Abstract: Methods for preparing an implant coated with a conversion electron emitting source (CEES) are disclosed. The typical method includes cleaning the surface of the implant; placing the implant in an activating solution comprising hydrochloric acid to activate the surface; reducing the surface by H2 evolution in H2SO4 solution; and placing the implant in an electroplating solution that includes ions of the CEES, HCl, H2SO4, and resorcinol, gelatin, or a combination thereof. Alternatively, before tin plating, a seed layer is formed on the surface. The electroplated CEES coating can be further protected and stabilized by annealing in a heated oven, by passivation, or by being covered with a protective film. The invention also relates to a holding device for holding an implant, wherein the device selectively prevents electrodeposition on the portions of the implant contacting the device.

Abstract: A tin-plated steel sheet includes a plating layer containing tin on at least one surface of a steel sheet, and a chemical conversion coating containing P and tin on the plating layer is provided. In the steel sheet, a coated amount of the chemical conversion coating per surface is 1.0 to 50 mg/m2 in terms of P, an atomic ratio Sn/P obtained from the intensity of a P2p peak and that of a Sn3d peak is 1.0 to 1.5, the intensities being measured at the surface using an x-ray photoelectron spectroscopic method, and an atomic ratio O/P obtained from the intensity of the P2p peak and that of an O1s peak is 4.0 to 9.0. The phosphoric acid-based chemical conversion coating of the tin-plated steel sheet can suppress degradation in performance, which is caused by the growth of a tin oxide layer on the surface, instead of a conventional chromate coating.

Abstract: In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu—Sn alloy layer, and a Sn layer which are deposited in this order is formed on a surface of a base material made of copper or a copper alloy. An average thickness of the Ni layer is 0.1 to 1.0 ?m, an average thickness of the Cu—Sn alloy layer is 0.55 to 1.0 ?m, and an average thickness of the Sn layer is 0.2 to 1.0 ?m. The Cu—Sn alloy layer includes Cu—Sn alloy layers having two compositions, a portion thereof in contact with the Ni layer is formed of an ?-phase having an average thickness of 0.5 to 0.95 ?m, and a portion thereof in contact with the Sn layer is formed of a ?-phase having an average thickness of 0.05 to 0.2 ?m.

Abstract: A slide member is disclosed. The slide member includes a bearing alloy layer, a Ni-based intermediate layer provided over the bearing alloy layer, and a Sn-based overlay provided over the Ni-based intermediate layer. The Sn-based overlay comprises at least one layer, the Sn-based overlay including a first layer or region having a sliding surface and a second layer or region placed in contact with the Ni-based intermediate layer. The first layer or region contains Sn and 3 mass % or more of Cu and the second layer or region contains Sn and 8 mass % or less of Cu.

Abstract: Steel sheet for container use able to realize superior corrosion resistance and canmaking ability, wherein at least one side of the steel sheet is provided with a chemical conversion coating film including a mixture of a zirconium oxide compound and a zirconium phosphate compound, the zirconium oxide compound is segregated at part or all of a region of 40 to 100% from the surface with respect to the total thickness of the chemical conversion coating film, and the zirconium phosphate compound is segregated at part or all of a region of 0 to 40% from the surface with respect to the total thickness of the chemical conversion coating film.

Abstract: A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.

Abstract: Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.

Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.

Abstract: A method for producing a tinned steel sheet includes forming an Sn-containing plating layer on at least one surface of a steel sheet such that mass per unit area of Sn is 0.05 to 20 g/m2, immersing the steel sheet in a chemical conversion solution which contains greater than 18 to 200 g/L or less of aluminum phosphate monobasic and which has a pH of 1.5 to 2.4 or cathodically electrolyzing the steel sheet at a current density of 10 A/dm2 or less in the chemical conversion solution, forming a chemical conversion coating in such a manner that the steel sheet is washed with water and then dried, and forming a product of a reaction with a silane coupling agent such that the mass per unit area is 0.10 to 100 mg/m2 in terms of Si.

Abstract: A chemical conversion solution contains greater than 18 to 200 g/L or less of aluminum phosphate monobasic and has a pH of 1.5 to 2.4. A method for producing a tinned steel sheet includes forming an Sn-containing plating layer on at least one surface of a steel sheet such that the mass per unit area of Sn is 0.05 to 20 g/m2, immersing the steel sheet in the chemical conversion solution or cathodically electrolyzing the steel sheet at a current density of 10 A/dm2 or less in the chemical conversion solution; and drying the steel sheet to form a chemical conversion coating.

Abstract: Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 ?m; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D1] of the minimum inscribed circle of the Sn covering layer is 0.2 ?m or less, the diameter [D2] of the maximum inscribed circle of the Sn covering layer is 1.2 to 20 ?m, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu—Sn alloy covering layer is 0.2 ?m or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 ?m or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.

Abstract: Plated steel sheet comprised of steel sheet having a tin alloy layer on it, which is characterized by (i) having free tin distributed on the tin alloy layer in a 5 to 97% area rate and further (ii) having a chemically treated layer having phosphate in an amount of 1.0 to 5.0 mg/m2 in terms of P and tin oxide in an amount of 0.3 to 4.0 mC/cm2 in terms of electricity necessary for reduction, formed on the tin alloy layer and free tin.

Abstract: A sliding bearing element is characterized in that a bearing material that is bonded to the backing is disposed at least at the edges of the backing in form of wires in the circumferential direction and that a soft material is located at least in a space between said wires. At least one intermediate wire can be disposed between the two edge wires generally running in the circumferential direction. The method comprises the following processing steps: providing a strip of steel or any other material having the required degree of strength which forms the backing of the bearing to be produced, bonding at least one wire at each of the two edges of the backing strip, whereat disposing the wires in such a manner that said wires run in circumferential direction generally, and filling out the spaces between the wires with soft material.

Abstract: It is an object to provide a surface-treated steel sheet which contains no Cr, which is excellent in wet resin adhesion, and which can be used as an alternative to a conventional tin-free steel sheet and to provide a resin-coated steel sheet produced by coating the surface-treated steel sheet with resin. A surface-treated steel sheet including an adhesive layer which is disposed on at least one surface of the steel sheet and which contains Ti and at least one selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, the ratio of the total amount of Co, Fe, Ni, V, Cu, Mn, and Zn to the amount of Ti contained therein being 0.01 to ten on a mass basis, and a method for producing the surface-treated steel sheet.

Abstract: There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at.%, and having an average thickness in a range of 0.1 to 3.0 ?m and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 ?m, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%.

Abstract: The present invention relates to a joint (10) that includes a first member (11) to be jointed, a second member (12) to be jointed and a jointing layer (13) located between the first member (11) and the second member (12). The jointing layer (13) is made of Sn metal and a metallic material with a melting point higher than the melting point of the Sn metal. The present invention relates also to a method of joining this first member (11) to the second member (12).

Abstract: Laminated steel sheet for a container material with a small environmental load container material and coating pre-coated steel sheet for a container material characterized by comprising steel sheet having on it a tin layer or iron-tin alloy layer which has on it a tin oxide layer of a thickness measured by an electric stripping method of 0 mC/cm2 to 3.5 mC/cm2 and has further formed on that a foundation layer including a zirconium compound not including fluorine or nitrate nitrogen, having an amount of coating converted to zirconium of 1 mg/m2 to 30 mg/m2, and having an amount of sulfuric acid radicals (SO42?) of 0 mg/m2 to 7 mg/m2.

Abstract: A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.

Abstract: A Ni plating is applied on a base metal in a metal strip form, and a brightener-free Sn-(1 to 4% by mass)Cu plating is applied on the Ni plating. The metal strip is heat-treated at a temperature at or above the melting point (solidus line) of a Sn-(1 to 4% by mass)Cu alloy to form a Cu—Sn compound layer or a Cu—Ni—Sn-compound layer on the Ni plating layer and a Sn layer or a Sn—Cu-ally layer on the Cu—Sn compound layer or the Cu—Ni—Sn-compound layer. The metal strip is further fabricated into a connector. Thus, a metal strip, which has good soldability on a substrate, is free from the occurrence of whiskers at a terminal part during storage or upon fitting into FPC or FFC, and is necessary for a lead-free connector, can be realized.

Abstract: The present invention provides hot dip plated high strength steel sheet for press forming use having a tensile strength of 380 MPa to less than 540 MPa, having a press formability able to be used for the automobile field, in particular fuel tank applications, and having superior secondary work embrittlement resistance and superior seam weld zone low temperature toughness and further superior plateability and a method of production of the same and provides hot dip plated high strength steel sheet for press forming use of the present invention having cold rolled steel sheet and a hot dip plated layer formed on the surface of said cold rolled steel sheet, characterized in that said cold rolled steel sheet contains, by mass %, C: 0.0005 to 0.0050%, Si: over 0.3 to 1.0%, Mn: 0.70 to 2.0%, P: 0.05% or less, Ti: 0.010 to 0.050%, Nb: 0.010 to 0.040%, B: 0.0005 to 0.0030%, S: 0.010% or less, Al: 0.01 to 0.30%, and N: 0.0010 to 0.

Abstract: A solder joint (200) has a first contact pad 114 and a second contact pad 124 of a first metal, preferably copper, facing each other across a gap. A coat and 125, respectively) of a second metal, preferably nickel, covers each pad. A layer 201 of crystals of first intermetallic compounds, such as Ni3Sn4 and (Ni, Cu)3Sn4, covers the surface of each coat. Isolated crystals 202 of second intermetallic compounds, such as Cu6Sn5 and (Cu, Ni)6Sn5, different from the first intermetallic compounds, are dispersed on top of the layer 201 of crystals of the first intermetallic compounds. A solder alloy 203 including a third metal, preferably tin, and the first metal fills the gap. The solder alloy 203 may further include a fourth metal, preferably selected from a group of metals including silver, zinc, and indium.

Abstract: Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.

Abstract: An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.

Abstract: The invention relates to the use of lead-free sliding layers in the laminated composite materials for slide bearings or bushes. According to the invention, the laminated composite material comprises a support layer, an antifriction layer (3) produced from a copper alloy or an aluminum alloy, an intermediate nickel layer (2) having a thickness >4 ?m and a sliding layer (1) consisting of approximately 0 to 20% by weight of copper and/or silver and the remainder tin. The sliding layer is electrodeposited from a methlysulfonic acid electrolyte.

Abstract: A tin-plated steel sheet includes a plating layer containing tin on at least one surface of a steel sheet, and a chemical conversion coating containing P and tin on the plating layer is provided. In the steel sheet, a coated amount of the chemical conversion coating per surface is 1.0 to 50 mg/m2 in terms of P, an atomic ratio Sn/P obtained from the intensity of a P2p peak and that of a Sn3d peak is 1.0 to 1.5, the intensities being measured at the surface using an x-ray photoelectron spectroscopic method, and an atomic ratio O/P obtained from the intensity of the P2p peak and that of an O1s peak is 4.0 to 9.0. The phosphoric acid-based chemical conversion coating of the tin-plated steel sheet can suppress degradation in performance, which is caused by the growth of a tin oxide layer on the surface, instead of a conventional chromate coating.

Abstract: A resin-coated steel plate obtained by providing, on at least one surface of the steel plate, (i-1) an alloy layer of iron and at least one metal selected from tin, zinc and nickel or (i-2) a tin-plated layer containing tin in an amount of not smaller than 0.5 g/m2, (ii) a silane coupling agent-treated layer, and (iii) a thermoplastic polyester resin layer in this order from the side of the steel plate. Despite not containing chromium, the resin-coated steel plate exhibits excellent work adhesion properties between the steel blank and the organic resin film even when the thickness is reduced due to a severe working and even at portions subjected to severe working such as flanging and necking. By press-forming the resin-coated steel plate, there are obtained cans featuring excellent corrosion resistance and being adapted to containing even highly corrosive contents.

Abstract: An exemplary embodiment of a hot-dip Sn—Zn coated steel sheet is provided which can include a steel sheet and a hot-dip coating layer which is formed on a surface of the steel sheet. The coating layer can contain between about 1 mass % and about 8.8 mass % of Zn, and a remainder including between about 91.2 mass % and about 99.0 mass % of Sn and inevitable impurities. A ratio of an endothermic value of melting heat generated by Sn—Zn eutectic crystals and an endothermic value of melting heat generated by Sn primary crystals in the hot-dip coating layer can satisfy the following relationship: (endothermic value of melting heat generated by Sn primary crystals)/{(endothermic value of melting heat generated by Sn primary crystals)+(endothermic value of melting heat generated by Sn—Zn eutectic crystals)}?about 0.3. Further, a temperature of an endothermic peak generated by melting of the Sn primary crystals can be between about 200° C. and about 230° C.

Abstract: A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.

Abstract: A radio-frequency shield comprised of a sheet of steel and tin-plating on at least one side of said sheet of steel. In addition, a method of making a radio-frequency shielding consisting of tin-plating at least one side of at least one sheet of steel. In addition, a backer material can be added to the back side the steel sheet which allows tin-plated steel sheets to be overlayed and attached to one another.

Abstract: An electronic component according to the present invention includes a land 112 having a flat reference surface p1 and having a solder joint p3 to be solder bonded, wherein the solder joint p3 as a concave 113 recessed from the reference surface, and a nickel plate layer 114 is laminated on a surface of the land 112, and a position of an interface between (a) a tin-containing alloy layer 116 formed on the solder joint p3 of the nickel plate layer 114 in solder bonding the nickel plate layer 114 and (b) the nickel plate layer 114 deviates from a plane including the reference surface p1. This makes it possible to provide an electronic component including a solder joint which hardly cracks.

Abstract: A sliding bearing includes a relatively soft first metallic material incorporated into a matrix of a relatively harder second metallic material. The first material is soluble in the second material. Particles of the first material are coated with a protective barrier coating to protect the first material from dissolving in the second material during processing and thereby yielding discrete secondary phases of the first material within the matrix of the second material. The first material may comprise tin or bismuth coated with a barrier coating of nickel within a copper-tin matrix of second material.

Abstract: A multi-layer sliding part is prepared by a process including mixing 1–50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5–20 mass % of Sn and a remainder of Cu to form a mixed powder, sintering the mixed powder in a reducing atmosphere to form a sintered mass, pulverizing the sintered mass to form a powder, dispersing the powder formed by pulverizing on a metal backing plate, and sintering the dispersed powder to bond grains of the dispersed powder to each other and to the backing plate. After sintering of the pulverized powder to form bearing metal layer, the bearing metal layer is pressed and densified. After densification, the bearing metal layer is annealed, again pressed, and then coated with a resin having good sliding properties.

Abstract: A coating system and coating method for damping vibration in an airfoil of a rotating component of a turbomachine. The coating system includes a metallic coating on a surface of the airfoil, and a ceramic coating overlying the metallic coating. The metallic coating contains metallic particles dispersed in a matrix having a metallic and/or intermetallic composition. The metallic particles are more ductile than the matrix, and have a composition containing silver and optionally tin. The method involves ion plasma cleaning the surface of the airfoil before depositing the metallic coating and then the ceramic coating.

Abstract: A resin sealed IC has a plurality of external terminals. A metal thin film made of a Sn—Bi alloy is formed in direct contact with the surface of a base member of each external terminal. A Bi content in the Sn—Bi alloy layer is within a range of 0.5 to 6.0 wt %. Further, the Sn—Bi alloy layer has a single-layer plating structure, and the film thickness is within a range of 10 to 25 MIC.

Abstract: A multi-layer sliding part is prepared by a process including mixing 1–50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5–20 mass % of Sn and a remainder of Cu to form a mixed powder, sintering the mixed powder in a reducing atmosphere to form a sintered mass, pulverizing the sintered mass to form a powder, dispersing the powder formed by pulverizing on a steel backing plate, and sintering the dispersed powder to bond grains of the dispersed powder to each other and to the backing plate.

Abstract: Disclosed is a sliding member having a bearing alloy layer, an intermediate layer of Ni or a Ni alloy formed on the bearing alloy layer, and an overlay layer of a Sn alloy containing Cu formed on the intermediate layer. There exist Sn—Cu compounds in the overlay layer, which protrudently extend from the intermediate layer. The hard Sn—Cu compounds contribute to the overlay layer in improving fatigue resistance property. A soft Sn matrix being rich in an outer surface region of the overlay layer is responsible for keeping good conformability to have excellent anti-seizure property.

Abstract: The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5–2 to 0.1–5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.

Abstract: A Pb-free hot-dip Sn—Zn coated steel sheet comprising a hot-dip coating layer comprised of 1 to 8.8 wt % of Zn and the balance of Sn in an amount of 91.2 to 99.0 wt % and unavoidable impurities and/or ancillary ingredients on the surface of steel sheet, the coating surface having Sn dendrite crystals and Sn dendrite arm spacings buried by an Sn—Zn two-way eutectic structure, an area ratio of Sn dendrites in the coating surface being 5 to 90%, and the arm spacing of the Sn dendrites being not more than 0.1 mm, preferably having a discontinuous FeSn2 alloy phase at the surface of the steel sheet.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: A method is proposed for preparing a structured metallic surface of a body or for the structuring close to the surface or the generation of metallic structures, first of all on a first metal layer or on a first intermetallic layer a second metal layer or a second intermetallic layer, the second layers differing from the first layers, being generated; and thereafter at least the second metal layer or the second intermetallic layer being heated up region by region in such a way that, in that location, there is formed an intermetallic compound using the material of the first intermetallic layer or the first metal layer and the material of the second metal layer or the second intermetallic layer, into which surface regions are embedded, which are at least essentially made of the material of the second metal layer or the second intermetallic layer.

Abstract: An optical recording medium having a recording layer which contains at least one compound selected from the group consisting of mono-, di-, and triazaporphyrin compounds optionally in the form of a metal complex; or an optical recording medium comprising a substrate and formed thereon at least a recording layer containing an organic dye as a main component, characterized in that the organic dye has a first maximum value of absorption at a wavelength ?1 of 400 nm or less in the absorption spectrum and has a second maximum value of absorption at a longer-wavelength side than the ?1, and a wavelength band wherein the refractive index (n) and the absorption coefficient (k) of the above organic dye satisfy n?1.90 and 0.03?k?0.30.

Abstract: The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surface-treated copper foil for a low-dielectric substrate which is used in bonded relationship to a low-dielectric substrate, which is characterized in that a nodular-treated layer constituted by bump-like copper particles is formed on a surface of the copper foil and that ultrafine copper particles are caused to precipitate on the whole surface of the nodular-treated layer and adhere thereto and the roughness value Rz of the surface is 1.0 to 6.5 ?m. The surface color of the surface-treated copper foil has L* of not more than 50, a* of not more than 20 and b* of not more than 15.

Abstract: A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 ?m. The copper-tin alloy layer has a thickness of 0.1-1.0 ?m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 ?m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 ?m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

Abstract: Electrical connectors incorporate a composite coating of molybdenum disulfide and a metal, preferably tin, for one or both of the contact surfaces of the electrical connector. The coating provides for a low coefficient of friction, low contact resistance, and good electrical conductivity, as well as good mechanical properties. The coating also reduces the insertion force of the electrical connectors, thereby increasing the number of possible terminal pairs and/or reducing terminal bending and breakage for a manually mated connector. The coating can be deposited on copper, tin-plated copper, tin alloy-plated copper or other metallic substrates, using any of several physical vapor deposition methods.

Abstract: A Sn-based metal-coated steel strip excellent in appearance comprises a Ni-based metal (such as Ni, a Ni—Sn alloy, a Ni—Zn alloy, a Ni—Fe alloy and a Ni—Co alloy) preplating layer and a Sn-based metal (such as a Sn—Zn alloy) coating formed thereon, and is characterized in that a Ni emission intensity line and an Fe emission intensity line obtained by glow discharge spectroscopy of the surface of the coated steel strip satisfy a relationship of the formula: T1?T2 wherein T1 is a sputtering time at the peak of a Ni emission intensity line, and T2 is a sputtering time at the inflection point of an Fe emission intensity line, or a relationship of the formulas: T1?T2, and 1?T1/T2?1.

Abstract: The present invention is directed to a coated substrate, comprising: an antitarnish layer deposited on a substrate in an amount effective to prevent tarnishing of said coated substrate; and an outer layer deposited onto said antitarnish layer, said outer layer comprising tin or tin alloys having at least 50% by weight tin. The present invention is also directed to coated substrates having a concentration gradient of antitarnish agent diffused into the coating, as well as methods of forming such coated substrates.

Abstract: A semiconductor device is disclosed containing a semiconductor die having a trimetal electrode soldered to a substrate by a Sn—Sb solder.

Abstract: An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.

Abstract: In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin and zinc metal alloy.