Group Ib Metal-base Component Alternative To Platinum Group Metal-base Component (e.g., Precious Metal, Etc.) Patents (Class 428/669)
  • Patent number: 11986757
    Abstract: A filtration filter according to the present invention includes a surface layer composed mainly of Pd, a base material inside the surface layer and composed mainly of a PdNi alloy, and an intermediate layer between the surface layer and the base material, wherein the intermediate layer is composed mainly of a PdNi alloy in which a Pd:Ni ratio changes from a surface layer side toward a base material side.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: May 21, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaru Banju, Takashi Kondo, Shusuke Yokota
  • Patent number: 11600296
    Abstract: A data storage method, apparatus and system that increase drive capacity, minimize latency, reduce write access time and improve drive lifetime is described in this invention. In one embodiment, the data storage device described here is a composite hard disk drive comprises a number of recording media platters labeled from 1 to n, where n is greater than or equal to 2; wherein there exist two positive integer n1 and n2, where n1 and n2 are between 1 and n; n1 is not equals to n2; wherein the data tracks for the media platters n1 and n2 are written based on one of the following: 1) different RTs; 2) different WAs; or 3) different RTs and different WAs.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: March 7, 2023
    Inventor: Kaizhong Gao
  • Patent number: 11174530
    Abstract: A steel strip, sheet or blank used for painted parts, wherein the steel strip, sheet or blank is optionally metallic coated. According to the invention, the steel has grains with an essentially equi-axed median grain size smaller than 11.0 micrometer, resulting in a difference in Waviness ?Wsa?0.12 ?m between the surface before and after the forming of the strip, sheet or blank. The invention also relates to a method for producing such a steel strip.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: November 16, 2021
    Assignee: TATA STEEL IJMUIDEN B.V.
    Inventors: Maxim Peter Aarnts, Job Anthonius Van Der Hoeven, Edgar Matthijs Toose
  • Patent number: 8946911
    Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: February 3, 2015
    Assignee: Samsung Electro-Machanics Co., Ltd.
    Inventors: Jung Youn Pang, Shimoji Teruaki, Eun Heay Lee, Seong Min Cho, Chi Seong Kim
  • Patent number: 8759986
    Abstract: Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: June 24, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chul Min Lee, Won Hyung Park, Kyung Jin Heo, Dek Gin Yang, Jin Su Yeo, Sung Wook Chun
  • Patent number: 8734957
    Abstract: A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each layer of the one or more noble metal layers is no greater than a monolayer. The seed film also includes either one or more conductive metal oxide layers or one or more silicon oxide layers, where either layer is no greater than a monolayer. The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: May 27, 2014
    Assignee: Micron Technology, Inc.
    Inventor: Eugene P. Marsh
  • Patent number: 8524378
    Abstract: Provided is a copper foil for a printed circuit with an electrodeposited ternary-alloy layer composed of copper, cobalt and nickel formed on a surface of the copper foil, wherein the electrodeposited layer comprises dendritic particles grown on the copper foil surface, and the entire surface of the copper foil is covered with particles having an area as seen from above the copper foil surface of 0.1 to 0.5 ?m2 at a density of 1000 particles/10000 ?m2 or less, particles exceeding 0.5 ?m2 at a density of 100 particles/10000 ?m2 or less, and particles less than 0.1 ?m2 as the remainder. Roughening particles formed dendritically in a roughening treatment based on copper-cobalt-nickel alloy plating are inhibited from shedding from the copper foil surface, and the phenomenon known as powder falling and uneven treatment are thereby inhibited.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: September 3, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Naoki Higuchi
  • Publication number: 20130171470
    Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.
    Type: Application
    Filed: June 13, 2012
    Publication date: July 4, 2013
    Inventors: Jun-Der LEE, Hsing-Hua TSAI, Tung-Han CHUANG
  • Patent number: 8409726
    Abstract: Provided is a printed circuit board (PCB) with multiple metallic layers and a method of manufacturing the PCB to improve adhesion between a metal film and a polymer film, on which a circuit pattern is formed. The PCB includes: a first metal film; a polymer film formed on one surface of the first metal film; and a second metal film, interposed between the first metal film and the polymer film, having a first surface facing the first metal film and a second surface facing the polymer film, wherein the second surface is rougher than the first surface.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: April 2, 2013
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Chang-han Shim, Sung-il Kang, Se-chuel Park
  • Patent number: 8075958
    Abstract: The present disclosure is generally related to providing thin hydrogen separation membranes coated on porous substrates that are useful in membrane steam reformers and methods for making same. These reformers can be integrated with protein exchange membrane (PEM) fuel cells to form power systems.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: December 13, 2011
    Assignee: Intelligent Energy, Inc.
    Inventors: Anand Chellappa, Thomas R. Vencill, W. Doyle Miller
  • Publication number: 20110171137
    Abstract: A process of preparing a plurality of nanostructures, each being composed of at least one target material is disclosed. The process comprises sequentially electrodepositing a first material and the at least one target material into pores of a porous membrane having a nanometric pore diameter, to thereby obtain within the pores nanometric rods, each of the nanometric rods having a plurality of segments where any two adjacent segments are made of different materials. The process further comprises and etching the membrane and the first material, thereby obtaining the nanostructures.
    Type: Application
    Filed: September 10, 2009
    Publication date: July 14, 2011
    Applicant: RAMOT AT TEL-AVIV UNIVERSITY LTD.
    Inventors: Fernando Patolsky, Roey Elnathan, Raisa Kantaev
  • Publication number: 20110117383
    Abstract: A sliding contact material containing 40 to 60% by weight of Au, 15 to 25% by weight of Pd, and Sn and In as essential elements, the total amount of Sn and In being 1 to 4% by weight and the balance being Ag, and a sliding contact material containing 40 to 60% by weight of Au, 15 to 25% by weight of Pd, and Zn, the amount of Zn being 0.1 to 5% by weight and the balance being Ag. The sliding contact material is insusceptible to the interaction with grease essential for the use of such contact materials, and has stable contact resistance, and therefore can be used for a long time.
    Type: Application
    Filed: May 28, 2010
    Publication date: May 19, 2011
    Inventors: Takao Asada, Junichi Takeuchi, Tomokazu Satoh
  • Publication number: 20110045317
    Abstract: A decorative metal finish for a part with a non-conductive surface where the non-conductive surface is lightly roughened to improve its adherence capabilities. A thin metal layer is electrolessly deposited on the lightly roughened surface to provide a bright durable metal finish on the non-conductive surface. An translucent finish is deposited over the thin metal layer to provide protection for the metal finish.
    Type: Application
    Filed: August 24, 2009
    Publication date: February 24, 2011
    Inventors: Ling Hao, David P. Hartrick, Lee A. Chase, Alan D. Fanta, Daniel W. Irvine, Yong Zhang, Maoshi Guan
  • Publication number: 20100233507
    Abstract: One aspect is a device including at least two interconnected metal parts. The two interconnected parts are formed from metals with different melting temperature from the group consisting of the elements Pt, Pd, Ag, Au, Nb, Ta, Ti, Zr, W, V, Hf, Mo, Co, Cr, Ni, Ir, Re, Ru as well as alloys on the basis of at least one of those elements. The metal part with the lower melting temperature is fused onto the metal part with the higher melting temperature and both parts are friction-locked and/or form-locked with each other.
    Type: Application
    Filed: March 12, 2010
    Publication date: September 16, 2010
    Applicant: W. C. HERAEUS GMBH
    Inventors: Christoph Vogt, Lena Lewandrowski, Stefan Schibli, Heiko Specht
  • Publication number: 20100047618
    Abstract: The present invention is related to a novel sterling silver compound for use in vermeil jewelry and other articles of manufacture. The compound includes an alloy composed of at least 92.5% by weight of silver, up to 7.5% by weight of gold, and the remainder in copper. The invention further relates to an article of jewelry including at least 92.5% by weight of silver, up to 7.5% by weight of gold, and the remainder in copper. The invention also relates to a method for making an article. The method includes providing a vessel and adding 3.75% by weight of gold, 94.0% by weight of silver, and 2.25% by weight of copper to the vessel. The method also includes melting the metals and mixing them until a homogenous mixture is formed. The method further includes pouring the homogenous mixture into a mold to form a semi-finished article and plating the semi-finished article with 18K rose gold.
    Type: Application
    Filed: August 21, 2008
    Publication date: February 25, 2010
    Applicant: Seno Jewelry, LLC
    Inventor: Ippolita Rostagno
  • Publication number: 20100028707
    Abstract: In particular embodiments, the present disclosure provides targets including a metal layer and defining a hollow inner surface. The hollow inner surface has an internal apex. The distance between at least two opposing points of the internal apex is less than about 15 ?m. In particular examples, the distance is less than about lam. Particular implementations of the targets are free standing. The targets have a number of disclosed shaped, including cones, pyramids, hemispheres, and capped structures. The present disclosure also provides arrays of such targets. Also provided are methods of forming targets, such as the disclosed targets, using lithographic techniques, such as photolithographic techniques. In particular examples, a target mold is formed from a silicon wafer and then one or more sides of the mold are coated with a target material, such as one or more metals.
    Type: Application
    Filed: September 12, 2006
    Publication date: February 4, 2010
    Inventors: Thomas E. Cowan, Steven Malekos, Grant Korgan, Jesse Adams, Yasuhiko Sentoku, Nathalie Le Galloudec, Julien Fuchs
  • Patent number: 7648775
    Abstract: A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: January 19, 2010
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Hisashi Wakako, Makoto Nagai, Atsushi Uchida, Masahito Morita, Kazuo Kimura
  • Publication number: 20090283309
    Abstract: Problem is to provide a ceramic-metal composite and a semiconductor device that exhibits high bonding strength, heat cycle resistance, durability, and reliability even if the ceramic-metal composite is used in a power module. A ceramic-metal composite includes a ceramic substrate, an active metal brazing alloy layer, and a metal plate bonded to the ceramic substrate through the active metal brazing alloy layer disposed therebetween. The active metal brazing alloy layer contains a transition metal.
    Type: Application
    Filed: July 3, 2007
    Publication date: November 19, 2009
    Applicants: Kabushiki Kaisha Toshiba, Toshiba Materials Co., LTD
    Inventors: Takayuki Naba, Michiyasu Komatsu, Noritaka Nakayama, Hiromasa Kato
  • Publication number: 20090263678
    Abstract: A metal material with electric contact layer includes a metal base made of metal containing chromium; an adhesive layer formed on a surface of the metal base, mainly containing chromium and having a thickness of 5 nm or more and 200 nm or less; and an electric contact layer formed on the surface of the adhesive layer, made of noble metal or an alloy of the noble metal, and having a thickness of 1 nm or more and 20 nm or less.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 22, 2009
    Applicant: HITACHI CABLE, LTD.
    Inventors: Takaaki SASAOKA, Mineo WASHIMA, Masahiro SEIDOU
  • Publication number: 20090197375
    Abstract: A fabrication method for a metal-base/polymer-resin bonded structured body according to the present invention includes the steps of: (1) applying, to a surface of the metal base, a solution containing an organometallic compound decomposable at 350° C. or lower; (2) baking the applied solution in an oxidizing atmosphere to form, on the surface of the metal base, a coating containing an oxide of the metal of the organometallic compound; (3) providing the polymer resin on the coating; and (4) hardening the polymer resin to provide the metal-base/polymer-resin bonded structured body.
    Type: Application
    Filed: January 29, 2009
    Publication date: August 6, 2009
    Inventors: Ryoichi Kajiwara, Shigehisa Motowaki, Kazutoshi Itou, Hiroshi Hozoji
  • Patent number: 7452612
    Abstract: Provided is a wiring portion capable of suppressing diffusion from occurring in a wiring portion or between the wiring portion and a substrate. In the wiring substrate, a first high melting point metal portion 18 having a melting point higher than Au and Ag is provided between an Au wiring portion 15 and an Ag wiring portion 17. The higher the melting point of the first high melting point metal portion 18, the lower a coefficient thereof, that is, the harder diffusion occurs. In addition, the first high melting point metal portion 19 functions as a barrier material which adequately suppresses Ag from being diffused from the Ag wiring portion 17. By providing the first high melting point metal portion 18 between the Au wiring portion 15 and the Ag wiring portion 17, it is possible to more efficiently suppress Ag from diffusion, in comparison with a case where the Ag wiring portion and the Au wiring portion are in contact with each other.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: November 18, 2008
    Assignee: Alps Electric Co., Ltd.
    Inventor: Shinji Murata
  • Patent number: 7378159
    Abstract: A protected article has a substrate and a protective structure overlying a surface of the substrate. The protective structure includes a protective layer overlying the surface of the substrate and having an aluminum content greater than that of the substrate, and a bond-coat layer of a bond-coat-layer metal. The bond-coat-layer metal has a bond-coat initial composition having at least about 60 percent by weight platinum, rhodium, palladium, or combinations thereof. There may be a diffusion-barrier layer between the surface of the substrate and the protective layer, and there may be a ceramic thermal barrier coating overlying the bond-coat layer.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: May 27, 2008
    Assignee: General Electric Company
    Inventors: Mark Daniel Gorman, Ramgopal Darolia
  • Patent number: 7285338
    Abstract: An anisotropic thin-film rare-earth permanent magnet endowed with high magnetic characteristics by rendering a vapor-phase-grown thin film anisotropic in the layering direction. The atomic laminate units are formed by laminating a monoatomic layer of a rare earth element on a substrate of a non-magnetic material having, a flat smoothness and then by laminating an atomic laminate of a transition metal element having a plurality of monoatomic layers of a transition metal element, so that the atomic laminate units of a characteristic construction are laminated in a plurality of layers. As a result, each atomic laminate of the transition metal element has an easy magnetizable axis in the laminate direction of the monoatomic layers and which are sandwiched between a monoatomic layer of a rare-earth element so that an inverse magnetic domain is suppressed to establish a strong coercive force.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: October 23, 2007
    Assignee: Neomax Co., Ltd.
    Inventors: Osamu Yamashita, Ken Makita
  • Patent number: 7256481
    Abstract: A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (302) and a plurality of lead segments (303). Covering the base metal are, consecutively, a continuous nickel layer (201) on the base metal, a layer of palladium on the nickel, wherein the palladium layer (203) on the chip side of the structure is thicker than the palladium layer (202) opposite the chip, and a gold layer (204) on the palladium layer (202) opposite the chip. A semiconductor chip (310) is attached to the chip mount pad and conductive connections (312) span from the chip to the lead segments. Polymeric encapsulation compound (320) covers the chip, the connections, and portions of the lead segments, but leaves other segment portions available for solder reflow attachment to external parts.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: August 14, 2007
    Assignee: Texas Instruments Incorporated
    Inventor: John P. Tellkamp
  • Patent number: 7247396
    Abstract: A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a magnetically soft underlayer: (1) a first crystalline layer of a material having a first lattice parameter and a strong preferred growth orientation; (2) a second crystalline layer of a material having a second lattice parameter and the same strong preferred growth orientation as the first crystalline layer; and (3) a third crystalline layer of an hcp material, having a [0002] lattice parameter similar to or different from that of the second lattice parameter of the second crystalline layer and a strong <0002> preferred growth orientation, wherein: the second crystalline layer has a lower interfacial energy with the first crystalline layer and a higher interfacial energy with the third crystalline layer, owing to a lower surface energy of th
    Type: Grant
    Filed: January 27, 2004
    Date of Patent: July 24, 2007
    Assignee: Seagate Technology LLC
    Inventors: Thomas Patrick Nolan, Erol Girt, Chunghee Chang, Qixu Chen, Li-Lien Lee
  • Patent number: 7211340
    Abstract: A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of crystalline layers, the intermediate crystalline layer providing one of the crystalline layers of the pair with a stronger out-of-plane preferred growth orientation than if each of the pair of crystalline layers are in overlying contact. Disclosed and preferred embodiments include perpendicular magnetic recording media comprising the multiple layer structure as an intermediate layer structure beneath a perpendicular magnetic recording layer for strengthening a preferred out-of-plane growth orientation of the latter.
    Type: Grant
    Filed: January 28, 2004
    Date of Patent: May 1, 2007
    Assignee: Seagate Technology LLC
    Inventor: Thomas Patrick Nolan
  • Patent number: 7205020
    Abstract: A magnetic recording medium has a non-magnetic under-layer, a magnetic layer, a protective film and a liquid lubricant layer sequentially laminated on a non-magnetic substrate. The magnetic layer has a multi-layer structure laminated with two or more magnetic layer components, each of the magnetic layer components having ferromagnetic grains and non-magnetic grain boundaries surrounding the grain. The resulting magnetic recording medium has a granular magnetic layer exhibiting very high Hc accompanying high density of magnetic recording, while decreasing the amount of platinum needed for attaining the high Hc, and reducing media noise accompanying the high recording density.
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: April 17, 2007
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Tadaaki Oikawa, Hiroyuki Uwazumi, Takahiro Shimizu, Naoki Takizawa
  • Patent number: 7141311
    Abstract: The present invention provides a Y-type hexagonal ferrite thin film suitable for high frequency devices, having a crystal structure with the c-axis oriented perpendicular to the surface of the thin film. The present invention also provides a method of producing the Y-type hexagonal ferrite thin film, comprising the steps of preparing a viscous solution containing a metal-organic complex which is formed using a primary component including a Fe+3 ion, and a secondary component including a Ba2+ ion, at least one transition metal ion selected from the group consisting of Fe2+, Co2+, Ni2+, Zn2+, Cu2+ and Mn2+; and optionally at least one metal ion selected from the group consisting of Sr2+, Ca2+ and Pb2+, forming a film having a Y-type ferrite composition on a surface made of noble metal through a coating process using the viscous solution, and burning the film at a temperature of 750° C. or more.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: November 28, 2006
    Assignee: Japan Science and Technology Agency
    Inventors: Jun Takada, Tatsuo Fujii, Makoto Nakanishi
  • Patent number: 7033613
    Abstract: Using a gene recombination technique, a glutamic acid and an aspartic acid positioned in a channel of apoferritin are substituted with serine having a small size and no charges. Then, a glutamic acid positioned in a holding portion is substituted with a basic amino acid such as lysine or a neutral amino acid. Furthermore, at least one cysteine is introduced into the holding portion. This prevents a repulsive force due to electrostatic interaction between (AuCl4)? having a negative charge and a negative amino acid from occurring, which facilitates the capture of (AuCl4)? into the channel and the holding portion. The (AuCl4)? captured into the holding portion is subsequently reduced to Au, and thus apoferritin including gold particles can be produced.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: April 25, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Ichiro Yamashita
  • Patent number: 6936353
    Abstract: Magnetic recording media having a magnetic layer with an easy magnetization axis lying about 45° out of plane of the magnetic layer is disclosed. SMNR from this media could be greatly improved from conventional longitudinal and perpendicular recording, because of an increase in the grain anisotropy that could be effectively written due to the angled recording configuration, resulting also in higher thermal stability, therefore, suitable for higher areal density recording.
    Type: Grant
    Filed: July 2, 2003
    Date of Patent: August 30, 2005
    Assignee: Seagate Technology LLC
    Inventors: Zhong Stella Wu, Qixu David Chen, Samuel D. Harkness, IV
  • Patent number: 6936352
    Abstract: A magnetic recording medium can be produced without substrate heating during sputtering. The recording medium has a substrate, an underlayer of a nonmagnetic film with a bcc structure formed on the substrate, an intermediated layer of a nonmagnetic film with an hcp structure formed on the underlayer, a magnetic layer of a magnetic film with an hcp structure formed on the intermediate layer, and a protective layer formed on the magnetic layer. Materials used for the underlayer, the intermediate layer, and the magnetic layer has spacings between principal lattice planes of the respective crystals that can be expresses as d1 (between (110) planes in the underlayer)>d2 (between (002) planes in the intermediate layer)>d3 (between (002) planes in the magnetic layer).
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: August 30, 2005
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Michio Ohsawa, Akihiro Otsuki
  • Patent number: 6921585
    Abstract: Perpendicular magnetic media are described for use in magnetic recording and data storage. For example, a magnetic medium may include a substrate, an amorphous underlayer formed over the substrate, a seed layer formed over the amorphous underlayer, and a multi-layered magnetic stack formed over the seed layer. In this manner, high perpendicular magnetic anisotropy can be achieved and storage densities can be increased.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: July 26, 2005
    Assignee: Imation Corp.
    Inventor: Joseph H. Sexton
  • Patent number: 6905780
    Abstract: A magnetoresistive device includes a magnetization pinned layer, a magnetization free layer, a nonmagnetic intermediate layer formed between the magnetization pinned layer and the magnetization free layer, and electrodes allowing a sense current to flow in a direction substantially perpendicular to the plane of the stack including the magnetization pinned layer, the nonmagnetic intermediate layer and the magnetization free layer. At least one of the magnetization pinned layer and the magnetization free layer is substantially formed of a binary or ternary alloy represented by the formula FeaCobNic (where a+b+c=100 at %, and a?75 at %, b?75 at %, and c?63 at %), or formed of an alloy having a body-centered cubic crystal structure.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: June 14, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiromi Yuasa, Masatoshi Yoshikawa, Yuzo Kamiguchi, Hitoshi Iwasaki, Masashi Sahashi
  • Patent number: 6899959
    Abstract: A magnetic recording medium includes a substrate, an underlayer, a lower magnetic layer formed on the underlayer, an intermediate layer, and an upper magnetic layer formed on the intermediate layer. The intermediate layer is typically Ru, and promotes antiferromagnetic coupling between the upper and lower magnetic layers. The upper and lower magnetic layers are typically Co alloys. The lower magnetic layer has a high saturation magnetization Ms to promote high exchange coupling between the upper and lower magnetic layers. The dynamic coercivity of the lower magnetic layer is lower than the exchange field to ensure rapid switching of the lower magnetic layer.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: May 31, 2005
    Assignee: Komag, Inc.
    Inventors: Gerardo Bertero, Sudhir Malhotra, David Wachenschwanz, Zhengsheng Shan, Donald Stafford
  • Patent number: 6893735
    Abstract: A magnetic recording medium includes a nonmagnetic underlayer, an initial magnetic layer, a nonmagnetic spacer layer provided on the initial magnetic layer, and a final magnetic layer provided on the nonmagnetic spacer layer. The initial magnetic layer is disposed closer to the nonmagnetic underlayer than the final magnetic layer, and the initial and final magnetic layers are made of mutually different compositions and are anti-ferromagnetically coupled.
    Type: Grant
    Filed: May 22, 2003
    Date of Patent: May 17, 2005
    Assignee: Fujitsu Limited
    Inventors: B. Ramamurthy Acharya, E. Noel Abarra
  • Patent number: 6875522
    Abstract: The invention discloses magnetic OVP, said pigment consisting of thin-layer flakes having a basic metal-dielectric-metal structure to result in a viewing-angle dependent color appearance, and having, in addition to said viewing-angle dependent color appearance, incorporated magnetic properties, to make them distinguishable from OVP of similar appearance but not having said magnetic properties. The invention discloses as well methods for obtaining such pigments and the use of such pigments as security elements in inks, coatings and articles.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: April 5, 2005
    Assignee: SICPA Holding SA
    Inventors: Myron Seto, Thomas Tiller, Edgar Müller, Claude-Alain Despland
  • Patent number: 6869689
    Abstract: A joined structure of a metal terminal and a ceramic member has a joining layer between the terminal and the ceramic member. The joining layer has a metal adhesive layer containing at least indium metal. The invention further provides a joined structure of a metal member and a ceramic member. The metal member has a tip face and a side face. A hollow is formed in the ceramic member. A joining layer is formed between a bottom surface facing the hollow and the tip face of the member, and further formed between a side wall surface facing the hollow and the side face of the member. The joining layer has a metal adhesive layer containing at least indium metal.
    Type: Grant
    Filed: May 14, 2004
    Date of Patent: March 22, 2005
    Assignee: NGK Insulators, Ltd.
    Inventors: Tomoyuki Fujii, Mitsuru Ohta, Tsuneaki Ohashi
  • Patent number: 6863991
    Abstract: A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (3) a molecular layer comprising at least one molecule having a hydrophilic region and a hydrophobic region, wherein the hydrophilic region at least partially extends into the partially-filled aperture. Also, provided are coated metallic meshes having bilayers and a method of providing a molecular layer to a coated mesh.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: March 8, 2005
    Assignee: The Ohio State University
    Inventors: James V. Coe, Shaun M. Williams, Kenneth R. Rodriguez
  • Patent number: 6861157
    Abstract: Articles for use in a high-temperature, oxidative environment, methods for manufacturing such articles, and a material system for protecting articles in such an environment are provided where, for example, one article comprises a substrate and a protective layer disposed over the substrate, the protective layer comprising at least about 60 atomic percent of a metal selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), iridium (Ir), and mixtures thereof.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: March 1, 2005
    Assignee: General Electric Company
    Inventors: Ji-Cheng Zhao, Melvin Robert Jackson
  • Patent number: 6846576
    Abstract: Laminated magnetic recording medium with two Co-containing layers separated by a non-magnetic Ru-containing interlayer is stabilized by Ru-containing layer between the recording layers and Co-containing stabilization layers through anti-ferromagnetic coupling. The insertion of Co layer beneath Ru spacer has resulted in increased coupling, and further coupling enhancement is achieved by low pressure process of Co and Ru layers.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: January 25, 2005
    Assignee: Seagate Technology LLC
    Inventors: Zhong Stella Wu, Samuel Dacke Harkness
  • Patent number: 6838190
    Abstract: A protected article includes a nickel-base superalloy substrate, an interlayer overlying the substrate, and a protective layer overlying the interlayer. The protective layer has a composition comprising at least one of rhodium, platinum, palladium, and ruthenium. In one composition, palladium is present in an amount of from about 1 to about 41 atomic percent; platinum is present in an amount of about (40+atomic percent palladium) atomic percent for palladium ranging from about 1 atomic percent to about 14 atomic percent and up to about 54 atomic percent for palladium ranging from about 15 atomic percent up to about 41 atomic percent; rhodium is present in an amount of at least about 24 atomic percent; zirconium, hafnium, titanium, and mixtures thereof are present in an amount of from zero up to about 5 atomic percent; and ruthenium is present in an amount of from zero up to about 5 atomic percent, balance impurities.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: January 4, 2005
    Assignee: General Electric Company
    Inventors: Ching-Pang Lee, Melvin Robert Jackson, Stephen Joseph Ferrigno, Gary Edward Trewiler, Mark Daniel Gorman
  • Patent number: 6835464
    Abstract: A perpendicular exchange biased device comprises a layer of buffer material on a surface of a substrate, a layer of ferromagnetic material on a surface of the buffer layer, wherein the magnetization of the ferromagnetic layer lies in a direction perpendicular to the plane of the layer of ferromagnetic material, and a layer of antiferromagnetic material on a surface of the layer of ferromagnetic material. A method of making a perpendicular exchange biased device comprising positioning a layer of buffer material on a surface of a substrate, positioning a layer of ferromagnetic material on a surface of the layer of buffer material, wherein the magnetization of the ferromagnetic layer lies in a direction perpendicular to the plane of the layer of ferromagnetic material, and positioning a layer of antiferromagnetic material on a surface of the layer of ferromagnetic material is also included.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: December 28, 2004
    Assignee: Seagate Technology LLC
    Inventors: Thomas F. Ambrose, Timothy John Klemmer, Rene Johannes Marinus van de Veerdonk, Gregory John Parker, James K. Howard
  • Patent number: 6811890
    Abstract: The present invention is directed to a disk for information storage. The disk, in one embodiment, comprises a substrate 204, antiferromagnetically exchange coupled first and second ferromagnetic films 220 and 236, a spacer film 228, and at least one buffer film 232 located between the first and second ferromagnetic films. One or more of the following statements is true with respect to the buffer film 232: (i) the buffer film 232 is paramagnetic; (ii) the buffer film 232 is superparamagnetic at temperatures of about 50° C. or less; and (iii) a lattice mismatch between the buffer film 232 and at least one of the first and second ferromagnetic films 220 and 236 in contact with the buffer film is about 5% or less.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: November 2, 2004
    Assignee: Maxtor Corporation
    Inventors: Jianing Richard Zhou, Geon Choe, Kenneth E. Johnson
  • Patent number: 6797405
    Abstract: A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting the metal mesh to a relatively fast deposition of an electrodeposited material so as to substantially uniformly coat said mesh with electrodeposited material; and (3) subjecting the product of the relatively fast deposition step to a relatively slow deposition of an electrodeposited material so as to reduce at least one dimension greater than nanometer scale size to a size of nanometer scale. Also provided are metallic meshes so prepared and spectral filters.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: September 28, 2004
    Assignee: The Ohio State University
    Inventors: James V. Coe, Shaun M. Williams
  • Patent number: 6759138
    Abstract: In a magnetic recording medium which includes a base body (1-4), first and second magnetic layers (5 and 7), each being of a ferromagnetic material, and a spacer layer (6) formed between the first and the second magnetic layers for inducing antiferromagnetic exchange interaction between the first and the second magnetic layers, the second magnetic layer located farther from the base body than the first magnetic layer includes a primary layer (72) and a secondary layer (71) located nearer to the base body than the primary layer. The primary layer has a primary anisotropic magnetic field while the secondary layer has a secondary anisotropic magnetic field which is smaller than the primary anisotropic magnetic field. The first magnetic layer is for controlling the antiferromagnetic exchange interaction.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: July 6, 2004
    Assignees: Hoya Corporation, Hoya Magnetics Singapore PTE, Ltd.
    Inventors: Hiroshi Tomiyasu, Keiji Moroishi, Teiichiro Umezawa, Kenji Ayama
  • Patent number: 6723450
    Abstract: A magnetic recording medium for data storage uses a magnetic recording layer having at least two ferromagnetic films with different remanent magnetization-thickness (Mrt) values that are coupled antiparallel across a nonferromagnetic spacer film predominantly by the dipole field (Hd) from the grains of the higher-Mrt ferromagnetic film. The material compositions and thicknesses of the ferromagnetic films and the nonferromagnetic spacer film are selected so that Hd predominates over any antiferromagnetic exchange coupling field (Haf) and is greater than the coercive field of the lower-Mrt ferromagnetic film. As a result, the magnetizations of the two ferromagnetic films are antiparallel in the two remanent magnetic states, and thus the net remanent magnetization-thickness product (Mrt) of the recording layer is the difference in the Mrt values of the two ferromagnetic films.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: April 20, 2004
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hoa Van Do, Mary F. Doerner, Eric Edward Fullerton, David Thomas Margulies, William G. McChesney, Manfred Ernst Schabes, Kai Tang
  • Patent number: 6630250
    Abstract: An article substrate is protected by a protective structure overlying a surface of the article substrate. The protective structure includes a protective coating that is formed by depositing a layer of iridium overlying the surface of the substrate, depositing a layer of aluminum overlying the layer of iridium, and heating the substrate, the layer of iridium, and the layer of aluminum to form an iridium-aluminum protective coating overlying the substrate. A ceramic thermal barrier coating may be applied over the protective coating.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: October 7, 2003
    Assignee: General Electric Co.
    Inventor: Ramgopal Darolia
  • Patent number: 6630248
    Abstract: A spin valve structure is described that has greater pinned layer robustness than is found in spin valves of the existing known art, making it well suited for use in high density recording. This has been achieved by a using a modified pinned layer that is a laminate of five layers—a first layer of cobalt-iron, a layer of ruthenium, a second layer of cobalt-iron, a layer of nickel-chromium, and a third layer of cobalt-iron. The second layer of cobalt-iron should be about twice the thickness of the third cobalt-iron layer. The sum of the second and third cobalt-iron layer thicknesses may be greater or smaller than the thickness of the first cobalt-iron layer. A process for manufacturing the structure is also described.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: October 7, 2003
    Assignee: Headway Technologies, Inc.
    Inventors: Cheng T. Horng, Min Li, Ru-Ying Tong, Simon H. Liao, Kochan Ju
  • Patent number: 6627301
    Abstract: The present invention provides a magnetic recording medium exhibiting excellent noise characteristics and thermal stability. On a substrate, a first undercoat film, a first perpendicular magnetic film, a second undercoat film, a non-magnetic intermediate film, a second perpendicular magnetic film, and a protective film are successively formed, and the magnetic anisotropy energy of the first perpendicular magnetic film is higher than that of the second perpendicular magnetic film.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: September 30, 2003
    Assignee: Showa Denko Kabushiki Kaisha
    Inventors: Kenji Shimizu, Akira Itoh, Hiroshi Sakai
  • Patent number: 6607847
    Abstract: An article, such as an airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece comprises a first metallic element and a second metallic element, wherein the first metallic element is one of titanium, palladium, zirconium, niobium, and hafnium, and wherein the second metallic element is one of titanium, palladium, zirconium, niobium, hafnium, aluminum, chromium, vanadium, platinum, gold, iron, nickel, and cobalt, the first metallic element being different from the second metallic element.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: August 19, 2003
    Assignee: General Electric Company
    Inventors: Ji-Cheng Zhao, Melvin Robert Jackson, Bernard Patrick Bewlay