Group Viii Or Ib Metal-base Component Patents (Class 428/668)
  • Patent number: 9902134
    Abstract: A metal foil including: a steel layer whose thickness is 10 to 200 ?m; an Al-containing metal layer arranged on the steel layer; and plural granular alloys which exist in an interface between the steel layer and the Al-containing metal layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 ?m, is absent on the contour curve, and wherein, when an equivalent sphere diameter of the granular alloys is x in units of ?m and a thickness of the Al-containing metal layer is T in units of ?m, the granular alloys satisfy x?0.5T.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: February 27, 2018
    Assignees: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD., NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Takayuki Kobayashi, Shinichi Terashima, Masamoto Tanaka, Masami Fujishima, Masao Kurosaki, Jun Maki, Hideaki Suda, Shuji Nagasaki
  • Patent number: 9296180
    Abstract: A metal foil including: a steel layer whose thickness is 10 to 200 ?m; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 ?m, is absent on the contour curve, and a thickness of the alloy layer is 0.1 to 8 ?m and the alloy layer contains an Al7Cu2Fe intermetallic compound or FeAl3 based intermetallic compounds.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: March 29, 2016
    Assignees: NIPPON STELL & SUMIKIN MATERIALS CO., LTD., NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shinichi Terashima, Takayuki Kobayashi, Masamoto Tanaka, Masami Fujishima, Masao Kurosaki, Jun Maki, Hideaki Suda, Shuji Nagasaki
  • Patent number: 9299636
    Abstract: A heat sink for an electronic device includes a Cr—Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr—Cu alloy layer.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: March 29, 2016
    Assignee: JFE Precision Corporation
    Inventors: Hoshiaki Terao, Hidoaki Kobiki
  • Patent number: 9280996
    Abstract: An “all optical switching” (AOS) magnetic recording system, i.e., one that does not require a magnetic field to reverse the magnetization in the magnetic recording media, uses a FeMnPt L10 alloy as the magnetic media. A FeMnPt alloy, with appropriate amounts of Mn, will have high magneto-crystalline anisotropy, but also ferrimagnetic spin alignment for triggering AOS. The combination of high magneto-crystalline anisotropy and ferrimagnetic spin configuration enables the FeMnPt media to function as magnetic media whose magnetization can be switched solely by polarized laser pulses. The FeMnPt media for may be a single layer with or without any segregants. Alternatively, the FeMnPt media may be a multilayered recording layer comprising alternating layers of FePt and MnPt L10 ordered alloys. The segregant-free embodiments of the FeMnPt material may be patterned to form bit-patterned-media (BPM).
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: March 8, 2016
    Assignee: HGST Netherlands B.V.
    Inventors: Olav Hellwig, Oleksandr Mosendz, Dieter K. Weller
  • Patent number: 9047893
    Abstract: A magnetic sensor having a first sensor stack portion that includes a free layer, non-magnetic spacer or barrier layer and a portion of a pinned layer structure. The sensor has second sensor stack portion formed over the first sensor stack portion. The second sensor stack portion include includes a second portion of the pinned layer structure and a layer of antiferromagnetic material formed over the. The first sensor stack portion is configured with a width and stripe height that define the functional width and strip height of the sensor, whereas the upper portion can be made wider and deeper without affecting sensor performance. Because the patterning of the first sensor stack portion is performed on a thinner structure than would be necessary to pattern the entire sensor stack, the patterning can be performed with smaller dimensions and increased resolution.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: June 2, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: Zheng Gao, Hardayal S. Gill, Ying Hong, Quang Le
  • Patent number: 8993122
    Abstract: The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: March 31, 2015
    Assignee: Praxair Technology, Inc.
    Inventors: Paul S. Gilman, Binu Mathew, Brian J. O'Hara, Thomas J. Hunt, Peter McDonald, Holger J. Koenigsmann
  • Patent number: 8980414
    Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 ?g/dm2 of Ni and said Cr layer containing 10-100 ?g/dm2 of Cr is provided.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: March 17, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Tomota Nagaura, Kazuhiko Sakaguchi
  • Patent number: 8962154
    Abstract: A pipe or pipe fitting for use in harsh environment such as in petroleum refinery processes for cracking petroleum feedstocks, the pipe or pipe fitting comprising a 0.25 to 2.5 mm thick Co-based metallic coating on an internal surface of the pipe body, the coating having a hypereutectic microstructure characterized by carbides in a cobalt matrix and an average carbide grain size of less than 50 microns, and the Co-based metallic composition overlays the pipe internal surface at an interface which is free of heat-affected zone and which has a diffusion zone which is less than 0.002 inches thick.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: February 24, 2015
    Assignee: Kennametal Inc.
    Inventors: Matthew Yao, Louw DeJong, Danie DeWet
  • Patent number: 8956735
    Abstract: A mating-type connecting part can be obtained by stamping and surface-roughening a copper sheet into a predetermined shape with depressions as a plurality of parallel lines. The copper sheet then has a roughness of from 0.5 ?m to 4.0 ?m parallel to a sliding direction upon connection, a mean projection-depression interval of from 0.01 mm to 0.3 mm in that direction, a skewness less than 0, and a protrusion peak portion height of 1 ?m or less. The copper sheet is then plated with Cu and Sn, followed by reflowing. The result is a connecting part having a Sn surface coating layer group as a plurality of parallel lines, and a Cu-Sn alloy coating layer adjacent to each side of each Sn surface coating layer.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: February 17, 2015
    Assignees: Kabushiki Kaisha Kobe Seiko Sho, Shinko Leadmikk Co., Ltd.
    Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
  • Patent number: 8951644
    Abstract: A thermally protective coating (21), such as may be used over a nickel-based superalloy substrate (24). The protective coating (21) includes a CoNiCrAlY or a NiCoCrAlY material and addition of given amounts of one or more secondary elements. The secondary element(s) facilitate and/or join in one or more precipitation mechanisms (??, B2) that retain an aluminum reservoir in the protective coating (21), reducing aluminum diffusion into the substrate (24). This aluminum reservoir maintains a protective alumina scale (38) on the coating (21), thus improving coating life and allowing higher operating temperatures.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: February 10, 2015
    Assignee: Siemens Energy, Inc.
    Inventors: Andrew J. Burns, Anand A. Kulkarni
  • Publication number: 20150030878
    Abstract: The present application provides an ultrathin shielding film of high shielding effectiveness, comprising two or more solid shielding layers. An electrically-conductive adhesive layer is coated onto the outer surface at one side of the solid shielding layers, and one or more insulation film layers are formed on the outer surface at the other side of the solid shielding layers. A carrier film layer is provided on the outer surface of the insulation film layers. A protective film covers the lower surface of the electrically-conductive adhesive layer. The present application further discloses a manufacturing method of an ultrathin shielding film of high shielding effectiveness.
    Type: Application
    Filed: September 28, 2012
    Publication date: January 29, 2015
    Applicant: GUANGZHOU FANG BANG ELECTRONICS CO., LTD.
    Inventor: Su Zhi
  • Patent number: 8940405
    Abstract: A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 ?m to 4.0 ?m in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 ?m or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 ?m or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: January 27, 2015
    Assignees: Kobe Steel, Ltd., Shinko Leadmikk Co., Ltd.
    Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto
  • Patent number: 8888069
    Abstract: The invention provides a valve which suppresses a continuous corrosion of a chemical compound phase such as an eutectic carbide or the like in a valve seat, and improves a corrosion resistance, an impact resistance and an erosion resistance of the valve seat. The invention disperses a chemical compound phase such as the eutectic carbide or the like crystallizing in a dendrite gap as a granular shape or a blocky shape which is equal to or less than about 100 ?m, by moving a tool rotating in a crimped state by a load application to a vertical direction to a surface of the valve seat so as to carry out a friction stir processing, and forming a weld metallographic structure of a surface layer portion of the valve seat as a cubic.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: November 18, 2014
    Assignee: Hitachi-GE Nuclear Energy, Ltd.
    Inventors: Yusaku Maruno, Seunghwan Park, Yoshihisa Kiyotoki, Shin Kumagai
  • Patent number: 8877347
    Abstract: A wear element for component subject to abrasive influences, for example in a region of a receiving element for bulk material, includes an element formed by a one-piece, approximately plate-shape molded body made of a wear resistant alloy. The molded body is configured not to be planar in any plane. The molded body has an approximately rectangular cross-section and includes longitudinal sides and lateral sides that are rounded sections flowing into each other.
    Type: Grant
    Filed: November 28, 2007
    Date of Patent: November 4, 2014
    Assignee: Caterpillar Global Mining HMS GmbH
    Inventor: Michael Dietrich
  • Publication number: 20140315392
    Abstract: A cold spray barrier coated component of a semiconductor plasma processing chamber comprises a substrate having at least one metal surface wherein a portion of the metal surface is configured to form an electrical contact. A cold spray barrier coating is formed from a thermally and electrically conductive material on at least the metal surface configured to form the electrical contact of the substrate. Further, the cold spray barrier coating may also be located on a plasma exposed and/or process gas exposed surface of the component.
    Type: Application
    Filed: April 22, 2013
    Publication date: October 23, 2014
    Applicant: Lam Research Corporation
    Inventors: Lin Xu, Hong Shih, Anthony Amadio, Rajinder Dhindsa, John Michael Kerns, John Daugherty
  • Publication number: 20140255726
    Abstract: Coatings as may be used in a gas turbine are provided. A cobalt based coating may include 15 to 40 wt % nickel, 15 to 28 wt % chromium, 5 to 15 wt % aluminum, 0.05 to 1 wt % yttrium and/or at least one of elements from lanthanum series, 0.05 to 5 wt % ruthenium and/or molybdenum, 0 to 2 wt % iridium, 0 to 3 wt % silicon, 0 to 5 wt % tantalum, hafnium, unavoidable impurities, and a balance of cobalt. A nickel based coating may include 15 to 40 wt % cobalt, 10 to 25 wt % chromium, 5 to 15 wt % aluminum, 0.05 to 1 wt % yttrium and/or at least one of elements from lanthanum series, 0.05 to 8 wt % ruthenium or iron, 0 to 1 wt % iridium, 0.05 to 5 wt % molybdenum, 0 to 3 wt % silicon, 0 to 5 wt % tantalum, 0 to 2 wt % hafnium, unavoidable impurities, and a balance of nickel.
    Type: Application
    Filed: September 18, 2012
    Publication date: September 11, 2014
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Xin-Hai Li
  • Patent number: 8765268
    Abstract: A coated article includes a substrate, a composite layer formed on the substrate, and a chromium-oxygen-nitrogen layer formed on the composite layer. The composite layer includes a plurality of nickel-aluminum-holmium layers and a plurality of iridium layers. Each nickel-aluminum-holmium layer interleaves with one iridium layer. A method for making the coated article is also described.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: July 1, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Shi Chen, Cong Li
  • Patent number: 8759986
    Abstract: Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: June 24, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chul Min Lee, Won Hyung Park, Kyung Jin Heo, Dek Gin Yang, Jin Su Yeo, Sung Wook Chun
  • Patent number: 8734957
    Abstract: A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each layer of the one or more noble metal layers is no greater than a monolayer. The seed film also includes either one or more conductive metal oxide layers or one or more silicon oxide layers, where either layer is no greater than a monolayer. The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: May 27, 2014
    Assignee: Micron Technology, Inc.
    Inventor: Eugene P. Marsh
  • Publication number: 20140141278
    Abstract: The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: Frederick Goldman, Inc.
    Inventor: Andrew Derrig
  • Publication number: 20140141277
    Abstract: The present invention relates generally to jewelry articles comprising a substrate and a metallic, external coating.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: Frederick Goldman, Inc.
    Inventor: Andrew Derrig
  • Patent number: 8703044
    Abstract: A method of fabricating a machine component is provided. The method includes preparing at least a portion of a surface of a machine component for receiving a sintered preform. The method also includes forming a pre-sintered preform hybrid hardface mixture that includes combining a predetermined portion of at least one hardfacing material with a predetermined portion of at least one brazing material. The method further includes forming a pre-sintered preform. The pre-sintered preform has predetermined dimensions. The method also includes forming the sintered preform and positioning the sintered preform on the machine component. The method further includes fixedly coupling the sintered preform to at least a portion of the machine component via brazing.
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: April 22, 2014
    Assignee: General Electric Company
    Inventors: Sujith Sathian, Anjilivelil K. Kuruvilla, Daniel Nowak
  • Patent number: 8691397
    Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: April 8, 2014
    Assignee: Integran Technologies, Inc.
    Inventors: Diana Facchini, Francisco Gonzalez, Jonathan McCrea, Mike Uetz, Gino Palumbo, Klaus Tomantschger
  • Patent number: 8691395
    Abstract: A composite material for brazing having features of: forming a homogenous distribution of components in the brazing filler material even after brazing; having an excellent workability; offering low manufacturing costs; and having satisfactory corrosion resistivity as desired. The composite material for brazing has a lamination of a brazing filler material layer thereon, wherein the brazing filler material layer is a layer of alloy that includes copper, aluminum, and nickel.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: April 8, 2014
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Kazuma Kuroki, Hiromitsu Kuroda
  • Patent number: 8668994
    Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a nickel or nickel alloy layer with a lower etching rate than copper formed on an etching side of the rolled copper foil or electrolytic copper foil, and a heat resistance layer composed of zinc or zinc alloy or its oxide formed on the nickel or nickel alloy layer.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: March 11, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
  • Publication number: 20140057122
    Abstract: An alloy for imparting wear- and corrosion-resistance to a metal component wherein the alloy comprises between about 0.12 wt % and about 0.7 wt % C, between about 20 wt % and about 30 wt % Cr, between about 10 wt % and about 15 wt % Mo, between about 1 wt % and about 4 wt % Ni, and balance of Co.
    Type: Application
    Filed: November 6, 2013
    Publication date: February 27, 2014
    Applicant: KENNAMETAL INC.
    Inventors: James B. C. Wu, Volker Hellinger, Matthew X. Yao
  • Publication number: 20130337288
    Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness Cr coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial and hydrophobic properties.
    Type: Application
    Filed: August 26, 2013
    Publication date: December 19, 2013
    Applicant: Integran Technologies Inc.
    Inventors: Diana Facchini, Francisco Gonzalez, Jonathan McCrea, Mike Uetz, Gino Palumbo, Klaus Tomantschger, Nandakumar Nagarajan, Jared J. Victor, Uwe Erb
  • Patent number: 8586194
    Abstract: Magnetic materials and methods exhibit large magnetic-field-induced deformation/strain (MFIS) through the magnetic-field-induced motion of crystallographic interfaces. The preferred materials are porous, polycrystalline composite structures of nodes connected by struts wherein the struts may be monocrystalline or polycrystalline. The materials are preferably made from magnetic shape memory alloy, including polycrystalline Ni—Mn—Ga, formed into an open-pore foam, for example, by space-holder technique. Removal of constraints that interfere with MFIS has been accomplished by introducing pores with sizes similar to grains, resulting in MFIS values of 0.12% in polycrystalline Ni—Mn—Ga foams, close to the best commercial magnetostrictive materials. Further removal of constraints has been accomplished by introducing pores smaller than the grain size, dramatically increasing MFIS to 2.0-8.7%.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: November 19, 2013
    Assignees: Boise State University, Northwestern University
    Inventors: Peter Mullner, Markus Chmielus, Cassie Witherspoon, David C. Dunand, Xuexi Zhang, Yuttanant Boonyongmaneerat
  • Patent number: 8580390
    Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a heat resistance layer composed of zinc or zinc alloy or its oxide formed on an etching side of the rolled copper foil or electrolytic copper foil, and a layer of nickel or nickel alloy, which is a metal or alloy with a lower etching rate than copper, formed on the heat resistance layer.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: November 12, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
  • Patent number: 8545994
    Abstract: An article includes an electrodeposited metallic material including Co with a minimum content of 75% by weight. The metallic material has a microstructure which is fine-grained with an average grain size between 2 and 5,000 nm and/or an amorphous microstructure. The metallic material forms at least part of an exposed surface of the article. The metallic material has an inherent contact angle for water of less than 90 degrees at room temperature when measured on a smooth exposed surface portion of the metallic material which has a maximum surface roughness Ra of 0.25 microns. The metallic material has an exposed patterned surface portion having surface structures having a height of between at least 5 microns to about 100 microns incorporated therein to increase the contact angle for water at room temperature of the exposed patterned surface portion to over 100 degrees.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: October 1, 2013
    Assignee: Integran Technologies Inc.
    Inventors: Diana Facchini, Francisco Gonzalez, Jonathan McCrea, Mike Uetz, Gino Palumbo, Klaus Tomantschger, Nandakumar Nagarajan, Jared J. Victor, Uwe Erb
  • Patent number: 8524365
    Abstract: A method of producing nanoparticles comprises effecting conversion of a nanoparticle precursor composition to the material of the nanoparticles. The precursor composition comprises a first precursor species containing a first ion to be incorporated into the growing nanoparticles and a separate second precursor species containing a second ion to be incorporated into the growing nanoparticles. The conversion is effected in the presence of a molecular cluster compound under conditions permitting seeding and growth of the nanoparticles.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: September 3, 2013
    Assignee: Nanoco Technologies Ltd.
    Inventors: Paul O'Brien, Nigel Pickett
  • Patent number: 8524378
    Abstract: Provided is a copper foil for a printed circuit with an electrodeposited ternary-alloy layer composed of copper, cobalt and nickel formed on a surface of the copper foil, wherein the electrodeposited layer comprises dendritic particles grown on the copper foil surface, and the entire surface of the copper foil is covered with particles having an area as seen from above the copper foil surface of 0.1 to 0.5 ?m2 at a density of 1000 particles/10000 ?m2 or less, particles exceeding 0.5 ?m2 at a density of 100 particles/10000 ?m2 or less, and particles less than 0.1 ?m2 as the remainder. Roughening particles formed dendritically in a roughening treatment based on copper-cobalt-nickel alloy plating are inhibited from shedding from the copper foil surface, and the phenomenon known as powder falling and uneven treatment are thereby inhibited.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: September 3, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Naoki Higuchi
  • Patent number: 8465847
    Abstract: This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near-equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired in a form such as corrugated sheet, discrete tubes or wires, may be joined together using the newly discovered joining technique. Pure niobium when brought into contact with nitinol at elevated temperature, liquefies at temperatures below the melting point and flows readily into capillary spaces between the elements to be joined, thus forming a strong joint.
    Type: Grant
    Filed: August 7, 2010
    Date of Patent: June 18, 2013
    Assignees: The Regents of the University of Michigan, Board of Trustees of Michigan State University
    Inventors: John A. Shaw, David S. Grummon
  • Publication number: 20130130059
    Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more.
    Type: Application
    Filed: November 15, 2012
    Publication date: May 23, 2013
    Applicant: TDK CORPORATION
    Inventor: TDK CORPORATION
  • Patent number: 8445114
    Abstract: The invention provides a method and system for electrolytically coating an article. The method includes providing an article to be coated and disposing the article in an electrolytic cell. The cell includes an anode, a cathode in operable communication with the article, and an electrolyte bath. During electrolysis, the electrolyte bath comprises cobalt ions, phosphorous acid, and tribological particles selected from the group consisting of refractory materials, solid lubricants and mixtures thereof dispersed therein. The method further includes applying steady direct electric current through the anode, the electrolyte bath and the cathode to coat the article with cobalt, phosphorous and the tribological particles. An improved composition of matter is also provided that may be used as a coating, or the composition may be electroformed on a mandrel to form an article made from the composition of matter.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: May 21, 2013
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Amitava Datta, John D. Carpenter, Aaron T. Nardi, Blair A. Smith
  • Patent number: 8440320
    Abstract: An article includes a substrate made of carbon fiber and zirconium diboride composites; an chromium layer deposited on the substrate; an chromium diffusing layer formed between the substrate and the chromium layer; and a iridium layer deposited on the chromium layer opposite to the chromium diffusing layer.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: May 14, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Shyan-Juh Liu, Cong Li
  • Publication number: 20130115478
    Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness chromium coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.
    Type: Application
    Filed: November 9, 2012
    Publication date: May 9, 2013
    Applicant: INTEGRAN TECHNOLOGIES, INC.
    Inventor: INTEGRAN TECHNOLOGIES, INC.
  • Publication number: 20130106123
    Abstract: A welded assembly characterized by improved structural integrity includes a first component disposed along a first plane. The first component includes first and second substantially parallel surfaces, and also includes a channel arranged on the first surface. The welded assembly also includes a second component disposed along a second plane, wherein the second component includes a leading edge. The leading edge of the second component is inserted into the channel of the first component such that an interface is formed between the first and second components. A weld generated on the second surface joins the first component with the second component at the interface such that the assembly is formed. The subject weld may be a friction-stir type of a weld. The subject welded assembly may be a vehicle bumper support. A method of forming such a welded assembly is also disclosed.
    Type: Application
    Filed: October 27, 2011
    Publication date: May 2, 2013
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Blair E. Carlson, Mark Allan Cunningham, Robert T. Szymanski
  • Patent number: 8431238
    Abstract: A composition and process for forming an electrodeposited coating comprising a co-deposit of a metal and MCrAlY particles. The composition includes a metal and a MCrAlY particles, and the electrodeposited coating comprises a metal matrix and MCrAlY particles dispersed in the matrix. In one aspect, a coating is provided that exhibits excellent oxidation resistance and tribological characteristics at high temperatures, including up to at least about 1350° F. A high temperature coating may comprise a nickel/cobalt alloy matrix comprising MCrAlY particles and chromium carbide particles dispersed in the nickel/cobalt matrix.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: April 30, 2013
    Assignee: Parker-Hannifin Corporation
    Inventors: Jeremy M. Payne, James E. Beach, Amitava Datta, Kenneth W. Cornett, Dominick G. More
  • Patent number: 8431240
    Abstract: A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each layer of the one or more noble metal layers is no greater than a monolayer. The seed film also includes either one or more conductive metal oxide layers or one or more silicon oxide layers, where either layer is no greater than a monolayer. The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: April 30, 2013
    Assignee: Micron Technology, Inc.
    Inventor: Eugene P. Marsh
  • Publication number: 20130086785
    Abstract: Hybrid repair plugs include an alloy core and a sintered preform shell at least partially surrounding the alloy core, wherein the sintered preform shell includes a mixture comprising a base alloy comprising about 30 weight percent to about 90 weight percent of the mixture and a second alloy including a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy.
    Type: Application
    Filed: October 6, 2011
    Publication date: April 11, 2013
    Inventors: Yan Cui, Srikanth Chandrudu Kottilingam, Brian Lee Tollison, Dechao Lin, David Edward Schick
  • Patent number: 8415024
    Abstract: An organic liquid is applied to both sides of a self-supporting film of a polyimide precursor solution, and then the self-supporting film is heated to effect imidization, thereby providing a polyimide film with reduced surface roughness.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: April 9, 2013
    Assignee: Ube Industries, Ltd.
    Inventors: Hideki Iwai, Kazuyuki Hamada, Yasuhiro Nagoshi
  • Patent number: 8409726
    Abstract: Provided is a printed circuit board (PCB) with multiple metallic layers and a method of manufacturing the PCB to improve adhesion between a metal film and a polymer film, on which a circuit pattern is formed. The PCB includes: a first metal film; a polymer film formed on one surface of the first metal film; and a second metal film, interposed between the first metal film and the polymer film, having a first surface facing the first metal film and a second surface facing the polymer film, wherein the second surface is rougher than the first surface.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: April 2, 2013
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Chang-han Shim, Sung-il Kang, Se-chuel Park
  • Patent number: 8409722
    Abstract: An alloy material having high-temperature corrosion resistance, which exhibits excellent oxidation resistance and ductility and can be applied to gas turbines used at ultra high temperatures, and a thermal barrier coating, a turbine member and a gas turbine each comprising the alloy material. An alloy material having high-temperature corrosion resistance, comprising, by weight, Co: 15 to 30%, Cr: 10 to 30%, Al: 4 to 15%, Y: 0.1 to 3%, and Re: 0.1 to 1%, with the balance being substantially Ni. Also, an alloy material having high-temperature corrosion resistance, comprising, by weight, Ni: 20 to 40%, Cr: 10 to 30%, Al: 4 to 15%, Y: 0.1 to 3%, and Re: 0.1 to 5%, with the balance being substantially Co.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: April 2, 2013
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Taiji Torigoe, Hidetaka Oguma, Ikuo Okada, Tomoaki Yunomura, Soji Kasumi
  • Publication number: 20130065077
    Abstract: A process is disclosed for applying a heat shielding coating system on a metallic substrate. The coating system comprises at least three individual layers selected from the group of barrier layer, hot gas corrosion protection layer, protection layer, heat barrier layer, and smoothing layer. The coating system is applied to the metallic substrate by low pressure plasma spraying in a single operation cycle. This process enables the layers to be applied in an arbitrary sequence. The process is preferably used in applying a coating system to a turbine blade, particularly a stator or a rotor blade of a stationary gas turbine or of an aircraft engine, or to another component in a stationary or aircraft turbine that is subjected to hot gas.
    Type: Application
    Filed: April 9, 2012
    Publication date: March 14, 2013
    Applicant: SULZER METCO AG
    Inventors: Michael Loch, Gérard Barbezat
  • Publication number: 20120308844
    Abstract: The present invention relates generally to methods for producing a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 6, 2012
    Applicant: FREDERICK GOLDMAN INC.
    Inventor: Andrew Derrig
  • Patent number: 8309232
    Abstract: A running-in coating for gas turbines and a method for production of a running-in coating are provided. The running-in coating serves to seal a radial gap between a housing (11) of the gas turbine and the rotating blades (10) themselves, whereby the running-in coating (13) is applied to the housing. The running-in coating is made from a CoNiCrAIY-hBN material. The CoNiCrAIY-hBN material can be applied by thermal spraying, in particular plasma spraying.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: November 13, 2012
    Assignee: MTU Aero Engines GmbH
    Inventors: Manfred A. Daeubler, Klaus Schweitzer
  • Publication number: 20120270068
    Abstract: A method for making a coated article includes the steps of: providing a substrate; forming a copper-cobalt target by a hot isostatic pressing process using copper powder and cobalt powder; forming a copper-cobalt alloy layer on the substrate by vacuum sputtering using the copper-cobalt target. A coated article is also described.
    Type: Application
    Filed: September 15, 2011
    Publication date: October 25, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, SHUN-MAO LIN
  • Publication number: 20120231295
    Abstract: A method of fabricating a component and a component are disclosed. The method includes beam brazing a pre-sintered preform to the component to form a beam-brazed portion. The component includes a beam-brazed portion formed by a pre-sintered preform.
    Type: Application
    Filed: March 8, 2011
    Publication date: September 13, 2012
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Srikanth Chandrudu KOTTILINGAM, Gene MURPHY, Yan CUI
  • Patent number: 8216691
    Abstract: Metal, ceramic and cermet articles produced from low viscosity suspensions. The articles include micro diameter hollow fibers, meshes and open cell foams. The articles are useful for filters, catalyst media, fuel cell electrodes, body implantation devices, structural materials, vibration and noise control, heat exchangers, heat sinks, heat pipes, heat shields and other applications.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: July 10, 2012
    Inventors: Alexander Lobovsky, Mohammad Behi