputtering process, detecting a first reflected radiation from the first CIG target and determining the amount of selenium poisoning of the first CIG target based on the first reflected radiation.Type: GrantFiled: March 2, 2011Date of Patent: May 27, 2014Assignee: Hanergy Holding Group Ltd.Inventor: John Corson
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Patent number: 8728629Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.Type: GrantFiled: September 17, 2010Date of Patent: May 20, 2014Assignee: The Furukawa Electric Co., Ltd.Inventors: Shuichi Kitagawa, Kengo Mitose, Yoshiaki Kobayashi
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Patent number: 8709612Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.Type: GrantFiled: April 12, 2012Date of Patent: April 29, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Atsuko Saito, Toshinobu Fujiwara, Kenji Masuko
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Patent number: 8679643Abstract: A plated steel sheet for cans with excellent secondary adhesion of an organic film and high corrosion resistance is provided, that is, a plated steel sheet for cans, which is a plated steel sheet having a alloy tin layer and a metallic tin layer in sequence from the steel sheet side, wherein a chemical conversion layer comprising tin oxide in an amount of 0.3 to 5.0 mC/cm2 in terms of electricity necessary for reduction and tin phosphate in an amount of 0.5 to 5.0 mg/m2 in terms of P is provided on the metallic tin layer and zirconium(IV) oxide in an amount of 0.2 to 5 mg/m2 in terms of Zr is provided on the chemical conversion layer. A production method thereof is also provided.Type: GrantFiled: April 4, 2008Date of Patent: March 25, 2014Assignee: Nippon Steel & Sumitomo Metal CorporationInventor: Hiromitsu Date
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Publication number: 20140023880Abstract: An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.Type: ApplicationFiled: September 27, 2013Publication date: January 23, 2014Applicant: Tyco Electronics CorporationInventors: GEORGE JYH-SHANN CHOU, Robert Daniel Hilty
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Publication number: 20130323528Abstract: The invention relates to a bearing part as well as to a spray method for manufacturing a layer system on a bearing part, in particular a connecting rod eye of a connecting rod for a reciprocating piston combustion engine, with a layer system containing at least tin being provided on a surface of the bearing part. In accordance with the invention, an outer, thermally sprayed top layer of the layer system is composed only of tin with the exception of contaminants.Type: ApplicationFiled: May 31, 2013Publication date: December 5, 2013Inventors: Peter Ernst, Bernd Distler
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Publication number: 20130323531Abstract: A bonded body of electrically conductive materials including a bonding interface structure in which paired bonded members (10, 20) made respectively of electrically conductive materials are surface-bonded to each other. The bonding interface structure has at least: a diffusion bonding region in which the electrically conductive materials are mutually diffused; and a plastic flow bonding region which has a pressure bonded and recrystallized structure through plastic flow of the electrically conductive materials.Type: ApplicationFiled: December 5, 2011Publication date: December 5, 2013Inventors: Shigeyuki Nakagawa, Toshikazu Nanbu, Chika Yamamoto, Tooru Fukami
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Patent number: 8574722Abstract: An electrical conductor has a metal substrate. A seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal. Optionally, the seal plating layer may be tin based. Optionally, the seal plating layer may create intermetallic interface layers with the nickel plating layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.Type: GrantFiled: May 9, 2011Date of Patent: November 5, 2013Assignee: Tyco Electronics CorporationInventors: George Jyh-Shann Chou, Robert Daniel Hilty
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Patent number: 8524376Abstract: In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed.Type: GrantFiled: April 26, 2007Date of Patent: September 3, 2013Assignee: JX Nippon Mining & Metals CorporationInventor: Takaaki Hatano
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Patent number: 8518555Abstract: Plated steel sheet comprised of steel sheet having a tin alloy layer on it, which is characterized by (i) having free tin distributed on the tin alloy layer in a 5 to 97% area rate and further (ii) having a chemically treated layer having phosphate in an amount of 1.0 to 5.0 mg/m2 in terms of P and tin oxide in an amount of 0.3 to 4.0 mC/cm2 in terms of electricity necessary for reduction, formed on the tin alloy layer and free tin.Type: GrantFiled: February 16, 2009Date of Patent: August 27, 2013Assignee: Nippon Steel & Sumitomo Metal CorporationInventor: Hiromitsu Date
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Patent number: 8491774Abstract: Tin and tin alloy deposits which are substantially free of certain crystal planes or equivalents thereof inhibit or prevent whisker formation. The tin or tin alloy deposits which are free of these crystal planes and inhibit or prevent whisker formation may be deposited by electroplating. Tin alloys include tin/copper, tin/nickel, tin/silver, tin/bismuth, tin/zinc and tin/antimony. The tin and tin alloy baths used to deposit the tin and tin alloys may be acidic or alkaline.Type: GrantFiled: December 19, 2005Date of Patent: July 23, 2013Assignee: Rohm and Haas Electronic Materials LLCInventor: André Egli
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Publication number: 20130130059Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more.Type: ApplicationFiled: November 15, 2012Publication date: May 23, 2013Applicant: TDK CORPORATIONInventor: TDK CORPORATION
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Patent number: 8422197Abstract: The instant article of manufacture is made by applying optical energy to one or more layers of nanoparticulate materials under predetermined conditions to produce a nanostructure. The nanostructure has layers of optically fused nanoparticles including a predetermined pore density, a predetermined pore size, or both. The predetermined conditions for applying the optical energy may include a predetermined voltage, a predetermined duration, a predetermined power density, or combinations thereof.Type: GrantFiled: July 14, 2010Date of Patent: April 16, 2013Assignee: Applied Nanotech Holdings, Inc.Inventors: Zvi Yaniv, Nan Jiang, James P. Novak, Richard L. Fink
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Publication number: 20130089751Abstract: The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing: at least one metal ion of an Sn ion, an Fe ion, and an Ni ion; Zr ion; a nitric acid ion: and an ammonium ion, in which the composite film contains at least one element of: Zr of 0.1 to 100 mg/m2 in equivalent units of metal Zr; Sn of 0.3 to 20 g/m2 in equivalent units of metal Sn; Fe of 5 to 2000 mg/m2 in equivalent units of metal Fe; and Ni of 5 to 2000 mg/m2 in equivalent units of metal Ni.Type: ApplicationFiled: June 28, 2011Publication date: April 11, 2013Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATIONInventors: Shigeru Hirano, Akira Tachiki, Hirokazu Yokoya, Morio Yanagihara, Makoto Kawabata
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Patent number: 8404357Abstract: Laminated steel sheet for a container material with a small environmental load container material and coating pre-coated steel sheet for a container material characterized by comprising steel sheet having on it a tin layer or iron-tin alloy layer which has on it a tin oxide layer of a thickness measured by an electric stripping method of 0 mC/cm2 to 3.5 mC/cm2 and has further formed on that a foundation layer including a zirconium compound not including fluorine or nitrate nitrogen, having an amount of coating converted to zirconium of 1 mg/m2 to 30 mg/m2, and having an amount of sulfuric acid radicals (SO42?) of 0 mg/m2 to 7 mg/m2.Type: GrantFiled: August 21, 2008Date of Patent: March 26, 2013Assignee: Nippon Steel & Sumitomo Metal CorporationInventors: Nobuo Kadowaki, Toshio Senda
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Patent number: 8388815Abstract: A coated article includes a substrate, a catalyst layer, a bonding layer and a hydrophobic layer. The catalyst layer made of tin is formed on the substrate. The bonding layer is formed on the catalyst layer, including titanium, tin, stannic oxide and titanium dioxide. The hydrophobic layer made of silicon-nitrogen is formed on the bonding layer.Type: GrantFiled: June 7, 2011Date of Patent: March 5, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Jia Huang
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Publication number: 20120288731Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.Type: ApplicationFiled: April 12, 2012Publication date: November 15, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Makoto OGAWA, Atsuko SAITO, Toshinobu FUJIWARA, Kenji MASUKO
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Publication number: 20120282486Abstract: A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.Type: ApplicationFiled: October 26, 2010Publication date: November 8, 2012Inventor: Naofumi Maeda
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Publication number: 20120208044Abstract: Provided are a tin-containing alloy plating bath being capable of manufacturing a tin-containing alloy plated product suitable for electric and electronic members with excellent anti-oxidation performance, and an electroplating method using the bath. Specifically the bath is a plating bath to deposit a tin-containing alloy on the surface of a substrate, which plating bath contains: (a) a tin compound containing 99.9% by mass to 46% by mass of tin based on entire metal mass in the plating bath; (b) a gadolinium compound containing 0.1% by mass to 54% by mass of gadolinium based on entire metal mass in the plating bath; (c) at least one complexing agent; and (d) a solvent, and the electroplating method uses the tin-containing alloy bath, thus can manufacture a tin-containing alloy plated product having excellent anti-oxidation performance.Type: ApplicationFiled: July 31, 2009Publication date: August 16, 2012Applicants: M-TECH JAPAN CO. LTD.Inventors: Shinji Dewaki, Teru Matsuura, Kenji Dewaki, Yukari Dewaki
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Publication number: 20120135270Abstract: The present invention relates to a layer system for coating a substrate surface and to a method for coating a substrate surface with a corresponding layer system, the layer system comprising at least two layers. One layer is a metal-nickel-alloy layer with a metal of the group comprising tin, copper, iron, tungsten and cobalt or an alloy of at least one of said metals, and the other layer is a layer of a metal of the group comprising nickel, copper, tin, molybdenum, niobium, cobalt, chromium, vanadium, manganese, titanium and magnesium, or an alloy of at least one of said metals. The layer system according to the invention is characterized by a high mechanical stability and great corrosion resistance.Type: ApplicationFiled: March 24, 2010Publication date: May 31, 2012Applicant: MTV METALLVEREDLUNG GMBH & CO. KGInventors: Klaus Wilbuer, Meik Gray, Matthias Patzelt
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Patent number: 8187723Abstract: A surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. The surface-treated copper foil comprises a rust-proofing layer and a silane coupling agent layer formed on an electrodeposited copper foil , wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the silane coupling layer is applied on top of the tin layer. The surface-treated copper foil may be further coated with a very thin primer resin layer having a thickness of 0.5 to 5 ?m.Type: GrantFiled: June 12, 2006Date of Patent: May 29, 2012Assignee: Mitsui Mining & Smelting Co., Ltd.Inventor: Tetsuhiro Matsunaga
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Patent number: 8188010Abstract: A thin film superconductive wire material (16) and an electro conductive tape (15) are immersed in a solder bath (35) containing a solder, which includes Sn(tin) and Bi (bismuth), to bond the thin film superconductive wire material (16) and the electro conductive tape (15) and a composite superconductive wire material (10) is formed.Type: GrantFiled: February 2, 2009Date of Patent: May 29, 2012Assignees: The Furukawa Electric Co., Ltd., International Superconductivity Center, The Juridical FoundationInventors: Masashi Yagi, Hirao Hirata, Shinichi Mukoyama, Yuh Shiohara
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Publication number: 20120114971Abstract: A sliding element 20, such as a bushing or bearing, includes a sintered powder metal base 24 deposited on a steel backing 22. The base 24 includes a tin, bismuth, first hard particles 40, such as Fe3P and MoSi2, and a balance of copper. In one embodiment, a tin overplate 26 is applied to the base 24. A nickel barrier layer 42 can be disposed between the base 24 and the tin overplate 26, and a tin-nickel intermediate layer 44 between the nickel bather layer 42 and the tin overplate 26. In another embodiment, the sliding element 20 includes either a sputter coating 30 of aluminum or a polymer coating 28 disposed directly on the base 24. The polymer coating 28 includes second hard particles 48, such as Fe2O3. The polymer coating 28 together with the base 24 provides exceptional wear resistance over time.Type: ApplicationFiled: October 6, 2011Publication date: May 10, 2012Inventors: Gerd Andler, Daniel Meister, David Saxton, Ing Holger Schmitt, James R. Toth