Next To Group Viii Metal-base Component Patents (Class 428/648)
  • Patent number: 11371130
    Abstract: A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m2 per one surface.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: June 28, 2022
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Masahiro Fuda, Toshinori Mizuguchi, Junji Nakano, Yoshiharu Inoue, Kazuhisa Kusumi, Yasuaki Naito
  • Patent number: 10294558
    Abstract: A method for producing a metal sheet is provided. The method includes providing a steel substrate having two faces, depositing a metal coating on each face by dipping the substrate in a bath, cooling the metal coatings, altering layers of magnesium oxide or magnesium hydroxide formed on the outer surfaces of the metal coatings, and depositing a layer of oil on the outer surfaces of the metal coatings.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: May 21, 2019
    Assignee: ARCELORMITTAL INVESTIGACION Y DESARROLLO, S.L.
    Inventors: Tiago Machado Amorim, Joëlle Richard, Eric Jacqueson, Audrey Lhermeroult, Pascale Feltin, Jean-Michel Lemaire, Luc Diez, Jean-Michel Mataigne
  • Patent number: 10287647
    Abstract: A steel component formed from a flat steel having a yield point of 150-1100 MPa and a tensile strength of 300-1200 MPa and coated with an anticorrosion coating of an alloy that includes 35-70% by weight aluminum, 35-60% by weight zinc, 0.1-10% by weight magnesium, up to 10% by weight Si, and up to 5% by weight Fe. A blank obtained from the flat steel product is heated to at least 800° C. and formed into the steel component. Alternatively, the steel component may be formed into the steel component first and then heated to at least 800° C. Regardless, the steel component may then be hardened by sufficiently rapid cooling the steel component from a sufficiently high temperature.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: May 14, 2019
    Assignee: THYSSENKRUPP STEEL EUROPE AG
    Inventors: Maria Köyer, Sascha Sikora, Janko Banik, Manuela Ruthenberg, Jennifer Schulz
  • Patent number: 10218102
    Abstract: A terminal fitting that can reduce the terminal insertion force and can suppress surface oxidation of a plating film, even if the terminal fitting is exposed to a hot and humid environment, and a connector that uses the terminal fitting. The terminal fitting includes a metal base material, and the plating film. The plating film includes a Ni foundation layer, an outermost layer exposed at the outermost surface, and a Ni3Sn4 layer formed between the Ni foundation layer and the outermost layer. The outermost layer includes a Sn parent phase, and intermetallic compound that is dispersed in the Sn parent phase, and is made of (Ni0.4Pd0.6)Sn4. The intermetallic compound protrudes from the lower side of the outermost layer to the Ni3Sn4 layer side, and is partially buried in the Ni3Sn4 layer. A connector includes the terminal fitting, and a housing that holds the terminal fitting.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: February 26, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hajime Watanabe, Yoshifumi Saka
  • Patent number: 9914584
    Abstract: A three-piece resealable can for acidic liquid includes, a cylindrical can body member that includes a screw portion at one end; and a can bottom member that contacts the can body member so as to close an opening portion of the other end of the can body member. The can body member includes a cylindrical first steel sheet, Ni plating that is formed on an inner circumferential surface of the first steel sheet, a polyester film that is formed so as to be disposed on the outermost surface of the inner circumference of the can body member, and a Zr-containing film that is formed between the first steel sheet and the polyester film. The can bottom member includes a second steel sheet, and Sn plating that is formed on the can body member side of the can bottom member. The Zr-containing film contains Zr compounds.
    Type: Grant
    Filed: May 27, 2013
    Date of Patent: March 13, 2018
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shigeru Hirano, Yoshiaki Tani, Hirokazu Yokoya
  • Patent number: 9758853
    Abstract: Disclosed is a hot-dip Al—Zn alloy coated steel sheet having excellent anti-corrosion property after coating, and a method for producing the same. In the disclosure, the hot-dip Al—Zn alloy coated steel sheet has a hot-dip coating layer containing by mass %, Al: 25% to 90%, and at least one of Sn: 0.01% to 2.0%, In: 0.01% to 10%, and Bi: 0.01% to 2.0%.
    Type: Grant
    Filed: February 17, 2014
    Date of Patent: September 12, 2017
    Assignee: JFE STEEL CORPORATION
    Inventors: Masahiro Yoshida, Akira Matsuzaki, Satoru Ando
  • Patent number: 9689052
    Abstract: The present invention provides a very thin steel sheet and production method thereof that, in a very thin steel sheet of 0.4 mm or less thickness, enable production at low addition of special elements, simultaneous achievement of both good workability and anti-aging property, and stable passing of even wide coil in a continuous annealing process, which very thin steel sheet and production method.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: June 27, 2017
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Hidekuni Murakami, Seiichi Tanaka, Keiichiroh Torisu, Akihiro Jinno
  • Patent number: 9428824
    Abstract: A metallic coated steel strip includes a steel strip and a metallic coating on at least one side of the strip. The metallic coating includes an Al—Zn—Mg—Si overlay alloy layer and an intermediate alloy layer between the steel strip and the overlay alloy layer. The intermediate alloy layer has a composition of, by weight, 4.0-12.0% Zn, 6.0-17.0% Si, 20.0-40.0% Fe, 0.02-0.50% Mg, and balance Al and unavoidable impurities.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: August 30, 2016
    Assignee: Bluescope Steel Limited
    Inventor: Qiyang Liu
  • Patent number: 9308545
    Abstract: A system and a method for pretreating an aluminum assembly includes selecting a blank having a thin film pretreatment layer and a lubricant coating applied to a surface. The blank is formed to a desired shape and an adhesive is applied to a selected portion of the surface. A cleaner is applied to the assembly to remove the thin film pretreatment layer and the lubricant coating from the surface except at the selected portion and a zirconium oxide conversion coating is applied to the assembly before painting.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: April 12, 2016
    Assignee: Ford Global Technologies, LLC
    Inventors: Mark Edward Nichols, Janice Lisa Tardiff, Brian Schneider, Steven J. Simko
  • Publication number: 20150118514
    Abstract: A method of thermal interface material (TIM) assembly includes plating a seed layer on each of a plurality of graphite film layers, each of the graphite film layers comprising parallel-oriented graphite nanoplates, stacking the plurality of graphite film layers, each of the plurality of graphite film layers separated by at least one solder layer, pressing together the stacked graphite film layers, and applying heat to the plurality of graphite film layers and respective at least one solder layer in a vacuumed furnace to form a graphite laminate.
    Type: Application
    Filed: October 30, 2013
    Publication date: April 30, 2015
    Inventors: Yuan Zhao, Dennis R. Strauss, Ten-Luen T. Liao, Vivek Mehrotra, Chung-Lung Chen
  • Publication number: 20150079419
    Abstract: This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.
    Type: Application
    Filed: March 28, 2013
    Publication date: March 19, 2015
    Inventors: Jean Joseph Campaniello, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
  • Publication number: 20150047879
    Abstract: The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 ?m or more; the thickness of the upper layer is 0.005 ?m or more and 0.
    Type: Application
    Filed: January 25, 2013
    Publication date: February 19, 2015
    Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
  • Patent number: 8956735
    Abstract: A mating-type connecting part can be obtained by stamping and surface-roughening a copper sheet into a predetermined shape with depressions as a plurality of parallel lines. The copper sheet then has a roughness of from 0.5 ?m to 4.0 ?m parallel to a sliding direction upon connection, a mean projection-depression interval of from 0.01 mm to 0.3 mm in that direction, a skewness less than 0, and a protrusion peak portion height of 1 ?m or less. The copper sheet is then plated with Cu and Sn, followed by reflowing. The result is a connecting part having a Sn surface coating layer group as a plurality of parallel lines, and a Cu-Sn alloy coating layer adjacent to each side of each Sn surface coating layer.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: February 17, 2015
    Assignees: Kabushiki Kaisha Kobe Seiko Sho, Shinko Leadmikk Co., Ltd.
    Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
  • Publication number: 20150044500
    Abstract: This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.
    Type: Application
    Filed: March 28, 2013
    Publication date: February 12, 2015
    Inventors: Jean Joseph Campaniello, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
  • Patent number: 8940405
    Abstract: A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 ?m to 4.0 ?m in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 ?m or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 ?m or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: January 27, 2015
    Assignees: Kobe Steel, Ltd., Shinko Leadmikk Co., Ltd.
    Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
  • Publication number: 20150017469
    Abstract: The invention relates to sheet steel for use as packaging steel, made of a non-alloy or low-alloy and cold-rolled steel having a carbon content of less than 0.1%. According to the invention, in order to use such sheet steel for packaging steel that has good formability and can be produced in a cost-effective way, the sheet steel contains less than 0.4 wt % of manganese, less than 0.04 wt % of silicium, less than 0.1 wt % of aluminum, and less than 0.1 wt % of chromium and is provided with a multi-phase structure, comprising ferrite and at least one of the structure constituents martensite, bainite, and/or residual austenite. The invention further relates to a method for producing such packaging steel from cold-rolled sheet steel.
    Type: Application
    Filed: October 2, 2012
    Publication date: January 15, 2015
    Inventors: Reiner Sauer, Burkhard Kaup, Dirk Matusch, Dimitrios Nouskalis
  • Patent number: 8915761
    Abstract: A connector terminal which can achieve high mechanical connection strength and stabilized low electrical connection resistance when it is crimped to an aluminum electric wire, and in addition, can suppress electrical contact resistance low when it is fitted to a mating connector terminal is provided. In a connector terminal (1A) having an electrical contact section (10) which is brought into contact and conducted with a mating connector terminal by fitting to the mating connector terminal, and a conductor crimping section (12) which is crimped to the conductor of an electric wire, a metal material which constitutes the terminal uses aluminum or an aluminum alloy as a base material (100), a Zn layer (101) having a thickness in the range from 0.1 ?m to 2.0 ?m by electroless plating and a Cu layer (102) having a thickness in the range from 0.5 ?m to 1.0 ?m by electrolytic plating are formed in sequence on the surface of the base material (100), and an Sn layer (105) having a thickness in the range from 0.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: December 23, 2014
    Assignee: Yazaki Corporation
    Inventor: Naoki Kakuta
  • Publication number: 20140370328
    Abstract: The present invention relates to a tin whisker mitigation material using thin film metallic glass underlayer, which is a thin film metallic glass (TFMG) formed between a metal substrate and a tin layer. Particularly, the TFMG can be a Zr46Ti26Ni28 underlayer or a Zr51.7Cu32.3Al9Ni underlayer, capable of blocking off the interaction occurring in the interface of a copper layer (the metal substrate) and the tin layer, so as to carry out the inhibition of tin whisker growth. Moreover, a variety of experiment data are proposed for proving that the TFMG of the Zr46Ti26Ni28 or the Zr51.7Cu32.3Al9Ni can indeed be used to replace the conventionally used thick tin layer for being the underlayer between the copper layer (the metal substrate) and the tin layer, and then effectively inhibit the interaction occurring in the Cu/Sn interface and the growth of tin whisker by low manufacturing cost way.
    Type: Application
    Filed: August 28, 2013
    Publication date: December 18, 2014
    Applicant: National Taiwan University of Science and Technology
    Inventors: Jinn Chu, I Made Wahyu Diyatmika, Yee-Wen Yen, Wen-Zhi Chang
  • Patent number: 8889264
    Abstract: The present invention provides a hot dip plated high strength steel sheet comprising a cold rolled steel sheet and a hot dip plated layer formed on the surface thereof, characterized in that the cold rolled steel sheet contains, by mass %, C: 0.0005 to 0.0050%, Si: over 0.3 to 1.0%, Mn: 0.70 to 2.0%, P: 0.05% or less, Ti: 0.010 to 0.050%, Nb: 0.010 to 0.040%, B: 0.0005 to 0.0030%, S: 0.010% or less, Al: 0.01 to 0.30%, and N: 0.0010 to 0.01%, and a balance of Fe and unavoidable impurities, and the cold rolled steel sheet has a value of TB* defined by the equation TB*=(0.11?[Ti])/(ln ([B]×10000)) of 0.03 to 0.06, and P is present in an amount of [P]?10×[B]+0.03, where [Ti] is the Ti content in mass percent, [B] is the B content in mass percent, and [P] is the P content in mass percent.
    Type: Grant
    Filed: April 11, 2008
    Date of Patent: November 18, 2014
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Hironori Satoh, Masayuki Abe, Yasuto Goto, Shinichi Yamaguchi
  • Publication number: 20140329107
    Abstract: There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 ?m, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 ?m.
    Type: Application
    Filed: September 10, 2012
    Publication date: November 6, 2014
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
  • Patent number: 8877348
    Abstract: It is an object to provide a surface-treated steel sheet which contains no Cr, which is excellent in wet resin adhesion, and which can be used as an alternative to a conventional tin-free steel sheet and to provide a resin-coated steel sheet produced by coating the surface-treated steel sheet with resin. A surface-treated steel sheet including an adhesive layer which is disposed on at least one surface of the steel sheet and which contains Ti and at least one selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, the ratio of the total amount of Co, Fe, Ni, V, Cu, Mn, and Zn to the amount of Ti contained therein being 0.01 to ten on a mass basis, and a method for producing the surface-treated steel sheet.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: November 4, 2014
    Assignee: JFE Steel Corporation
    Inventors: Yuka Nishihara, Takeshi Suzuki, Noriko Makiishi, Takumi Tanaka, Hiroki Iwasa, Norihiko Nakamura, Kaoru Sato, Takashi Kawano
  • Patent number: 8865319
    Abstract: A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: October 21, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Naofumi Maeda
  • Publication number: 20140308540
    Abstract: Plated contacts and processes of manufacturing plated contacts are disclosed. The processes include providing a metallic substrate, applying tin-containing plating over the metallic substrate, applying corrosion-prevention plating over the first tin-containing plating, applying a second tin-containing plating over the first corrosion-prevention plating, applying a second corrosion-prevention plating over the second tin-containing plating, and applying a gold plating over the second corrosion-prevention plating to form the plated contact. One or both of the first corrosion-prevention plating and the second corrosion-prevention plating includes nickel, a nickel-based alloy, copper, a copper containing alloy, or a combination thereof.
    Type: Application
    Filed: April 12, 2013
    Publication date: October 16, 2014
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventor: George Jyh-Shann CHOU
  • Patent number: 8822037
    Abstract: A surface-treated steel plate obtained by forming, on at least one surface of the steel plate by cathodic electrolysis, a surface-treating film which contains a mixed oxide of an oxide of Fe and at least one of an oxide of Zr or an oxide of Ti, and a polycarboxylic acid, the amount of Zr or Ti, or the total amount of Zr and Ti if both of them are present, being from 3 to 300 mg/m2 and the amount of C being from 0.1 to 5.0 mg/m2.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: September 2, 2014
    Assignees: Toyo Seikan Group Holdings, Ltd., Toyo Kohan Co., Ltd.
    Inventors: Wataru Kurokawa, Seitaro Kanazawa, Shinichi Taya, Kunihiro Yoshimura, Naomi Iida, Miwa Iida, Masahiko Matsukawa
  • Publication number: 20140178711
    Abstract: A copper substrate for use as a contact having Sn plating, nickel plating and Au plating overlying the substrate. A combination of Sn plating is applied over a copper substrate; nickel plating is applied over the Sn plating; and Au plating is applied over the nickel plating to form a stack. The stack is then processed by a vapor phase Sn reflow step that results in the formation of intermetallics and eliminates stannous oxide layers that may otherwise form on the tin layer. The intermetallic layers provide excellent corrosion resistance, and serve as diffusion barriers to prevent the further migration of either Ni atoms or Cu atoms into the Sn, and Sn atoms outwardly into either the Ni or the Cu. Regardless of the thickness, the interfaces are substantially free of oxides, in particular tin oxide, and not prone to delamination.
    Type: Application
    Filed: December 26, 2012
    Publication date: June 26, 2014
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventor: George Jyh-Shann CHOU
  • Publication number: 20140162087
    Abstract: The invention relates to a method for enhancing a metallic coating on a steel strip or steel plate, the coating being melted by heating to a temperature above the melting temperature of the material of the coating, the heating taking place by irradiation of the surface of the coating with electromagnetic radiation having a high power density over a limited irradiation time of not more than 10 ?s, and the mandated irradiation time and the energy density introduced into the coating by the electromagnetic radiation being selected such that the coating melts completely over its entire thickness down to the boundary layer with the steel strip, thereby forming a thin alloy layer at the boundary layer between the coating and the steel strip.
    Type: Application
    Filed: January 2, 2012
    Publication date: June 12, 2014
    Applicant: THYSSENKRUPP RASSELSTEIN GMBH
    Inventors: Winfried Hoehn, Helmut Oberhoffer, Benjamin Johannes Liebscher, Reiner Sauer
  • Patent number: 8734619
    Abstract: A method including directing a first radiation at a first copper-indium-gallium (CIG) sputtering target in a reactive copper indium gallium selenide (CIGS) sputtering process, detecting a first reflected radiation from the first CIG target and determining the amount of selenium poisoning of the first CIG target based on the first reflected radiation.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: May 27, 2014
    Assignee: Hanergy Holding Group Ltd.
    Inventor: John Corson
  • Patent number: 8728629
    Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: May 20, 2014
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Shuichi Kitagawa, Kengo Mitose, Yoshiaki Kobayashi
  • Patent number: 8709612
    Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: April 29, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akihiro Motoki, Makoto Ogawa, Atsuko Saito, Toshinobu Fujiwara, Kenji Masuko
  • Patent number: 8679643
    Abstract: A plated steel sheet for cans with excellent secondary adhesion of an organic film and high corrosion resistance is provided, that is, a plated steel sheet for cans, which is a plated steel sheet having a alloy tin layer and a metallic tin layer in sequence from the steel sheet side, wherein a chemical conversion layer comprising tin oxide in an amount of 0.3 to 5.0 mC/cm2 in terms of electricity necessary for reduction and tin phosphate in an amount of 0.5 to 5.0 mg/m2 in terms of P is provided on the metallic tin layer and zirconium(IV) oxide in an amount of 0.2 to 5 mg/m2 in terms of Zr is provided on the chemical conversion layer. A production method thereof is also provided.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: March 25, 2014
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventor: Hiromitsu Date
  • Publication number: 20140023880
    Abstract: An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.
    Type: Application
    Filed: September 27, 2013
    Publication date: January 23, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: GEORGE JYH-SHANN CHOU, Robert Daniel Hilty
  • Publication number: 20130323531
    Abstract: A bonded body of electrically conductive materials including a bonding interface structure in which paired bonded members (10, 20) made respectively of electrically conductive materials are surface-bonded to each other. The bonding interface structure has at least: a diffusion bonding region in which the electrically conductive materials are mutually diffused; and a plastic flow bonding region which has a pressure bonded and recrystallized structure through plastic flow of the electrically conductive materials.
    Type: Application
    Filed: December 5, 2011
    Publication date: December 5, 2013
    Inventors: Shigeyuki Nakagawa, Toshikazu Nanbu, Chika Yamamoto, Tooru Fukami
  • Publication number: 20130323528
    Abstract: The invention relates to a bearing part as well as to a spray method for manufacturing a layer system on a bearing part, in particular a connecting rod eye of a connecting rod for a reciprocating piston combustion engine, with a layer system containing at least tin being provided on a surface of the bearing part. In accordance with the invention, an outer, thermally sprayed top layer of the layer system is composed only of tin with the exception of contaminants.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 5, 2013
    Inventors: Peter Ernst, Bernd Distler
  • Patent number: 8574722
    Abstract: An electrical conductor has a metal substrate. A seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal. Optionally, the seal plating layer may be tin based. Optionally, the seal plating layer may create intermetallic interface layers with the nickel plating layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: November 5, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: George Jyh-Shann Chou, Robert Daniel Hilty
  • Patent number: 8524376
    Abstract: In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: September 3, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Takaaki Hatano
  • Patent number: 8518555
    Abstract: Plated steel sheet comprised of steel sheet having a tin alloy layer on it, which is characterized by (i) having free tin distributed on the tin alloy layer in a 5 to 97% area rate and further (ii) having a chemically treated layer having phosphate in an amount of 1.0 to 5.0 mg/m2 in terms of P and tin oxide in an amount of 0.3 to 4.0 mC/cm2 in terms of electricity necessary for reduction, formed on the tin alloy layer and free tin.
    Type: Grant
    Filed: February 16, 2009
    Date of Patent: August 27, 2013
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventor: Hiromitsu Date
  • Patent number: 8491774
    Abstract: Tin and tin alloy deposits which are substantially free of certain crystal planes or equivalents thereof inhibit or prevent whisker formation. The tin or tin alloy deposits which are free of these crystal planes and inhibit or prevent whisker formation may be deposited by electroplating. Tin alloys include tin/copper, tin/nickel, tin/silver, tin/bismuth, tin/zinc and tin/antimony. The tin and tin alloy baths used to deposit the tin and tin alloys may be acidic or alkaline.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: July 23, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: André Egli
  • Publication number: 20130130059
    Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more.
    Type: Application
    Filed: November 15, 2012
    Publication date: May 23, 2013
    Applicant: TDK CORPORATION
    Inventor: TDK CORPORATION
  • Patent number: 8422197
    Abstract: The instant article of manufacture is made by applying optical energy to one or more layers of nanoparticulate materials under predetermined conditions to produce a nanostructure. The nanostructure has layers of optically fused nanoparticles including a predetermined pore density, a predetermined pore size, or both. The predetermined conditions for applying the optical energy may include a predetermined voltage, a predetermined duration, a predetermined power density, or combinations thereof.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: April 16, 2013
    Assignee: Applied Nanotech Holdings, Inc.
    Inventors: Zvi Yaniv, Nan Jiang, James P. Novak, Richard L. Fink
  • Publication number: 20130089751
    Abstract: The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing: at least one metal ion of an Sn ion, an Fe ion, and an Ni ion; Zr ion; a nitric acid ion: and an ammonium ion, in which the composite film contains at least one element of: Zr of 0.1 to 100 mg/m2 in equivalent units of metal Zr; Sn of 0.3 to 20 g/m2 in equivalent units of metal Sn; Fe of 5 to 2000 mg/m2 in equivalent units of metal Fe; and Ni of 5 to 2000 mg/m2 in equivalent units of metal Ni.
    Type: Application
    Filed: June 28, 2011
    Publication date: April 11, 2013
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shigeru Hirano, Akira Tachiki, Hirokazu Yokoya, Morio Yanagihara, Makoto Kawabata
  • Patent number: 8404357
    Abstract: Laminated steel sheet for a container material with a small environmental load container material and coating pre-coated steel sheet for a container material characterized by comprising steel sheet having on it a tin layer or iron-tin alloy layer which has on it a tin oxide layer of a thickness measured by an electric stripping method of 0 mC/cm2 to 3.5 mC/cm2 and has further formed on that a foundation layer including a zirconium compound not including fluorine or nitrate nitrogen, having an amount of coating converted to zirconium of 1 mg/m2 to 30 mg/m2, and having an amount of sulfuric acid radicals (SO42?) of 0 mg/m2 to 7 mg/m2.
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: March 26, 2013
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Nobuo Kadowaki, Toshio Senda
  • Patent number: 8388815
    Abstract: A coated article includes a substrate, a catalyst layer, a bonding layer and a hydrophobic layer. The catalyst layer made of tin is formed on the substrate. The bonding layer is formed on the catalyst layer, including titanium, tin, stannic oxide and titanium dioxide. The hydrophobic layer made of silicon-nitrogen is formed on the bonding layer.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: March 5, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Jia Huang
  • Publication number: 20120288731
    Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.
    Type: Application
    Filed: April 12, 2012
    Publication date: November 15, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Akihiro MOTOKI, Makoto OGAWA, Atsuko SAITO, Toshinobu FUJIWARA, Kenji MASUKO
  • Publication number: 20120282486
    Abstract: A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.
    Type: Application
    Filed: October 26, 2010
    Publication date: November 8, 2012
    Inventor: Naofumi Maeda
  • Publication number: 20120208044
    Abstract: Provided are a tin-containing alloy plating bath being capable of manufacturing a tin-containing alloy plated product suitable for electric and electronic members with excellent anti-oxidation performance, and an electroplating method using the bath. Specifically the bath is a plating bath to deposit a tin-containing alloy on the surface of a substrate, which plating bath contains: (a) a tin compound containing 99.9% by mass to 46% by mass of tin based on entire metal mass in the plating bath; (b) a gadolinium compound containing 0.1% by mass to 54% by mass of gadolinium based on entire metal mass in the plating bath; (c) at least one complexing agent; and (d) a solvent, and the electroplating method uses the tin-containing alloy bath, thus can manufacture a tin-containing alloy plated product having excellent anti-oxidation performance.
    Type: Application
    Filed: July 31, 2009
    Publication date: August 16, 2012
    Applicants: M-TECH JAPAN CO. LTD.
    Inventors: Shinji Dewaki, Teru Matsuura, Kenji Dewaki, Yukari Dewaki
  • Publication number: 20120135270
    Abstract: The present invention relates to a layer system for coating a substrate surface and to a method for coating a substrate surface with a corresponding layer system, the layer system comprising at least two layers. One layer is a metal-nickel-alloy layer with a metal of the group comprising tin, copper, iron, tungsten and cobalt or an alloy of at least one of said metals, and the other layer is a layer of a metal of the group comprising nickel, copper, tin, molybdenum, niobium, cobalt, chromium, vanadium, manganese, titanium and magnesium, or an alloy of at least one of said metals. The layer system according to the invention is characterized by a high mechanical stability and great corrosion resistance.
    Type: Application
    Filed: March 24, 2010
    Publication date: May 31, 2012
    Applicant: MTV METALLVEREDLUNG GMBH & CO. KG
    Inventors: Klaus Wilbuer, Meik Gray, Matthias Patzelt
  • Patent number: 8187723
    Abstract: A surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. The surface-treated copper foil comprises a rust-proofing layer and a silane coupling agent layer formed on an electrodeposited copper foil , wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the silane coupling layer is applied on top of the tin layer. The surface-treated copper foil may be further coated with a very thin primer resin layer having a thickness of 0.5 to 5 ?m.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: May 29, 2012
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventor: Tetsuhiro Matsunaga
  • Patent number: 8188010
    Abstract: A thin film superconductive wire material (16) and an electro conductive tape (15) are immersed in a solder bath (35) containing a solder, which includes Sn(tin) and Bi (bismuth), to bond the thin film superconductive wire material (16) and the electro conductive tape (15) and a composite superconductive wire material (10) is formed.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: May 29, 2012
    Assignees: The Furukawa Electric Co., Ltd., International Superconductivity Center, The Juridical Foundation
    Inventors: Masashi Yagi, Hirao Hirata, Shinichi Mukoyama, Yuh Shiohara
  • Publication number: 20120114971
    Abstract: A sliding element 20, such as a bushing or bearing, includes a sintered powder metal base 24 deposited on a steel backing 22. The base 24 includes a tin, bismuth, first hard particles 40, such as Fe3P and MoSi2, and a balance of copper. In one embodiment, a tin overplate 26 is applied to the base 24. A nickel barrier layer 42 can be disposed between the base 24 and the tin overplate 26, and a tin-nickel intermediate layer 44 between the nickel bather layer 42 and the tin overplate 26. In another embodiment, the sliding element 20 includes either a sputter coating 30 of aluminum or a polymer coating 28 disposed directly on the base 24. The polymer coating 28 includes second hard particles 48, such as Fe2O3. The polymer coating 28 together with the base 24 provides exceptional wear resistance over time.
    Type: Application
    Filed: October 6, 2011
    Publication date: May 10, 2012
    Inventors: Gerd Andler, Daniel Meister, David Saxton, Ing Holger Schmitt, James R. Toth
  • Publication number: 20120109287
    Abstract: Methods for preparing an implant coated with a conversion electron emitting source (CEES) are disclosed. The typical method includes cleaning the surface of the implant; placing the implant in an activating solution comprising hydrochloric acid to activate the surface; reducing the surface by H2 evolution in H2SO4 solution; and placing the implant in an electroplating solution that includes ions of the CEES, HCl, H2SO4, and resorcinol, gelatin, or a combination thereof. Alternatively, before tin plating, a seed layer is formed on the surface. The electroplated CEES coating can be further protected and stabilized by annealing in a heated oven, by passivation, or by being covered with a protective film. The invention also relates to a holding device for holding an implant, wherein the device selectively prevents electrodeposition on the portions of the implant contacting the device.
    Type: Application
    Filed: December 22, 2011
    Publication date: May 3, 2012
    Inventors: Suresh C. Srivastava, Gilbert R. Gonzales, Radoslav Adzic, George E. Meinken